Quick dismounting structure of flexible circuit board and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a quick dismounting structure of a flexible circuit board and electronic equipment, which comprises a conductive structural member, the flexible circuit board and an electric reducing adhesive layer, the flexible circuit board is provided with a first board surface and a second board surface which are arranged oppositely, the first board surface is provided with a power connection end, and the second board surface is provided with a conductive surface. The power connection end is conducted with the conductive surface; the electric viscosity reducing adhesive layer is provided with a first adhesive surface and a second adhesive surface, the first adhesive surface is adhered to the conductive structural member, the second adhesive surface is adhered to the conductive surface, and the conductive surface is insulated from the conductive structural member. When the flexible circuit board is disassembled, the power connection end is connected with one pole of an external power supply, the conductive surface is electrified, and the conductive structural member is connected with the other pole of the external power supply, so that an electric field is formed on the first adhesive surface and the second adhesive surface of the electric viscosity reduction adhesive layer, the adhesive force of the electric viscosity reduction adhesive layer is reduced or disappears, and the flexible circuit board can be easily and quickly disassembled from the conductive structural member. And the disassembly reject ratio is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to a quick-disassembly structure for a flexible circuit board and an electronic device thereof. Background Technology

[0002] Currently, with the rapid development of electronic devices, consumers have increasingly higher requirements for the functionality, reliability, and appearance of these devices. Consumer electronics contain a complex array of FPCs (Flexible Printed Circuits), requiring both reliable bonding and easy disassembly. However, these are inherently contradictory: the stronger the bonding, the more difficult the disassembly, and the more prone it is to damage. Current methods for disassembling FPCs mainly involve two approaches: direct pulling and tearing, or heating them at high temperatures before using tools. The problems with these methods are that disassembling an electronic device takes a long time, is unreliable, and easily tears the FPC. To resolve this contradiction between bonding and disassembly, we urgently need a solution that ensures both reliable FPC bonding and efficient, convenient disassembly. Utility Model Content

[0003] The main purpose of this invention is to provide a quick disassembly structure for flexible circuit boards and an electronic device, which aims to ensure both the bonding reliability of the flexible circuit boards and efficient and convenient disassembly.

[0004] To achieve the above objectives, this utility model proposes a quick-disassembly structure for a flexible circuit board, comprising:

[0005] Conductive structural components;

[0006] A flexible circuit board having a first plate surface and a second plate surface disposed opposite to each other, the first plate surface having a power receiving terminal, the second plate surface having a conductive surface, and the power receiving terminal being in communication with the conductive surface.

[0007] An electro-adhesive layer has a first adhesive surface and a second adhesive surface. The first adhesive surface is bonded to the conductive structural component, and the second adhesive surface is bonded to the conductive surface. The conductive surface is insulated from the conductive structural component.

[0008] Optionally, the second adhesive surface completely covers the conductive surface.

[0009] Optionally, the area of ​​the conductive surface accounts for more than 50% of the area of ​​the second plate surface.

[0010] Optionally, the outer peripheral edge of the second adhesive surface does not extend beyond the outer peripheral edge of the second plate surface.

[0011] Optionally, the power receiving terminal is the exposed copper point on the first board surface of the flexible circuit board, and the conductive surface is the exposed copper surface on the second board surface of the flexible circuit board. The exposed copper point and the exposed copper surface are connected inside the flexible circuit board.

[0012] Optionally, the first board surface is provided with an insulating layer outside the exposed copper point and / or the second board surface is provided with an insulating layer outside the exposed copper surface.

[0013] Optionally, the thickness of the electro-adhesive layer is 0.1 to 0.2 mm.

[0014] This utility model also discloses an electronic device, including the above-mentioned quick-disassembly structure for a flexible circuit board.

