Chip testing device

The design of the electric guide rail and disassembly/reassembly components has achieved flexibility and versatility in the chip testing device, solving the problems of high maintenance costs and poor adaptability of traditional testing devices, and improving testing accuracy and stability.

CN223977315UActive Publication Date: 2026-03-06NINGBO SHENGRUI SEMICON TECH CO LTD
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Patent Information

Application Number
CN202520209155.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-10
Publication Date
2026-03-06
Estimated Expiration
2035-02-10

AI Technical Summary

Technical Problem

Traditional chip testing equipment suffers from high maintenance costs, inability to adapt to the testing needs of different chip models, low testing efficiency, and poor versatility due to its fixed data connector design.

Method used

It adopts an electric guide rail and disassembly component design, which enables quick replacement of data plugs through disassembly component. Combined with an adjustable fixing component clamp, it can adapt to different models and specifications of FC-BGA packaged chips.

Benefits of technology

It improves the flexibility and versatility of testing, reduces maintenance costs, ensures testing accuracy and stability, adapts to the rapid changes in new chips, and reduces the risk of equipment obsolescence.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a chip testing device which comprises a workbench, the surface of the workbench is provided with an electric guide rail, a fixing assembly and a carrying table, the fixing assembly and the electric guide rail are vertically arranged on the surface of the workbench, the carrying table is located above the fixing assembly and used for placing a chip, the fixing assembly is used for fixing the chip, and the electric guide rail is provided with a test piece. And the data insertion block is connected with the test piece through the dismounting assembly. According to the utility model, the replacement of the data insertion block is realized through the dismounting assembly, so that the testing device can easily deal with FC-BGA packaging chips of different models and specifications, and when a testing object needs to be replaced, a user only needs to select or customize the corresponding data insertion block according to the specification of a data interface of a new chip, so that the testing object can be replaced. And the device can be rapidly installed in the installation frame of the testing device, so that the testing flexibility is greatly improved.
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Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically, it relates to a chip testing device. Background Technology

[0002] Against the backdrop of rapid development in semiconductor technology, flip-chip ball grid array (FC-BGA) packaging technology has been widely used in high-tech fields such as high-performance computing, smartphones, IoT devices, and data centers due to its significant advantages of high density, high performance, and low power consumption. FC-BGA packaging technology directly flip-chips onto a substrate and uses a ball grid array to achieve electrical connections. This not only significantly improves chip integration and signal transmission speed but also greatly reduces package size, meeting the urgent needs of modern electronic devices for miniaturization, lightweight design, and high performance.

[0003] However, in the testing process of FC-BGA packages, the design of the test interface device has become one of the key factors restricting testing efficiency and flexibility. Traditional test devices typically use fixed data connectors. While this design ensures the stability and reliability of data transmission to a certain extent, it brings many inconveniences. First, when the data connector is damaged due to long-term use or improper operation, the entire test device often needs to be disassembled and replaced, which not only increases maintenance costs but also seriously affects the testing schedule. Second, with the continuous advancement of semiconductor technology, the pace of new chip releases is accelerating, and the data interfaces between different chip models may differ. Traditional fixed data connectors often cannot adapt to these changes, preventing the test device from effectively testing new chips. In addition, fixed data connectors also limit the versatility of the test device, making it impossible for the same test device to simultaneously meet the testing requirements of multiple types of chips, further reducing testing efficiency. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, this utility model provides a chip testing device, including a worktable, an electric guide rail, a fixing component, and a stage, all arranged vertically on the worktable surface. The fixing component and the electric guide rail are positioned above the worktable surface and are used to place the chip. The fixing component is used to fix the chip, and a test piece is arranged on the electric guide rail. A data interposer is connected to the test piece via a disassembly and assembly component. This utility model allows for the replacement of the data interposer through the disassembly and assembly component, enabling the testing device to easily handle FC-BGA packaged chips of different models and specifications. When it is necessary to change the test object, the user only needs to select or customize the corresponding data interposer according to the data interface specifications of the new chip and quickly install it into the mounting frame of the testing device. This design greatly improves the flexibility of testing.

[0005] To achieve the above and other related objectives, this utility model provides a chip testing device, comprising:

[0006] A workbench, the surface of which is provided with an electric guide rail, a fixing component and a platform, the electric guide rail extends along a first direction, the fixing component extends along a second direction perpendicular to the first direction, the platform is located above the midpoint of the fixing component and at one end of the electric guide rail, the platform is used to place a chip, and the fixing component is used to fix the chip.

[0007] The test piece is located above the electric guide rail and is slidably connected to the electric guide rail.

