Anti-oxidation gold stamping film

Abstract

The utility model provides an anti-oxidation gold stamping film which comprises a first anti-oxidation layer, a metal layer and a second anti-oxidation layer, and the metal layer is arranged between the first anti-oxidation layer and the second anti-oxidation layer. The first anti-oxidation layer is configured to prevent impurities on one side, far away from the metal layer, of the first anti-oxidation layer from permeating into the metal layer, and the second anti-oxidation layer is configured to prevent impurities on one side, far away from the metal layer, of the second anti-oxidation layer from permeating into the metal layer. According to the gilding film, sandwich protection on the metal layer is formed through the two anti-oxidation layers, the gilding film has more excellent permeation resistance to water vapor, oxygen and halide, corrosion of sulfur-containing gas is prevented, and the service life is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of film material technology, and in particular to an anti-oxidation hot stamping film. Background Technology

[0002] Hot stamping foil, also known as electroplated aluminum foil, is a hot stamping material made by coating a thin film base with an additional layer of aluminum foil. Hot stamping foil is widely used in industries such as paper products, plastics, cosmetics, artificial leather, textiles, 3C products, home appliances, credit card printing, and bookbinding. In the paper industry, it acts as a special film applied to the surface of printed materials, giving them a metallic sheen. When the hot stamping machine heats the foil, the adhesive layer on the base film melts, and the metallic foil material within the foil adheres to the surface of the printed material, creating the hot stamping effect. Hot stamping foil can be used on various types of printed materials, including publications, covers, and packaging boxes. Furthermore, the hot stamping effect is not limited to black areas in the design. Hot stamping film can also be used for other colors. For example, gold hot stamping effects can be achieved on black, red, blue, yellow, and green parts. When hot stamping film is applied to LCD displays of various sizes, such as TVs, monitors, laptops, tablets, and industrial control systems, it serves as a reflective film in the backlight components. Its main function is to improve the reflectivity of the optical surface, efficiently and losslessly reflecting the light leaking from the bottom of the light guide plate, thereby reducing light loss, reducing power consumption, and improving the light saturation of the liquid crystal display surface. Therefore, hot stamping film is an indispensable and important industrial product.

[0003] Currently, the shortcomings of hot stamping film are gradually becoming apparent with long-term use. Specifically, these shortcomings include: 1. When hot stamping film is used in products such as televisions, flat panels, and monitors as a reflective film in backlight components, the reflectivity of the aluminum plating layer is not high enough, often resulting in poor reflective performance of the product; 2. Its oxidation resistance is not strong enough, making it easily penetrated by water vapor, oxygen, halides, and corroded by sulfur-containing gases, leading to a short lifespan; 3. Before use, the metal layer is easily scratched, causing damage; 4. The traditional hot stamping film production process is cumbersome and inefficient, and the traditional magnetron sputtering coating process results in poor adhesion and low purity of the metal layer. Summary of the Invention

[0004] The present invention aims to solve the above problems and provides an anti-oxidation hot stamping film that can improve oxidation resistance and service life.

[0005] To achieve the above objectives, this utility model provides an anti-oxidation hot stamping film, comprising a first anti-oxidation layer, a metal layer, and a second anti-oxidation layer. The metal layer is disposed between the first anti-oxidation layer and the second anti-oxidation layer. The first anti-oxidation layer is configured to prevent impurities on the side of the first anti-oxidation layer away from the metal layer from penetrating into the metal layer. The second anti-oxidation layer is configured to prevent impurities on the side of the second anti-oxidation layer away from the metal layer from penetrating into the metal layer.

[0006] In this invention, by placing the metal layer between the first anti-oxidation layer and the second anti-oxidation layer, it is possible to reduce the penetration of impurities from the side of the first and second anti-oxidation layers away from the metal layer into the metal layer, thereby reducing the oxidation of the metal layer and improving the oxidation resistance and service life of the hot stamping film.

[0007] In the anti-oxidation hot stamping film involved in this utility model, the metal layer may optionally be at least one of a silver layer, a copper layer, an iron layer, a nickel layer, and a zinc layer.

[0008] In the anti-oxidation hot stamping film involved in this utility model, optionally, the first anti-oxidation layer includes a main adhesive and a corrosion inhibitor, and the second anti-oxidation layer includes a main adhesive and a corrosion inhibitor.

[0009] Optionally, the anti-oxidation hot stamping film involved in this utility model may further include a base film layer, which is disposed on the side of the first anti-oxidation layer away from the metal layer.

[0010] In the anti-oxidation hot stamping film involved in this utility model, the corrosion inhibitor may optionally be octadecyl mercaptan.

[0011] In the anti-oxidation hot stamping film involved in this utility model, the thickness of the metal layer is optionally 0.01 micrometers to 0.1 micrometers.

[0012] In the anti-oxidation hot stamping film involved in this utility model, the thickness of the base film layer is optionally 10 micrometers to 100 micrometers.

