Imaging structure and detection device
By using an imaging structure with an openable cover and light-emitting elements in wafer production, wafer surface defects can be captured, solving the problem of fragment detection, improving wafer yield and equipment reliability, and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2026-03-06
AI Technical Summary
During wafer manufacturing, the presence of debris affects production equipment and wafer output, reduces yield and increases costs, and is difficult to detect and handle in a timely manner.
Design an imaging structure including an openable cover, a tray, a light source, and an imaging module. Use light within a sealed containment cavity to capture defects on the wafer surface. Obtain wafer images through the imaging module to identify and analyze minute defects, trace the source of debris, and take preventative measures.
Improve wafer yield, reduce production costs, ensure equipment performance and reliability, and improve production quality control through precise detection and analysis of minute defects.
Smart Images
Figure CN223977143U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor fabrication technology, and in particular relates to an imaging structure and detection device. Background Technology
[0002] During the wafer manufacturing process, fragments often occur. If these fragments are not processed and inspected in a timely manner, they will not only affect the production equipment and reduce wafer output and yield, but also damage other wafers, increasing production costs and reducing production efficiency. Utility Model Content
[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes an imaging structure and detection device. By setting a cover that can be opened and closed with a tray, and arranging a light-emitting element and an imaging module within a receiving cavity, the light emitted by the light-emitting element within the sealed receiving cavity makes it easier for defects and features on the wafer surface to be captured by the imaging module. This allows the imaging module to obtain a wafer image, enabling subsequent identification, analysis, and fragmentation of minute defects (such as scratches, cracks, particle contamination, etc.) on the wafer surface. This facilitates tracing the source of fragmentation and taking corresponding preventative measures, thus aiding in quality control and process improvement in wafer production. It helps increase wafer yield, reduce production costs, and ensure the performance and reliability of subsequent wafers and production equipment.
[0004] In a first aspect, this application provides an imaging structure for detecting a wafer formed by splicing together multiple fragments, the imaging structure comprising:
[0005] A cover, one end of which has an opening;
[0006] A tray, closable and mountable to the cover to close the opening, the tray and the cover together forming a receiving cavity, the tray being used to hold the wafer;
[0007] A light-emitting element is disposed within the receiving cavity for illuminating the wafer;
[0008] An imaging module, disposed within the receiving cavity, is used to image the wafer to obtain a wafer image.
[0009] According to the imaging structure of this application, when the cover is open, fragments generated during the production process can be placed on a tray, which facilitates splicing and supports the spliced wafers. After the spliced wafers are formed, the cover is closed and the light-emitting element is turned on to reduce the interference of the external environment on the wafer imaging. The light emitted by the light-emitting element in the sealed cavity makes it easier for the imaging module to capture the defects and features on the wafer surface. The imaging module then obtains the wafer image corresponding to the wafer, which is used to identify, separate, and analyze the minute defects (such as scratches, cracks, particle contamination, etc.) on the wafer surface. This allows for tracing the source of the fragments and taking corresponding preventive measures, which helps to improve the quality control and process improvement of wafer production, improve wafer yield, reduce production costs, and ensure the performance and reliability of subsequent wafers and production equipment.
[0010] According to one embodiment of this application, one side of the cover is pivotally connected to the tray, and the other side of the cover is engaged with or disengaged from the tray.
[0011] According to one embodiment of this application, the light-emitting element includes a plurality of LED beads, which are spaced apart and arranged around the inner top surface of the cover; or
[0012] Multiple LED beads are spaced apart and arranged on the inner sidewall of the cover.
[0013] According to one embodiment of this application, the light-emitting element includes:
[0014] The light strip is disposed on the inner side wall of the cover and is arranged around the circumference of the cover;
[0015] Multiple spaced LED beads are arranged on the side of the light strip away from the cover.
[0016] According to one embodiment of this application, the outer diameter of the cover is equal to the outer diameter of the tray.
[0017] According to one embodiment of this application, the tray forms a groove, the wafer is disposed in the groove, and the outer sidewall of the wafer at least partially abuts against the inner sidewall of the groove.
