Control circuit and device for physical cooling instrument for children
By controlling the semiconductor cooling chip and full-bridge circuit, the cold compress and hot compress modes of the children's physical cooling device can be switched, which solves the problem of the inability to raise the temperature in the existing technology and improves the user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-03
- Publication Date
- 2026-03-06
AI Technical Summary
Existing physical cooling devices for children cannot raise the temperature after it drops, resulting in a poor user experience.
It uses a semiconductor cooling chip and a full-bridge circuit, and controls the conduction combination of MOSFETs through the main control chip to change the current flow and realize the switching between cold compress or hot compress mode.
It enables children's physical cooling devices to work flexibly under different treatment needs, meet the need to switch between cold and hot compress modes, and improve the user experience.
Smart Images
Figure CN223977524U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of physical cooling technology, and in particular to a control circuit and device for a physical cooling device for children. Background Technology
[0002] Physical cooling devices for children have wide applications in pediatric clinical treatment and home care. For example, for children who are not suitable for medication or have contraindications to medication, such as those allergic to antipyretics or with liver or kidney dysfunction, physical cooling devices are a safe and effective alternative.
[0003] Currently, most children's physical cooling devices on the market use compressors for cooling, which control a relay switch to achieve cooling. However, once the temperature drops, it cannot be raised again, resulting in a poor user experience. Utility Model Content
[0004] To overcome the shortcomings of the prior art, this application provides a control circuit and device for a physical cooling device for children, which can switch between cold compress and hot compress modes through a semiconductor cooling chip, so as to meet the working requirements of the physical cooling device for children under different treatment needs.
[0005] This application provides a control circuit for a physical cooling device for children, wherein the physical cooling device uses a semiconductor cooling chip to heat or cool a treatment solution that comes into contact with the child's body; the control circuit includes:
[0006] The semiconductor control circuit includes a first driver chip and two MOS transistors connected thereto, and a second driver chip and two MOS transistors connected thereto. The four MOS transistors form a full-bridge circuit, and the output interface of the full-bridge circuit is connected to the interface of the semiconductor cooling chip.
[0007] The main control chip is used to send control signals to the first driver chip and the second driver chip to control the conduction combination of different MOS transistors, and to switch the cooling surface of the semiconductor refrigeration chip to cool down or heat up by changing the current flow direction.
[0008] In one possible implementation, the semiconductor control circuit further includes:
[0009] Temperature sensor, used to collect the temperature of the heating surface of a semiconductor refrigeration chip;
[0010] An AND gate chip is used, with its output connected to the enable pins of the first and second driver chips, and its input connected to the first and second temperature control switches. When the temperature of the heating surface of the semiconductor cooling chip exceeds a set threshold, the main control chip controls the first or second temperature control switch to disconnect.
[0011] In one possible implementation, the two MOSFETs connected to the first driver chip are the thirteenth MOSFET Q13 and the fourteenth MOSFET Q14, and the two MOSFETs connected to the second driver chip are the fifteenth MOSFET Q15 and the sixteenth MOSFET Q16; the interface of the semiconductor cooling chip includes a first interface SEM1 and a second interface SEM2.
[0012] When both the first driver chip and the second driver chip are turned on, and the main control chip sends a control signal of PWMA high level to the input pin of the first driver chip and a control signal of PWMB low level to the input pin of the second driver chip, the thirteenth MOSFET Q13 and the sixteenth MOSFET Q16 are driven to conduct. The current flows from the first interface SEM1 into the semiconductor cooling chip through the thirteenth MOSFET Q13, then flows out from the second interface SEM2, and returns to the negative terminal of the power supply through the sixteenth MOSFET Q16, thereby cooling the cooling surface of the semiconductor cooling chip.
[0013] When both the first and second driver chips are turned on, and the main control chip sends a low-level PWMA control signal to the input pin of the first driver chip and a high-level PWMB control signal to the input pin of the second driver chip, the fourteenth MOSFET Q14 and the fifteenth MOSFET Q15 are turned on. Current flows from the second interface SEM2 into the thermoelectric cooler through the fifteenth MOSFET Q15, then flows out from the first interface SEM1, and returns to the negative terminal of the power supply through the fourteenth MOSFET Q14, thus heating the cooling surface of the thermoelectric cooler.