[0015] The technical solution provided by this utility model can include the following beneficial effects:

[0016] In the quick-release structure for a flexible circuit board provided by this utility model, the flexible circuit board is bonded to a conductive structural component via an electro-adhesive layer. During disassembly, the electrical terminal is connected to one pole of an external power source, causing the conductive surface to become charged. The conductive structural component is connected to the other pole of the external power source. This creates an electric field on the first and second adhesive surfaces of the electro-adhesive layer. Randomly distributed mobile charged particles in the electro-adhesive layer migrate directionally under the influence of this electric field, causing a rapid electrochemical reaction to occur on the adhesive surface of the electro-adhesive layer. This reduces or eliminates the adhesive force of the electro-adhesive layer, achieving electro-adhesive debonding. This facilitates the peeling of the flexible circuit board from the conductive structural component, allowing for easy and quick disassembly of the flexible circuit board and reducing the failure rate during disassembly.

[0017] It is worth noting that the distance between the flexible circuit board and the conductive structure is only the thickness of the electro-adhesive layer, which poses a potential risk of electrical continuity between the conductive surface and the conductive structure. Therefore, in this solution, the conductive surface of the second board is insulated from the conductive structure, effectively preventing any electrical connection between the flexible circuit board and the conductive structure. This resolves the potential for electrical continuity between the two components due to the limited distance between the second board and the conductive structure (only the electro-adhesive layer is present), and also avoids the inability to form an electric field during disassembly due to direct electrical connection between the conductive surface and the conductive structure. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is an exploded view of the quick-disassembly structure of this utility model;

[0020] Figure 2 for Figure 1 Another perspective of the exploded structural diagram of the embodiment;

[0021] Figure 3 This is a cross-sectional schematic diagram of the quick-disassembly structure of this utility model.

[0022] Explanation of reference numerals: 100-conductive structural component, 200-flexible circuit board, 210-first board surface, 211-electrical terminal, 220-second board surface, 221-conductive surface, 300-electrically reducing adhesive layer, 310-first adhesive surface, 320-second adhesive surface. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; taking "A and / or B" as an example, it includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0027] The following is combined Figures 1 to 3 This invention describes a quick-release structure for a flexible circuit board according to an embodiment of the present invention, comprising a conductive structural component 100, a flexible circuit board 200, and an electro-adhesive layer 300. The flexible circuit board 200 has a first surface 210 and a second surface 220 disposed opposite to each other. The first surface 210 has a terminal 211, and the second surface 220 has a conductive surface 221, wherein the terminal 211 is in communication with the conductive surface 221. The electro-adhesive layer 300 has a first adhesive surface 310 and a second adhesive surface 320. The first adhesive surface 310 is bonded to the conductive structural component 100, and the second adhesive surface 320 is bonded to the conductive surface 221. The conductive surface 221 is insulated from the conductive structural component 100.

[0028] The conductive structural component 100 serves as the main support structure for the electronic device, which may include, but is not limited to, mobile phones, tablets, virtual reality devices, laptops, personal computers, super mobile personal computers, handheld computers, and smart wearable devices with flexible circuit boards. Smart wearable devices may include, but are not limited to, smartwatches and smart bracelets. Specifically, taking a mobile phone as an example, the conductive structural component 100 is the phone's mid-frame and is made of a conductive metal material. The surface where the conductive structural component 100 is bonded to the electro-adhesive layer 300 is conductive. Connecting one pole of an external power source to any point on the conductive structural component 100 allows current to be conducted to the first adhesive surface 310 of the electro-adhesive layer 300.

[0029] In the quick-release structure of the flexible circuit board 200 provided by this utility model, the flexible circuit board 200 is bonded to the conductive structure 100 by an electro-adhesive layer 300. During disassembly, the electrical terminal 211 is connected to one pole of an external power source, making the conductive surface 221 charged, and the conductive structure 100 is connected to the other pole of the external power source. Thus, an electric field is formed on the first adhesive surface 310 and the second adhesive surface 320 of the electro-adhesive layer 300. This causes randomly distributed mobile charged particles in the electro-adhesive layer 300 to migrate directionally under the action of the electric field, thereby causing a rapid electrochemical reaction to occur on the adhesive surface of the electro-adhesive layer 300 in the presence of the electric field. This reduces or eliminates the adhesive force of the electro-adhesive layer 300, achieving electro-adhesive debonding. This makes the peeling between the flexible circuit board 200 and the conductive structure 100 easier, allowing the flexible circuit board 200 to be easily and quickly removed from the conductive structure 100, reducing the failure rate of disassembly.