[0013] In the anti-oxidation hot stamping film of this utility model, optionally, the base film layer includes a first substrate layer, a first release layer, and a colored layer. The colored layer is disposed on the side of the first anti-oxidation layer away from the metal layer, the first release layer is disposed on the side of the colored layer away from the first anti-oxidation layer, and the first substrate layer is disposed on the side of the first release layer away from the colored layer.

[0014] In the anti-oxidation hot stamping film involved in this utility model, optionally, the thickness of the first substrate layer is 40 micrometers to 60 micrometers.

[0015] In the anti-oxidation hot stamping film involved in this utility model, optionally, the thickness of the first release layer is 1 micrometer to 10 micrometers.

[0016] In the anti-oxidation hot stamping film involved in this utility model, optionally, the thickness of the colored layer is 0.5 micrometers to 2 micrometers.

[0017] Optionally, the anti-oxidation hot stamping film involved in this utility model may further include a protective layer, which is disposed on the side of the second anti-oxidation layer away from the metal layer.

[0018] Optionally, in the anti-oxidation hot stamping film of this utility model, the protective layer includes a second substrate layer, a second release layer and a composite adhesive layer, the composite adhesive layer is bonded to the second anti-oxidation layer, the second release layer is disposed on the side of the composite adhesive layer away from the second anti-oxidation layer, and the second substrate layer is disposed on the side of the second release layer away from the composite adhesive layer.

[0019] In the anti-oxidation hot stamping film of this utility model, optionally, a composite adhesive is coated on the surface of the second release layer to form the composite adhesive layer on the surface of the second release layer.

[0020] In the anti-oxidation hot stamping film involved in this utility model, the composite adhesive may optionally include a composite adhesive main agent, a curing agent, an organic solvent, and an auxiliary agent.

[0021] According to this utility model, an anti-oxidation hot stamping film with improved anti-oxidation properties and service life can be provided. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the description are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the anti-oxidation hot stamping film of this utility model.

[0024] Figure 2 This is a schematic diagram of the structure of Embodiment 2 of the anti-oxidation hot stamping film of this utility model.

[0025] Figure 3 This is a flowchart of Example 1 of the method for preparing anti-oxidation hot stamping film of this utility model.

[0026] Figure 4 This is a flowchart of Example 2 of the method for preparing anti-oxidation hot stamping film of this utility model.

[0027] Reference numerals: 10, base film layer; 11, first substrate layer; 12, first release layer; 13, colored layer; 20, first anti-oxidation layer; 30, metal layer; 40, second anti-oxidation layer; 50, protective layer; 51, composite adhesive layer; 52, second release layer; 53, second substrate layer.

[0028] The following description, in conjunction with embodiments and the accompanying drawings, further illustrates the achievement of the present invention's objectives, functional characteristics, and advantages. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0030] This invention provides an anti-oxidation hot stamping film, which can be transferred to the surface of a target object or printed material by means of heat transfer or adhesion. The anti-oxidation hot stamping film is sometimes simply referred to as hot stamping film. The anti-oxidation hot stamping film of this invention can also be called a high-reflectivity anti-oxidation hot stamping film or a high-reflectivity hot stamping film, etc.

[0031] In some embodiments, the hot stamping film may include a first anti-oxidation layer 20 and a metal layer 30. The first anti-oxidation layer 20 may be disposed on one side of the metal layer 30, and the first anti-oxidation layer 20 may be configured to prevent impurities on the side of the first anti-oxidation layer 20 away from the metal layer 30 from penetrating into the metal layer 30. This reduces the likelihood of the metal layer 30 being oxidized due to impurities on the side of the first anti-oxidation layer 20 away from the metal layer 30 penetrating into the metal layer 30.

[0032] In some embodiments, the hot stamping film may further include a second anti-oxidation layer 40. The second anti-oxidation layer 40 may be disposed on the other side of the metal layer 30 (i.e., the side of the metal layer 30 away from the first anti-oxidation layer 20), and the second anti-oxidation layer 40 may be configured to prevent impurities on the side of the second anti-oxidation layer 40 away from the metal layer 30 from penetrating into the metal layer 30. This reduces the likelihood of impurities on the side of the second anti-oxidation layer 40 away from the metal layer 30 penetrating into the metal layer 30 and causing oxidation of the metal layer 30.

[0033] In some embodiments, the first anti-oxidation layer 20 may include a main adhesive and a corrosion inhibitor. In some embodiments, the main adhesive and the corrosion inhibitor may be added to a mixer and stirred to form a viscous, slurry-like first anti-oxidation adhesive. The first anti-oxidation layer 20 may be prepared using the first anti-oxidation adhesive.

[0034] In some embodiments, the thickness of the first anti-oxidation layer 20 can be from 1 micrometer to 10 micrometers. Preferably, the thickness of the first anti-oxidation layer 20 can be 5 micrometers.

[0035] In some embodiments, the metal layer 30 may be at least one of a silver layer, a copper layer, an iron layer, a nickel layer, and a zinc layer.

