Probe assembly, probe card and detection system
By designing probe assemblies with heating elements and conductive layers, the problem of poor contact between small-sized probes and chips was solved, enabling more efficient chip testing, reducing misjudgments and retesting time, and improving production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NEXCHIP SEMICON CO LTD
- Filing Date
- 2025-05-08
- Publication Date
- 2026-05-01
AI Technical Summary
In existing technologies, poor contact between small-sized probes and metal contacts on the chip leads to testing errors, prolongs testing time, and reduces production efficiency.
Design a probe assembly including a heating element and a conductive layer. The heating element receives or generates heat to expand the probe, thereby improving contact with the metal contact. An airflow is introduced through a deflector for cleaning and cooling, thereby reducing contact resistance.
Improve testing accuracy, reduce chip misjudgment, shorten retesting time, and increase production efficiency by approximately 15%.
Smart Images
Figure CN224190098U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a probe assembly, probe card and detection system. Background Technology
[0002] Chip probing (CP) testing is a critical step in semiconductor manufacturing, primarily used to perform functional and performance testing on chips before wafer dicing and packaging. The purpose of CP testing is to: ① verify functionality, ensuring the chip meets design requirements; ② obtain key parameters such as chip operating speed and power consumption to evaluate chip performance; and ③ screen for defects, identifying and eliminating substandard chips to reduce subsequent costs.
[0003] Currently, with the advancement of chip manufacturing processes, the metal contacts on chips are becoming increasingly smaller, which in turn requires the probes used for chip conformation (CP) testing to be even smaller. Small probes are prone to poor contact with the metal contacts on the chip, leading to some chips being falsely identified as defective. Furthermore, chips deemed defective require retesting, which prolongs CP testing time and reduces production efficiency. Utility Model Content
[0004] The purpose of this invention is to provide a probe assembly, a probe card, and a detection system to avoid testing errors caused by poor contact between small-sized probes and metal contacts on the chip.
[0005] To achieve the above objectives, the present invention provides a probe assembly, including a probe, the probe comprising a heating part and a conductive layer, the conductive layer being wrapped around the outer surface of the heating part.
[0006] Optionally, the probe includes an axially connected tail portion and a tip portion; the outer diameter of the tip portion gradually decreases in the direction away from the tail portion.
[0007] Optionally, the probe assembly further includes an energy conductor, a portion of which is located outside the probe, and another portion of which penetrates the conductive layer at the probe tail and extends into the conductive layer. The portion of the energy conductor located within the conductive layer is connected to the heating element.
[0008] Optionally, the heating element includes an electrothermal layer and an insulating and heat-conducting layer disposed on the outer surface of the electrothermal layer;
[0009] The energy conduction element is a wire, which also passes through the insulating heat-conducting layer and is electrically connected to the electrothermal layer.
[0010] Optionally, the probe assembly further includes a flow guide shroud, which is a hollow structure with an inner cavity, one end of which is an open end, and the diameter of the inner cavity is larger than the maximum outer diameter of the probe; the flow guide shroud is also provided with a joint port communicating with the inner cavity on its wall;
[0011] The needle tail is at least partially inserted into the inner cavity, and the needle tip extends at least partially from the opening end of the inner cavity.
[0012] Optionally, the probe further includes a protrusion, which is disposed at least on the outer surface of the portion of the probe tip located outside the flow guide.
[0013] Optionally, the height of the protrusion is 1μm to 2μm, and the outer diameter of the protrusion is 1μm to 2μm.
[0014] To achieve the above objectives, the present invention also provides a probe card, including a substrate and a probe assembly as described in any of the preceding claims, the probe assembly being disposed on the substrate.
[0015] To achieve the above objectives, the present invention also provides a detection system, including a robotic arm and a probe assembly as described in any of the preceding claims, the probe assembly being connected to the robotic arm.
[0016] Optionally, the detection system further includes a temperature detection element disposed at the end of the robotic arm.