[0008] The assembly is mounted on the side wall of the test piece facing the stage, and includes a mounting frame, a mounting block, and a locking assembly. The mounting frame has an opening facing the stage, and the locking assembly is located above the mounting frame. The locking assembly includes a locking rod extending along a third direction. The mounting block has a locking hole, and the locking rod passes through the locking hole to secure the mounting block in the mounting frame. The third direction is perpendicular to the first direction and the second direction.

[0009] Optionally, the locking component further includes:

[0010] The housing includes two opposing side plates and a top plate, the side plates being disposed perpendicular to the top surface of the mounting frame, and the top plate connecting the top ends of the two side plates;

[0011] A baffle, located inside the housing, has its two ends fixedly connected to the two side plates respectively, and is parallel to the top plate;

[0012] A reset plate is fixed to the locking rod, perpendicular to the locking rod, and located between the baffle and the top plate;

[0013] A reset spring, one end of which is fixedly connected to the top plate and the other end of which is fixedly connected to the reset plate.

[0014] Optionally, the locking rod passes through the top plate, the reset plate, and the baffle in sequence from top to bottom, and then into the locking hole.

[0015] Optionally, the fixing component includes:

[0016] Adjustment frame, extending along the second direction;

[0017] A threaded rod, fixed in the adjustment frame, extends along the second direction;

[0018] The knob is located on the outside of one end of the adjustment frame and is connected to the threaded rod;

[0019] Two clamping plates, each with a connector fixed to its bottom, the connector being located in the adjustment frame, the threaded rod passing through the two connectors to connect the clamping plate to the threaded rod.

[0020] Optionally, the threaded rod includes a first part and a second part with opposite thread directions and equal lengths, and the two connecting members are respectively located on the first part and the second part.

[0021] Optionally, a rubber pad layer is provided on the opposite surfaces of the two clamps.

[0022] Optionally, it also includes a data plug block mounted on the side wall of the mounting block facing the stage.

[0023] Optionally, the workbench surface is also provided with a display.

[0024] The chip testing device provided by this utility model has at least the following beneficial effects:

[0025] 1) The data plug is replaced by the cooperation of the mounting frame and the mounting block, which enables the test device to easily cope with FC-BGA packaged chips of different models and specifications. When the test object needs to be changed, the corresponding data plug can be selected or customized according to the data interface specifications of the new chip and quickly installed into the mounting frame of the test device. This design greatly improves the flexibility of the test and enables the test device to quickly adapt to the new chips that are constantly emerging in the market, reducing the risk of equipment obsolescence due to technology updates. Once the traditional fixed data plug is damaged, the entire test device often needs to be replaced or repaired, which is costly and affects the test progress. However, this application allows users to replace only the damaged data plug without touching the entire test device, thereby significantly reducing maintenance and replacement costs.

[0026] 2) The clamping plate can hold the chip by rotating the knob in the fixing component, keeping the chip under test fixed and stable during the test. The clamping plate can fit tightly against both sides of the chip, thereby avoiding test errors caused by chip movement or shaking. This design not only improves the accuracy of the test, but also ensures the stability and reliability of the test results. The rubber pad layer covering the inside of the clamping plate can effectively buffer and disperse pressure during clamping, thereby avoiding physical damage to the chip. This structure can flexibly adapt to chips of different sizes. This design allows the test device to meet the testing needs of multiple types of chips at the same time, further improving the versatility and flexibility of the test. Attached Figure Description

[0027] Figure 1 The diagram shown is a schematic representation of the chip testing apparatus provided in this embodiment.

[0028] Figure 2 The diagram shown is a structural schematic of the disassembly and assembly components provided in the embodiment.

[0029] Figure 3 The diagram shown is a structural schematic of the locking component provided in the embodiment.

[0030] Figures 4-5 The diagram shown is a structural schematic of the fixing component provided in the embodiment.

[0031] Component designation explanation

[0032] 1 workbench with 12 baffles

[0033] 2 Electric guide rails 13 Reset plate

[0034] 3. Platform 14. Return Spring

[0035] 4. Test piece 15: Adjustment frame

[0036] 5 Disassembly and assembly components 16 Threaded rod

[0037] 6. Data plug 161 Threaded rod, first part

[0038] 7. Mounting Frame 162 Threaded Rod Part 2

[0039] 8 mounting blocks 17 knobs

[0040] 80 Locking Hole 18 Clamping Plate

[0041] 9 Locking components 19 Connectors

[0042] 10 Locking bar 20 Rubber pad

[0043] 11 Housing 21 Display

[0044] 111 Side panel 100 chip

[0045] 112 Top Slab Detailed Implementation

[0046] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0047] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.

