Ultrasonic fingerprint identification module and electronic equipment

Abstract

The utility model provides an ultrasonic fingerprint identification module and electronic equipment, the ultrasonic fingerprint identification module at least comprises a substrate, a piezoelectric transducer, an insulating layer, a flexible circuit board and a connecting structure, and the substrate is provided with a first interconnection layer; the piezoelectric transducer is arranged on the substrate; the insulating layer is arranged on the substrate and covers the piezoelectric transducer, and the insulating layer is used for connecting a screen; a second interconnection layer is arranged on the flexible circuit board; the connection structure is electrically connected with the first interconnection layer and the second interconnection layer, and a first protection layer is arranged on the connection structure. According to the utility model, the circuit connection mode is optimized, and the overall thickness of the ultrasonic fingerprint identification module can be effectively reduced, so that the required installation space can be reduced, and the efficient layout of the ultrasonic fingerprint identification module in the limited space of the electronic equipment can be realized; and the development requirements of lightness, thinness and full screen of the electronic equipment are better met.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to an ultrasonic fingerprint recognition module and electronic device. Background Technology

[0002] With the continuous development of electronic devices, users have placed higher demands on the security and convenience of these devices. Fingerprint recognition technology, as an important biometric technology, is widely used in smartphones, tablets, and other personal electronic devices due to its uniqueness, stability, and non-invasiveness. Currently, the mainstream fingerprint recognition technologies include capacitive, optical, and ultrasonic. Among them, ultrasonic fingerprint recognition technology has gradually become a hot topic in the market due to its unique penetration ability and high-precision recognition performance. Ultrasonic fingerprint recognition technology uses an ultrasonic transmitter to send ultrasonic signals to the surface of the finger. Because ultrasonic waves can penetrate materials and generate reflections (echoes) when encountering different material interfaces, the three-dimensional structure of the fingerprint can be reconstructed by detecting these echo signals. Compared with traditional capacitive or optical fingerprint recognition technologies, ultrasonic fingerprint recognition technology has advantages such as strong penetration, strong environmental adaptability, and high security. Specifically, ultrasonic waves can penetrate materials such as glass, metal, stainless steel, and sapphire, so the fingerprint recognition module can be integrated under the display screen without compromising the screen's integrity, supporting full-screen designs. Compared to optical fingerprint recognition, ultrasonic technology is unaffected by ambient light and can function normally even in strong light. It also maintains high recognition accuracy even when fingers are wet or dirty. Furthermore, ultrasonic fingerprint recognition can capture the three-dimensional features of fingerprints, making it more difficult to forge than two-dimensional image recognition, thus improving security. With the trend towards thinner and lighter electronic devices and full-screen designs, fingerprint recognition modules need to be integrated into the screen. However, existing fingerprint recognition modules typically require additional space for installation, which not only increases the overall thickness of the electronic device but may also affect the screen's display quality and touch experience. Therefore, how to effectively place the fingerprint recognition module within the limited space of an electronic device to meet the requirements of overall device integration has become a pressing technical problem to be solved. Utility Model Content

[0003] In order to overcome the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is to provide an ultrasonic fingerprint recognition module and an electronic device, so as to better realize the effective layout of the fingerprint recognition module in a limited space to meet the requirements of the whole machine fitting.

[0004] The above-mentioned objective of this utility model can be achieved by the following technical solution: This utility model provides an ultrasonic fingerprint recognition module, comprising:

[0005] A substrate, wherein a first interconnect layer is provided on the substrate;

[0006] A piezoelectric transducer, wherein the piezoelectric transducer is disposed on the substrate;

[0007] An insulating layer disposed on the substrate and covering the piezoelectric transducer, the insulating layer being used to connect the screen;

[0008] A flexible circuit board, wherein a second interconnect layer is provided on the flexible circuit board;

[0009] A connection structure electrically connects the first interconnect layer and the second interconnect layer, and the connection structure is provided with a first protective layer.

[0010] In a preferred embodiment of the present invention, the ultrasonic fingerprint recognition module further includes a first bonding layer, which is used to connect the insulating layer and the screen.

[0011] In a preferred embodiment of this utility model, the insulating layer is a PDMS layer.

[0012] In a preferred embodiment of the present invention, the ultrasonic fingerprint recognition module further includes a passivation layer disposed on the substrate, the passivation layer being located between the substrate and the piezoelectric transducer.

[0013] In a preferred embodiment of the present invention, the substrate and the piezoelectric transducer are electrically connected via a TVS via.

[0014] In a preferred embodiment of the present invention, the substrate includes a plurality of circuit units, and the piezoelectric transducer includes a plurality of piezoelectric transducer units, with each piezoelectric transducer unit correspondingly disposed on one of the circuit units.

[0015] In a preferred embodiment of the present invention, the flexible circuit board is disposed in the region between the substrate and the screen.

[0016] In a preferred embodiment of the present invention, the first interconnect layer includes a metal pad disposed on the substrate, and the second interconnect layer includes a first ACF pad disposed on the flexible circuit board, wherein the metal pad and the first ACF pad are electrically connected through the connection structure.

[0017] In a preferred embodiment of this utility model, the metal pad is an aluminum pad.

[0018] In a preferred embodiment of the present invention, the connection structure includes a seed layer disposed on the substrate and an RDL redistribution layer formed on the seed layer, wherein the seed layer is used to electrically connect the first interconnect layer and the second interconnect layer.

[0019] In a preferred embodiment of the present invention, the substrate includes a first end face facing the screen and a trench region formed by etching on one side of the first end face. A transition slope is provided between the trench region and the first end face. The first interconnect layer is disposed on the first end face. The projection of the second interconnect layer in the thickness direction of the substrate is located in the trench region. The seed layer extends from the first end face to the trench region.

[0020] In a preferred embodiment of this utility model, the inclination angle α of the transition slope is ≤60°.