[0036] In some embodiments, the metal layer 30 can be a single layer or multiple layers. The single-layer metal layer 30 can be one of a silver layer, a copper layer, an iron layer, a nickel layer, and a zinc layer. The multi-layer metal layer can be formed by stacking at least two of a silver layer, a copper layer, an iron layer, a nickel layer, and a zinc layer.

[0037] In some embodiments, the thickness of the metal layer 30 can be 0.01 to 0.1 micrometers. Preferably, the thickness of the metal layer can be 0.05 micrometers.

[0038] In some embodiments, the metal layer 30 can be prepared using an e-book evaporation coating process.

[0039] In some embodiments, the second anti-oxidation layer 40 may include a main adhesive and a corrosion inhibitor. In some embodiments, the main adhesive and the corrosion inhibitor may be added to a mixer and stirred to form a viscous, slurry-like second anti-oxidation adhesive. The second anti-oxidation layer 40 may be prepared using the second anti-oxidation adhesive.

[0040] In some embodiments, the components of the first anti-oxidation layer 20 and the second anti-oxidation layer 40 may be the same, for example, both may be the main adhesive and corrosion inhibitor as described above. In other embodiments, the components of the first anti-oxidation layer 20 and the second anti-oxidation layer 40 may also be different.

[0041] In this invention, the metal layer 30 is preferably a silver layer. The thickness of the silver layer can be 0.05 micrometers. The advantages of combining a silver layer and an antioxidant layer will be explained below, using silver as an example of metal layer 30.

[0042] In some embodiments, octadecyl mercaptan can be used as the corrosion inhibitor. The corrosion inhibitor can react with the silver layer to form a self-assembled monolayer (SAM). The self-assembled monolayer can effectively protect the silver surface, prevent silver sulfidation and corrosion, maintain the color, luster and reflectivity of silver, and has high protection efficiency and good durability.

[0043] Specifically, the corrosion inhibitor can complex with the silver atoms in the silver layer through sulfur atoms in its molecules to form a dense hydrophobic layer. This hydrophobic layer prevents moisture, oxygen, and halides from penetrating into the silver layer from the external environment (the side of the first anti-oxidation layer 20 and / or the second anti-oxidation layer 40 away from the silver layer). This reduces the likelihood of moisture, oxygen, and halides penetrating into the silver layer and reacting chemically or physically with it, leading to oxidation of the silver layer. Furthermore, due to the formation of the anti-oxidation layer or hydrophobic layer, the first anti-oxidation layer 20 and the similarly formed second anti-oxidation layer 40 exhibit superior resistance to moisture, oxygen, and halides, and can also prevent corrosion from sulfur-containing gases, thereby extending the service life of the hot stamping film.

[0044] In some embodiments, the host adhesive can be a natural or synthetic, organic or inorganic substance that bonds two or more parts or materials together through interfacial adhesion and cohesion. The raw materials for the host adhesive can be various resins, rubbers, and natural polymer compounds.

[0045] In some embodiments, the hot stamping film may include a base film layer 10. The base film layer 10 may be configured to serve as a substrate for fabricating the hot stamping film. The base film layer 10 may be disposed on the side of the first anti-oxidation layer 20 away from the metal layer 30.

[0046] In some embodiments, the base film layer 10 can be peeled off during use of the hot stamping film.

[0047] In some embodiments, a first anti-oxidation adhesive can be coated on the surface of the base film layer 10, and after the first anti-oxidation adhesive has cured, a first anti-oxidation layer 20 is formed on the surface of the base film layer 10.

[0048] In some embodiments, the base film layer 10 may include a first substrate layer 11, a first release layer 12, and a colored layer 13. The colored layer 13 may be disposed on the side of the first anti-oxidation layer 20 away from the metal layer 30. The first release layer 12 may be disposed on the side of the colored layer 13 away from the first anti-oxidation layer 20, and the first substrate layer 11 may be disposed on the side of the first release layer 12 away from the colored layer 13. The colored layer 13 may be made using a dye with high light transmittance. The metal layer 30 may be used to reflect incident light to achieve the metallic texture of the hot stamping film.

[0049] In some embodiments, the first release layer 12 may be formed by applying a release agent between the first substrate layer 11 and the colored layer 13. The first release layer 12 may be formed by applying a release agent to the first substrate layer 11.

[0050] In some embodiments, the hot stamping film can be peeled off the first substrate layer 11 by the glass action of the first release layer 12 during use.

[0051] In some embodiments, the material of the first substrate layer 11 may be PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), PVC (polyvinyl chloride), PBT (polybutylene terephthalate), PEF (polyvinyl furanate), PU (polyurethane), etc.

[0052] In some embodiments, a first anti-oxidation adhesive may be applied to the surface of the colored layer 13, and after the first anti-oxidation adhesive has cured, a first anti-oxidation layer 20 is formed on the colored layer 13.

[0053] In some embodiments, the thickness of the base film layer 10 can be from 10 micrometers to 100 micrometers. Preferably, the thickness of the base film layer 10 can be 50 micrometers.