[0018] According to one embodiment of this application, the tray is provided with circumferential scale lines, which include at least one of time scale lines and angle scale lines.
[0019] According to one embodiment of this application, the imaging module is disposed on the inner top surface of the cover, and the imaging module is located at the center of the inner top surface.
[0020] According to one embodiment of this application, the material of the cover is PVC; and / or
[0021] The tray is made of PVC.
[0022] Secondly, this application provides a detection device that includes the imaging structure described above.
[0023] According to the detection device of this application, by setting a cover that can be opened and closed with the tray in the imaging structure, and setting a light-emitting element and an imaging module in the receiving cavity, the light emitted by the light-emitting element in the sealed receiving cavity makes it easier for defects and features on the wafer surface to be captured by the imaging module. Thus, the imaging module obtains the wafer image corresponding to the wafer, so as to identify, separate and analyze the small defects (such as scratches, cracks, particle contamination, etc.) on the wafer surface, and then trace the source of the fragments and take corresponding preventive measures. This helps to improve the quality control and process improvement of wafer production, which helps to improve the wafer yield, reduce production costs, and ensure the performance and reliability of subsequent wafers and production equipment.
[0024] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0025] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0026] Figure 1 This is a schematic diagram of the imaging structure provided in the embodiments of this application;
[0027] Figure 2 This is a schematic diagram of the imaging structure with the tray hidden, provided in the embodiments of this application;
[0028] Figure 3 This is a cross-sectional view of the cover provided in the embodiment of this application;
[0029] Figure 4 This is one of the structural schematic diagrams of the tray provided in the embodiments of this application;
[0030] Figure 5 This is a second schematic diagram of the tray structure provided in the embodiments of this application;
[0031] Figure 6 This is a cross-sectional view of the tray provided in the embodiments of this application.
[0032] Figure label:
[0033] 100. Cover body; 101. Opening;
[0034] 200. Pallet; 201. Groove;
[0035] 310. LED beads;
[0036] 400. Imaging module. Detailed Implementation
[0037] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0038] The following is for reference. Figures 1-6 The imaging structure provided in this application embodiment is described. The imaging structure is used to detect a wafer formed by splicing multiple fragments. The imaging structure includes a cover 100, a tray 200, a light-emitting element, and an imaging module 400.
[0039] One end of the cover 100 has an opening 101. It should be noted that the shape and size of the cover 100 and the opening 101 can be designed according to actual needs, and this embodiment does not impose specific limitations on them.
[0040] For example, the lower end of the cover 100 is provided with an opening 101, which faces the tray 200, to facilitate wafer placement and removal and provide convenience for the use of the imaging structure.
[0041] The tray 200 is closable and can be installed on the cover 100 to close the opening 101. The tray 200 and the cover 100 together form a receiving cavity, and the tray 200 is used to hold the wafer. It should be noted that the shape and size of the receiving cavity can be designed according to actual needs, and this embodiment does not impose specific limitations on this.
[0042] Understandably, with the enclosure 100 open, fragments generated during the production process can be placed on the tray 200 for subsequent assembly and observation. With the enclosure 100 closed, the assembled wafer can be located within a closed containment cavity, which helps maintain the stability of the internal environment and reduces potential external interference during subsequent wafer inspection.
[0043] A light-emitting element is disposed within the receiving cavity for illuminating the wafer. An imaging module 400 is disposed within the receiving cavity for imaging the wafer to obtain a wafer image.
[0044] Understandably, with the cover 100 open, fragments generated during the production process can be placed on the tray 200, facilitating splicing and supporting the spliced wafers. After the spliced wafers are formed, the cover 100 is closed and the light-emitting element is turned on to reduce interference from the external environment on wafer imaging. The light emitted by the light-emitting element within the sealed containment cavity makes it easier for the imaging module 400 to capture defects and features on the wafer surface. Thus, the imaging module 400 obtains a wafer image corresponding to the wafer, enabling subsequent identification, analysis, and processing of minute defects on the wafer surface (such as scratches, cracks, particle contamination, etc.). This allows for tracing the source of fragments and taking corresponding preventative measures, which helps in quality control and process improvement in wafer production, increases wafer yield, reduces production costs, and ensures the performance and reliability of subsequent wafers and production equipment.