[0021] In a preferred embodiment of the present invention, the connection structure further includes a second protective layer covering the seed layer, the second protective layer having a window structure for electrically connecting the second interconnect layer to the seed layer.

[0022] In a preferred embodiment of this utility model, the second protective layer is a PI layer.

[0023] In a preferred embodiment of this utility model, the spacing S1 between the flexible circuit board and the screen is ≥80μm; the spacing S2 between the first protective layer and the screen is ≥80μm.

[0024] In a preferred embodiment of the present invention, the window structure is provided with metal bumps, and the metal bumps are electrically connected to the second interconnect layer and the seed layer.

[0025] In a preferred embodiment of this invention, the material of the metal bump is one of Cu, Ag, and Au; and / or, the projected area of ​​the metal bump in the thickness direction of the substrate is 8000 μm. 2 Up to 50000μm 2 ; and / or, the maximum side length Lmax of the projection of the metal bump in the thickness direction of the substrate is ≥0.04mm, and the maximum side length Lmin of the projection of the metal bump in the thickness direction of the substrate is ≥0.02mm.

[0026] In a preferred embodiment of the present invention, the first protective layer is disposed around the metal bump and fills the gap between the substrate and the flexible circuit board.

[0027] In a preferred embodiment of the present invention, the connection structure further includes a surface treatment layer disposed on the metal bump.

[0028] In a preferred embodiment of this invention, the material of the surface treatment layer is NiAu or Ni.

[0029] In a preferred embodiment of the present invention, the flexible circuit board and the screen are respectively disposed on both sides of the substrate, and a second bonding layer is provided between the flexible circuit board and the substrate.

[0030] In a preferred embodiment of the present invention, the first interconnect layer includes a metal pad disposed on the substrate, and the second interconnect layer includes an FPC gold finger disposed on the flexible circuit board, wherein the metal pad and the FPC gold finger are electrically connected through the connection structure.

[0031] In a preferred embodiment of the present invention, the connection structure includes a bonding wire for electrically connecting the metal pad and the FPC gold finger, and the first protective layer covers the bonding wire and is disposed on the metal pad and the FPC gold finger.

[0032] In a preferred embodiment of the present invention, the spacing S3 between the first protective layer and the screen is ≥80μm.

[0033] In a preferred embodiment of the present invention, the connection structure includes a seed layer disposed on the substrate, an RDL redistribution layer formed on the seed layer, and a bonding line. The seed layer is electrically connected to the metal pad, and the bonding line is electrically connected to the seed layer and the FPC gold finger.

[0034] In a preferred embodiment of the present invention, the substrate includes a first end face facing the screen and a trench region formed on one side of the first end face. A transition slope is provided between the trench region and the first end face. The first interconnect layer is disposed on the first end face. The projection of the second interconnect layer in the thickness direction of the substrate is located in the trench region. The seed layer extends from the first end face to the trench region.

[0035] In a preferred embodiment of the present invention, the connection structure further includes a second protective layer covering the seed layer, the second protective layer having a window structure for electrically connecting the binding wire to the seed layer.

[0036] In a preferred embodiment of the present invention, the spacing S4 between the first protective layer and the screen is ≥80μm; the spacing S5 between the second protective layer and the screen is ≥80μm.

[0037] In a preferred embodiment of the present invention, the connection structure further includes a surface treatment layer disposed in the window structure and electrically connected to the seed layer.

[0038] In a preferred embodiment of the present invention, the first protective layer covers the bonding line and is disposed on the surface treatment layer and the FPC gold finger.

[0039] In a preferred embodiment of this invention, the material of the binding wire includes at least one of Au, Ag, and Cu.

[0040] This invention also provides an electronic device, including the aforementioned ultrasonic fingerprint recognition module.

[0041] In a preferred embodiment of the present invention, the electronic device includes a screen, and the insulating layer of the ultrasonic fingerprint recognition module is fixed to the underside of the screen by a first bonding layer.

[0042] In a preferred embodiment of the present invention, the electronic device includes a screen and a structural component, and the ultrasonic fingerprint recognition module is fixed to the bottom of the screen via the structural component.

[0043] The technical solution of this utility model has the following significant beneficial effects:

[0044] In this invention, both the substrate and the flexible circuit board in the ultrasonic fingerprint recognition module are layered. By stacking the substrate and the flexible circuit board, and through a first interconnect layer, a second interconnect layer, and a connection structure, the circuitry in the substrate is electrically connected to the flexible circuit board. The circuitry in the substrate, in conjunction with a piezoelectric transducer, enables fingerprint recognition. The flexible circuit board also allows for external electrical connections, and the first protective layer protects the connection structure, helping to ensure the stability of the electrical connection. This invention optimizes the circuit connection method, effectively reducing the overall thickness of the ultrasonic fingerprint recognition module, thereby reducing the required installation space. This facilitates efficient layout of the ultrasonic fingerprint recognition module within the limited space of electronic devices, meeting the requirements for overall device integration and better satisfying the development needs of thinner and lighter electronic devices and full-screen designs. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of this invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely illustrative to aid in understanding the invention and do not specifically limit the shapes and proportions of the components. Those skilled in the art, under the guidance of this invention, can select various possible shapes and proportions to implement this invention according to specific circumstances.

[0047] Figure 1 This is a cross-sectional view of one embodiment of the ultrasonic fingerprint recognition module of this utility model;

[0048] Figure 2 This is a schematic diagram of the installation structure of one embodiment of the ultrasonic fingerprint recognition module of this utility model;

[0049] Figure 3 This is a top view of one embodiment of the first and second chip cutting channels of the present invention.

[0050] Figure 4 This is a cross-sectional view of another embodiment of the ultrasonic fingerprint recognition module of this utility model;

[0051] Figure 5 This is a schematic diagram of the installation structure of another embodiment of the ultrasonic fingerprint recognition module of this utility model;

[0052] Figure 6 This is a cross-sectional view of another embodiment of the ultrasonic fingerprint recognition module of this utility model;

[0053] Figure 7 This is a schematic diagram of the installation structure of another embodiment of the ultrasonic fingerprint recognition module of this utility model.