[0054] In some embodiments, the thickness of the first substrate layer 11 can be from 40 micrometers to 60 micrometers. Preferably, the thickness of the first substrate layer 11 can be 45 micrometers.

[0055] In some embodiments, the thickness of the first release layer 12 can be from 1 micrometer to 10 micrometers. Preferably, the thickness of the first release layer 12 can be 4 micrometers.

[0056] In some embodiments, the thickness of the colored layer 13 can be from 0.5 micrometers to 2 micrometers. Preferably, the thickness of the colored layer 13 can be 1 micrometer.

[0057] In this invention, by providing a first anti-oxidation layer 20, it is possible to reduce the entry of impurities such as air and moisture into the porous colored layer 13 and into the metal layer, thereby reducing the oxidation of the metal layer.

[0058] In some embodiments, the hot stamping film may include a protective layer 50. The protective layer 50 may be configured as the outermost layer of the hot stamping film to reduce damage to the film, for example, to prevent scratches and abrasions during transport. When the hot stamping film is applied to a target object, the protective layer 50 may be attached to the target object. The protective layer 50 may be disposed on the side of the second anti-oxidation layer 40 away from the metal layer 30.

[0059] In some embodiments, the protective layer 50 may include a second substrate layer 53, a second release layer 52, and a composite adhesive layer 53. The composite adhesive layer 53 may be bonded to the second anti-oxidation layer 40. The second release layer 52 may be disposed between the second substrate layer 53 and the composite adhesive layer 53.

[0060] In some embodiments, a release agent may be applied to one side of the second substrate layer 53 to form a second release layer 52 on one side of the second substrate layer 53. Then, a composite adhesive may be applied to the side of the second release layer 52 away from the second substrate layer 53 to form a composite adhesive layer 53 on one side of the second release layer 52.

[0061] In some embodiments, the material of the second substrate layer 53 may be PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), PVC (polyvinyl chloride), PBT (polybutylene terephthalate), PEF (polyvinyl furanate), PU (polyurethane), etc.

[0062] In some embodiments, the composite adhesive layer 53 may be prepared from a composite adhesive base, a curing agent, an organic solvent, and additives.

[0063] In some embodiments, the main component of the composite adhesive can be acrylic resin; the curing agent can be toluene diisocyanate; the organic solvent can be ethyl acetate; and the additive can be a leveling agent.

[0064] In some embodiments, acrylic resin, toluene diisocyanate, ethyl acetate, and leveling agent can be selected in a weight ratio of 100:4:100:15. The acrylic resin, toluene diisocyanate, ethyl acetate, and leveling agent are added to a mixer and stirred to form a viscous, slurry-like composite adhesive. Composite adhesive layer 53 can be prepared using this composite adhesive.

[0065] In some embodiments, the composite adhesive layer 53 of the protective layer 50 can be bonded to the second anti-oxidation layer 40. This allows the adhesive properties of the composite adhesive layer 53 to ensure a tight bond between the protective layer 50 and the second anti-oxidation layer 40.

[0066] In some embodiments, the hot stamping film can be adhered to the target object by means of the adhesive properties of the composite adhesive layer 53. In other words, when using the hot stamping film, the second substrate layer 53 and the second release layer 52 can be peeled off by means of the easy peeling properties of the second release layer 52, and then the hot stamping film can be adhered to the target object by means of the adhesive properties of the composite adhesive layer 53.

[0067] In this invention, by providing a second anti-oxidation layer, impurities such as air and moisture can be prevented from penetrating the porous composite adhesive layer 53 and entering the metal layer 30, thereby reducing the oxidation of the metal layer 30.

[0068] Example 1:

[0069] like Figure 3 As shown, this utility model provides a method for preparing an anti-oxidation hot stamping film, which can be simply referred to as the preparation method.

[0070] In some embodiments, the preparation method may include step S100, preparing a first anti-oxidation layer 20.

[0071] In some embodiments, step S100 (i.e., the preparation process of the first anti-oxidation layer 20) may include step S110, preparing the first anti-oxidation adhesive. Specifically, a main adhesive and a corrosion inhibitor may be obtained and stirred to form the first anti-oxidation adhesive.

[0072] In some embodiments, the main adhesive and corrosion inhibitor can be obtained in a ratio of 20:1 by weight.

[0073] In some embodiments, the main adhesive and corrosion inhibitor may be added to a mixer and dispersed and stirred for 10 minutes to form a viscous, slurry-like first anti-oxidation adhesive.

[0074] In some embodiments, step S100 may include step S120, coating the surface of the base film layer 10 with a first anti-oxidation adhesive to form a first anti-oxidation layer 20 on the surface of the base film layer 10.

[0075] In some embodiments, the thickness of the first anti-oxidation layer 20 may be 5 micrometers.

[0076] In some embodiments, the main component of the main adhesive may be epoxy resin.

[0077] In some embodiments, the metal layer 30 may be a silver layer.

