Positioning tool for semiconductor chip packaging

Abstract

The utility model belongs to the technical field of chip packaging, and particularly relates to a positioning tool for semiconductor chip packaging, which comprises a positioning bottom plate and a positioning top plate, the positioning bottom plate is provided with at least one positioning hole I, and the positioning hole I is used for placing an emitter molybdenum sheet, a soldering lug and a chip; the positioning top plate is provided with at least one second positioning hole matched with the first positioning hole, the second positioning hole is used for placing another soldering lug and an emitter molybdenum piece, the positioning top plate is provided with a fence surrounding the second positioning hole, and the interior of the fence is used for being attached to the edge of a semiconductor chip to isolate a chip field ring. And the assembled positioning tool is placed in a vacuum reflow oven to be welded and cooled, double-face welding of the chip is completed, then gluing and curing are conducted, and packaging of the chip is completed. A fence on the positioning tool ensures that welding does not deviate, welding flux is prevented from splashing and splashing to the chip field ring, and the tool is prevented from making contact with the chip field ring to cause smudginess of the chip.

Description

Technical Field

[0001] This invention belongs to the field of chip packaging technology, and specifically relates to a positioning fixture for semiconductor chip packaging. Background Technology

[0002] Positioning fixtures are primarily used for precise positioning and fixing of chips during the semiconductor chip packaging process. By working in conjunction with packaging equipment, they ensure the chip's accurate positioning during packaging, preventing deviations or misalignments.

[0003] Existing positioning fixtures mostly focus on the positioning accuracy of molybdenum sheets, solder pads and chips, preventing deviation during soldering, but they are prone to solder splashing onto the chip field ring. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a positioning fixture for semiconductor chip packaging, which effectively ensures that the solder generated during welding does not splash onto the chip field ring.

[0005] This invention provides a positioning fixture for semiconductor chip packaging, comprising:

[0006] The positioning base plate has at least one positioning hole, which is used to place the emitter molybdenum sheet, the solder pad, and the chip.

[0007] The positioning top plate has at least one positioning hole two that is adapted to the positioning hole one. The positioning hole two is used to place another solder pad and an emitter molybdenum sheet. The positioning top plate is provided with a barrier around the positioning hole two. The interior of the barrier is used to fit against the edge of the semiconductor chip to isolate the chip field ring.

[0008] Optionally, the four edges of the positioning hole one are provided with clearance grooves.

[0009] Optionally, the first positioning hole has a rectangular structure, and the second positioning hole and the enclosure also have a rectangular structure.

[0010] Optionally, each of the four apex corners of the positioning hole has a rounded corner groove extending outward.

[0011] Optionally, the three apex corners of the enclosure have rounded edges extending outwards, and the remaining apex corner has a tooling groove.

[0012] Optionally, the outer sides of the two opposite apex corners of the enclosure are provided with positioning frames, and one of them is an apex corner with a tooling groove.

[0013] Optionally, the length, width and depth of the positioning hole are 21.3×21.3×1mm.

[0014] Optionally, the length, width, and height of the fence are 18.3×1×1mm.

[0015] Optionally, the edges of the positioning base plate and the positioning top plate are respectively provided with mounting groove one and mounting groove two for positioning and assembling the positioning base plate and the positioning top plate.

[0016] Optionally, the positioning base plate has 4-8 positioning holes arranged in a rectangular row, and the corresponding positioning top plate has 4-8 positioning holes arranged in a rectangular row and a enclosure.

[0017] A field ring is a ring-shaped structure located at the edge or a specific region of a chip. It is typically made of the same material as the internal circuitry of the chip, but with a specific geometry and doping concentration. The main function of the field ring is to alter the electric field distribution, preventing excessive concentration of the electric field at the chip edge or in certain critical areas, thereby avoiding device breakdown or damage due to excessively high electric fields.

[0018] The beneficial effects of this invention are as follows: A positioning base plate is placed on a welding tray, the emitter molybdenum sheet is placed in the first positioning hole, and then the collector solder pad and the chip are sequentially placed on the emitter molybdenum sheet. The positioning top plate is placed on the chip surface, and the baffle is aligned and fitted with the chip edge. The emitter solder pad and the emitter molybdenum sheet are placed in the second positioning hole. The assembled positioning fixture is placed in a vacuum reflow oven for welding and cooling to complete the double-sided welding of the chip. Then, adhesive is applied and cured to complete the chip encapsulation. The baffle on the positioning fixture ensures that the welding does not shift, prevents solder splashing and splashing onto the chip's field ring, and also prevents the fixture from contacting the chip's field ring, thus preventing chip contamination. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the positioning base plate of the present invention;

[0020] Figure 2 This is a schematic diagram of the positioning top plate of the present invention;

[0021] Figure 3 This is a schematic diagram of the positioning tooling of the present invention.

[0022] In the diagram: 100, positioning base plate; 101, positioning hole one; 102, clearance groove; 103, rounded corner groove; 104, mounting groove one; 200, positioning top plate; 201, positioning hole two; 202, enclosure; 203, rounded corner edge; 204, tooling groove; 205, positioning frame; 206, mounting groove two. Detailed Implementation

[0023] like Figure 1-3As shown, the present invention provides a positioning fixture for semiconductor chip packaging, comprising: a positioning base plate 100 and a positioning top plate 200; wherein, the positioning base plate 100 has at least one positioning hole 101 for placing an emitter molybdenum sheet, a solder pad, and a chip; the positioning top plate 200 has at least one positioning hole 201 adapted to the positioning hole 101 for placing another solder pad and an emitter molybdenum sheet, and the positioning top plate 200 is provided with a barrier 202 surrounding the positioning hole 201, the interior of the barrier 202 being used to conform to the edge of the semiconductor chip to isolate the chip field ring.