[0048] Example

[0049] This embodiment provides a chip testing device, such as... Figure 1 As shown, the device includes a workbench 1, on the surface of which are provided an electric guide rail 2, a fixing component and a platform 3. The platform 3 is used to place a chip 100, and the fixing component is used to fix the chip 100. A test piece 4 is provided above the electric guide rail 2, and a disassembly and assembly component 5 is installed on the side wall of the test piece 4 facing the platform 3. The disassembly and assembly component 5 is used to install a data plug 6.

[0050] like Figure 1 As shown, a display 21 is also provided on the surface of the workbench 1 to visualize the test status.

[0051] like Figure 1 As shown, the electric guide rail 2 is along the first direction ( Figure 1 Extending along the X-axis (as shown), test piece 4 is located above electric guide rail 2 and is slidably connected to electric guide rail 2, allowing test piece 4 to move on electric guide rail 2.

[0052] like Figure 1 and Figure 2 As shown, the assembly / disassembly component 5 includes a mounting frame 7, a mounting block 8, and a locking component 9. The mounting frame 7 has an opening facing the stage 3, and the locking component 9 is located above the mounting frame 7. The locking component 9 includes components along a third direction ( Figure 2 The locking rod 10 extends in the Z-axis direction shown. The mounting block 8 has a locking hole 80. The locking rod 10 passes through the locking hole 80 to fix the mounting block 8 in the mounting frame 7. The data plug 6 is mounted on the side wall of the mounting block 8 facing the stage 3.

[0053] like Figure 3As shown, the locking assembly 9 also includes a housing 11, a baffle 12, a reset plate 13, and a reset spring 14. The housing 11 includes two opposing side plates 111 and a top plate 112. The side plates 111 are perpendicular to the top surface of the mounting frame 7, and the top plate 112 connects the top ends of the two side plates 111. The baffle 12 is located inside the housing 11, with its two ends fixedly connected to the two side plates 111 respectively, and parallel to the top plate 112. The reset plate 13 is fixed on the locking rod 10, perpendicular to the locking rod 10, and located between the baffle 12 and the top plate 112. One end of the reset spring 14 is fixedly connected to the top plate 112, and the other end is fixedly connected to the reset plate 13. The two reset springs 14 are located on both sides of the locking rod 10.

[0054] As an example, when installing data plug 6, first lift the locking lever 10, compress the return spring 14 by the reset plate 13, and place the mounting block 8 in the mounting frame 7 with the locking hole 80 facing the locking lever 10; then release the locking lever 10, which is reset by the return spring 14 and the reset plate 13 until the reset plate 13 contacts the baffle 12, the locking lever 10 passes through the locking hole 80, and the mounting block 8 is fixed in the mounting frame 7; finally, install the data plug 6 on the exposed surface of the mounting block 8. As an example, the process of replacing the data plug 6 is the same as the above process, and in the above process, the stroke of the reset plate 13 needs to be greater than the length of the locking lever 10 in the locking hole 80 so that the mounting block 8 can be smoothly removed from the mounting frame 7.

[0055] In this embodiment, the data plug 6 is replaced through the cooperation of the mounting frame 7 and the mounting block 8, enabling the test device to easily handle chips 100 of different models and specifications. When it is necessary to change the test object, it is only necessary to select or customize the corresponding data plug 6 according to the data interface specifications of the new chip and quickly install it into the mounting frame 7 of the test device. This design greatly improves the flexibility of testing, enabling the test device to quickly adapt to the new chips that are constantly emerging in the market and reducing the risk of equipment obsolescence due to technological updates. Once the traditional fixed data plug is damaged, the entire test device often needs to be replaced or repaired, which is costly and affects the test progress. However, this application allows users to replace only the damaged data plug 6 without touching the entire test device, thereby significantly reducing maintenance and replacement costs.

[0056] like Figure 1 and Figure 4 As shown, the fixing component is along the second direction ( Figure 1 Extending along the Y-axis (as shown), the stage 3 is located above the midpoint of the fixing component and at one end of the motorized guide rail 2. As an example, during testing, the chip 100 is placed on the stage 3, the fixing component secures the chip 100, and the test piece 4, equipped with the data plug 6, moves along the motorized guide rail 2 to the chip 100 for testing.

[0057] like Figure 4 and Figure 5 As shown, the fixing assembly includes an adjusting frame 15, a threaded rod 16, a knob 17, and two clamping plates 18, wherein the adjusting frame 15 is along the second direction ( Figure 1 Extending along the Y-axis (as shown); the threaded rod 16 is fixed in the adjusting frame 15, along the second direction ( Figure 1 (Extended in the Y-axis direction as shown); Knob 17 is located on the outside of one end of the adjustment frame 15 and is connected to the threaded rod 16; Connector 19 is fixed to the bottom of both clamping plates 18, and the connector 19 is located in the adjustment frame 15. The threaded rod 16 passes through the two connectors 19 so that the clamping plate 18 is connected to the threaded rod 16.