[0078] In some embodiments, octadecyl mercaptan can be selected as the corrosion inhibitor. The corrosion inhibitor can form an antioxidant layer at the interface between the main adhesive and the silver layer. The corrosion inhibitor can complex with the silver atoms in the silver layer through sulfur atoms in the molecule to form a dense hydrophobic layer. The hydrophobic layer can prevent water vapor, oxygen, and halides from outside the silver layer from penetrating into the silver layer. The hydrophobic layer can prevent water vapor, oxygen, and halides in the external environment (the side of the first antioxidant layer 20 and / or the second antioxidant layer 40 away from the silver layer) from penetrating into the silver layer, thereby reducing the possibility of water vapor, oxygen, and halides penetrating into the silver layer and reacting with the silver layer chemically or physically, leading to the oxidation of the silver layer. In addition, due to the formation of the antioxidant layer or the hydrophobic layer, the first antioxidant layer 20 and the similarly formed second antioxidant layer 40 have better anti-penetration performance against water vapor, oxygen, and halides, and can prevent corrosion from sulfur-containing gases, thereby extending the service life of the hot stamping film.

[0079] In some embodiments, the host adhesive can be a natural or synthetic, organic or inorganic substance that bonds two or more parts or materials together through interfacial adhesion and cohesion. The raw materials for the host adhesive can be various resins, rubbers, and natural polymer compounds.

[0080] In some embodiments, the preparation method may include step S200, evaporating a film on the surface of the first anti-oxidation layer 20 to form a metal layer 30 on the surface of the first anti-oxidation layer 20.

[0081] In some embodiments, step S200 (i.e., the preparation step of metal layer 30) may include step S210, in which the prepared first semi-finished substrate is placed in the vacuum chamber of the electron beam evaporation coating apparatus, and the vacuum chamber is evacuated. The first semi-finished substrate is the collective term for the first anti-oxidation layer 20 and the base film layer 10 after bonding.

[0082] In some embodiments, the vacuum level of the vacuum chamber can reach 7.2 × 10⁻³ Pa. Specifically, it is necessary to ensure that the vacuum level of the vacuum chamber is not lower than 7 × 10⁻³ Pa. In this process, by controlling a higher vacuum level, the energy loss of the electron beam can be reduced, and breakdown due to gas discharge can be prevented, thereby preventing damage to the electron beam evaporation coating device.

[0083] Vacuum degree refers to the degree of rarefaction of gas in a vacuum state. If the pressure inside the measuring device is lower than atmospheric pressure, a vacuum gauge is required for pressure measurement. The value read from the vacuum gauge is called the vacuum degree. The vacuum degree value indicates that the actual pressure of the system is lower than atmospheric pressure, that is: Vacuum degree = Atmospheric pressure - Absolute pressure; Pa stands for Pascal, which is the basic unit of pressure in the International System of Units (SI).

[0084] In some embodiments, step S200 may include step S210, preheating the electron gun filament cathode of the electron beam evaporation coating apparatus, scanning the metal target with the electron beam, pre-melting the metal target for 30 minutes, and finally bringing the metal target to a molten state.

[0085] Specifically, the current at the electron gun filament cathode of the electron beam evaporation coating apparatus is increased from 10 amps to 26 amps within 6 minutes, while the secondary high voltage of the electron gun filament is raised to 900 volts. After the electron gun filament preheats, the current is maintained at 26 amps, the secondary high voltage is lowered to 500 volts, and the main high voltage is raised to 30 kV with a main high voltage current of 0.03 amps. The electron beam is then focused onto the center of the crucible containing the metal target. At this point, the electron beam scanning range is on the metal target in the crucible. The electron gun power is adjusted to 36 kilowatts, and the electron beam scans the metal target in the crucible, allowing the metal target to pre-melt for 30 minutes until it reaches a molten state. At this point, the electron beam power is maintained at no less than 36 kilowatts to ensure the metal target reaches a molten state in the crucible. This allows the metal target to rapidly vaporize during the subsequent coating process, which is beneficial for electron beam evaporation silver plating. After the metal target is pre-melted, the electron gun filament can be kept in a preheated state by controlling the current and the secondary high voltage.

[0086] In some embodiments, step S200 may include step S230, focusing the electron beam scanning range onto the first semi-finished substrate, and scanning the first semi-finished substrate with an electron beam to preheat the semi-finished substrate to 100°C.

[0087] Specifically, the electron beam scanning power can be 36 kW, and the scanning time for the first semi-finished substrate can be 1 minute. The first semi-finished substrate can rotate during the scanning process, with a rotation speed of 16 revolutions per minute. This allows the surface of the first semi-finished substrate to be scanned alternately. By controlling the electron beam scanning power, the first semi-finished substrate can be scanned with a high energy density electron beam. When the surface temperature of the first semi-finished substrate rises above the vaporization temperature of impurities on the substrate surface, these impurities can be evaporated and removed. Furthermore, preheating the first semi-finished substrate reduces stress in subsequent coating processes, increases the activation energy of the deposition reaction, and enhances the adhesion of the metal layer. After scanning, the first semi-finished substrate can be preheated to 100°C, thereby increasing the bonding force between the metal layer and the first anti-oxidation layer 20. This production process is simple to operate and highly efficient. In addition, the first semi-finished substrate is kept rotating during the scanning process. By controlling the rotation speed, the surfaces of the base film layer 10 and the first anti-oxidation layer 20 can be scanned alternately. The scanning time is relatively short and will not exceed the phase transition temperature and melting point temperature of the base film layer 10 and the first anti-oxidation layer 20, thereby avoiding deformation of the base film layer 10 and the first anti-oxidation layer 20 due to excessive temperature.