[0024] Compared with existing technologies, the positioning fixture for semiconductor chip packaging provided by this invention places a positioning base plate 100 on a soldering tray, places the emitter molybdenum sheet into the positioning hole 101, then sequentially places the collector solder pad and the chip on the emitter molybdenum sheet, places the positioning top plate 200 on the chip surface, aligns and fits the enclosure 202 with the chip edge, places the emitter solder pad and emitter molybdenum sheet into the positioning hole 201, and places the assembled positioning fixture into a vacuum reflow oven for soldering and cooling to complete the double-sided soldering of the chip. Then, adhesive is applied and cured to complete the chip packaging. The enclosure 202 on the positioning fixture ensures that the soldering does not shift, prevents solder splashing and splashing onto the chip's field ring, and also prevents the fixture from contacting the chip's field ring, thus preventing chip contamination.

[0025] In one embodiment, the positioning hole 101 has a relief groove 102 around its four edges, which facilitates the placement of the emitter molybdenum sheet, collector solder sheet and chip by the clamping tool through the relief groove 102.

[0026] In one embodiment, the positioning hole 101 is rectangular in shape, and the corresponding positioning hole 201 and the enclosure 202 are also rectangular in shape. Specifically, the area of ​​positioning hole 101 is larger than that of positioning hole 201. The enclosure 202 is located along the edge of positioning hole 201. When the positioning base plate 100 and the positioning top plate 200 are assembled, the end face of the enclosure 202 is located inside the positioning hole 101 and fits exactly against the edge of the chip.

[0027] In one embodiment, the four corners of the positioning hole 101 each have outwardly extending rounded corner grooves 103, the main function of which are gas exhaust channels during the welding process.

[0028] In one embodiment, the three apex corners of the enclosure 202 each have outwardly extending rounded edges 203, and the remaining apex corner has a tooling groove 204. The rounded edges 203 prevent solder from overflowing onto the chip surface during the soldering process. The tooling groove 204 prevents the soldering tool from contacting the chip gate, thus avoiding interference with subsequent product processes.

[0029] In one embodiment, the outer sides of the two opposite apex corners of the enclosure 202 are provided with positioning frames 205, one of which is an apex corner with a tooling groove 204. The positioning frames 205 serve to fasten onto the molybdenum sheet for positioning.

[0030] In one embodiment, the length, width, and depth of the positioning hole 101 are 21.3 × 21.3 × 1 mm, respectively.

[0031] In one embodiment, the length, width, and height of the enclosure 202 are 18.3 × 1 × 1 mm, respectively.

[0032] In one embodiment, the edges of the positioning base plate 100 and the positioning top plate 200 respectively have mounting groove 104 and mounting groove 206 for positioning and assembling the positioning base plate 100 and the positioning top plate 200. Specifically, the positioning base plate 100 is placed first, followed by the workpiece to be welded, then the positioning top plate 200 is assembled onto the workpiece to be welded, and finally the molybdenum sheet to be welded is placed in the tooling positioning hole.

[0033] In one embodiment, the positioning base plate 100 has 4-8 positioning holes 101 arranged in a rectangular row, and the corresponding positioning top plate 200 has 4-8 positioning holes 201 arranged in a rectangular row and a enclosure 202.

[0034] In this embodiment, the chip is a power MOSFET or an IGBT.

[0035] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of protection of this application is limited to these examples; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of one or more embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0036] One or more embodiments in this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this application should be included within the protection scope of this application.

Claims

1. A positioning fixture for semiconductor chip packaging, characterized in that, include: The positioning base plate (100) has at least one positioning hole (101) for placing the emitter molybdenum sheet, the solder pad and the chip; The positioning top plate (200) has at least one positioning hole two (201) adapted to the positioning hole one (101), the positioning hole two (201) being used to place another solder pad and emitter molybdenum sheet, the positioning top plate (200) being provided with a enclosure (202) surrounding the positioning hole two (201), the interior of the enclosure (202) being used to fit against the edge of the semiconductor chip to isolate the chip field ring.

2. The positioning fixture according to claim 1, characterized in that, The positioning hole (101) has a clearance groove (102) on all four sides.

3. The positioning fixture according to claim 2, characterized in that, The first positioning hole (101) has a rectangular structure, and the second positioning hole (201) and the enclosure (202) also have a rectangular structure.

4. The positioning fixture according to claim 3, characterized in that, The four corners of the positioning hole (101) each have rounded corner grooves (103) extending outward.

5. The positioning fixture according to claim 3, characterized in that, The enclosure (202) has rounded edges (203) extending outward at each of its three apex corners, and a tooling groove (204) at the remaining apex corner.

6. The positioning fixture according to claim 5, characterized in that, The enclosure (202) has a positioning frame (205) on the outer side of the two opposite apex corners, one of which is an apex corner with a tooling groove (204).

7. The positioning fixture according to any one of claims 3-6, characterized in that, The length, width and depth of the positioning hole (101) are 21.3×21.3×1mm respectively.

8. The positioning fixture according to any one of claims 3-6, characterized in that, The length, width and height of the enclosure (202) are 18.3×1×1mm respectively.

9. The positioning fixture according to any one of claims 1-6, characterized in that, The edges of the positioning base plate (100) and the positioning top plate (200) are respectively provided with mounting groove one (104) and mounting groove two (206) for positioning and assembling the positioning base plate (100) and the positioning top plate (200).

10. The positioning fixture according to any one of claims 1-6, characterized in that, The positioning base plate (100) has 4-8 positioning holes (101) arranged in a rectangular row, and the corresponding positioning top plate (200) has 4-8 positioning holes (201) arranged in a rectangular row and a fence (202).

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