Heat-conducting medium filling structure of electronic equipment

Abstract

The utility model relates to a heat-conducting medium filling structure of electronic equipment, which comprises a PCB (Printed Circuit Board) of which one side plate surface is provided with a heating element to be coated, a heat-conducting medium coated on the outer surface of the heating element, a radiator and a filling blocking frame which is arranged around the heating element and of which the two sides are respectively assembled with the PCB and the radiator, a gap between the heating element and the radiator is filled with the heat-conducting medium, a groove is formed in the middle of the filling blocking frame, and the heat-conducting medium is filled in the part, higher than the heating element, of the groove in the filling blocking frame. According to the utility model, the filling blocking frame is arranged, the middle part of the filling blocking frame is provided with the groove which is convenient for filling the heat-conducting medium in the to-be-filled area of the heating element, one side of the filling blocking frame is positioned on the PCB through the groove, and then the heat-conducting medium is filled in the part of the groove, higher than the heating element, in the filling blocking frame; and finally, the radiator is assembled on the PCB, and the end part of the radiator correspondingly shields the groove to prevent the heat-conducting medium from overflowing, so that standardized filling of the heat-conducting medium can be realized.

Description

Technical Field

[0001] This utility model relates to the field of thermal conductivity technology for electronic devices, and in particular to a thermal conductivity medium filling structure for electronic devices. Background Technology

[0002] With the continuous development of electronic devices, the heat dissipation requirements of heat-generating components on their PCBs have become a key bottleneck restricting performance improvement. Thermally conductive media (such as thermal grease), as the core material filling the gap between heat-generating components and heat sinks, directly determine heat dissipation performance through the uniformity of its filling and the control of its dosage.

[0003] Currently, thermally conductive media are typically applied manually to the heat-generating components on a PCB board. The coated components are then assembled with a heatsink, filling the gap between them. This allows heat from the heat-generating components to be transferred to the heatsink. However, this non-standardized filling method has the following drawbacks: 1. Uneven application of thermally conductive media leads to poor local heat dissipation efficiency; 2. Overfilling causes material waste and adhesive overflow; 3. Inaccurate thickness control affects assembly precision. Utility Model Content

[0004] Therefore, it is necessary to provide a thermally conductive medium filling structure for electronic devices.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A thermally conductive medium filling structure for an electronic device includes a PCB board on one side of which a heating element to be coated is disposed, a thermally conductive medium coated on the outer surface of the heating element, and a heat sink assembled on the end face of the heating element in the PCB board, with a gap formed between a portion of the inner edge and the outer surface of the heating element. The thermally conductive medium fills the gap between the heat sink and the heating element. The structure also includes a filling baffle surrounding the heating element and assembled on both sides with the PCB board and the heat sink, respectively. A groove with a longitudinal cross-sectional shape and size adapted to the heating element is opened in the middle of the filling baffle. The thermally conductive medium is filled in the portion of the groove in the filling baffle that is higher than the heating element.

[0006] In one embodiment, the heat sink has a pressure block 51 protruding outward at one end facing the PCB board. When the filler frame is assembled with the PCB board and the heat sink, one side of the filler frame is positioned on the PCB board by placing the groove in the heat-generating element. The heat sink is assembled on the PCB board by a locking structure. The other side of the filler frame abuts against the pressure block of the heat sink to fix the filler frame.

[0007] In one embodiment, the heat sink protrudes outward on opposite sides of one end of the PCB board to form connecting bosses. The free end face of the connecting boss is flush with the opposite face of the filling frame that abuts against the pressure block. The locking structure consists of a threaded hole opened in the connecting boss and a bolt that passes through the PCB board and connects to the threaded hole to lock the PCB board onto the heat sink.

[0008] In one embodiment, the connecting boss and the outer periphery of the free end of the pressure block are respectively provided with rounded corners.