[0017] Compared with the prior art, the probe assembly, probe card and detection system of this utility model have the following advantages:
[0018] The aforementioned probe assembly includes a probe, which comprises a heating element and a conductive layer, the conductive layer being wrapped around the outer surface of the heating element. When performing chip CP testing using this probe assembly, the probe is first partially inserted into the metal contacts of the chip. Then, the heating element receives or generates heat, causing the probe to expand due to heat. This improves the contact between the probe and the metal contacts, preventing poor contact and reducing the contact resistance between them. This reduces the likelihood of the chip being falsely identified as defective, thereby improving test accuracy, reducing the number of chips requiring retesting, reducing retesting time, and increasing test efficiency.
[0019] The probe assembly also includes a flow guide shroud covering part of the outer surface of the probe. The flow guide shroud is used to introduce gas carrying positive and negative ions into the outer surface of the probe to purge the surface of the probe and clean the probe. In addition, the probe can also be cooled by introducing airflow. Attached Figure Description
[0020] The accompanying drawings are provided to better understand this utility model and do not constitute an undue limitation thereof. Wherein:
[0021] Figure 1 This is a cross-sectional view of a probe assembly provided according to an embodiment of the present invention;
[0022] Figure 2 This is a cross-sectional view of a probe assembly provided according to an embodiment of the present invention. Figure 2 and Figure 1 The cutting surfaces are different;
[0023] Figure 3 This is a schematic diagram of an application scenario of the probe assembly provided by this utility model according to an embodiment, wherein the probe in the diagram has a low temperature;
[0024] Figure 4 This is a schematic diagram of an application scenario of the probe assembly provided by this utility model according to an embodiment. The probe in the diagram has a high temperature.
[0025] [The reference numerals in the attached figures are explained as follows]: 10-Probe assembly, 100-Probe, 101-Tail end of probe, 102-Tip of probe, 110-Heating part, 111-Electrothermal layer, 112-Insulating and heat-conducting layer, 120-Conductive layer, 130-Protrusion, 200-Energy conductor, 300-Flow guide, 310-Inner cavity, 311-Open end, 320-Match, 21-Metal contact. Detailed Implementation
[0026] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.
[0027] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this utility model must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, based on the disclosure of this utility model and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this utility model.
[0028] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “a plurality” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “install,” “connect,” and “join” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can represent internal communication between two elements or an interaction between two elements. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0029] To make the objectives, advantages, and features of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to conveniently and clearly illustrate the objectives of the embodiments of this utility model. The same or similar reference numerals in the drawings represent the same or similar parts.
[0030] Figure 1 This diagram shows a cross-sectional view of the probe assembly 10 provided in some embodiments of the present invention on a cutting plane. Figure 2 This is a cross-sectional view of the probe assembly 10 on another cutting plane. (See image.) Figure 1 and Figure 2 As shown, the probe assembly 10 includes a probe 100, which includes a heating part 110 and a conductive layer 120, the conductive layer 120 being wrapped around the outer surface of the heating part 110.
[0031] The probe assembly 10 can be used to perform CP testing on the chip, effectively improving test accuracy, reducing misjudgments, and increasing production efficiency.
[0032] Specifically, when performing the CP test on the chip using the probe assembly 10, the probe 100 is first partially inserted into the metal contact 21 of the chip (e.g., Figure 3 (as shown), and then the heating part 110 receives or generates heat, thereby causing the probe 100 to expand due to heat (as shown). Figure 4 (As shown), the test program is then input into the chip via the probe 100 to test the chip. By causing the probe 100 to expand due to heat, the contact between the probe 100 and the metal contact 21 is improved, reducing or even avoiding problems caused by poor contact between the probe 100 and the metal contact 21 during testing. Simultaneously, the contact resistance between the probe 100 and the metal contact 21 is reduced. This not only improves the accuracy of CP testing but also reduces the number of chips requiring retesting, reduces the time spent on retesting, and improves production efficiency. In practice, the application of the probe assembly 10 can improve testing efficiency by approximately 15%.