[0030] It is worth noting that the gap between the flexible circuit board 200 and the conductive structure 100 is only the thickness of the electro-adhesive layer 300, which poses a potential risk of electrical continuity between the conductive surface 221 and the conductive structure. Therefore, in this design, the conductive surface 221 of the second board surface 220 is insulated from the conductive structure 100, thus preventing electrical continuity between the flexible circuit board 200 and the conductive structure 100. This solves the problem of potential electrical continuity between the two components due to the small gap of the electro-adhesive layer 300 and the second board surface 220 of the flexible circuit board 200. It also prevents direct electrical connection between the conductive surface 221 and the conductive structure 100 during disassembly, thus avoiding the formation of an electric field.

[0031] Specifically, the electro-adhesive layer 300 is a conventional electro-adhesive colloid. Specifically, the electro-adhesive layer 300 is a colloid whose adhesion weakens or even disappears after being energized, and exhibits good adhesive properties when no electricity is applied. In this application, the structure and composition of the electro-adhesive colloid are not further elaborated.

[0032] Specifically, in some optional embodiments, the conductive structure 100 is covered with an insulating cloth around the electro-adhesive layer 300, and the edge of the insulating cloth protrudes from the edge of the flexible circuit board 200. In this way, there is an insulating cloth and an electro-adhesive layer 300 between the flexible circuit board and the conductive structure, which can make the conductive surface 221 insulated from the conductive structure 100.

[0033] As an optional embodiment, the second adhesive surface 320 completely covers the conductive surface 221. In this embodiment, the electro-adhesive layer 300 itself is an insulating adhesive layer. By completely covering the conductive surface 221 with the second adhesive surface 320, the conductive surface 221 is completely covered by the electro-adhesive layer 300, thereby isolating the conductive surface 221 from the conductive structural component 100 by the insulating electro-adhesive layer 300. This prevents the exposed conductive surface 221 from coming into close contact with the conductive structural component 100, achieving insulation between the conductive surface 221 and the conductive structural component 100, eliminating the need for insulating cloth. This prevents the flexible circuit board 200 from becoming electrically connected to the conductive structural component 100, resolving the potential for electrical continuity between the second surface 220 of the flexible circuit board 200 and the conductive structural component 100 due to the only gap between them being the electro-adhesive layer 300. It also avoids the situation where, during disassembly, the conductive surface 221 and the conductive structural component 100 become directly connected, preventing the formation of an electric field. In a preferred embodiment of this utility model, the area of ​​the second adhesive surface 320 is similar to the area of ​​the conductive surface 221.

[0034] As an optional embodiment, the area of ​​the conductive surface 221 occupies more than 50% of the area of ​​the second board surface 220. By limiting the area of ​​the conductive surface 221 to more than 50% of the area of ​​the second board surface 220, sufficient area is provided for contact with the electrostrictive adhesive, ensuring the bonding reliability of the flexible circuit board 200. In specific embodiments, the larger the area of ​​the conductive surface 221 on the second board surface 220, the better. More specifically, in some optional embodiments, the conductive surface 221 can be a directional area, a circular area, a polygon, or a "U" shape, etc., and this utility model does not impose specific limitations.

[0035] As an optional embodiment, the outer peripheral edge of the second adhesive surface 320 does not extend beyond the outer peripheral edge of the second board surface 220. This prevents the electro-adhesive from extending beyond the flexible circuit board 200, improving the aesthetics of the bonding.