[0009] In one embodiment, the locking structure is a threaded locking structure or a snap-fit ​​locking structure respectively provided on the PCB board and the heat sink.

[0010] In one embodiment, the filler frame is made entirely of heat-resistant silicone rubber.

[0011] In one embodiment, the inner wall surface of the groove is provided with a rough structure for attaching the heat-conducting medium.

[0012] In one embodiment, the rough structure is formed by machining, laser etching, or chemical etching.

[0013] In one embodiment, the longitudinal section of the groove on the filling frame is rectangular, and the dimensions of the groove length, width and depth are 10mm×5mm×1.5mm, respectively.

[0014] The beneficial effects of this utility model are as follows: The thermal conductive medium filling structure for electronic devices provided by this utility model further includes a filling baffle, and the middle of the filling baffle is designed with a groove to facilitate the application of thermal conductive medium to the area to be coated on the heating element. In actual use, one side of the filling baffle is positioned on the PCB board by the groove, and then the thermal conductive medium is filled into the groove in the filling baffle that is higher than the heating element. Finally, the heat sink is assembled on the PCB board and the end of the heat sink covers the groove to prevent the thermal conductive medium from overflowing. The structure design of this utility model is relatively simple and can conveniently and efficiently achieve standardized filling of thermal conductive medium. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the assembled state structure of an optional embodiment of the thermally conductive medium filling structure of the electronic device of this utility model;

[0017] Figure 2 This is a schematic diagram of the split-state structure of an optional embodiment of the thermally conductive medium filling structure of the electronic device of this utility model;

[0018] Figure 3 This is a cross-sectional view of an optional embodiment of the thermally conductive medium filling structure of the electronic device of this utility model, through a longitudinal section perpendicular to the groove.

[0019] Figure 4 for Figure 3 A magnified view of a portion at point A.

[0020] In the attached diagram, 1 is the PCB board; 10 is the heating element; 3 is the heat transfer medium; 5 is the heat sink; 51 is the pressure block; 53 is the connecting boss; 6 is the filler frame; 60 is the groove; 8 is the locking structure; 81 is the threaded hole; 83 is the bolt; and 9 is the rounded corner. Detailed Implementation

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments of the present invention can be combined with each other. The technical solutions of the present invention will be further described below with reference to the accompanying drawings of the embodiments. The present invention is not limited to the specific embodiments described below.

[0022] It should be understood that the same or similar reference numerals in the accompanying drawings of the embodiments correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "front," "rear," "left," "right," "top," and "bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms describing positional relationships in the accompanying drawings are for illustrative purposes only and should not be construed as limiting this patent. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0023] In one embodiment, such as Figures 1-4As shown, a thermally conductive medium filling structure for an electronic device includes a PCB board 1 on one side of which a heating element 10 to be coated is disposed; a thermally conductive medium 3 coated on the outer surface of the heating element 10; and a heat sink 5 assembled on the end face of the heating element 10 on the PCB board 1, with a gap formed between a portion of the inner edge of the heat sink 10 and the outer surface of the heating element 10. The thermally conductive medium 3 fills the gap between the heat sink 5 and the heating element 10. The structure also includes a filling baffle 6 surrounding the heating element 10 and assembled on both sides of the PCB board 1 and the heat sink 5, respectively. A groove 60 with a longitudinal cross-sectional shape and size adapted to the heating element 10 is formed in the middle of the filling baffle 6. The thermally conductive medium 3 is filled in the portion of the groove 60 in the filling baffle 6 that is higher than the heating element 10.

[0024] Compared with the prior art, the present invention has at least the following advantages: The present invention provides a thermal conductive medium 3 filling structure for an electronic device, which further includes a filling baffle 6. The filling baffle 6 has a groove 60 in the middle to facilitate the application of thermal conductive medium 3 to the area to be coated on the heating element 10. In actual use, one side of the filling baffle 6 is positioned on the PCB board 1 by the groove 60. Then, the thermal conductive medium 3 is filled into the part of the groove 60 in the filling baffle 6 that is higher than the heating element 10. Finally, the heat sink 5 is assembled on the PCB board 1 and the end of the heat sink 5 covers the groove 60 to prevent the thermal conductive medium 3 from overflowing. The structure of the present invention is relatively simple and can conveniently and efficiently achieve standardized filling of the thermal conductive medium 3.