[0033] The structure of the probe assembly 100 will be further described below.
[0034] Please continue to refer to this. Figure 1 The probe 100 includes an axially connected tail portion 101 and a tip portion 102, wherein the tip portion 102 is used to at least partially penetrate the metal contact 21 of the chip. Preferably, the outer diameter of the tip portion 102 gradually decreases in the direction away from the tail portion 101, so that the tip portion 102 is formed into a tapered structure, which facilitates the tip portion 102 to at least partially penetrate the metal contact 21 of the chip.
[0035] Typically, the cross-section of the needle tip 102 is circular (e.g., Figure 2 (As shown), the cross-section of the needle tip 102 may not be circular but may be other shapes, such as a regular polygon or an ellipse. When the cross-section of the needle tip 102 is a regular polygon, the outer diameter of the needle tip 102 refers to the diameter of the circumcircle of the cross-section of the needle tip 102; when the cross-section of the needle tip 102 is elliptical, the outer diameter of the needle tip 102 includes the dimensions of the major axis and / or minor axis of the cross-section of the needle tip 102. Of course, the cross-section of the needle tip 102 may also be other shapes, as long as the needle tip 102 tapers away from the needle tail 102 to form a tip.
[0036] In addition, the cross-section of the needle tail 101 can be circular or not, and this embodiment of the present invention does not limit it.
[0037] like Figure 1As shown, the probe assembly 10 also includes an energy conductor 200. The energy conductor 200 is used to conduct energy from an external energy source, such as electrical energy or thermal energy, to the heating part 110, thereby heating the probe 100.
[0038] A portion of the energy conductor 200 is located outside the probe 100 and can be connected to the energy source. Another portion of the energy conductor 200 penetrates the conductive layer 120 and extends into the interior of the conductive layer 120. The portion of the energy conductor 200 located inside the conductive layer 120 is connected to the heating part 110 so as to conduct the energy provided by the energy source to the heating part 110.
[0039] Specifically, the energy conductor 200 penetrates the conductive layer 120 at the needle tail 101. In other words, the conductive layer 120 covers the entire outer surface of the heating element 110 at the needle tip 102, and also covers the outer surface of the heating element 110 at the needle tail 101, except for the area where it contacts the energy conductor 200. Preferably, the energy conductor 200 penetrates the conductive layer 120 at the end of the needle tail 101 away from the needle tip 102.
[0040] In some examples, such as Figure 1 and Figure 2 As shown, the heating part 110 includes an electrothermal layer 111 and an insulating and thermally conductive layer 112 disposed on the outer surface of the electrothermal layer 111. Correspondingly, the energy conductor 200 is a wire, and the energy source is a power source. That is, electrical energy is conducted to the electrothermal layer 111 through the energy conductor 200, causing the electrothermal layer 111 to generate heat energy, thereby achieving the heating effect of the probe 100. The insulating and thermally conductive layer 112 serves two purposes: firstly, it conducts heat energy to the conductive layer 120, which in turn conducts heat energy to the metal contacts 21 of the chip; secondly, it provides electrical isolation between the electrothermal layer 111 and the conductive layer 120.
[0041] The electrothermal layer 111 can be made of a metal with a high melting point, and the metal may include, but is not limited to, tungsten. The insulating and thermally conductive layer 112 is made of an insulating and thermally conductive material in the prior art, and the optional insulating and thermally conductive material may be a ceramic material, more specifically, alumina ceramic, aluminum nitride ceramic, etc. The conductive layer 120 is made of a metal with high density, high hardness, and high strength, and the optional metal may include, but is not limited to, osmium-tungsten alloy.