[0088] In some embodiments, step S200 may include step S240, adjusting the electron beam scanning range to the molten metal target and performing electron beam evaporation coating.

[0089] In some embodiments, the evaporated metal can be uniformly attached to the surface of the first anti-oxidation layer 20 to form a metal layer 30 on the surface of the first anti-oxidation layer 20.

[0090] Specifically, the vacuum chamber of the electron beam evaporation coating apparatus can be 7.2 × 10⁻⁶. -3 Under a vacuum of Pa, the electron beam scanning range is adjusted to the molten metal target, and the electron beam power is increased to 40 kW for electron beam evaporation coating, allowing the molten metal to evaporate for 10 minutes. During this process, the thickness of the metal layer 30 formed by electron beam evaporation coating can be controlled by adjusting the electron beam power.

[0091] In some embodiments, the thickness of the metal layer 30 may be 0.05 micrometers.

[0092] In some embodiments, step S200 may include step S250, cooling the second semi-finished substrate to room temperature and then removing the second semi-finished substrate from the vacuum chamber. The first semi-finished substrate coated with the metal layer 30 is the second semi-finished substrate.

[0093] Specifically, the metal layer 30 is formed using electron beam evaporation deposition. High-speed electrons bombard a metal target within a crucible, converting the electrons' kinetic energy into heat energy, causing the metal target to evaporate and deposit into the metal layer 30. Compared to traditional magnetron sputtering deposition, the metal layer 30 produced by electron beam evaporation deposition exhibits better adhesion, higher purity, and higher reliability, and is not susceptible to oxidation due to environmental water and oxygen. High reliability refers to the absence of oxidation or film peeling in the metal layer 30 after 1000 hours of high temperature and high humidity (65℃ / 95%RH), where %RH refers to relative humidity.

[0094] In some embodiments, the preparation method may include step S300, preparing a second anti-oxidation adhesive, applying the second anti-oxidation adhesive to the side of the metal layer 30 away from the first anti-oxidation layer 20, and curing the second anti-oxidation adhesive to form a second anti-oxidation layer 40 on the surface of the metal layer 30.

[0095] In some embodiments, the preparation process of the second anti-oxidation layer 40 can be the same as that of the first anti-oxidation layer 20.

[0096] In some embodiments, step S300 (i.e. the preparation process of the second anti-oxidation layer 40) may include step S310, obtaining the main adhesive and corrosion inhibitor, and stirring to form a viscous, slurry-like second anti-oxidation adhesive.

[0097] In some embodiments, the main adhesive and corrosion inhibitor can be obtained in a ratio of 20:1 by weight.

[0098] In some embodiments, the main adhesive and corrosion inhibitor can be added to a mixer and dispersed and stirred for 10 minutes to form a viscous, slurry-like second anti-oxidation adhesive.

[0099] Similarly, an antioxidant layer or a hydrophobic layer can be generated in the second anti-oxidation layer 40.

[0100] In some embodiments, the thickness of the second anti-oxidation layer 40 may be 5 micrometers.

[0101] Reference Figure 4 In some embodiments, the preparation method may include step S400, preparing a protective layer 50.

[0102] In some embodiments, the protective layer 50 may include a second substrate layer 53, a second release layer 52, and a composite adhesive layer 53.

[0103] In some embodiments, a composite adhesive may be formulated and applied to the surface of the second release layer 52 away from the second substrate layer 53 to form a composite adhesive layer 53 on the surface of the second release layer 52.

[0104] Specifically, in some embodiments, step S400 may include step S410, selecting the composite adhesive main agent, curing agent, organic solvent and additives.

[0105] In some embodiments, the main component of the composite adhesive can be acrylic resin, the curing agent can be toluene diisocyanate, the organic solvent can be ethyl acetate, and the additive can be a leveling agent.

[0106] In some embodiments, acrylic resin, toluene diisocyanate, ethyl acetate, and leveling agent may be selected in a weight ratio of 100:4:100:15. The acrylic resin, toluene diisocyanate, ethyl acetate, and leveling agent are added to a mixer and dispersed and stirred for 10 minutes to form a viscous, slurry-like composite adhesive.

[0107] In some embodiments, step S400 may include step 420, in which a composite adhesive may be applied to the surface of the second release layer 52 away from the second substrate layer 53 to form a composite adhesive layer 51 on the surface of the second release layer 52, and the composite adhesive layer 51 may be baked to a semi-dry state at room temperature.