[0054] The reference numerals in the above figures are as follows:

[0055] 10. Screen;

[0056] 20. First chip cutting track;

[0057] 30. Second chip cutting channel;

[0058] 100, Substrate; 101, First end face; 102, Trench region; 103, Transition slope; 110, First interconnect layer; 120, Passivation layer;

[0059] 200. Piezoelectric transducer; 210. Piezoelectric transducer unit;

[0060] 300. Insulation layer;

[0061] 400. Flexible circuit board; 410. Second interconnect layer;

[0062] 500. Connection structure; 510. First protective layer; 520. Seed layer; 530. RDL redistribution layer; 540. Second protective layer; 550. Window structure; 560. Metal bump; 570. Surface treatment layer; 580. Bonding line;

[0063] 600, First bonding layer;

[0064] 700, Second bonding layer. Detailed Implementation

[0065] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0066] Implementation Method 1

[0067] Please refer to the following: Figures 1 to 7 As shown, an embodiment of this utility model provides an ultrasonic fingerprint recognition module, which includes at least a substrate 100, a piezoelectric transducer 200, an insulating layer 300, a flexible circuit board 400, and a connection structure 500. A first interconnect layer 110 is provided on the substrate 100; the piezoelectric transducer 200 is disposed on the substrate 100; the insulating layer 300 is disposed on the substrate 100 and covers the piezoelectric transducer 200, and the insulating layer 300 is used to connect to the screen 10; a second interconnect layer 410 is provided on the flexible circuit board 400; the connection structure 500 electrically connects the first interconnect layer 110 and the second interconnect layer 410, and a first protective layer 510 is provided on the connection structure 500.

[0068] Overall, the substrate 100 and flexible circuit board 400 in this ultrasonic fingerprint recognition module can be arranged in layers. By stacking the substrate 100 and flexible circuit board 400, and through the cooperation of the first interconnect layer 110, the second interconnect layer 410 and the connection structure 500, the circuit (not shown) in the substrate 100 is electrically connected to the flexible circuit board 400. The circuit (not shown) in the substrate 100, in cooperation with the piezoelectric transducer 200, can perform fingerprint recognition. The flexible circuit board 400 can also be used to achieve external electrical connection, and the first protective layer 510 can protect the connection structure 500, which helps to ensure the stability of the electrical connection.

[0069] This invention optimizes the circuit connection method, which can effectively reduce the overall thickness of the ultrasonic fingerprint recognition module, thereby reducing the required installation space. This facilitates the efficient layout of the ultrasonic fingerprint recognition module within the limited space of electronic devices to meet the requirements of overall device integration, and better meets the development needs of thinner and lighter electronic devices and full-screen designs.

[0070] Furthermore, by setting a piezoelectric transducer 200 on the substrate 100, combined with the design of the insulating layer 300 and the protective layer, not only is the stability of signal transmission ensured, but the overall mechanical strength and environmental adaptability are also enhanced. Because ultrasonic fingerprint recognition technology has the advantages of strong penetration and immunity to ambient light interference, this ultrasonic fingerprint recognition module can maintain high recognition accuracy in various complex environments (such as when fingers are wet or dirty).

[0071] Furthermore, the three-dimensional image capture capability of this ultrasonic fingerprint recognition module is more difficult to forge than the two-dimensional recognition in existing technologies, thus improving the security level of user authentication. This ultrasonic fingerprint recognition module can be integrated under the display screen, ensuring the integrity of the screen 10 and the touch experience, while significantly enhancing the overall aesthetics and ease of use of the electronic device.

[0072] In the embodiments of this utility model, designers can adjust the specific material and structure of the substrate 100 according to the needs of use, and no specific limitations are made here. For example, the substrate 100 can be a silicon-based substrate or a TFT-based substrate, and various circuits can be set in the substrate 100, and the type of circuit is not limited. It can be a circuit manufactured by various processes, such as CMOS process, TFT process, etc.

[0073] In one feasible embodiment of this utility model, such as Figure 2 In the embodiment shown, the ultrasonic fingerprint recognition module further includes a first bonding layer 600, which is used to connect the insulating layer 300 and the screen 10.

[0074] Specifically, the ultrasonic fingerprint recognition module is fixed to the bottom of the screen 10 via the first bonding layer 600. The first bonding layer 600 effectively achieves a stable bond between the ultrasonic fingerprint recognition module and the display screen, improving the overall mechanical strength and environmental adaptability of the structure, and also has the function of buffering stress and preventing damage to the device from vibration and impact.

[0075] Furthermore, by optimizing material selection and thickness, the first bonding layer 600 ensures minimal loss of ultrasonic signals during transmission, thereby improving the sensitivity and accuracy of fingerprint recognition and further enhancing the user experience. Designers can adjust the specific materials of the first bonding layer 600 according to their needs; no specific limitations are imposed here.

[0076] In another feasible embodiment of this utility model, the ultrasonic fingerprint recognition module is fixed to the bottom of the screen 10 by a structural component (not shown). Specifically, the ultrasonic fingerprint recognition module is connected to the device frame by the structural component, and the ultrasonic fingerprint recognition module is fixed to the bottom of the screen 10 by the device frame.

[0077] In one feasible embodiment, the insulating layer 300 of the ultrasonic fingerprint recognition module can be made to directly contact the screen 10 through the device frame, thereby establishing a stable ultrasonic transmission path.

[0078] In another feasible embodiment, the insulating layer 300 of the ultrasonic fingerprint recognition module can be spaced apart from the screen 10 through the device frame, and functional layers, such as acoustic matching layers and buffer layers, can be further set in the space to facilitate the transmission of ultrasonic waves.

