Backlight fantasy lamp strip
By combining a flexible circuit board and PET film structure with specific levels of electrical and mechanical design, the problems of bending and shaping of backlight strips have been solved, achieving the visual effects and reliability requirements of high-end audio equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-14
- Publication Date
- 2026-03-06
AI Technical Summary
Existing backlit ambient light strips have problems with bending and shaping, making it difficult to meet the visual effects and reliability requirements of high-end audio equipment.
The design employs a combination of flexible circuit board and PET film, which is fixed by adhesive layer bonding. The combination of mask solder resist layer, copper foil circuit layer and PI film insulation layer ensures electrical connection and mechanical strength. The lamp bead is electrically connected to the copper foil circuit layer through solder layer, and the solder feet are stably soldered to the copper foil circuit layer.
The bending adaptability and arc support of the backlit color strip have been improved, the overall strength and stability of the strip have been enhanced, production costs have been reduced, and the lighting atmosphere effect has been improved.
Smart Images
Figure CN223975944U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of audio equipment accessories, specifically to a backlit color-changing light strip. Background Technology
[0002] With the rapid development of the audio industry, users' demands for the visual experience of products are increasing, prompting manufacturers to pay more attention to the design and innovation of ambient lighting while improving sound quality.
[0003] Currently, mainstream backlit ambient light strips are mainly achieved through two processes: one is by mounting iridescent LEDs on a single-sided FR4 rigid substrate, and the other is by integrating LEDs using a double-sided flexible printed circuit board (FPC). However, with the development of the audio industry, speaker shapes are becoming increasingly personalized, with many irregularly shaped speakers. This directly leads to increasingly higher requirements for the bending angle and curvature support of the backlit ambient light strips. When using single-sided FR4, the existing process is prone to FR4 board breakage when the bending curvature is too large or too numerous, resulting in abnormalities during installation and affecting the reliability and lifespan of the product. When using double-sided FPC flexible boards, the board is prone to deformation and cannot be shaped, resulting in a lack of curvature support and a significant reduction in the lighting atmosphere effect, failing to meet the visual requirements of high-end audio equipment. Utility Model Content
[0004] The purpose of this invention is to provide a backlit iridescent light strip that has the advantages of improved bending adaptability and enhanced arc support.
[0005] The technical solution adopted by this utility model is: a backlit color-changing light strip, comprising a flexible circuit board, a plurality of LED beads evenly disposed on one side of the flexible circuit board, and a PET film disposed on the other side of the flexible circuit board. An adhesive layer is provided between the PET film and the flexible circuit board, and the PET film is bonded and fixed to the flexible circuit board by the adhesive layer.
[0006] Optionally, the flexible circuit board includes a mask solder resist layer, a copper foil circuit layer, and a PI film insulating layer arranged sequentially from top to bottom. The mask solder resist layer has through holes, and a solder layer is provided in the through holes. The LED bead is electrically connected to the copper foil circuit layer through the solder layer.
[0007] Optionally, each of the four corners of the LED bead is provided with a solder foot, the number of through holes corresponds one-to-one with the number of solder feet, and the solder feet are soldered to the copper foil circuit layer through the solder layer.
[0008] Optionally, the adhesive layer is an acrylic double-sided adhesive layer.
[0009] Optionally, the thickness of the PET film is 0.1 mm to 0.3 mm.
[0010] Optionally, the thickness of the flexible circuit board is 0.1 mm to 0.15 mm.
[0011] Optionally, the thickness of the adhesive layer is 60 μm to 80 μm.
[0012] Optionally, the thickness of the mask solder resist layer is 30 μm to 60 μm.
[0013] Optionally, the thickness of the copper foil circuit layer is 15 μm to 30 μm.
[0014] Optionally, the thickness of the PI film insulating layer is 25 μm to 35 μm.
[0015] As described above, the backlight strip provided in this application includes a flexible circuit board, a plurality of LEDs evenly arranged on one side of the flexible circuit board, and a PET film disposed on the other side of the flexible circuit board. An adhesive layer is provided between the PET film and the flexible circuit board, and the PET film is bonded and fixed to the flexible circuit board through the adhesive layer. This structural design, through the combination of the flexible circuit board and the PET film, effectively solves the problems of bending and shaping in existing backlight strips, while improving the overall strength and stability of the strip. The structure is simple and compact, reducing production costs and facilitating market promotion. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the overall structure of this embodiment;
[0018] Figure 2 This is an exploded view of this embodiment;
[0019] Figure 3 This is a schematic diagram illustrating the assembly relationship between the LED beads, the mask solder resist layer, the copper foil circuit layer, and the PI film insulating layer in this embodiment.