[0014] In one possible implementation, when both the first temperature control switch and the second temperature switch are turned on, the first driver chip and the second driver chip are turned on.
[0015] When the cooling surface of the thermoelectric cooler is cooled and the temperature of its heating surface exceeds a set threshold, the main control chip controls the first temperature control switch to open, thereby turning off the first driving chip and the second driving chip.
[0016] When the cooling surface of the thermoelectric cooler is heated and the temperature of its heating surface exceeds a set threshold, the main control chip controls the second temperature control switch to turn off, thereby shutting down the first driving chip and the second driving chip.
[0017] In one possible implementation, the control circuit further includes:
[0018] The heat dissipation circuit is used to dissipate heat from the heat dissipation surface of the semiconductor cooling chip via a cooling water pump.
[0019] In one possible implementation, the heat dissipation circuit includes:
[0020] The first MOSFET Q1 has its drain connected to a DC power supply via a light-emitting diode and another via a cooling water pump. Its source is grounded, and its gate is connected to the control signal of the main control chip. When the control signal sent by the main control chip to the gate of the first MOSFET is high, the first MOSFET is turned on, and the cooling water pump operates.
[0021] In one possible implementation, the control circuit further includes:
[0022] The treatment fluid circulation circuit includes a circulating water pump and a pressure sensor. When the circulating water pump cools or heats the cooling surface of the thermoelectric cooler, the main control chip controls it to rotate forward, delivering the treatment fluid heated or cooled by the thermoelectric cooler from the storage container to the protective sleeve that comes into contact with the child's body. The pressure sensor is used to monitor the internal pressure of the protective sleeve. When the internal pressure is released to zero, the main control chip controls the circulating water pump to rotate in reverse, recovering the treatment fluid in the protective sleeve back to the storage container.
[0023] This application provides a control device for a physical cooling device for children, which employs any of the control circuits described above for a physical cooling device for children.
[0024] Compared with the prior art, the beneficial effects of this application are:
[0025] The control circuit and device for a physical cooling device for children provided in this embodiment control different MOSFETs in the full-bridge circuit by sending different PWM signals through the main control chip, thereby changing the direction of the current flowing through the semiconductor cooling chip and realizing the switching between cold compress or hot compress modes, thus meeting the working requirements of the physical cooling device for children under different treatment needs. Attached Figure Description
[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 A circuit diagram of a semiconductor control circuit according to an embodiment of this application is shown;
[0028] Figure 2 A circuit diagram of the main control chip according to an embodiment of this application is shown;
[0029] Figure 3A circuit diagram of a heat dissipation circuit according to an embodiment of this application is shown;
[0030] Figure 4 A circuit diagram of the therapeutic fluid circulation circuit according to an embodiment of this application is shown. Detailed Implementation
[0031] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0032] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0035] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0036] In view of the technical problems mentioned in the background art, this application provides a control circuit and device for a children's physical cooling device, which can realize the cold compress and hot compress modes of the children's physical cooling device through a semiconductor cooling chip.
[0037] One embodiment of this application provides a control circuit for a physical cooling device for children, wherein the physical cooling device uses a semiconductor cooling chip to heat or cool a treatment solution that comes into contact with the child's body; the control circuit includes:
[0038] The semiconductor control circuit includes a first driver chip and two MOS transistors connected thereto, and a second driver chip and two MOS transistors connected thereto. The four MOS transistors form a full-bridge circuit, and the output interface of the full-bridge circuit is connected to the interface of the semiconductor cooling chip.
[0039] The main control chip is used to send control signals to the first driver chip and the second driver chip to control the conduction combination of different MOS transistors, and to switch the cooling surface of the semiconductor refrigeration chip to cool down or heat up by changing the current flow direction.