[0045] According to the imaging structure provided in the embodiments of this application, by setting a cover 100 that can be opened and closed with the tray 200, and setting a light-emitting element and an imaging module 400 in the receiving cavity, the light emitted by the light-emitting element in the sealed receiving cavity makes it easier for the imaging module 400 to capture the defects and features on the wafer surface. Thus, the imaging module 400 obtains the wafer image corresponding to the wafer, so as to identify, split and analyze the tiny defects (such as scratches, cracks, particle contamination, etc.) on the wafer surface, and then trace the source of the fragments and take corresponding preventive measures. This helps to improve the quality control and process improvement of wafer production, improve the wafer yield, reduce production costs, and ensure the performance and reliability of subsequent wafers and production equipment.
[0046] In some embodiments, such as Figure 1 As shown, one side of the cover 100 is pivotally connected to the tray 200, and the other side of the cover 100 is either in contact with or detached from the tray 200.
[0047] It is understood that one side of the cover 100 is pivotally connected to the outer wall of the tray 200 via a hinge or latch, thereby enabling the other side of the cover 100 to disengage from the tray 200 when the cover 100 is open, allowing fragments to be placed on the tray 200. When the cover 100 is closed, the other side of the cover 100 abuts against the tray 200, so that the cover 100 and the tray 200 together form a sealed receiving cavity, thus enabling the tray 200 to be easily opened and closed and used flexibly. Of course, in other embodiments, the connection method between the cover 100 and the tray 200 includes, but is not limited to, other detachable connection methods such as snap-fit, plug-in, or threaded connection. This embodiment does not impose specific limitations on this.
[0048] In some embodiments, such as Figure 2As shown, the light-emitting element includes multiple LED beads 310, which are spaced apart and arranged around the inner top surface of the cover 100. It should be noted that the number and specific distribution of the LED beads 310 can be designed according to actual needs, and this embodiment does not impose specific limitations on this.
[0049] Understandably, arranging the LEDs 310 at intervals around the inner top surface of the housing 100 can ensure uniform illumination of the wafer surface, reduce the possibility of defects being missed during wafer imaging, help reduce the effects of shadows and glare, and improve the quality of the wafer image captured by the imaging module 400.
[0050] In some embodiments, the light-emitting element includes a plurality of LED beads 310, which are spaced apart and arranged around the inner sidewall of the cover 100. It should be noted that the number and specific distribution of the LED beads 310 can be designed according to actual needs, and this embodiment does not impose specific limitations on this.
[0051] Understandably, multiple LEDs 310 spaced around the inner wall of the housing 100 can provide uniform illumination of the wafer surface, adjust the illumination angle, reduce the effects of shadows and glare, and improve image clarity. Furthermore, considering the potentially complex three-dimensional structure of the wafer surface, the LEDs 310 spaced around the inner wall of the housing 100 can provide multi-angle illumination, improving imaging accuracy.
[0052] In some embodiments, the light-emitting element includes a light strip and a plurality of spaced-apart LED beads 310. The light strip is disposed on the inner sidewall of the cover 100 and surrounds the cover 100 circumferentially; the LED beads 310 are disposed on the side of the light strip away from the cover 100. The connection method between the light strip and the cover 100 includes, but is not limited to, adhesive bonding. It should be noted that the number and specific distribution of the LED beads 310 can be designed according to actual needs, and this embodiment does not impose specific limitations on this.
[0053] Understandably, by circumferentially arranging the light strip around the cover 100 to form a ring, not only can multiple spaced LEDs 310 be used to provide omnidirectional illumination of the wafer, but the length of the light strip can also be directly adapted to cover 100 of different sizes, improving the ease of use and maintenance of the imaging structure, providing multi-angle and uniform illumination, and helping to improve the efficiency and accuracy of wafer imaging.