[0020] Explanation of reference numerals in the attached figures: 10, Flexible circuit board; 11, Mask solder resist layer; 111, Through hole; 12, Copper foil circuit layer; 13, PI film insulating layer; 20, LED bead; 21, Solder lead; 30, PET film; 40, Adhesive layer; 50, Solder layer. Detailed Implementation
[0021] The following will refer to the appendix in the embodiments of this utility model. Figures 1 to 3The technical solutions in the embodiments of this utility model are clearly and completely described herein. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.
[0022] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0023] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0024] This embodiment relates to a backlit color-changing light strip, as shown in the reference... Figure 1 and Figure 2 The device includes a flexible circuit board 10, a plurality of LED beads 20 evenly disposed on one side of the flexible circuit board 10, and a PET film 30 disposed on the other side of the flexible circuit board 10. An adhesive layer 40 is provided between the PET film 30 and the flexible circuit board 10, and the PET film 30 is bonded and fixed to the flexible circuit board 10 by the adhesive layer 40. In this embodiment, the LED beads 20 are ambient LED beads.
[0025] This application adopts a combination structure of flexible circuit board 10 and PET film 30, and the two are bonded and fixed by adhesive layer 40. This not only solves the problem that single-sided FR4 substrate is easy to break in the prior art, but also avoids the defect that double-sided FPC flexible board cannot be plasticized after deformation. This allows it to better adapt to the personalized design needs of audio equipment and enhance the lighting atmosphere effect.
[0026] Furthermore, referring to Figure 2 and Figure 3The flexible circuit board 10 includes a mask solder resist layer 11, a copper foil circuit layer 12 and a PI film insulating layer 13 arranged sequentially from top to bottom. The mask solder resist layer 11 has through holes 111 and a solder layer 50 is provided in the through holes 111. The LED bead 20 is electrically connected to the copper foil circuit layer 12 through the solder layer 50.
[0027] The combination of the mask solder resist layer 11, the copper foil circuit layer 12, and the PI film insulating layer 13 provides sufficient mechanical strength and electrical performance. The design of the through-hole 111 allows the solder layer 50 to effectively connect the LED chip 20 and the copper foil circuit layer 12, thereby ensuring the reliability of the electrical connection.
[0028] The design of having a solder layer 50 within the through-hole 111 can be achieved in several ways. For example, the solder layer 50 can be formed using a conventional through-hole 111 electroplating process, or it can be filled with conductive adhesive. The material of the solder layer 50 can be common solder or other conductive materials to ensure good electrical connection and mechanical strength. These methods enable a stable connection between the LED chip 20 and the copper foil circuit layer 12, thereby improving product reliability and lifespan.
[0029] Furthermore, referring to Figure 2 and Figure 3 Each of the four corners of the LED bead 20 is provided with a solder foot 21. The number of through holes 111 corresponds one-to-one with the number of solder feet 21, and the solder feet 21 are soldered to the copper foil circuit layer 12 through the solder layer 50.
[0030] By placing solder feet 21 at the four corners of the LED bead 20, the connection between the solder feet 21 and the copper foil circuit layer 12 is made more stable. This design can effectively improve the electrical connection reliability of the LED bead 20 and avoid circuit failures caused by weak soldering. In addition, the number of through holes 111 corresponds one-to-one with the number of solder feet 21 of the LED bead 20, making the soldering process more precise and reducing errors in the production process.
[0031] It should be noted that the solder pad 21 is soldered to the copper foil circuit layer 12 through the solder layer 50, and conventional soldering processes, such as reflow soldering or manual soldering, can be used.
[0032] Furthermore, adhesive layer 40 is an acrylic double-sided adhesive layer. Specifically, adhesive layer 40 in this application is 300LSE double-sided adhesive manufactured by 3M, which has the characteristics of high bonding strength, high temperature resistance, and good moisture resistance.
[0033] Furthermore, the thickness of the PET film 30 is 0.1 mm to 0.3 mm.
[0034] By employing a PET film 30 with a thickness of 0.1 mm to 0.3 mm, better bending performance and curvature support can be provided while maintaining the overall structural stability of the flexible circuit board 10. The 0.1 mm to 0.3 mm thick PET film 30 effectively provides additional support and protection to the flexible circuit board 10, preventing damage caused by bending or deformation. Specifically, the thickness of the PET film 30 can be adjusted according to actual application requirements to ensure optimal mechanical properties and optical effects. For example, in applications requiring higher bending angles, a thinner PET film 30 can be selected to increase flexibility, while in applications requiring higher mechanical strength, a thicker PET film 30 can be selected.