[0079] In this embodiment of the invention, the insulating layer 300 is a PDMS layer. PDMS material has a low elastic modulus and high chemical stability, effectively absorbing external impacts and vibrations, preventing device damage or performance degradation caused by mechanical stress. By setting the insulating layer 300 as a PDMS (polydimethylsiloxane) layer, not only is excellent insulation performance provided, but also a certain degree of flexibility and stress buffering capability.

[0080] In the embodiments of this utility model, such as Figure 1 and Figure 2 In the embodiment shown, the ultrasonic fingerprint recognition module also includes a passivation layer 120 disposed on the substrate 100, the passivation layer 120 being located between the substrate 100 and the piezoelectric transducer 200.

[0081] By providing a passivation layer 120 between the substrate 100 and the piezoelectric transducer 200, the electrical performance and reliability of the device can be effectively improved. Specifically, the passivation layer 120 can prevent external moisture, dust and other contaminants from entering the internal circuitry of the chip, reducing the risk of signal interference or device failure caused by environmental factors.

[0082] Furthermore, the passivation layer 120 also possesses excellent insulation and stress buffering properties, which can suppress unnecessary mechanical vibration transmission during the operation of the piezoelectric transducer 200, improve the stability and accuracy of ultrasonic signal acquisition, and help extend the overall service life of the module, enhancing its adaptability under complex working conditions. Designers can adjust the specific material of the passivation layer 120 according to their needs; no specific limitations are imposed here.

[0083] In this embodiment of the invention, the substrate 100 and the piezoelectric transducer 200 are electrically connected via TVS vias. Using TVS vias to achieve the electrical connection between the substrate 100 and the piezoelectric transducer 200 not only improves circuit integration but also significantly optimizes the signal transmission path, reducing signal loss and interference.

[0084] Furthermore, TVS vias reduce the additional space required by traditional cables or external connections, facilitating the thinning and high-density packaging of ultrasonic fingerprint recognition modules. In addition, the TVS via structure possesses excellent mechanical stability and thermal adaptability, enhancing the reliability of devices in complex environments and ensuring the efficiency and stability of the fingerprint recognition process.

[0085] In the embodiments of this utility model, such as Figure 3 In the embodiment shown, the substrate 100 includes a plurality of circuit units, and the piezoelectric transducer 200 includes a plurality of piezoelectric transducer units 210, each piezoelectric transducer unit 210 being disposed on a corresponding circuit unit.

[0086] Designers can adjust the specific structure of the circuit unit according to the usage requirements, and no specific restrictions are imposed here. For example, in one feasible embodiment, the circuit unit is an ultrasonic fingerprint recognition pixel.

[0087] By assigning each piezoelectric transducer 210 to a corresponding circuit unit, one-to-one precise signal acquisition and conversion is achieved, significantly improving the spatial resolution and sensitivity of fingerprint recognition. This enables more accurate capture of the fine features of fingerprints, helps optimize signal transmission efficiency, reduces the risk of crosstalk, and improves recognition speed and accuracy.

[0088] In one feasible embodiment of this utility model, such as Figure 1 and Figure 2 In the embodiment shown, the flexible circuit board 400 is disposed in the region between the substrate 100 and the screen 10.

[0089] By placing the flexible circuit board 400 in the area between the substrate 100 and the screen 10, the space formed by the insulating layer 300 or the space formed by the functional layer and the insulating layer 300 is fully utilized, such as the space formed by the first bonding layer 600 and the insulating layer 300. This reduces the required installation space, optimizes the spatial layout of the overall structure, and better meets the development needs of thinner and lighter electronic devices and full-screen displays. In the embodiments of this utility model, such as... Figure 1 In the embodiment shown, the first interconnect layer 110 includes a metal pad disposed on the substrate 100, and the second interconnect layer 410 includes a first ACF pad disposed on the flexible circuit board 400. The metal pad and the first ACF pad are electrically connected through the connection structure 500.

[0090] The substrate 100 is electrically connected to the first ACF pad on the flexible circuit board 400 via a metal pad, ensuring high efficiency, stability and reliability of signal transmission and fine-pitch connection.

[0091] Designers can adjust the number and material of the metal pads according to usage needs, without specific limitations. Preferably, the metal pads are aluminum pads. More preferably, multiple aluminum pads are provided, arranged at intervals.

[0092] In the embodiments of this utility model, such as Figure 1 and Figure 2 In the embodiment shown, the connection structure 500 includes a seed layer 520 disposed on the substrate 100 and an RDL redistribution layer 530 formed on the seed layer 520. The seed layer 520 is used to electrically connect the first interconnect layer 110 and the second interconnect layer 410.

[0093] By working together with the seed layer 520 on the substrate 100 and the RDL redistribution layer 530, not only is an efficient electrical connection between the first interconnect layer 110 and the second interconnect layer 410 achieved, but the wiring path is also optimized, which helps to improve the stability and integration of signal transmission.

[0094] In the embodiments of this utility model, such as Figure 1 and Figure 2 In the embodiment shown, the substrate 100 includes a first end face 101 facing the screen 10 and a trench region 102 formed by etching on one side of the first end face 101. A transition slope 103 is provided between the trench region 102 and the first end face 101. A first interconnect layer 110 is disposed on the first end face 101. The projection of the second interconnect layer 410 in the thickness direction of the substrate 100 is located in the trench region 102. A seed layer 520 extends from the first end face 101 into the trench region 102.

[0095] By etching a trench region 102 on one side of the first end face 101, the trench region 102 can be used to set up structures such as the seed layer 520 and the RDL redistribution layer 530, thereby reducing the overall height. Furthermore, by providing a transition slope 103 between the first end face 101 and the trench region 102, the transition slope 103 prevents stress concentration problems in the RDL redistribution layer 530, avoiding poor connections and further enhancing the stability of signal transmission.