[0040] For details, please refer to the instruction manual appendix. Figure 1 Included with instruction manual Figure 2The main control chip is GD32F103VCT6, and the first driver chip U12 and the second driver chip U13 are IR2184. In this configuration, the high-side output pin HO of the first driver chip U12 is connected to the gate of the thirteenth MOSFET Q13 via the ninety-first resistor R91, and the low-side output pin LO of the first driver chip U12 is connected to the gate of the fourteenth MOSFET Q14 via the ninety-second resistor R92. The drain of the thirteenth MOSFET Q13 is connected to the positive power supply V24, and its source is connected to the drain of the fourteenth MOSFET Q14. The source of the fourteenth MOSFET Q14 is connected to the negative power supply GND via the ninety-fifth resistor R95. Similarly, the high-side output pin HO of the second driver chip U13 is connected to the gate of the fifteenth MOSFET Q15 via the ninety-third resistor R93, and the low-side output pin LO of the second driver chip U13 is connected to the gate of the sixteenth MOSFET Q16 via the ninety-fourth resistor R94. The drain of the fifteenth MOSFET Q15 is connected to the positive power supply V24, and its source is connected to the drain of the sixteenth MOSFET Q16. The source of the sixteenth MOSFET Q16 is connected to the negative power supply GND via the ninety-fifth resistor R95.
[0041] The first interface SEM1 of the semiconductor cooling chip P14 is connected between the source of the thirteenth MOSFET Q13 and the drain of the fourteenth MOSFET Q14; the second interface SEM2 of the semiconductor cooling chip P14 is connected between the source of the fifteenth MOSFET Q15 and the drain of the sixteenth MOSFET Q16.
[0042] In addition, the semiconductor control circuit also includes a temperature sensor and an AND gate chip. The temperature sensor (not shown in the figure) is used to collect the temperature of the heating surface of the thermoelectric cooler. The AND gate chip U14, model 74AHC1G28G, has its output terminal Y connected to the enable pin SD of the first driver chip U12 and the second driver chip U13. Its input terminal has two pins, of which pin B is connected to the first temperature control switch P12 and pin A is connected to the second temperature control switch P13. When the temperature of the heating surface of the thermoelectric cooler exceeds the set threshold, the main control chip controls the first temperature control switch or the second temperature control switch to open. In this application, when both the first temperature control switch P12 and the second temperature control switch P13 are turned on, the output terminal Y of the AND gate chip U14 outputs a high level, and the first driver chip U12 and the second driver chip 13 are in the on state; when the temperature of the heating surface of the semiconductor cooling chip P14 is detected to exceed a set threshold, the main control chip controls the first temperature control switch P12 or the second temperature control switch P13 to turn off, the output terminal Y of the AND gate chip U14 outputs a low level, and the first driver chip U12 and the second driver chip 13 are in the off state.
[0043] In one embodiment, both the first temperature control switch P12 and the second temperature control switch P13 are turned on. When the control signal sent by the main control chip to the input pin IN of the first driver chip U12 is PWMA high level and the control signal sent to the input pin IN of the second driver chip U13 is PWMB low level, the thirteenth MOSFET Q13 and the sixteenth MOSFET Q16 are turned on. The current flows from the first interface SEM1 to the semiconductor cooling chip P14 through the thirteenth MOSFET Q13, then flows out from the second interface SEM2, and returns to the negative terminal of the power supply through the sixteenth MOSFET Q16. The cooling surface of the semiconductor cooling chip P14 is cooled, and the children's physical cooling device operates in cold compress mode.
[0044] When the temperature of the heating surface of the thermoelectric cooler P14 continues to rise and reaches the operating temperature of the temperature control switch, the first temperature control switch P12 opens, the AND gate chip U14 outputs a low level, the driver chips U12 and U13 are disabled, and the thirteenth MOSFET Q13 and the sixteenth MOSFET Q16 are turned off. When the temperature drops below the operating temperature of the temperature control switch, the first temperature control switch P12 closes, the AND gate chip U14 outputs a high level, and the first driver chip U12 and the second driver chip U13 resume operation.
[0045] When both the first temperature control switch P12 and the second temperature control switch P13 are turned on, and the control signal sent by the main control chip to the input pin IN of the first driver chip U12 is PWMA low level and the control signal sent to the input pin IN of the second driver chip U13 is PWMB high level, the fourteenth MOSFET Q14 and the fifteenth MOSFET Q15 are turned on. The current flows from the second interface SEM2 into the semiconductor cooling chip through the fifteenth MOSFET Q15, then flows out from the first interface SEM1, and returns to the negative terminal of the power supply through the fourteenth MOSFET Q14. The cooling surface of the semiconductor cooling chip is heated, and the children's physical cooling device operates in hot compress mode.