[0025] In one embodiment, such as Figures 1-4 As shown, the heat sink 5 has a pressure block 51 protruding outward at one end facing the PCB board 1. When the filler frame 6 is assembled with the PCB board 1 and the heat sink 5, one side of the filler frame 6 is positioned on the PCB board 1 by the groove 60 placed in the heat-generating element 10. The heat sink 5 is assembled on the PCB board 1 by a locking structure, and the other side of the filler frame 6 abuts against the pressure block 51 of the heat sink 5 to fix the filler frame 6. In this embodiment, by setting the pressure block 51 at the corresponding position of the heat sink 5, the filler frame 6 can be shielded and abutted against the groove 60 after it is positioned on the PCB board 1. This fixes the filler frame 6 and prevents it from shifting, while also preventing the heat-conducting medium 3 inside the filler frame 6 from overflowing from the groove 60.

[0026] In one embodiment, such as Figures 1-4As shown, the heat sink 5 has connecting bosses 53 protruding outward on opposite sides of one end facing the PCB board 1. The free end face of the connecting boss 53 is flush with the opposite face of the abutting surface of the filling block 6 to the pressure block 51. The locking structure 8 consists of a threaded hole 81 opened in the connecting boss 53 and a bolt 83 that passes through the PCB board 1 and connects to the threaded hole 81 to lock the PCB board 1 onto the heat sink 5. In this embodiment, the heat sink 5 has connecting bosses 53 at corresponding locations, and the locking structure 8 uses the threaded hole 81 and bolt 83 on the connecting boss 53 to assemble the filling block, resulting in a simple structural design. In the specific assembly of the filler frame 6, the free end face of the connecting boss 53 is flush with the opposite face of the filling frame 6 that abuts against the pressure block 51. Thus, the height difference between the top face of the connecting boss 53 and the top face of the pressure block 51 is the thickness of the filling frame 6, which makes it convenient to compactly install the filling frame 6 in the gap between the PCB board 1 and the pressure block 51, resulting in good stability of the overall installation structure.

[0027] In one embodiment, such as Figures 1-4 As shown, the outer periphery of the free end of the connecting boss 53 and the pressure block 51 is respectively provided with rounded corners 9. In this embodiment, by providing rounded corners 9 on the outer periphery of the free end of the connecting boss 53 and the pressure block 51, the occurrence of scratches and collisions between the connecting boss 53 and the PCB board 1 and between the pressure block 51 and the heating element 10 can be reduced.

[0028] In one embodiment, such as Figures 1-4 As shown, the locking structure 8 is either a threaded locking structure or a snap-fit ​​locking structure respectively provided on the PCB board 1 and the heat sink 5. In this embodiment, the locking structure 8 can adopt the above-mentioned threaded locking structure or snap-fit ​​locking structure (e.g., snap-fit ​​groove and snap-fit ​​protrusion or snap-fit ​​barb), both of which can effectively assemble and fix the heat sink 5 on the PCB board 1.

[0029] In one embodiment, such as Figures 1-4 As shown, the filler frame 6 is made entirely of heat-resistant silicone rubber. In this embodiment, the filler frame 6 is made entirely of heat-resistant silicone rubber, which is readily available, has stable performance, and is not easily deformed by temperature changes, ensuring standardized filling of the heat-conducting medium 3.

[0030] In one embodiment, such as Figures 1-4 As shown, the inner wall surface of the groove 60 is provided with a rough structure (not shown) for adhering the heat-conducting medium 3. In this embodiment, by providing a rough structure on the inner wall surface of the groove 60, the adhesion of the heat-conducting medium 3 can be improved, so as to stably conduct heat to the heating element 10.