[0096] Designers can adjust the specific tilt angle of the transition slope 103 according to usage requirements; no specific limitations are imposed here. Preferably, such as... Figure 1 In the illustrated embodiment, the inclination angle α of the transition slope 103 is ≤60°. More preferably, the inclination angle α of the transition slope 103 is ≤45°.

[0097] Since the structural strength of the trench region 102 is relatively weak, in the embodiments of this utility model, a reinforcing structure can be provided in the trench region 102 to increase the structural strength of the trench region 102.

[0098] In one feasible embodiment, when the substrate 100 is thinned by etching to form the trench region 102, chemical polishing is used to reduce stress, and a PI protective adhesive layer is added to the back side of the substrate 100 corresponding to the trench region 102. The combination of chemical polishing and the PI protective adhesive layer can improve the structural strength of the trench region 102.

[0099] Furthermore, the chip cutting path can be used to form the trench region 102. For example, Figure 3 In the embodiment shown, the width of the first chip dicing channel 20 between adjacent substrates 100 is not less than 300 μm along the direction perpendicular to the trench region 102; and the width of the second chip dicing channel 30 between adjacent substrates 100 is 60 μm or 80 μm along the extension direction of the trench region 102.

[0100] In the embodiments of this utility model, such as Figure 1 and Figure 2 In the embodiment shown, the connection structure 500 further includes a second protective layer 540 covering the seed layer 520. The second protective layer 540 is provided with a window structure 550 for electrically connecting the second interconnect layer 410 to the seed layer 520.

[0101] By setting a window structure 550 on the second protective layer 540, the second interconnect layer 410 and the seed layer 520 can be electrically connected by means of the window structure 550, and the second protective layer 540 can play a protective role, further ensuring the long-term durability of the ultrasonic fingerprint recognition module.

[0102] Designers may adjust the specific material of the second protective layer 540 according to the application requirements, and no specific restrictions are imposed here. Preferably, the second protective layer 540 is a PI layer.

[0103] The PI layer not only provides excellent mechanical support and environmental protection, but also enhances the reliability and durability of the connection structure 500 with its good insulation and thermal stability, ensuring the stable operation of the ultrasonic fingerprint recognition module under complex working conditions.

[0104] In the embodiments of this utility model, such as Figure 2 In the embodiment shown, the spacing S1 between the flexible circuit board 400 and the screen 10 is ≥80μm; and / or, the spacing S2 between the first protective layer 510 and the screen 10 is ≥80μm.

[0105] Preferably, the spacing S1 between the flexible circuit board 400 and the screen 10 is ≥80μm; the spacing S2 between the first protective layer 510 and the screen 10 is ≥80μm.

[0106] By controlling the spacing S1 between the flexible circuit board 400 and the screen 10, and the spacing S2 between the first protective layer 510 and the screen 10, assembly errors and physical interference caused by excessively narrow space can be effectively avoided. This improves the adaptability and installation reliability of the fingerprint recognition module within the electronic device layout, and helps reduce the transmission of mechanical stress from the screen 10 or other adjacent components. It also prevents the flexible circuit board 400 and the connecting structure 500 from deforming or being damaged due to stress, further enhancing the structural stability and long-term working durability of the module.

[0107] In addition, the appropriate spacing provides ample operating space for subsequent manufacturing processes such as bonding, encapsulation, and dispensing, ensuring high production yield and product consistency.

[0108] Designers can adjust the specific values ​​of S1 and S2 according to usage requirements, and no specific limitations are imposed here. In one feasible embodiment, S1 is approximately 80 μm and S2 is approximately 80 μm. In another feasible embodiment, S1 is approximately 90 μm and S2 is approximately 90 μm. In yet another feasible embodiment, S1 is approximately 100 μm and S2 is approximately 100 μm.

[0109] In the embodiments of this utility model, such as Figure 1 and Figure 2 In the embodiment shown, the window structure 550 is provided with metal bumps 560, which are electrically connected to the second interconnect layer 410 and the seed layer 520.

[0110] By setting metal bumps 560 in the window structure 550, a bump region is formed by multiple metal bumps 560. The bump region is electrically connected to the metal pad through the RDL redistribution layer 530 on the seed layer 520. Furthermore, the metal bumps 560 can also be attached to the second interconnect layer 410 on the flexible circuit board 400 to achieve electrical connection.

[0111] The metal bump 560 not only improves the reliability of signal transmission, but also enhances the overall mechanical strength of the connection structure 500, further ensuring the performance and durability of the ultrasonic fingerprint recognition module in high-density integration and complex environments.

[0112] Designers can adjust the specific structure and material of the metal bump 560 according to usage requirements, and no specific restrictions are imposed here. For example, the material of the metal bump 560 may be one of Cu, Ag, or Au; and / or, the projected area of ​​the metal bump 560 in the thickness direction of the substrate 100 may be 8000 μm. 2Up to 50000μm 2 ; and / or, the maximum side length Lmax of the projection of the metal bump 560 in the thickness direction of the substrate 100 is ≥0.04mm, and the maximum side length Lmin of the projection of the metal bump 560 in the thickness direction of the substrate 100 is ≥0.02mm.

[0113] Preferably, the material of the metal bump 560 is one of Cu, Ag, and Au; the projected area of ​​the metal bump 560 in the thickness direction of the substrate 100 is 8000 μm. 2 Up to 50000μm 2 The maximum side length Lmax of the projection of the metal bump 560 onto the thickness direction of the substrate 100 is ≥0.04mm, and the maximum side length Lmin of the projection of the metal bump 560 onto the thickness direction of the substrate 100 is ≥0.02mm, which can better meet the pull-out force requirements and conductivity requirements after FPC bonding.

[0114] In the embodiments of this utility model, such as Figure 1 In the embodiment shown, a first protective layer 510 is disposed around the metal bump 560 and fills the gap between the substrate 100 and the flexible circuit board 400.

