Leveling probe card

Abstract

The embodiment of the utility model discloses a leveling probe card, which comprises a substrate and a test circuit board, a plurality of test probes are arranged on one side of the substrate, and the test circuit board is positioned on the other side of the substrate; the elastic connecting piece comprises at least three spring piece sets, each spring piece set comprises at least one spring piece, and the three spring piece sets are distributed on the periphery of the substrate in a triangular mode and used for achieving elastic connection between the substrate and the test circuit board; and the plurality of leveling execution mechanisms are arranged on the test circuit board, penetrate through the test circuit board, abut against different areas, close to one side of the test circuit board, of the substrate, and are used for adjusting the levelness of the substrate relative to the test circuit board. According to the embodiment of the invention, the problems that the horizontal adjustment of the probe card is difficult, the efficiency is low, and the probe is easy to damage are solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, specifically to an adjustable probe card. Background Technology

[0002] In the field of semiconductor testing, probe cards, as a key component connecting chips and testing equipment, have a crucial impact on the accuracy and efficiency of test results. With the rapid development of the semiconductor industry and the increasing demand for multi-site testing, higher requirements are being placed on the levelness of probe cards.

[0003] Traditional probe card leveling methods primarily rely on manual adjustment of each probe by operators. This method has several drawbacks: firstly, the operation is extremely cumbersome and time-consuming, severely impacting testing efficiency; secondly, it demands a high level of skill from the operators, and differences in operation among different operators can easily lead to deviations in test results. Moreover, slight carelessness during manual operation can damage the probes, increasing testing costs. Therefore, developing a probe card leveling structure that can quickly, accurately, and easily achieve leveling is of significant practical importance. Utility Model Content

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application provides an adjustable probe card to solve the problems of difficulty in leveling the probe card, low efficiency, and easy damage to the probe in the prior art.

[0005] The objective of this application can be achieved through the following technical solutions:

[0006] This application provides an adjustable probe card, which includes:

[0007] A substrate, with several test probes on one side of the substrate;

[0008] The test circuit board is located on the other side of the substrate;

[0009] The elastic connector includes at least three spring plate groups, each spring plate group having at least one spring plate, and the three spring plate groups are triangularly distributed around the substrate to achieve an elastic connection between the substrate and the test circuit board.

[0010] The leveling actuator is provided in multiple ways. All leveling actuators are installed on the test circuit board and pass through the test circuit board. They abut against different areas of the substrate on the side closest to the test circuit board to adjust the levelness of the substrate relative to the test circuit board.

[0011] By setting up elastic connectors, the substrate and the test circuit board are elastically connected. Then, by setting up multiple leveling actuators to abut against different areas of the substrate, the levelness of the substrate relative to the test circuit board is adjusted, so that the distance between each probe and the chip under test can be equal during testing. This solves the problems of difficulty, low efficiency and easy damage to probes in traditional manual leveling.

[0012] Optionally, the leveling probe card also includes a mounting frame, which is fixedly fitted around the substrate. The inner side of the mounting frame has a first stepped surface, and the side of the substrate closest to the test circuit board is placed on the first stepped surface.

[0013] By setting up an installation frame and creating a first step surface inside the frame, a stable placement position is provided for the substrate, making substrate installation more convenient and precise. This helps improve the stability of the entire probe card structure, ensuring that the substrate will not easily shift during testing, thereby enhancing the reliability of the test.

[0014] Optionally, the outer side of the mounting frame is provided with a second stepped surface, and one end of the spring sheet is fixed to the second stepped surface.

[0015] By setting a second stepped surface on the outside of the mounting frame, a stable fixing position is provided for the spring sheet, ensuring that the spring sheet will not loosen or shift during operation, thus guaranteeing the stability of the elastic connector, making the elastic connection more reliable, and further improving the performance of the probe card.

[0016] Optionally, the resilient connector may also include a sheet frame surrounding the substrate, with a spring sheet extending inward from the inner edge of the sheet frame to the first step surface.