[0054] In some embodiments, such as Figure 1 As shown, the outer diameter of the cover 100 is equal to the outer diameter of the tray 200 to achieve a precise match between the cover 100 and the tray 200, ensuring the sealing between the cover 100 and the tray 200, maintaining the cleanliness and stability of the environment during wafer imaging, and ensuring that the LED beads 310 can be evenly distributed outside the wafer to provide uniform illumination and imaging accuracy.
[0055] In some embodiments, such as Figure 1 , Figures 4 to 6 As shown, the tray 200 forms a groove 201 with the opening of the groove 201 facing upwards to accommodate the wafer, and the outer sidewall of the wafer at least partially abuts against the inner sidewall of the groove 201. It should be noted that the size and shape of the groove 201 can be designed according to actual needs, and this embodiment does not impose specific limitations on this. For example, the groove 201 is circular in shape.
[0056] It should be noted that, as Figure 3 As shown, the cover 100 forms a mounting groove with an opening 101. The inner wall of the mounting groove and the inner wall of the groove 201 together form the inner wall of the receiving cavity. The bottom surface of the cover 100 near the opening 101 abuts or disengages from the top surface of the tray 200 near the opening of the groove 201.
[0057] Understandably, the tray 200 forms a groove 201 to place the wafer within the groove 201, which helps ensure the stability and positioning accuracy of the wafer during the splicing and imaging process. Considering the possibility of missing parts in a wafer spliced from multiple fragments, the outer wall of the wafer is at least partially engaged with the inner wall of the groove 201, reducing the possibility of wafer displacement and separation between fragments during splicing and imaging, thereby improving imaging accuracy.
[0058] In some embodiments, such as Figure 5 As shown, the tray 200 is provided with circumferential scale lines, which include at least one of time scale lines and angle scale lines.
[0059] It should be noted that the time scale lines can simulate the position marks of a clock (i.e., 3 o'clock, 6 o'clock, 9 o'clock, and 12 o'clock, etc.); the angle scale lines can mark the specific angular position of the wafer relative to the tray 200 (i.e., 0°, 90°, 180°, and 360°, etc.).
[0060] Understandably, the surface of the tray 200 near the groove 201 has circumferential scale lines for precise positioning and placement of the wafer within the groove 201. This simulates the initial position of the wafer on the production equipment during manufacturing, more accurately predicting and simulating potential issues the wafer might encounter in actual production. This allows for more precise analysis of the wafer image, providing more reliable inspection results. Simultaneously, the circumferential scale lines can be used to record the precise location of wafer defects and help reduce positioning errors caused by visual errors or inaccurate estimations.
[0061] In some embodiments, such as Figure 2As shown, the imaging module 400 is disposed on the inner top surface of the housing 100, and the imaging module 400 is located at the center of the inner top surface. The imaging module 400 includes, but is not limited to, a CCD camera or a camera.
[0062] Understandably, by placing the imaging module 400 on the inner top surface of the housing 100 and centering it there, alignment of the imaging module 400 with the center of the wafer is ensured. This enables rapid alignment and positioning of the wafer, reduces imaging distortion caused by edge effects, and minimizes the impact of shadows and glare caused by direct reflection of light sources from the wafer surface on the imaging, thereby improving image clarity and quality. Furthermore, the LEDs 310 are arranged around the imaging module 400, meaning the imaging module 400 and the symmetrical LED layout combine to achieve uniformity in illumination and imaging, ensuring that the wafer image accurately displays defects on the wafer surface.
[0063] In some embodiments, such as Figure 2 As shown, considering the need to ensure the airtightness of the cavity, the imaging module 400 is wirelessly connected to the control module outside the housing 100 (such as Wi-Fi, Bluetooth, Zigbee and LoRa, etc.) to minimize the impact of the external environment on imaging and the electromagnetic interference from the cable, thereby improving the quality and accuracy of the wafer image.
[0064] In some embodiments, such as Figures 1 to 3 As shown, the cover 100 is made of PVC (polyvinyl chloride), which has low manufacturing cost and certain durability and corrosion resistance. For example, the outer diameter of the cover 100 is 320mm, the width of the mounting groove is 10mm, and the depth of the mounting groove is 10mm.