[0115] By setting the first protective layer 510 around the metal bump 560 and filling the gap between the substrate 100 and the flexible circuit board 400, the first protective layer 510 not only effectively enhances the sealing performance, but also ensures the reliability of the electrical connection, further improving the stability of the circuit connection.

[0116] Designers can adjust the specific material of the first protective layer 510 according to the needs of use. For example, the first protective layer 510 can be formed by FPC protective adhesive, and no specific restrictions are made here.

[0117] Specifically, after the flexible circuit board 400 is bonded, adhesive is applied to the first ACF pad area and the bending area of ​​the flexible circuit board 400 to form the first protective layer 510. The first protective layer 510 protects the FPC bonding and prevents the FPC from bending and breaking.

[0118] In the embodiments of this utility model, such as Figure 1 and Figure 2 In the embodiment shown, the connection structure 500 further includes a surface treatment layer 570 disposed on the metal bump 560.

[0119] By setting a surface treatment layer 570 on the surface of the metal bump 560, not only are the oxidation resistance and wear resistance of the metal bump 560 effectively improved, but its conductivity and connection reliability are also significantly enhanced.

[0120] Designers may adjust the specific material of the surface treatment layer 570 according to the application requirements, and no specific limitations are imposed here. For example, in one feasible embodiment, the material of the surface treatment layer 570 is NiAu. In another feasible embodiment, the material of the surface treatment layer 570 is Ni.

[0121] In another feasible embodiment of this utility model, such as Figure 4 and Figure 5 In the embodiment shown, the flexible circuit board 400 and the screen 10 are respectively disposed on both sides of the substrate 100, and a second bonding layer 700 is provided between the flexible circuit board 400 and the substrate 100.

[0122] By placing the flexible circuit board 400 and the screen 10 on opposite sides of the substrate 100, the flexible circuit board 400 can be stacked with the substrate 100, reducing the required installation space and improving the convenience of electrical connection between the flexible circuit board 400 and external circuits, effectively avoiding mutual interference between lines.

[0123] Furthermore, a second bonding layer 700 is provided between the flexible circuit board 400 and the substrate 100. The second bonding layer 700 enables the flexible circuit board 400 and the substrate 100 to be tightly bonded and stably connected, thereby enhancing the mechanical strength and reliability of the overall structure.

[0124] In another feasible embodiment of this utility model, such as Figure 4 and Figure 5 In the embodiment shown, the first interconnect layer 110 includes a metal pad disposed on the substrate 100, and the second interconnect layer 410 includes an FPC gold finger disposed on the flexible circuit board 400. The metal pad and the FPC gold finger are electrically connected through a connection structure 500.

[0125] The metal pad and the FPC gold finger are electrically connected through the connection structure 500, which not only ensures stable and efficient signal transmission between the substrate 100 and the flexible circuit board 400, but also improves the reliability of the overall structure.

[0126] In another feasible embodiment of this utility model, such as Figure 4 and Figure 5 In the embodiment shown, the connection structure 500 includes a bonding wire 580 for electrically connecting the metal pad and the FPC gold finger, and a first protective layer 510 covers the bonding wire 580 and is disposed on the metal pad and the FPC gold finger.

[0127] The bonding wire 580 enables electrical connection between the metal pad and the FPC gold finger, thereby ensuring efficient and stable signal transmission between the substrate 100 and the flexible circuit board 400.

[0128] Furthermore, the first protective layer 510 covers the bonding wire 580 and is placed on the metal pad and FPC gold finger, effectively preventing damage to the circuit connection part from the external environment and enhancing the reliability and durability of the overall structure.

[0129] Designers may adjust the specific material of the binding wire 580 according to usage requirements, and no specific restrictions are imposed here. Preferably, the material of the binding wire 580 is one of Au, Ag, and Cu.

[0130] The bonding wire 580 can be bonded in either the forward or reverse direction. After bonding, the area of ​​the bonding wire 580 is sealed with adhesive to prevent short circuits, contamination, and moisture intrusion.

[0131] In another feasible embodiment of this utility model, such as Figure 5 In the embodiment shown, the spacing S3 between the first protective layer 510 and the screen 10 is ≥80μm.

[0132] By controlling the gap S3 between the first protective layer 510 and the screen 10, assembly errors and physical interference caused by excessively narrow space can be effectively avoided, thereby improving the adaptability and installation reliability of the fingerprint recognition module in the internal layout of electronic devices.

[0133] Designers can adjust the specific value of S3 according to usage requirements, and no specific limitation is made here. In one feasible embodiment, S3 is approximately 80 μm. In another feasible embodiment, S3 is approximately 90 μm. In yet another feasible embodiment, S3 is approximately 100 μm.

[0134] In another feasible embodiment of this utility model, such as Figure 6 and Figure 7 In the embodiment shown, the flexible circuit board 400 and the screen 10 are respectively disposed on both sides of the substrate 100, and a second bonding layer 700 is provided between the flexible circuit board 400 and the substrate 100.

[0135] In another feasible embodiment of this utility model, such as Figure 6 and Figure 7 In the embodiment shown, the connection structure 500 includes a seed layer 520 disposed on the substrate 100, an RDL redistribution layer 530 formed on the seed layer 520, and a bonding line 580. The seed layer 520 is electrically connected to a metal pad, and the bonding line 580 is electrically connected to the seed layer 520 and the FPC gold finger.

[0136] The RDL redistribution layer 530 enables complex circuit layout and signal path optimization, improving the integration and electrical performance between the substrate 100 and the flexible circuit board 400. The seed layer 520 provides a good conductive foundation, which helps to improve the stability and integration of signal transmission.

[0137] Designers may adjust the specific material of the binding wire 580 according to usage requirements, and no specific restrictions are imposed here. Preferably, the material of the binding wire 580 includes at least one of Au, Ag, and Cu.