[0108] In some embodiments, when using the hot stamping film, the second substrate layer 53 and the second release layer 52 can be peeled off first by the peeling action of the second release layer 52, and then the hot stamping film can be adhered to the target object by utilizing the adhesive properties of the composite adhesive layer 51. The composite adhesive layer 51 has strong adhesive properties, which can be used to adhere the hot stamping film to the target object.

[0109] Specifically, the second anti-oxidation layer 40 can be bonded to the composite adhesive layer 51 of the protective layer 50.

[0110] In some embodiments, the thickness of the second substrate layer 53 may be 45 micrometers or 65 micrometers.

[0111] In some embodiments, the thickness of the composite adhesive layer 51 may be 5 micrometers or 10 micrometers.

[0112] In other words, the thickness of the protective layer 50 can be 50 micrometers or 75 micrometers.

[0113] In some embodiments, the preparation method may include step S500, preparing a base film layer 10.

[0114] In some embodiments, a first anti-oxidation adhesive may be applied to the surface of the base film layer 10 and cured to form a first anti-oxidation layer 20 on the surface of the base film layer 10.

[0115] In some embodiments, the base film layer 10 may include a first substrate layer 11, a first release layer 12, and a colored layer 13. The colored layer 13 may be disposed on the side of the first anti-oxidation layer 20 away from the metal layer 30, the first release layer 12 may be disposed on the side of the colored layer 13 away from the first anti-oxidation layer 20, and the first substrate layer 11 may be disposed on the side of the first release layer 12 away from the colored layer 13.

[0116] In some embodiments, step S500 (method of preparing base film layer 10) may include step S510, preparing a colored layer 13, and forming the colored layer 13 on the side of the first release layer 12 away from the first substrate layer 11.

[0117] In some embodiments, the colored layer 13 may be prepared from dyes and synthetic resins.

[0118] In some embodiments, the synthetic resin may include polyurethane, acrylic resin, epoxy resin, etc.

[0119] In some embodiments, the method for preparing the colored layer 13 may include: mixing dye and synthetic resin in a certain proportion to form a colored solution, ensuring that the dye is uniformly dispersed in the resin; coating the side of the first release layer 12 away from the first substrate layer 11 with a colored solvent to form the colored layer 13 on the first release layer 12.

[0120] In some embodiments, step S500 (method of preparing base film layer 10) may include step S510, applying a release agent to one side of the first substrate layer 11 to form a first release layer 12 on the first substrate layer 11.

[0121] In some embodiments, a first anti-oxidation adhesive can be applied to the surface of the colored layer 13 to form a first anti-oxidation layer 20 on the surface of the colored layer 13, and the colored layer 13 and the first anti-oxidation layer 20 can be dried and cured at room temperature.

[0122] In some embodiments, the thickness of the base film layer 10 may be 50 micrometers.

[0123] In some embodiments, the thickness of the first substrate layer 11 may be 45 micrometers.

[0124] In some embodiments, the thickness of the first release layer 12 may be 4 micrometers.

[0125] In some embodiments, the thickness of the colored layer 13 may be 1 micrometer.

[0126] In some embodiments, the preparation method may include step S600, which involves curing the finished product at room temperature for four days to solidify it.

[0127] The present invention discloses a high reflectivity anti-oxidation hot stamping film, which may include, from bottom to top, a base film layer 10, a first anti-oxidation layer 20, a metal layer 30, a second anti-oxidation layer 40, and a protective layer 50.

[0128] In this invention, the metal layer 30 is sandwiched between the first anti-oxidation layer 20 and the second anti-oxidation layer 40. The first anti-oxidation layer 20 and the second anti-oxidation layer 40 are respectively formed with an anti-oxidation layer and a hydrophobic layer, thereby effectively preventing external water vapor, oxygen and halides from penetrating into the metal layer 30, and also preventing corrosion from sulfur-containing gases.

[0129] In addition, the first anti-oxidation layer 20 and the second anti-oxidation layer 40 are sandwiched between the base film layer 10 and the protective layer 50, thereby ensuring that the hot stamping film is not easily scratched or damaged before use.

[0130] The first substrate layer 11 and the second substrate layer 53 can be made of PET plastic raw materials, such as polyethylene terephthalate. The advantages of PET plastic raw materials are: 1. Good mechanical properties, with impact strength 3-5 times that of other films, and good folding resistance; 2. Resistant to oil, grease, dilute acids, and dilute alkalis, and resistant to most solvents; 3. Excellent high and low temperature resistance, capable of long-term use within a temperature range of 120℃, short-term use at 150℃, and resistance to -70℃, with minimal impact on mechanical properties at high and low temperatures; 4. Low gas and water vapor permeability, providing excellent barrier properties against gas, water, oil, and odors; 5. High transparency, blocking ultraviolet rays, good gloss; non-toxic, odorless, and with good hygiene and safety.

[0131] Specifically, the first substrate layer 11 and the second substrate layer 53 can provide excellent protection for the first anti-oxidation layer 20, the metal layer 30 and the second anti-oxidation layer 40, and can protect the metal layer 30 from scratches and damage.