[0035] Furthermore, the thickness of the flexible circuit board 10 is 0.1 mm to 0.15 mm.
[0036] By controlling the thickness of the flexible circuit board 10 to be between 0.1mm and 0.15mm, it can be ensured that the circuit board has good shaping ability when bent, avoiding the lack of arc support caused by the board being too thin, thereby ensuring the stability and consistency of the lighting atmosphere effect.
[0037] Furthermore, the thickness of the adhesive layer 40 is 60 μm to 80 μm.
[0038] The adhesive layer 40, with a thickness of 60μm to 80μm, ensures a strong bond between the PET film 30 and the flexible circuit board 10, preventing delamination or displacement during use. The acrylic double-sided adhesive layer 40 exhibits excellent adhesion and durability, maintaining stable performance in various environments.
[0039] Furthermore, the thickness of the mask solder resist layer 11 is 30 μm to 60 μm.
[0040] The thickness of the mask solder mask layer 11 is designed to be between 30 μm and 60 μm. The purpose of this design is to minimize the impact on the overall thickness of the flexible circuit board 10 while ensuring the functionality of the solder mask layer, thereby improving the flexibility and bending performance of the backlight LED strip.
[0041] Furthermore, the thickness of the copper foil circuit layer 12 is 15 μm to 30 μm.
[0042] By setting the thickness of the copper foil circuit layer 12 between 15μm and 30μm, the conductivity and mechanical strength of the circuit board are ensured, meeting the requirements of the backlight LED strip in terms of bending angle and arc support. Choosing the thickness of the copper foil circuit layer 12 within this range effectively avoids excessive rigidity due to excessive thickness, which would prevent it from adapting to the irregular shape of the speaker, while also avoiding insufficient conductivity due to insufficient thickness.
[0043] Furthermore, the thickness of the PI film insulating layer 13 is 25 μm to 35 μm.
[0044] By setting the thickness of the PI film insulation layer 13 to between 25 μm and 35 μm, it is possible to ensure that the PI film insulation layer 13 has good insulation properties while maintaining flexibility and bend resistance.
[0045] The above is only used to illustrate the technical solution of this utility model and not to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.
Claims
1. A backlit iridescent lightbar, characterized in that, The application relates to a flexible circuit board (10), a plurality of lamp beads (20) uniformly arranged on one side of the flexible circuit board (10) and a PET film (30) arranged on the other side of the flexible circuit board (10), wherein a glue layer (40) is arranged between the PET film (30) and the flexible circuit board (10), and the PET film (30) is fixed on the flexible circuit board (10) through the glue layer (40).
2. The backlight iridescent light bar of claim 1, wherein, The flexible circuit board (10) comprises, from top to bottom, a mask solder resist layer (11), a copper foil circuit layer (12) and a PI film insulating layer (13), the mask solder resist layer (11) is provided with a through hole (111), the through hole (111) is provided with a solder layer (50), and the lamp bead (20) is electrically connected with the copper foil circuit layer (12) through the solder layer (50).
3. The backlight iridescent light bar of claim 2, wherein, The lamp bead (20) is provided with a soldering leg (21) at each corner, the number of the through holes (111) is one-to-one corresponding to the number of the soldering legs (21), and the soldering leg (21) is welded on the copper foil circuit layer (12) through the solder layer (50).
4. The backlight iridescent light bar of claim 3, wherein, The glue layer (40) is an acrylic double-sided glue layer (40).
5. The backlight iridescent light bar of claim 1, wherein, The thickness of the PET film (30) is 0.1mm to 0.3mm.
6. The backlight iridescent light bar of claim 1, wherein, The thickness of the flexible circuit board (10) is 0.1mm to 0.15mm.
7. The backlight iridescent light bar of claim 1, wherein, The thickness of the glue layer (40) is 60mu to 80mu.
8. The backlight iridescent light bar of claim 2, wherein, The thickness of the mask solder resist layer (11) is 30mu to 60mu.
9. The backlight iridescent light bar of claim 2, wherein, The thickness of the copper foil circuit layer (12) is 15mu to 30mu.
10. The backlight iridescent light bar of claim 2, wherein, The thickness of the PI film insulating layer (13) is 25mu to 35mu.