Edge chamfering device for monocrystalline silicon wafer production

Abstract

The utility model discloses an edge chamfering device for monocrystalline silicon wafer production, and belongs to the technical field of chamfering devices. An edge chamfering device for monocrystalline silicon wafer production comprises a U-shaped support, a fixed motor is arranged at the bottom of the inner side of the U-shaped support, the fixed motor penetrates through the output end of the U-shaped support to be fixedly connected with a driving wheel, the top of the U-shaped support is rotationally connected with a driven wheel through a bearing, and the driving wheel and the driven wheel are connected through a belt; according to the utility model, the first electric push rod and the second electric push rod are respectively in threaded connection with the clamping discs, so that an operator can flexibly adjust the distance between the two clamping discs according to the dimensions of the monocrystalline silicon wafers, thereby stably and accurately clamping and fixing the monocrystalline silicon wafers with different dimensions, and improving the working efficiency. And the situation that the monocrystalline silicon wafer shakes or shifts in the polishing process is avoided, and a solid foundation is provided for high-quality chamfering machining.

Description

Technical Field

[0001] This utility model relates to the field of chamfering device technology, and in particular to an edge chamfering device for monocrystalline silicon wafer production. Background Technology

[0002] In the production process of monocrystalline silicon wafers, edge chamfering is a crucial step. High-quality edge chamfering can significantly improve the performance and reliability of monocrystalline silicon wafers, reduce wafer breakage and electrical performance degradation caused by edge burrs, cracks, and other problems, thereby improving the conversion efficiency and lifespan of electronic devices such as solar cells.

[0003] In terms of clamping stability, the clamping structure of traditional devices often lacks sufficient flexibility and precision. Different sizes of monocrystalline silicon wafers are frequently switched during production, and existing devices struggle to make quick and precise clamping adjustments according to the wafer size. This leads to wafer wobbling and displacement during the chamfering process, which not only severely affects the uniformity and consistency of the chamfering, resulting in inconsistent edge quality and increased product defect rate, but may also damage the wafer due to abnormal collisions with the grinding components, causing unnecessary waste. Grinding quality and efficiency are also major shortcomings of existing devices. Some devices have unreasonable grinding mechanism designs, resulting in insufficient contact between the grinding tools and the wafer edge, leading to uneven chamfering and potential issues such as incomplete or over-grinding in certain areas. Furthermore, the lack of efficient transmission and drive systems results in slow grinding speeds and low production efficiency, failing to meet the demands of large-scale production.

[0004] Therefore, in order to address this problem, this utility model provides an edge chamfering device for monocrystalline silicon wafer production. Utility Model Content

[0005] The purpose of this invention is to solve the problems in the prior art by proposing an edge chamfering device for the production of single-crystal silicon wafers.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a chamfering device for producing monocrystalline silicon wafers, comprising a U-shaped bracket, a fixed motor disposed at the bottom inner side of the U-shaped bracket, a drive wheel fixedly connected to the output end of the fixed motor passing through the U-shaped bracket, a driven wheel rotatably connected to the top of the U-shaped bracket via a bearing, the drive wheel and the driven wheel being connected by a belt, a first electric push rod fixedly connected to the output end of the driven wheel passing through the U-shaped bracket, the driven wheel being located above the fixed motor, a second electric push rod rotatably connected to the top of the U-shaped bracket away from the first electric push rod via a bearing, a clamping disc being threaded to one end of the first and second electric push rods respectively, a mounting base disposed at the middle position of the bottom of the U-shaped bracket, a clamping seat being snapped into the top of the mounting base, and a grinding arc frame being fixedly connected to the top of the clamping seat.

[0007] Preferably, mounting plates are symmetrically snapped onto both sides of the U-shaped bracket, and a mounting groove is provided on the top of the mounting plate.

[0008] Preferably, the bottom of the U-shaped bracket has a slot that matches the mounting plate.

[0009] Preferably, the mounting base has a threaded seat on its side, and the threaded seat is threadedly connected to a fixing pin, which is used for locking.