[0138] The bonding wire 580 can be bonded in either the forward or reverse direction. After bonding, the area of ​​the bonding wire 580 is sealed with adhesive to prevent short circuits, contamination, and moisture intrusion.

[0139] In another feasible embodiment of this utility model, such as Figure 6 and Figure 7 In the embodiment shown, the substrate 100 includes a first end face 101 facing the screen 10 and a trench region 102 formed on one side of the first end face 101. A transition slope 103 is provided between the trench region 102 and the first end face 101. A first interconnect layer 110 is disposed on the first end face 101. The projection of the second interconnect layer 410 in the thickness direction of the substrate 100 is located in the trench region 102. A seed layer 520 extends from the first end face 101 to the trench region 102.

[0140] By etching a trench region 102 on one side of the first end face 101, the trench region 102 can be used to set up structures such as the seed layer 520 and the RDL redistribution layer 530, thereby reducing the overall height.

[0141] Furthermore, by providing a transition slope 103 between the first end face 101 and the trench area 102, the transition slope 103 prevents the RDL redistribution layer 530 from experiencing stress concentration issues, avoids poor connection phenomena, and further enhances the stability of signal transmission.

[0142] Designers can adjust the specific tilt angle of the transition slope 103 according to usage requirements, and no specific limitations are imposed here. Preferably, the tilt angle α of the transition slope 103 is ≤ 60°. More preferably, the tilt angle α of the transition slope 103 is ≤ 45°.

[0143] In another feasible embodiment of this utility model, such as Figure 6 and Figure 7 In the embodiment shown, the connection structure 500 further includes a second protective layer 540 covering the seed layer 520. The second protective layer 540 is provided with a window structure 550 for electrically connecting the binding wire 580 to the seed layer 520.

[0144] By setting a window structure 550 on the second protective layer 540, the binding line 580 and the seed layer 520 can be electrically connected by means of the window structure 550, and the second protective layer 540 can play a protective role, further ensuring the long-term durability of the ultrasonic fingerprint recognition module.

[0145] In another feasible embodiment of this utility model, such as Figure 7 In the embodiment shown, the spacing S4 between the first protective layer 510 and the screen 10 is ≥80μm; and / or, the spacing S5 between the second protective layer 540 and the screen 10 is ≥80μm.

[0146] Preferably, the spacing S4 between the first protective layer 510 and the screen 10 is ≥80μm; the spacing S5 between the second protective layer 540 and the screen 10 is ≥80μm.

[0147] By controlling the spacing S4 between the first protective layer 510 and the screen 10, and the spacing S5 between the second protective layer 540 and the screen 10, assembly errors and physical interference caused by excessively narrow space can be effectively avoided. This improves the adaptability and installation reliability of the fingerprint recognition module within the electronic device layout, and helps reduce the transmission of mechanical stress from the screen 10 or other adjacent components. It also prevents the flexible circuit board 400 and the internal connection structure 500 from deforming or being damaged due to stress, further enhancing the structural stability and long-term working durability of the module.

[0148] In addition, the appropriate spacing provides ample operating space for subsequent manufacturing processes such as bonding, encapsulation, and dispensing, ensuring high production yield and product consistency.

[0149] Designers can adjust the specific values ​​of S4 and S5 according to usage requirements; no specific limitations are imposed here. In one feasible embodiment, S4 is approximately 80 μm and S5 is approximately 80 μm. In another feasible embodiment, S4 is approximately 90 μm and S5 is approximately 90 μm. In yet another feasible embodiment, S4 is approximately 100 μm and S5 is approximately 100 μm.

[0150] In another feasible embodiment of the present invention, the connection structure 500 further includes a surface treatment layer 570 disposed in the window structure 550 and electrically connected to the seed layer 520.

[0151] By providing a surface treatment layer 570 on the seed layer 520 located in the window structure 550, not only is the oxidation resistance and wear resistance of the seed layer 520 effectively improved, but its conductivity and connection reliability are also significantly enhanced.

[0152] In another feasible embodiment of the present invention, the first protective layer 510 covers the bonding line 580 and is disposed on the surface treatment layer 570 and the FPC gold finger.

[0153] By covering the bonding wire 580 with the first protective layer 510 and covering the surface treatment layer 570 and the FPC gold fingers, damage to the circuit connection parts by the external environment is effectively prevented, and the reliability and durability of the overall structure are enhanced.

[0154] Implementation Method 2

[0155] This invention also provides an electronic device, which includes the ultrasonic fingerprint recognition module described in Embodiment 1. This electronic device includes, but is not limited to, mobile terminal devices, such as mobile phones, laptops, tablets, etc.

[0156] In an embodiment of this utility model, the electronic device includes a screen 10, and an ultrasonic fingerprint recognition module is disposed below the screen 10 for recognizing the fingerprint of a finger pressed on the display screen.

[0157] In an embodiment of this utility model, the electronic device includes a screen 10, and the insulating layer 300 of the ultrasonic fingerprint recognition module is fixed to the bottom of the screen 10 through a first bonding layer 600.

[0158] The first bonding layer 600 effectively achieves a stable bond between the ultrasonic fingerprint recognition module and the display screen, improving the overall mechanical strength and environmental adaptability of the structure. It also has the function of buffering stress and preventing damage to the device from vibration and impact.

[0159] In another feasible embodiment of the present invention, the electronic device includes a screen 10 and a structural component, wherein the ultrasonic fingerprint recognition module is fixed below the screen 10 by the structural component.

[0160] The ultrasonic fingerprint recognition module can be mounted on a structural component, which can be connected to the structure in the electronic device, thereby fixing the ultrasonic fingerprint recognition module below the screen 10. The structural component can be a structural bracket, structural plate, or other structure, and no specific restrictions are imposed here.

[0161] Specifically, the ultrasonic fingerprint recognition module is connected to the device frame via structural components, and the ultrasonic fingerprint recognition module is fixed to the bottom of the screen 10 via the device frame.