[0058] As an example, the threaded rod 16 includes a first part 161 and a second part 162 with opposite thread directions and equal lengths. Two connecting pieces 19 are located on the first part 161 and the second part 162, respectively. When the threaded rod 16 rotates, the two connecting pieces 19 can move towards or away from each other, thereby causing the two clamping plates 18 to move towards or away from each other, so as to fix or release the chip 100. For example, by turning the knob 17 in one direction, the two clamping plates 18 can be moved towards each other to clamp the chip 100; by turning the knob 17 in the opposite direction, the two clamping plates 18 can be moved away from each other to release the chip 100.

[0059] As an example, rubber pads 20 are also provided on the opposite surfaces of the two clamping plates 18 to prevent damage to the chip 100 when the clamping plates 18 clamp the chip 100.

[0060] In this embodiment, the clamping plate 18 can clamp the chip 100 by using the knob 17 in the fixing component, so that the chip under test 100 can remain fixed and stable during the test. The clamping plate 18 can fit tightly against both sides of the chip 100, thereby avoiding test errors caused by the movement or shaking of the chip 100. This design not only improves the accuracy of the test, but also ensures the stability and reliability of the test results. The rubber pad 20 covering the inner side of the clamping plate 18 can effectively buffer and disperse pressure during the clamping process, thereby avoiding physical damage to the chip 100. This structure can flexibly adapt to chips of different sizes. This design enables the test device to meet the test requirements of multiple types of chips at the same time, further improving the versatility and flexibility of the test.

[0061] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A chip testing apparatus characterized by comprising: The utility model provides a chip testing device, which comprises the following: a workbench, the surface of the workbench is provided with an electric guide rail, a fixing assembly and a carrier, the electric guide rail extends along a first direction, the fixing assembly extends along a second direction perpendicular to the first direction, the carrier is located above the midpoint of the fixing assembly and at one end of the electric guide rail, the carrier is used for placing a chip, and the fixing assembly is used for fixing the chip; a test piece located above the electric guide rail and in sliding connection with the electric guide rail; a dismounting assembly installed on the side wall of the test piece facing the carrier, comprising a mounting frame, a mounting block and a locking assembly, the mounting frame has an opening facing the carrier, the locking assembly is located above the mounting frame, the locking assembly comprises a locking rod extending along a third direction, the mounting block is provided with a locking hole, and the locking rod penetrates into the locking hole to fix the mounting block in the mounting frame, wherein the third direction is perpendicular to the first direction and the second direction.

2. The chip testing apparatus according to claim 1, wherein The locking assembly further comprises: a shell comprising two opposite side plates and a top plate, the side plates are arranged perpendicularly to the top surface of the mounting frame, and the top plate is connected to the top ends of the two side plates; a baffle located inside the shell, both ends of the baffle are fixedly connected with the two side plates respectively, and the baffle is parallel to the top plate; a reset plate fixed on the locking rod, the reset plate is perpendicular to the locking rod and located between the baffle and the top plate; a reset spring, one end of the reset spring is fixedly connected with the top plate, and the other end of the reset spring is fixedly connected with the reset plate.

3. The chip testing apparatus according to claim 2, wherein The locking rod penetrates through the top plate, the reset plate and the baffle in sequence from top to bottom and penetrates into the locking hole.

4. The chip testing apparatus according to claim 1, wherein The fixing assembly comprises: an adjusting frame extending along the second direction; a threaded rod fixed in the adjusting frame and extending along the second direction; a knob located outside one end of the adjusting frame and connected with the threaded rod; two clamping plates, each clamping plate is fixedly provided with a connecting piece at the bottom, the connecting piece is located in the adjusting frame, and the threaded rod penetrates through the two connecting pieces so that the clamping plates are connected with the threaded rod.

5. The chip testing apparatus according to claim 4, wherein The threaded rod comprises a first part and a second part with opposite screw directions and equal lengths, and the two connecting pieces are located on the first part and the second part respectively.

6. The chip testing apparatus according to claim 4, wherein Rubber pads are arranged on the opposite surfaces of the two clamping plates.

7. The chip testing apparatus according to claim 1, wherein A data plug-in block is further arranged on the side wall of the mounting block facing the carrier.

8. The chip testing apparatus according to claim 1, wherein The surface of the workbench is further provided with a display.