[0046] When the temperature of the heating surface of the thermoelectric cooler P14 continues to rise and reaches the operating temperature of the temperature control switch, the second temperature control switch P13 opens, the AND gate chip U14 outputs a low level, the driver chips U12 and U13 are disabled, and the fourteenth MOSFET Q14 and the fifteenth MOSFET Q15 are turned off. When the temperature drops below the operating temperature of the temperature control switch, the second temperature control switch P13 closes, the AND gate chip U14 outputs a high level, and the first driver chip U12 and the second driver chip U13 resume operation.
[0047] In other embodiments, the control circuit further includes a heat dissipation circuit for dissipating heat from the heat dissipation surface of the thermoelectric cooler using a cooling water pump. See the appendix to the specification. Figure 3The heat dissipation circuit includes a first MOSFET Q1, whose drain is connected to DC power supply V12 via an LED and another via a cooling water pump P3. Its source is grounded to GND, and its gate is connected to the control signal Hot_Pump_Ctrl of the main control chip via a 21st resistor R21. When the control signal Hot_Pump_Ctrl sent by the main control chip to the gate of the first MOSFET Q1 is high, the first MOSFET Q1 is turned on, the LED lights up as an indicator, and the cooling water pump P3 operates, carrying away the heat from the heating surface of the semiconductor cooling chip P14 through circulating liquid, thus achieving the heat dissipation function.
[0048] In other embodiments, see the appendix to the specification. Figure 4 The control circuit also includes a treatment fluid circulation circuit, comprising a circulating water pump P18 and a pressure sensor (not shown in the figure). The circulating water pump P18 is a WM speed-regulating pump, supporting forward and reverse rotation. When the cooling surface of the semiconductor cooling chip P14 is cooled or heated, the main control chip controls its forward rotation, delivering the treatment fluid heated or cooled by the semiconductor cooling chip P14 from the storage container to the protective sleeve that comes into contact with the child's body. The pressure sensor is used to monitor the internal pressure of the protective sleeve. This is because during the cold or hot compress process, the treatment fluid is delivered to the protective sleeve, at which point the sleeve is filled with treatment fluid and a certain pressure is generated. When the cold or hot compress process ends, the main control chip controls the circulating water pump P18 to stop working. At this time, the treatment fluid in the protective sleeve no longer flows, and the pressure gradually releases until the pressure in the protective sleeve drops to zero. When the internal pressure is released to zero, the main control chip controls the circulating water pump P14 to reverse, recovering the treatment fluid in the protective sleeve back to the storage container.
[0049] The control circuit for a children's physical cooling device provided in this application controls the conduction of different MOSFETs in the full-bridge circuit by sending different PWM signals through the main control chip. This changes the direction of the current flowing through the thermoelectric cooler, enabling switching between cold and hot compress modes and meeting the operational requirements of the children's physical cooling device under different treatment needs. Furthermore, by setting a temperature control switch, the driver chip is shut down when the temperature of the heating surface of the thermoelectric cooler becomes too high, providing a protective function.
[0050] This utility model also provides a control device for a children's physical cooling device. Using the aforementioned control circuit for the children's physical cooling device, the device can switch between cold and hot compress modes, meeting the operational requirements of the device under different treatment needs. Since the principle of the temperature measuring device in this application embodiment is similar to the temperature measuring circuit described above, the implementation of the temperature measuring device can refer to the implementation of the temperature measuring circuit; repeated details will not be elaborated further.
[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0052] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A control circuit for a child physical cooling device, characterized in that, The child physical cooling device uses semiconductor refrigerating sheets to heat or cool the treatment liquid in contact with the child's body; the control circuit comprises: A semiconductor control circuit comprises a first driving chip, two MOS tubes connected to the first driving chip, a second driving chip, and two MOS tubes connected to the second driving chip, four MOS tubes form a full-bridge circuit, and the output interface of the full-bridge circuit is connected to the interface of the semiconductor refrigerating sheet; A main control chip is used to send control signals to the first driving chip and the second driving chip to control the conduction combination of different MOS tubes, and to switch the cooling surface of the semiconductor refrigerating sheet to cool or heat by changing the current direction.