[0042] In other examples, the heating element includes only an insulating and thermally conductive layer and not an electrothermal layer (not shown in the figure). In these examples, the energy conduction element includes an insulating and thermally conductive element and an insulating and thermally insulating element. A portion of the insulating and thermally conductive element penetrates the conductive layer and extends into and connects to the insulating and thermally conductive layer. Another portion of the insulating and thermally conductive element is located outside the conductive layer to be connected to the energy source. The insulating and thermally insulating element covers the outer surface of the portion of the insulating and thermally conductive element located outside the conductive layer. The energy source is a heat source. In these examples, the material of the insulating and thermally conductive element can be the same as or different from the material of the insulating and thermally conductive layer. The insulating and thermally insulating element can be made of any suitable insulating and thermally insulating material available in the prior art.
[0043] Preferably, such as Figure 1 and Figure 2 As shown, the probe assembly 100 also includes a flow guide 300. The flow guide 300 is a hollow structure with an inner cavity 310, one end of which is an open end 311, and the diameter of the inner cavity 310 is larger than the maximum outer diameter of the probe 100. The wall of the flow guide 300 is also provided with a joint 320 communicating with the inner cavity 310. The needle tail 101 is at least partially inserted into the inner cavity 310, and the needle tip 102 extends at least partially from the open end 311 of the inner cavity 310.
[0044] The joint 320 can be located at any suitable position on the wall of the flow guide 300. Preferably, the flow guide 300 and the opening end 311 of the inner cavity 310 are opposite each other in the axial direction of the probe 100.
[0045] Alternatively, preferably, the entire needle tail 101 passes through the inner cavity 310, and a portion of the needle tip 102 is located within the inner cavity 310.
[0046] The flow guide shroud 300 is connected to an external air source (not shown) via the connection port 320, which provides a low-temperature airflow. The low-temperature airflow enters the inner cavity 310 via the connection port 320 and flows further from the gap between the flow guide shroud 300 and the probe 100 to the opening end 311 of the inner cavity 310, and exits from the opening end 311, thereby purging the surface of the probe 100 and cooling it. The cooling operation of the probe 100 is performed at least before the probe 100 partially penetrates the metal contact 21 of the chip, so that the probe 100 shrinks due to cooling, resulting in a smaller volume and easier penetration into the metal contact of the chip.
[0047] Furthermore, those skilled in the art will readily understand that the temperature of the probe 100 during testing should not be too high, otherwise the chip may be burned out. To address this, a purging operation on the surface of the probe 100 can be performed during testing as needed to enhance heat dissipation and prevent the probe 100 from overheating. In practice, the maximum temperature of the probe 100 is determined based on the chip's performance, with the aim of preventing chip burnout.
[0048] Therefore, during the CP test, a temperature sensing element should be used to detect the temperature of the probe 100 and the chip. The temperature sensor can have any suitable configuration, as long as it can simultaneously detect the temperature of the probe 100 and the chip.
[0049] Furthermore, a positive and negative ion generator (not shown in the figure) is also provided between the gas source and the junction 320. The low-temperature airflow provided by the gas source first flows through the positive and negative ion generator, and then flows into the inner cavity 310 from the junction 320. In this way, the airflow flowing into the inner cavity 310 carries positive and negative ions. When the airflow carrying positive and negative ions blows on the surface of the probe 100, the positive and negative ions can neutralize the particles adsorbed on the surface of the probe 100, destroy the electrostatic adsorption between the particles and the surface of the probe 100, and cause the particles to detach from the probe 100, thereby cleaning the probe 100.
[0050] Those skilled in the art will readily understand that each time a CP test is performed using the probe assembly 10, particulate matter from the chip or other materials adheres to the surface of the probe 100. This adsorbed particulate matter can interfere with the accuracy of the CP test. Therefore, purging the surface of the probe 100 with an airflow carrying both positive and negative ions before partially inserting the probe 100 into the metal contacts of the chip can further improve the accuracy of the CP test.
[0051] It is easy to understand that the energy conductor 200 also penetrates the shroud 300 and extends partially to the outside of the shroud 300 to be able to connect with the energy source.