[0017] By spaced-around the base plate with sheet-like frames, and with spring sheets extending inward from their inner edges to the first step surface, this structural design makes the spring sheet layout more regular, enhancing the overall structural strength and stability of the elastic connector. Simultaneously, the sheet-like frames also provide some protection for the spring sheets, preventing deformation or damage from external forces.

[0018] Optionally, the leveling probe card also includes a buffer frame that surrounds the mounting frame and is fitted with the mounting frame with clearance. The buffer frame is fixedly mounted on the test circuit board, and the sheet frame is fixedly mounted on the buffer frame.

[0019] The sheet frame is fixed to the buffer frame by surrounding the mounting frame and securing it to the test circuit board. The buffer frame further cushions the impact forces during testing, protecting the substrate, test probes, and test circuit board. Furthermore, it enhances the overall stability of the probe card structure, making the connections between components tighter, reducing loosening of components due to vibration or external forces, and improving test stability.

[0020] Optionally, each spring plate group consists of multiple spring plates, and the spring plates in each spring plate group are evenly distributed at intervals.

[0021] By assembling each spring sheet group into multiple evenly spaced spring sheets, the elastic force on the substrate in all directions can be made more uniform, improving the stability of the elastic connection and making the leveling process smoother and more precise, thus enabling more accurate control of the substrate's level.

[0022] Optionally, three leveling actuators are provided, arranged in an equilateral triangle.

[0023] By arranging the leveling actuators into three equilateral triangles, this layout allows for adjustment of the substrate's level from three different directions, forming a stable support and adjustment structure. Compared to other distribution methods, the equilateral triangle distribution can adjust the substrate's level more efficiently and precisely, ensuring effective control of the substrate's levelness in all directions and improving testing accuracy.

[0024] Optionally, the leveling actuator includes rotatable leveling bolts and contact balls, with each leveling bolt abutting against the substrate via the contact ball. The leveling bolts are used to adjust the levelness of the substrate relative to the test circuit board.

[0025] By employing a combination of a rotatable adjusting bolt and a contact ball in the leveling actuator, and adjusting the pressure of the contact ball on the substrate by rotating the adjusting bolt, the levelness of the substrate can be adjusted. This design is easy to operate, allows for precise control of the adjustment amount, and achieves high-precision leveling, meeting the stringent requirements of semiconductor testing for probe card levelness.

[0026] Optionally, a back plate is fixed on the side of the test circuit board away from the substrate. The back plate has a threaded hole that mates with the thread of the leveling bolt. The test circuit board has a first clearance hole for avoiding the leveling bolt. The leveling bolt passes through the threaded hole and the first clearance hole and abuts against the substrate through a contact ball.

[0027] By setting a backplate on the side of the test circuit board away from the substrate, and providing threaded holes on the backplate to mate with the leveling bolts, and creating a first clearance hole on the test circuit board, the leveling bolts can smoothly pass through and abut against the substrate. The backplate not only provides stable support and threaded connection for the leveling bolts, but also enhances the structural strength of the entire test circuit board, ensuring the normal operation of the leveling actuator and guaranteeing the stability and reliability of the leveling process.

[0028] Optionally, the leveling probe card also includes an inserter that is detachably mounted between the test board and the substrate and is configured to connect the switching circuitry in the substrate to the test circuitry in the test board.

[0029] By using an inserter, the conversion circuits in the substrate can be connected one by one with the test circuits in the test circuit board, ensuring the accuracy and stability of signal transmission. This is a crucial step in enabling the probe card to perform its testing functions, ensuring that the test equipment can accurately acquire the chip's test data and improving the reliability and effectiveness of the test. Furthermore, the detachable inserter facilitates replacement and adjustment between different test requirements or different models of test circuit boards and substrates. Attached Figure Description

[0030] The present application will be further described below with reference to the accompanying drawings.