[0132] In some embodiments, the light transmittance of the first substrate layer 11 and the second substrate layer 53 can be greater than or equal to 90%. In this case, the high light transmittance of the first substrate layer 11 and the second substrate layer 53 can be used to ensure that they do not affect the reflectivity of the metal layer 30.

[0133] Aluminum has a reflectivity of about 80%, while silver has a reflectivity of about 95%, so a silver plating layer has a higher reflectivity than an aluminum plating layer.

[0134] Therefore, this invention performs better when used as a reflective film in a backlight component. Secondly, as a raw material for anti-counterfeiting labels, this invention utilizes laser color holographic plate-making technology and precision molding technology to produce anti-counterfeiting labels that are precisely positioned, beautifully patterned, unique, highly resistant to counterfeiting, and colorful. Compared to ordinary full-page hot stamping film, this invention offers superior anti-counterfeiting technology and higher anti-counterfeiting effectiveness.

[0135] The materials of the first substrate layer 11 and the second substrate layer 53 may be selected from at least one of polyethylene terephthalate, polymethyl methacrylate, polycarbonate, polyamide, polyimide, or polystyrene.

[0136] In some embodiments, the thickness of the base film layer can be 50 micrometers, the thickness of the first anti-oxidation layer can be 5 micrometers, the thickness of the metal layer can be 0.05 micrometers, the thickness of the second anti-oxidation layer can be 5 micrometers, and the thickness of the protective layer 50 can be 50 micrometers or 75 micrometers.

[0137] Example 2:

[0138] The difference between Example 2 and Example 1 lies in the thickness of each layer of the high-reflectivity anti-oxidation hot stamping film. According to the method principle of Example 1, the high-reflectivity anti-oxidation hot stamping film produced in Example 2 has a base film layer thickness of 50 micrometers, a first anti-oxidation layer thickness of 7 micrometers, a metal layer thickness of 0.08 micrometers, a second anti-oxidation layer thickness of 7 micrometers, and a protective layer thickness of 50 of 50 micrometers or 75 micrometers.

[0139] Example 3:

[0140] The difference between Example 3 and Example 1 lies in the thickness of each layer of the high-reflectivity anti-oxidation hot stamping film. According to the method principle of Example 1, the high-reflectivity anti-oxidation hot stamping film produced in Example 3 has a base film layer thickness of 50 micrometers, a first anti-oxidation layer thickness of 8 micrometers, a metal layer thickness of 0.12 micrometers, a second anti-oxidation layer thickness of 8 micrometers, and a protective layer thickness of 50 micrometers or 75 micrometers.

[0141] The following are specific embodiments and comparative examples, and their detailed formulations are shown in Table 1.

[0142] Table 1

[0143]

[0144] The performance test was conducted, and the results are shown in Table 2 below.

[0145] Table 2

[0146]

[0147] As can be seen from Tables 1 and 2, the high-reflectivity anti-oxidation hot stamping films prepared in the above three embodiments all exhibit excellent performance in terms of water vapor, oxygen, halide permeability, sulfur-containing gas corrosion resistance, and reflectivity.

[0148] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. An oxidation-preventing gilding film, characterized by, The metal layer is at least one of a silver layer, a copper layer, an iron layer, a nickel layer, and a zinc layer.

2. The oxidation-preventing gilding film according to claim 1, wherein The first oxidation-preventing layer includes a main adhesive and a corrosion inhibitor, and the second oxidation-preventing layer includes a main adhesive and a corrosion inhibitor.

3. The oxidation-preventive stamping film according to claim 1, wherein The base film layer is disposed on a side of the first oxidation-preventing layer away from the metal layer.

4. The oxidation-preventive stamping film according to claim 1, wherein The corrosion inhibitor is octadecane mercaptan.

5. The oxidation-preventive stamping film according to claim 3, wherein The base film layer includes a first base material layer, a first release layer, and a colored layer, the colored layer is disposed on a side of the first oxidation-preventing layer away from the metal layer, the first release layer is disposed on a side of the colored layer away from the first oxidation-preventing layer, and the first base material layer is disposed on a side of the first release layer away from the colored layer.

6. The oxidation-preventive gilding film according to claim 4, wherein The protection layer includes a second base material layer, a second release layer, and a composite adhesive layer, the composite adhesive layer is attached to the second oxidation-preventing layer, the second release layer is disposed on a side of the composite adhesive layer away from the second oxidation-preventing layer, and the second base material layer is disposed on a side of the second release layer away from the composite adhesive layer.

7. The oxidation-preventive stamping film according to claim 1, wherein The composite adhesive layer is coated on a surface of the second release layer to form the composite adhesive layer on the surface of the second release layer.

8. The oxidation-preventive gilding film according to claim 7, wherein The composite adhesive includes a composite adhesive main agent, a curing agent, an organic solvent, and an auxiliary agent.

9. The oxidation-preventive gilding film according to claim 8, wherein ​ 10. The oxidation-preventive gilding film according to claim 9, wherein ​

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