[0052] Furthermore, such as Figure 1 and Figure 2 As shown, the probe 100 further includes a protrusion 130, which is disposed at least on the outer surface of the portion of the probe tip 102 located outside the flow guide shroud 140. By providing the protrusion 200, the contact between the expanded probe 100 and the metal contacts of the chip can be further improved.
[0053] The shape of the protrusion 200 is not particularly limited in this embodiment of the invention. In optional examples, the protrusion 200 can be cylindrical, hemispherical, ellipsoidal, or any other suitable shape. The maximum outer diameter of the protrusion 200 can be 1 μm to 2 μm, and the height H of the protrusion 200 can be 1 μm to 2 μm.
[0054] Furthermore, this embodiment of the invention also provides a probe card, which includes a substrate and a probe assembly 10 as described above, the probe assembly 10 being disposed on the substrate. It is understood that the probe card typically includes multiple probe assemblies 10, and the multiple probe assemblies 10 are arranged in an array on the substrate.
[0055] Furthermore, this embodiment of the invention also provides a detection system, which includes a robotic arm and a probe assembly 10 as described above, the probe assembly being connected to the robotic arm. The detection system is configured to move the probe assembly 10 via the movement of the robotic arm, such that the probe 100 can partially insert into or remove from the metal contacts 21 of the chip.
[0056] Typically, multiple probe assemblies 10 are connected to a substrate to form a probe card. The robotic arm is connected to multiple probe assemblies 10 simultaneously by connecting to the substrate.
[0057] Furthermore, the detection system also includes the aforementioned temperature sensor, which is a non-contact temperature sensor disposed at the end of the robotic arm to detect the temperature of the probe 100 and the chip.
[0058] Furthermore, if the probe assembly 10 includes the flow guide 300, the detection system may also include the gas source and may further include the positive and negative ion generator.
[0059] While the present invention has been disclosed above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and variations.
Claims
1. A probe assembly, characterized in that, The device includes a probe, which comprises a heating element and a conductive layer, the conductive layer being wrapped around the outer surface of the heating element.
2. The probe assembly according to claim 1, characterized in that, The probe includes an axially connected tail portion and a tip portion; the outer diameter of the tip portion gradually decreases in the direction away from the tail portion.
3. The probe assembly according to claim 2, characterized in that, The probe assembly also includes an energy conductor, a portion of which is located outside the probe, and another portion of which penetrates the conductive layer at the probe tail and extends into the conductive layer. The portion of the energy conductor located within the conductive layer is connected to the heating element.
4. The probe assembly according to claim 3, characterized in that, The heating element includes an electrothermal layer and an insulating and heat-conducting layer disposed on the outer surface of the electrothermal layer; The energy conduction element is a wire, which also passes through the insulating heat-conducting layer and is electrically connected to the electrothermal layer.
5. The probe assembly according to claim 2, characterized in that, The probe assembly also includes a flow guide shroud, which is a hollow structure with an inner cavity. One end of the inner cavity is an open end, and the diameter of the inner cavity is larger than the maximum outer diameter of the probe. The flow guide shroud is also provided with a joint port communicating with the inner cavity. The needle tail is at least partially inserted into the inner cavity, and the needle tip extends at least partially from the opening end of the inner cavity.
6. The probe assembly according to claim 5, characterized in that, The probe also includes a protrusion, which is disposed at least on the outer surface of the portion of the probe tip located outside the flow guide.
7. The probe assembly according to claim 6, characterized in that, The height of the protrusion is 1μm to 2μm, and the outer diameter of the protrusion is 1μm to 2μm.
8. A probe card, characterized in that, It includes a substrate and a probe assembly as described in any one of claims 1-7, the probe assembly being disposed on the substrate.
9. A detection system, characterized in that, It includes a robotic arm and a probe assembly as described in any one of claims 1-7, the probe assembly being connected to the robotic arm.
10. The detection system according to claim 9, characterized in that, The detection system also includes a temperature detection element, which is disposed at the end of the robotic arm.