[0036] As an optional embodiment, the terminal 211 is the exposed copper point of the flexible circuit board 200 on the first board surface 210, and the conductive surface 221 is the exposed copper surface of the flexible circuit board 200 on the second board surface 220. The exposed copper point and the exposed copper surface are connected internally within the flexible circuit board 200. In this embodiment, the flexible circuit board 200 is non-conductive because its surface is covered with an insulating layer. Therefore, this invention exposes copper in the first board surface 210 to create an exposed copper point as a terminal, and exposes copper in the second board surface 220 to obtain an exposed copper surface as a conductive surface 221, so that external current can flow from the first board surface 210 outside the flexible circuit board 200 to the second board surface 220 inside the flexible circuit board 200.

[0037] As an optional embodiment, the first board surface 210 is provided with an insulating layer outside the exposed copper point and / or the second board surface 220 is provided with an insulating layer outside the exposed copper surface. This achieves protection of the flexible circuit board 200 through the insulating layer.

[0038] As an optional embodiment, the thickness of the electro-adhesive layer 300 is 0.1 to 0.2 mm.

[0039] This utility model also discloses an electronic device, including a quick-release structure for the aforementioned flexible circuit board 200. This application provides an electronic device, which may include, but is not limited to, mobile phones, tablets, virtual reality (VR) devices, laptops, personal computers (PCs), ultra-mobile personal computers (UMPCs), handheld computers, smart wearable devices, and other electronic devices with flexible circuit boards. Smart wearable devices may include, but are not limited to, smartwatches and smart bracelets. The conductive structural component 100 is the main supporting structure of the electronic device. Taking a mobile phone as an example, the conductive structural component 100 is the phone's mid-frame, and the conductive structural component 100 is made of a conductive metal material.

[0040] In the electronic device provided by this utility model, the flexible circuit board 200 is bonded to the conductive structure 100 by an electro-adhesive layer 300. During disassembly, the terminal 211 is connected to one pole of an external power source, causing the conductive surface 221 to become charged, and the conductive structure 100 is connected to the other pole of the external power source. Thus, an electric field is formed on the first adhesive surface 310 and the second adhesive surface 320 of the electro-adhesive layer 300, causing the randomly distributed mobile charged particles in the electro-adhesive layer 300 to migrate directionally under the action of the electric field. This causes the adhesive surface of the electro-adhesive layer 300 to undergo a rapid electrochemical reaction in the presence of the electric field, reducing or eliminating the adhesive force of the electro-adhesive layer 300, i.e., achieving electro-adhesive debonding. This makes it easier to peel the flexible circuit board 200 from the conductive structure 100, allowing the flexible circuit board 200 to be easily and quickly removed from the conductive structure 100.

[0041] It is worth noting that the gap between the flexible circuit board 200 and the conductive structure 100 is only the thickness of the electro-adhesive layer 300, which poses a potential risk of electrical continuity between the conductive surface 221 and the conductive structure. Therefore, in this design, the conductive surface 221 of the second board surface 220 is insulated from the conductive structure 100, thus preventing electrical continuity between the flexible circuit board 200 and the conductive structure 100. This solves the problem of potential electrical continuity between the two components due to the small gap of the electro-adhesive layer 300 and the second board surface 220 of the flexible circuit board 200. It also prevents direct electrical connection between the conductive surface 221 and the conductive structure 100 during disassembly, thus avoiding the formation of an electric field.

[0042] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the concept of the present utility model and using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present utility model.

Claims

1. A quick release structure of a flexible circuit board, characterized by comprising: The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface.

2. The quick release structure of a flexible circuit board according to claim 1, wherein The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface.

3. The quick release structure of a flexible circuit board according to claim 2, wherein The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface.

4. The quick release structure of a flexible circuit board according to claim 1, wherein The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface.

5. The quick release structure of a flexible circuit board according to claim 1, wherein The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface.

6. The quick release structure of a flexible circuit board according to claim 5, wherein The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface.

7. The quick release structure of a flexible circuit board according to claim 1, wherein The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface.

8. An electronic device, comprising: The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and particularly relates to a flexible circuit board with a conductive structure and an electrically conductive surface. The utility model relates to a flexible circuit board, and

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