[0010] Preferably, the top of the mounting base is provided with a mating groove, which matches the snap-fit ​​base.

[0011] Compared with the prior art, this utility model provides an edge chamfering device for monocrystalline silicon wafer production, which has the following beneficial effects:

[0012] 1. This monocrystalline silicon wafer edge chamfering device features clamping discs connected by threads to a first and a second electric push rod. This design allows operators to flexibly adjust the distance between the two clamping discs according to the size specifications of the monocrystalline silicon wafer, ensuring stable and precise clamping and fixing of wafers of different sizes. This prevents the wafers from shaking or shifting during grinding, providing a solid foundation for high-quality chamfering. In terms of grinding, a fixed motor drives the drive wheel to rotate, which in turn drives the driven wheel via a belt. This causes the first electric push rod to rotate the clamped monocrystalline silicon wafer. Simultaneously, the grinding arc frame, fixed to the clamping seat, contacts the edge of the rotating wafer, achieving edge chamfering. This rotary grinding method ensures full contact between the grinding arc frame and the wafer edge, guaranteeing uniformity and consistency of the chamfer, significantly improving chamfering quality, reducing product defects caused by uneven chamfering, and enhancing the production quality and market competitiveness of monocrystalline silicon wafers.

[0013] 2. This single-crystal silicon wafer edge chamfering device uses a mounting base and a snap-fit ​​base connected by a mating groove and locked with a fixing pin. When the grinding arc frame wears or is damaged due to prolonged use, the operator only needs to loosen the fixing pin and remove the snap-fit ​​base from the mounting base to quickly replace it with a new grinding arc frame. This eliminates the need for large-scale disassembly and maintenance of the entire device, greatly reducing equipment downtime and improving production efficiency. In addition, the symmetrical snap-fit ​​mounting plates on both sides of the U-shaped bracket and the slot design at the bottom of the U-shaped bracket make the installation and removal of the mounting plates more convenient and quick. This allows for expansion of the device or integration with other equipment according to actual production needs, further improving production flexibility and adaptability, and reducing the company's production costs and operational risks. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of an edge chamfering device for producing single-crystal silicon wafers according to the present invention;

[0015] Figure 2 This is a structural development diagram of an edge chamfering device for producing single-crystal silicon wafers proposed in this utility model;

[0016] Figure 3 This utility model proposes an edge chamfering device for the production of single-crystal silicon wafers. Figure 1 Enlarged view of area A in the middle.

[0017] In the diagram: 1. U-shaped bracket; 101. Slot; 2. Fixed motor; 3. Drive wheel; 4. Driven wheel; 5. First electric push rod; 6. Second electric push rod; 7. Clamping disc; 8. Mounting base; 801. Threaded seat; 802. Connecting groove; 9. Snap-fit ​​seat; 10. Fixed pin; 11. Grinded arc frame; 12. Mounting plate; 13. Mounting slot. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0020] Reference Figures 1-3An edge chamfering device for producing monocrystalline silicon wafers includes a U-shaped bracket 1 as its main structure. A fixed motor 2 is fixedly mounted on the inner bottom of the U-shaped bracket 1. The output end of the fixed motor 2 passes through the U-shaped bracket 1 and is fixedly connected to a drive wheel 3, causing the drive wheel 3 to rotate. A driven wheel 4 is rotatably connected to the top of the U-shaped bracket 1 via a bearing. The drive wheel 3 and the driven wheel 4 are connected by a belt, allowing the drive wheel 3 to rotate synchronously with the driven wheel 4. The output end of the driven wheel 4 also passes through the U-shaped bracket 1 and is fixedly connected to a first electric push rod 5. The driven wheel 4 is positioned above the fixed motor 2 on the U-shaped bracket 1. A second electric push rod 6 is rotatably connected to the top of the U-shaped bracket 1, away from the first electric push rod 5, via a bearing. A clamping disc 7 is threadedly connected to one end of both the first electric push rod 5 and the second electric push rod 6 for clamping and fixing the monocrystalline silicon wafer. A mounting base 8 is provided at the bottom center of the U-shaped bracket 1. A snap-fit ​​seat 9 is snapped onto the top of the mounting base 8. A grinding arc frame 11 is fixedly connected to the top of the snap-fit ​​seat 9. The grinding arc frame 11 is used to chamfer and grind the edge of the clamped monocrystalline silicon wafer.