[0031] In one embodiment, such as Figures 1-4 As shown, the roughened structure is formed by machining, laser etching, or chemical etching. In this embodiment, the roughened structure can be formed using one of these methods, offering high flexibility in process selection.

[0032] In one embodiment, such as Figures 1-4 As shown, the longitudinal section of the groove 60 of the filling frame 6 is rectangular, and the dimensions of the groove 60's length, width, and depth are 10mm × 5mm × 1.5mm, respectively. In a specific implementation, the filling frame 6 is a cuboid with dimensions of 20mm × 15mm × 1.5mm, and the longitudinal section of the groove 60 of the filling frame 6 is rectangular with dimensions of 10mm × 5mm × 1.5mm, thereby facilitating the formation of a 75mm... 3 The groove has a volume of 60 mm. In practical implementation, it can be used in conjunction with external dispensing equipment, with the dispensing volume of the equipment set to (75±5) mm. 3 It meets the standardized requirements for filling with thermally conductive medium 3, and has good processing consistency.

[0033] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A thermally conductive medium filling structure for an electronic device, comprising a PCB board on one side having a heat-generating element to be coated thereon, a thermally conductive medium coated on the outer surface of the heat-generating element, and a heat sink assembled on the end face of the heat-generating element on the PCB board, wherein a gap is formed between a portion of the inner edge of the heat sink and the outer surface of the heat-generating element, wherein the thermally conductive medium fills the gap between the heat sink and the heat-generating element, characterized in that, The structure also includes a filling frame surrounding the heating element and assembled with the PCB board and the heat sink on both sides respectively. The filling frame has a groove in the middle with a longitudinal cross-sectional shape and size that matches the heating element. The heat-conducting medium is filled in the part of the groove in the filling frame that is higher than the heating element.

2. The thermally conductive medium filling structure of the electronic device according to claim 1, characterized in that, The heat sink has a pressure block protruding outward at one end facing the PCB board. When the filler frame is assembled with the PCB board and the heat sink, one side of the filler frame is positioned on the PCB board by placing it in the heat-generating element through the groove. The heat sink is assembled on the PCB board by a locking structure. The other side of the filler frame abuts against the pressure block of the heat sink to fix the filler frame.

3. The thermally conductive medium filling structure for electronic devices according to claim 2, characterized in that, The heat sink has two opposite sides protruding outwards at one end of the PCB board to form connecting bosses. The free end face of the connecting boss is flush with the opposite face of the filling frame that abuts against the pressure block. The locking structure consists of a threaded hole opened in the connecting boss and a bolt that passes through the PCB board and connects to the threaded hole to lock the PCB board onto the heat sink.

4. The thermally conductive medium filling structure of the electronic device according to claim 3, characterized in that, The connecting boss and the outer periphery of the free end of the pressure block are respectively provided with rounded corners.

5. The thermally conductive medium filling structure of the electronic device according to claim 2, characterized in that, The locking structure is either a threaded locking structure or a snap-fit ​​locking structure respectively provided on the PCB board and the heat sink.

6. The thermally conductive medium filling structure of the electronic device according to claim 1, characterized in that, The entire filler frame is made of heat-resistant silicone rubber.

7. The thermally conductive medium filling structure of the electronic device according to claim 1, characterized in that, The inner wall surface of the groove is provided with a rough structure for attaching the heat-conducting medium.

8. The thermally conductive medium filling structure of the electronic device according to claim 7, characterized in that, The rough structure is formed by machining, laser etching, or chemical etching processes.

9. The thermally conductive medium filling structure of the electronic device according to claim 1, characterized in that, The longitudinal section of the groove on the filling frame is rectangular, and the dimensions of the groove length, width and depth are 10mm×5mm×1.5mm, respectively.

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