[0031] Figure 1 This is a top view of an adjustable probe card in one embodiment of this application;

[0032] Figure 2 This is an axial cross-sectional view of an adjustable probe card in one embodiment of this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1. Substrate; 11. Test probe; 2. Test circuit board; 3. Elastic connector; 31. Spring plate assembly; 311. Spring plate; 32. Sheet frame; 4. Leveling actuator; 41. Leveling bolt; 42. Contact ball; 5. Mounting frame; 51. Second step surface; 6. Buffer frame; 7. Back plate; 8. Insertor; 81. Fixing bracket; 82. Guide pin; 9. First bolt. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0036] Please see Figure 1 and Figure 2As shown, in some embodiments, this application provides an adjustable probe card, which includes a substrate 1, a test circuit board 2, an elastic connector 3, and a leveling actuator 4. A plurality of test probes 11 are regularly arranged on one side of the substrate 1. These test probes 11 are used to make electrical connections with the chip under test (DUT) to achieve signal transmission. The test circuit board 2 is located on the other side of the substrate 1 and integrates test circuitry for connection to test equipment. The elastic connector 3 consists of at least three spring sheet groups 31, each spring sheet group 31 containing at least one spring sheet 311. These three spring sheet groups 31 are triangularly distributed around the substrate 1. One end of each spring sheet group 31 is connected to the substrate 1, and the other end is connected to the test circuit board 2. Through its own elastic deformation, an elastic connection is achieved between the substrate 1 and the test circuit board 2. Multiple leveling actuators 4 are provided, which are evenly mounted on the test circuit board 2 and penetrate through the test circuit board 2. The ends of these leveling actuators 4 are in close contact with different areas of the substrate 1 near the test circuit board 2. By adjusting the leveling actuators 4, the distance between different areas of the substrate 1 and the test circuit board 2 can be changed, thereby adjusting the levelness of the substrate 1 relative to the test circuit board 2. This ensures that the distance between each probe and the chip under test is equal during testing, ensuring that each test probe 11 can make good contact with the chip, improving the accuracy of the test results. At the same time, it avoids the problems of low efficiency and easy damage to probes in the traditional manual leveling method, significantly improving the testing efficiency.

[0037] Please see Figure 1 As shown, in some embodiments, each spring sheet group 31 is composed of a plurality of spring sheets 311. These spring sheets 311 are evenly distributed at intervals along a specific direction within each spring sheet group 31.

[0038] Specifically, taking the extension direction of the spring sheet group 31 corresponding to the side of the substrate 1 as a reference, adjacent spring sheets 311 maintain an equal spacing in this direction. This uniformly distributed design makes the elastic force on the substrate 1 more uniform in all directions. When adjusting the level of the substrate 1 by the leveling actuator 4, the leveling adjustment process is more stable and precise due to the uniform elastic force. Operators can more accurately control the level of the substrate 1, improving the accuracy of leveling adjustment.

[0039] Please see Figure 1 and Figure 2As shown, in some embodiments, the adjustable probe card also includes a mounting frame 5, which is a closed-loop structure. The inner contour of the mounting frame 5 is the same as the outer contour of the substrate 1. For example, the substrate 1 is rectangular, and the mounting frame 5 is a rectangular ring. The mounting frame 5 is tightly fitted around the substrate 1, and the two can be fixedly connected by adhesive bonding, interference fit, or other methods. A first stepped surface is machined on the inner side of the mounting frame 5. The size and shape of this stepped surface are adapted to the edge of the substrate 1 near the test circuit board 2. The edge of the substrate 1 near the test circuit board 2 is precisely placed on the first stepped surface. The mounting frame 5 and its first stepped surface provide a stable and reliable placement position for the substrate 1, greatly facilitating the installation process. During installation, simply placing the substrate 1 on the first stepped surface in a specific direction completes the initial positioning of the substrate 1, eliminating the need for complex calibration operations. Simultaneously, this precise positioning ensures that the substrate 1 will not shift due to external vibrations, displacements, or other factors during testing, guaranteeing the stability of the entire probe card structure and thus improving the reliability of the test.