[0065] In some embodiments, such as Figure 1 , Figures 4 to 6 As shown, the pallet 200 is made of PVC (polyvinyl chloride), which has low manufacturing cost and certain durability and corrosion resistance. For example, the outer diameter of the pallet 200 is 320mm, the inner diameter of the groove 201 is 305mm, the groove depth of the groove 201 is 3mm, and the height of the pallet 200 is 5mm.
[0066] This application also provides a detection device. The detection device includes the imaging structure described above.
[0067] According to the detection device provided in the embodiments of this application, by setting a cover 100 that can be opened and closed with the tray 200 in the imaging structure, and setting a light-emitting element and an imaging module 400 in the receiving cavity, the light emitted by the light-emitting element in the sealed receiving cavity makes it easier for defects and features on the wafer surface to be captured by the imaging module 400. Thus, the imaging module 400 obtains the wafer image corresponding to the wafer, so as to identify, separate and analyze the small defects (such as scratches, cracks, particle contamination, etc.) on the wafer surface, and then trace the source of the fragments and take corresponding preventive measures. This helps to improve the quality control and process improvement of wafer production, which helps to improve the wafer yield, reduce production costs, and ensure the performance and reliability of subsequent wafers and production equipment.
[0068] In some embodiments, the detection device further includes a control module, which is communicatively connected to the imaging module 400 to control the switching on and off of the imaging module 400 and the magnification of the camera of the imaging module 400.
[0069] In some embodiments, the control module and the light-emitting element are communicatively connected to adjust the switching on and off of the light-emitting element and its brightness. Of course, in other embodiments, the opening or closing of the cover 100 can also be used to turn off the light-emitting element; this embodiment does not impose specific limitations on this.
[0070] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0071] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0072] In the description of this application, "first feature" and "second feature" may include one or more of the features.
[0073] In the description of this application, "multiple" means two or more.
[0074] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.
[0075] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.
[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0077] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. An imaging structure for detecting a wafer formed by splicing a plurality of chips, characterized by, The imaging structure comprises: a cover body, one end of the cover body having an opening; a tray, which is hingedly mounted on the cover body to close the opening, the tray and the cover body jointly forming a containing cavity, the tray being used for carrying the wafer; a light-emitting member, which is arranged in the containing cavity and used for illuminating the wafer; an imaging module, which is arranged in the containing cavity and used for imaging the wafer to obtain a wafer image; wherein the light-emitting member comprises a plurality of lamp beads, the plurality of lamp beads being arranged at intervals around an inner top surface of the cover body; or the plurality of lamp beads being arranged at intervals around an inner side wall of the cover body. Or, the light-emitting member comprises: a lamp strip, which is arranged on an inner side wall of the cover body and circumferentially surrounds the cover body; a plurality of lamp beads arranged at intervals, the lamp beads being arranged on a side of the lamp strip away from the cover body.
2. The imaging structure of claim 1, wherein, One side of the cover body is pivotally connected to the tray, and the other side of the cover body is in abutting or disengaging engagement with the tray.
3. The imaging structure according to any one of claims 1 or 2, wherein, An outer diameter of the cover body is equal to an outer diameter of the tray.
4. The imaging structure according to any one of claims 1 or 2, wherein, The tray forms a recess, the wafer is arranged in the recess, and an outer side wall of the wafer is at least partially in abutting engagement with an inner side wall of the recess.
5. The imaging structure according to any one of claims 1 or 2, wherein, The tray is provided with a circumferential scale line, the circumferential scale line comprising at least one of a time scale line and an angle scale line.
6. The imaging structure according to any one of claims 1 or 2, wherein, The imaging module is arranged on an inner top surface of the cover body, and the imaging module is located at the center of the inner top surface.
7. The imaging structure according to any one of claims 1 or 2, wherein, The cover body is made of PVC; and / or The tray is made of PVC.
8. A detection device, characterized in that The imaging structure comprises the imaging structure according to any one of claims 1 to 7.