[0021] Mounting plates 12 are symmetrically attached to both sides of the U-shaped bracket 1. The top of the mounting plate 12 has a mounting groove 13, which can be used to install other auxiliary equipment or make fixed connections, so as to facilitate further expansion of the entire chamfering device or integration with other equipment.

[0022] The snap-fit ​​structure between the U-shaped bracket 1 and the mounting plate 12 is described in detail below. A slot 101 is provided at the bottom of the U-shaped bracket 1. The shape and size of the slot 101 match the mounting plate 12. By snapping the mounting plate 12 into the slot 101, a stable snap-fit ​​between the U-shaped bracket 1 and the mounting plate 12 is achieved, ensuring the structural stability of the entire device.

[0023] The locking structure between the mounting base 8 and the snap-fit ​​base 9 is described in detail below. A threaded seat 801 is provided on the side of the mounting base 8, and a fixing pin 10 is threaded onto the threaded seat 801. After the snap-fit ​​base 9 is engaged in the corresponding position on the mounting base 8, the fixing pin 10 is rotated to penetrate into the gap between the snap-fit ​​base 9 and the mounting base 8, thereby locking the snap-fit ​​base 9 and preventing it from loosening or falling off during use.

[0024] The mounting base 8 has a mating groove 802 on its top, the shape and size of which match the snap-fit ​​base 9. When installing the snap-fit ​​base 9, the snap-fit ​​base 9 is aligned with the mating groove 802 and snapped into it, achieving accurate mating between the mounting base 8 and the snap-fit ​​base 9. This provides a basis for subsequent fixing and locking operations, and also ensures the accurate installation position of the grinding arc frame 11, ensuring the quality of chamfering grinding of the monocrystalline silicon wafer edges.

[0025] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A device for producing edge chamfering of a single crystal silicon wafer, comprising a U-shaped support (1), characterized in that, The inner bottom of the U-shaped support (1) is provided with a fixed motor (2), the output end of the fixed motor (2) is fixedly connected with a driving wheel (3) penetrating through the U-shaped support (1), the top of the U-shaped support (1) is rotatably connected with a driven wheel (4) through a bearing, the driving wheel (3) and the driven wheel (4) are connected through a belt, the first electric push rod (5) is fixedly connected to the output end of the driven wheel (4) penetrating through the U-shaped support (1), the driven wheel (4) is located above the fixed motor (2), the second electric push rod (6) is rotatably connected to the top of the U-shaped support (1) away from the first electric push rod (5) through a bearing, one end of the first electric push rod (5) and the second electric push rod (6) is respectively threadedly connected with a clamping disc (7), the bottom of the U-shaped support (1) is provided with a mounting seat (8) at the middle position, the top of the mounting seat (8) is clamped with a clamping seat (9), and the top of the clamping seat (9) is fixedly connected with a polishing arc frame (11).

2. The device for producing edge chamfering of single crystal silicon wafer according to claim 1, wherein, The two sides of the U-shaped support (1) are symmetrically clamped with mounting plates (12), and the top of the mounting plate (12) is provided with a mounting groove (13).

3. The device for producing edge chamfering of single crystal silicon wafer according to claim 2, characterized in that, The bottom of the U-shaped support (1) is provided with a clamping groove (101), and the clamping groove (101) is matched with the mounting plate (12).

4. The device for producing edge chamfering of single crystal silicon wafer according to claim 1, characterized in that, The side surface of the mounting seat (8) is provided with a threaded seat (801), the threaded seat (801) is threadedly connected with a fixed bolt (10), and the fixed bolt (10) is used for locking.

5. The apparatus for producing a single crystal silicon wafer edge chamfer according to claim 1, wherein The top of the mounting seat (8) is provided with a butt joint groove (802), and the butt joint groove (802) is matched with the clamping seat (9).

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