[0040] Please see Figure 1 and Figure 2 As shown, in some embodiments, the mounting frame 5 has a second stepped surface 51 on the outer side corresponding to the mounting spring plate assembly 31. One end of the spring plate 311 is securely fixed to the second stepped surface 51 by welding, riveting, or bolting. The fixing position of the spring plate 311 is carefully designed to ensure that it remains stable during operation and will not loosen or shift. The second stepped surface 51 provides a stable fixing point for the spring plate 311, ensuring the stability of the spring plate 311 during long-term use.

[0041] Please see Figure 1 and Figure 2 As shown, in one possible embodiment, the outer contour of the mounting frame 5 is generally rectangular. The rectangular frame has a first side, and a second side and a third side located on both sides of the first side and both perpendicular to the first side.

[0042] In this embodiment, three sets of spring sheet groups 31 are arranged in an isosceles triangle. Specifically, one set of spring sheet groups 31 is fixedly connected to the middle position of the first side, and each set of spring sheets 311 consists of five spring sheets 311. The other two sets of spring sheet groups 31 are fixed to the lower half of the second side away from the first side and the lower half of the third side away from the first side, respectively, and each of these two sets of spring sheet groups 31 consists of four spring sheets 311. This arrangement can provide balanced elastic support for the substrate 1 while ensuring structural stability, thus meeting the usage requirements of the probe card.

[0043] Please see Figure 1 and Figure 2As shown, in some embodiments, the elastic connector 3 includes a sheet-like frame 32 in addition to the spring sheet assembly 31. The sheet-like frame 32 is spaced around the perimeter of the substrate 1, and its inner edge is connected to the starting end of the spring sheet 311. The spring sheet 311 extends inward from the inner edge of the sheet-like frame 32 to the first step surface, and is integrally formed or reliably connected to the sheet-like frame 32 to ensure a firm and reliable connection between the spring sheet 311 and the sheet-like frame 32.

[0044] The design of the plate-like frame 32 makes the layout of the spring plates 311 more regular and orderly, enhancing the overall structural strength and stability of the elastic connector 3. The plate-like frame 32 acts like a supporting skeleton, providing additional support and protection for the spring plates 311. On the one hand, it prevents the spring plates 311 from excessively deforming or displacing when subjected to external forces, ensuring the normal operation of the spring plates 311; on the other hand, the plate-like frame 32 also provides a certain degree of physical protection for the spring plates 311, preventing them from being damaged by direct impacts from external objects, further improving the reliability of the elastic connector 3.

[0045] Please see Figure 1 and Figure 2 As shown, in some embodiments, the levelable probe card also includes a buffer frame 6, which is spaced around the mounting frame 5. The buffer frame 6 is securely mounted on the test circuit board 2 by means of screws, welding, or clips. The sheet frame 32 is fixedly connected to the buffer frame 6 by multiple first bolts 9. The number and position of the first bolts 9 are designed according to actual application requirements. By reasonably setting the number and position of the first bolts 9, the sheet frame 32 is stably mounted on the buffer frame 6, ultimately forming a tightly connected and collaborative structural system with the buffer frame 6, the sheet frame 32, and the test circuit board 2.

[0046] The buffer frame 6 plays a crucial role in cushioning during testing. It effectively absorbs and disperses external impacts, protecting the substrate 1, test probes 11, and test circuit board 2 from damage. Simultaneously, the buffer frame 6 enhances the overall stability of the probe card structure, making the connections between components tighter. When subjected to vibration or external forces, the buffer frame 6 reduces relative displacement between components, minimizing test errors caused by component loosening and improving the stability and reliability of the test.

[0047] In some embodiments, three leveling actuators 4 are provided, arranged in an equilateral triangle on the test circuit board 2, particularly preferably around the center point of the test circuit board 2. This arrangement allows the three leveling actuators 4 to adjust the levelness of the substrate 1 from three different directions. In other embodiments, the leveling actuators 4 may also have other numbers, such as two, four, or five. The specific number and position of the leveling actuators 4 can be adaptively set according to the size and shape of the substrate 1 and the levelness accuracy requirements of the probe card, and are not specifically limited here.