2. The control circuit for a child physical cooling device of claim 1, wherein, The semiconductor control circuit further comprises: A temperature sensor is used to collect the temperature of the heating surface of the semiconductor refrigerating sheet; A AND gate chip is connected to the enable pins of the first driving chip and the second driving chip, and the input end of the AND gate chip is connected to the first temperature control switch and the second temperature control switch; when the temperature of the heating surface of the semiconductor refrigerating sheet exceeds the set threshold, the main control chip controls the first temperature control switch or the second temperature control switch to be turned off.
3. The control circuit for a child physical cooling device of claim 2, wherein, The two MOS tubes connected to the first driving chip are the thirteenth MOS tube Q13 and the fourteenth MOS tube Q14, and the two MOS tubes connected to the second driving chip are the fifteenth MOS tube Q15 and the sixteenth MOS tube Q16; the interface of the semiconductor refrigerating sheet comprises a first interface SEM1 and a second interface SEM2; When the first driving chip and the second driving chip are both turned on, the main control chip sends a control signal with PWMA high level to the input pin of the first driving chip and a control signal with PWMB low level to the input pin of the second driving chip, the thirteenth MOS tube Q13 and the sixteenth MOS tube Q16 are driven to be conductive, the current flows from the first interface SEM1 into the semiconductor refrigerating sheet through the thirteenth MOS tube Q13, then flows out from the second interface SEM2, and returns to the negative electrode of the power supply through the sixteenth MOS tube Q16, and the cooling surface of the semiconductor refrigerating sheet is cooled; When the first driving chip and the second driving chip are both turned on, the main control chip sends a control signal with PWMA low level to the input pin of the first driving chip and a control signal with PWMB high level to the input pin of the second driving chip, the fourteenth MOS tube Q14 and the fifteenth MOS tube Q15 are driven to be conductive, the current flows from the second interface SEM2 into the semiconductor refrigerating sheet through the fifteenth MOS tube Q15, then flows out from the first interface SEM1, and returns to the negative electrode of the power supply through the fourteenth MOS tube Q14, and the cooling surface of the semiconductor refrigerating sheet is heated.
4. The control circuit for a child physical cooling device of claim 3, wherein, When the first temperature control switch and the second temperature control switch are both turned on, the first driving chip and the second driving chip are turned on; When the cooling surface of the semiconductor refrigerating sheet is cooled and the temperature of its heating surface exceeds the set threshold, the main control chip controls the first temperature control switch to be turned off, so that the first driving chip and the second driving chip are turned off. When the cooling surface of the semiconductor refrigeration sheet is warmed up and the temperature of its heating surface exceeds a set threshold, the main control chip controls the second temperature control switch to be turned off, so that the first driving chip and the second driving chip are turned off.
5. The control circuit for a child physical cooling device of claim 3, wherein, The control circuit further comprises: A heat dissipation circuit for dissipating heat from the heat dissipation surface of the semiconductor refrigeration sheet by a heat dissipation water pump.
6. The control circuit for a child physical cooling device of claim 5, wherein, The heat dissipation circuit comprises: A first MOS tube Q1, whose drain is connected to a direct current power supply through a light emitting diode and connected to the direct current power supply through the heat dissipation water pump, whose source is grounded, and whose gate is connected to a control signal of the main control chip; when the control signal sent by the main control chip to the gate of the first MOS tube is high, the first MOS tube is turned on, and the heat dissipation water pump works.
7. The control circuit for a child physical cooling device of claim 1, wherein, The control circuit further comprises: A treatment liquid circulation circuit comprising a circulating water pump and a pressure sensor; when the cooling surface of the semiconductor refrigeration sheet is cooled down or warmed up, the main control chip controls the circulating water pump to rotate forward, so that the treatment liquid after being warmed up or cooled down by the semiconductor refrigeration sheet is transported from a storage container to a sheath in contact with the body of the child; the pressure sensor is used to monitor the internal pressure of the sheath, and when the internal pressure is released to zero, the main control chip controls the circulating water pump to rotate reversely, so that the treatment liquid in the sheath is recovered to the storage container.
8. A control device for a child physical cooling apparatus, characterized by, The control circuit for the physical cooling instrument for children according to any one of claims 1-7.