[0048] Each leveling actuator 4 passes vertically through the test circuit board 2, with its end contacting the corresponding area of ​​the substrate 1 closest to the test circuit board 2. Due to their equilateral triangular distribution, the leveling actuators 4 form a stable support and adjustment structure. Compared to other distributions, this layout ensures that the substrate 1 receives balanced forces in three directions during adjustment, preventing wobbling or tilting. By coordinating the three leveling actuators 4, the levelness of the substrate 1 in all directions can be effectively controlled, significantly improving test accuracy.

[0049] Please see Figure 2 As shown, in some embodiments, the leveling actuator 4 consists of a rotatable and adjustable leveling bolt 41 and a contact ball 42. One end of the leveling bolt 41 is a threaded rod, and the other end is a conveniently operated head, such as an inwardly slotted head, for easy rotation using a tool such as a flathead screwdriver. The contact ball 42 is mounted on the top of the threaded rod of the leveling bolt 41 and directly contacts the area of ​​the substrate 1 near the test circuit board 2. The contact ball 42 is made of a material with high hardness and good wear resistance, such as tungsten carbide, ceramic materials, or high-hardness alloy steel. The leveling bolt 41 is directly or indirectly threadedly connected to the test circuit board 2 and indirectly abuts against the test circuit board 2 via the contact ball 42. By rotating the leveling bolt 41, the contact ball 42 moves up and down, thereby applying different levels of pressure to the substrate 1 and adjusting the levelness of the substrate 1.

[0050] In some implementations, due to insufficient structural strength of the test circuit board 2, the leveling bolt 41 can only be indirectly connected to the test circuit board 2 via threaded transmission.

[0051] For details, please refer to Figure 2As shown, a back plate 7 is fixed on the side of the test circuit board 2 away from the substrate 1. The back plate 7 is typically made of a high-strength metal material with a certain thickness and rigidity, such as stainless steel. Threaded holes are machined on the back plate 7, which are threaded into the leveling bolts 41. Their positions correspond one-to-one with the leveling bolts 41, and their thread specifications also match. A first clearance hole is provided on the test circuit board 2 to allow the leveling bolts 41 to pass through. The diameter of the first clearance hole is slightly larger than the diameter of the threaded rod of the leveling bolt 41, thus ensuring that the leveling bolt 41 can smoothly pass through the test circuit board 2. The leveling bolt 41 passes sequentially through the threaded holes on the back plate 7 and the first clearance hole on the test circuit board 2, and abuts against the substrate 1 through the contact ball 42 at its tip.

[0052] The back plate 7 plays a crucial role. Firstly, it provides stable support and a reliable threaded connection for the leveling bolt 41, ensuring that it does not wobble or shift during adjustment, thus guaranteeing the stability of the leveling operation. Secondly, the back plate 7 enhances the structural strength of the entire test circuit board 2, allowing it to maintain its shape and performance even under the pressure of the leveling bolt 41 and external forces. This structural design effectively ensures the normal operation of the leveling actuator 4, guaranteeing a stable and reliable leveling process, and further improving the accuracy of the probe card's level adjustment.

[0053] Please see Figure 2 As shown, in some embodiments, the adjustable probe card also includes an inserter 8, which is disposed between the test circuit board 2 and the substrate 1. The core function of the inserter 8 is to enable the conversion circuit in the substrate 1 to conduct one-to-one with the test circuit in the test circuit board 2, so as to ensure that the signal can be transmitted stably and accurately. This is a key link to ensure that the probe card test function can be realized normally.

[0054] In one possible implementation, the inserter 8 consists of a guide pin 82 and a fixing bracket 81. The guide pin 82 is made of a highly conductive and stable metallic material, such as a copper alloy plated with gold, and its design parameters are tailored to the circuit layout and interface requirements to ensure circuit continuity. The fixing bracket 81 is made of an insulating material, such as engineering plastic or ceramic, to fix the guide pin 82, ensuring its position and orientation and preventing signal short circuits. The fixing bracket 81 has a second clearance hole for avoiding the contact ball 42, further optimizing the compatibility of the inserter 8 with the entire probe card structure. During installation, a positioning pin is set on the side of the substrate 1 closest to the test circuit board 2, matching the positioning hole on the fixing bracket 81 of the inserter 8. The inner wall of the positioning hole is smooth and has appropriate tolerances with the positioning pin. During installation, the positioning hole is aligned with the positioning pin and inserted, which is simple to operate and precise in positioning, improving installation efficiency and accuracy, ensuring that the guide pin 82 is accurately connected to the circuit interface, and achieving reliable continuity.

[0055] The foregoing has provided a detailed description of one embodiment of this application, but the description is merely a preferred embodiment and should not be construed as limiting the scope of this application. All equivalent variations and modifications made within the scope of this application should still fall within the patent coverage of this application.

[0056] It should be noted that the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Descriptions in this application regarding directions such as "left," "right," "left side," "right side," "upper part," "lower part," "top," and "bottom" are defined based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, not to indicate or imply that the described structure must be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0057] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

Claims

1. An adjustable probe card, characterized by, The adjustable probe card comprises: a substrate, one side of which is provided with a plurality of test probes; a test circuit board, located on the other side of the substrate; an elastic connecting member, comprising at least three spring sheet groups, each of which has at least one spring sheet, and the three spring sheet groups are distributed in a triangular manner around the substrate, for realizing the elastic connection between the substrate and the test circuit board; a plurality of leveling actuators, each of which is installed on the test circuit board and penetrates the test circuit board, and abuts against different areas of the side of the substrate close to the test circuit board, for adjusting the levelness of the substrate relative to the test circuit board.

2. The tunable probe card of claim 1, wherein, The adjustable probe card further comprises a mounting frame, which is fixed around the substrate, and the inner side of the mounting frame is provided with a first stepped surface, and the side of the substrate close to the test circuit board is arranged on the first stepped surface.

3. The tunable probe card of claim 2, wherein, The outer side of the mounting frame is provided with a second stepped surface, and one end of the spring sheet is fixed on the second stepped surface.

4. The tunable probe card of claim 2, wherein, The elastic connecting member further comprises a sheet-shaped frame, which is spaced around the substrate, and the spring sheet extends inward from the inner edge of the sheet-shaped frame to the first stepped surface.

5. The tunable probe card of claim 4, wherein, The adjustable probe card further comprises a buffer frame, which surrounds the mounting frame and is in clearance fit with the mounting frame, and the buffer frame is fixedly installed on the test circuit board, and the sheet-shaped frame is fixedly installed on the buffer frame.

6. The tunable probe card of claim 1, wherein, Each of the spring sheet groups is composed of a plurality of spring sheets, and each of the spring sheets in each of the spring sheet groups is uniformly distributed.

7. The tunable probe card of claim 1, wherein, The leveling actuators are provided with three, which are distributed in an equilateral triangle.

8. The tunable probe card of claim 1, wherein, The leveling actuators comprise rotatable leveling bolts and contact spheres, each of the leveling bolts abuts against the substrate through the contact sphere, and the leveling bolt is used to adjust the levelness of the substrate relative to the test circuit board.

9. The tunable probe card of claim 8, wherein, The side of the test circuit board away from the substrate is fixedly provided with a back plate, the back plate is provided with a threaded hole threadedly matched with the leveling bolt, the test circuit board is provided with a first avoiding hole for avoiding the leveling bolt, the leveling bolt penetrates the threaded hole and the first avoiding hole and abuts against the substrate through the contact sphere.

10. The coplanar probe card of any one of claims 1 to 9, wherein, The adjustable probe card further comprises an inserter, which is arranged between the test circuit board and the substrate and is configured to one-to-one connect the conversion circuit in the substrate with the test circuit in the test circuit board.

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