[0162] In one feasible embodiment, the insulating layer 300 of the ultrasonic fingerprint recognition module can be made to directly contact the screen 10 through the device frame, thereby establishing a stable ultrasonic transmission path.

[0163] In another feasible embodiment, the insulating layer 300 of the ultrasonic fingerprint recognition module can be spaced apart from the screen 10 through the device frame, and functional layers, such as acoustic matching layers and buffer layers, can be further set in the space to facilitate the transmission of ultrasonic waves.

[0164] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for various purposes. The term “substantially constitutes…” used to describe a combination should include the identified element, component, part, or step, as well as other elements, components, parts, or steps that do not substantially affect the essential novelty of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, components, parts, or steps herein also contemplates embodiments substantially constituted by such elements, components, parts, or steps. The use of the term “may” herein is intended to indicate that any described attribute “may” include is optional. Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The disclosure of “a” or “an” used to describe an element, component, part, or step does not imply exclusion of other elements, components, parts, or steps.

[0165] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. An ultrasonic fingerprint identification module, characterized in that, include: A substrate, wherein a first interconnect layer is provided on the substrate, the first interconnect layer including a metal pad disposed on the substrate; A piezoelectric transducer, wherein the piezoelectric transducer is disposed on the substrate; An insulating layer disposed on the substrate and covering the piezoelectric transducer; A flexible circuit board, wherein a second interconnect layer is provided on the flexible circuit board; A connection structure electrically connects the first interconnect layer and the second interconnect layer, and the connection structure is provided with a first protective layer. 2.The ultrasonic fingerprint identification module of claim 1, wherein, The ultrasonic fingerprint recognition module further includes a first bonding layer, which is used to connect the insulating layer and the screen. 3.The ultrasonic fingerprint identification module of claim 1, wherein, The insulating layer is a PDMS layer. 4.The ultrasonic fingerprint identification module of claim 1, wherein, The ultrasonic fingerprint recognition module also includes a passivation layer disposed on the substrate, the passivation layer being located between the substrate and the piezoelectric transducer. 5.The ultrasonic fingerprint identification module of claim 4, wherein, The substrate and the piezoelectric transducer are electrically connected via TVS vias. 6.The ultrasonic fingerprint identification module of claim 1, wherein, The substrate includes multiple circuit units, and the piezoelectric transducer includes multiple piezoelectric transducer units, with each piezoelectric transducer unit correspondingly disposed on one of the circuit units. 7.The ultrasonic fingerprint identification module of claim 1, wherein, The flexible circuit board is disposed in the area between the substrate and the screen. 8.The ultrasonic fingerprint identification module of claim 7, wherein, The second interconnect layer includes a first ACF pad disposed on the flexible circuit board, and the metal pad is electrically connected to the first ACF pad through the connection structure. 9.The ultrasonic fingerprint identification module of claim 8, wherein, The metal pad is an aluminum pad. 10.The ultrasonic fingerprint identification module of claim 7, wherein, The connection structure includes a seed layer disposed on the substrate and an RDL redistribution layer formed on the seed layer, wherein the seed layer is used to electrically connect the first interconnect layer and the second interconnect layer. 11.The ultrasonic fingerprint identification module of claim 10, wherein, The substrate includes a first end face facing the screen and a trench region formed by etching on one side of the first end face. A transition slope is provided between the trench region and the first end face. The first interconnect layer is disposed on the first end face. The projection of the second interconnect layer in the thickness direction of the substrate is located in the trench region. The seed layer extends from the first end face to the trench region. 12.The ultrasonic fingerprint identification module of claim 11, wherein, The inclination angle α of the transition slope is ≤60°. 13.The ultrasonic fingerprint identification module of claim 10, wherein, The connection structure further includes a second protective layer covering the seed layer, and the second protective layer has a window structure for electrically connecting the second interconnect layer to the seed layer. 14.The ultrasonic fingerprint identification module of claim 13, wherein, The second protective layer is a PI layer. 15.The ultrasonic fingerprint identification module of claim 13, wherein, The spacing between the flexible circuit board and the screen is S1 ≥ 80 μm; the spacing between the first protective layer and the screen is S2 ≥ 80 μm.

16. The ultrasonic fingerprint identification module of claim 13, wherein the ultrasonic fingerprint identification module is configured to be mounted on a mobile device. The window structure is provided with metal bumps, which electrically connect the second interconnect layer and the seed layer.

17. The ultrasonic fingerprint identification module of claim 16, wherein the ultrasonic fingerprint identification module is configured to be mounted on a mobile device. The projected area of the metal bump in the thickness direction of the substrate is 8000 μm 2 to 50000 μm 2 ; and / or, the maximum side length Lmax of the projection of the metal bump in the thickness direction of the substrate is ≥ 0.04 mm, and the minimum side length Lmin of the projection of the metal bump in the thickness direction of the substrate is ≥ 0.02 mm.

18. The ultrasonic fingerprint identification module of claim 16, wherein the ultrasonic fingerprint identification module is configured to be mounted on a mobile device. The first protective layer is disposed around the metal bump and fills the gap between the substrate and the flexible circuit board.

19. The ultrasonic fingerprint identification module of claim 16, wherein the ultrasonic fingerprint identification module is configured to be mounted on a mobile device. The connection structure also includes a surface treatment layer disposed on the metal bump.

20. The ultrasonic fingerprint identification module of claim 1, wherein, The flexible circuit board and the screen are respectively disposed on both sides of the substrate, and a second bonding layer is provided between the flexible circuit board and the substrate.

21. The ultrasonic fingerprint identification module of claim 20, wherein the ultrasonic fingerprint identification module is configured to be mounted on a back of a mobile device. The second interconnect layer includes FPC gold fingers disposed on the flexible circuit board, and the metal pad is electrically connected to the FPC gold fingers through the connection structure.

22. The ultrasonic fingerprint identification module of claim 21, wherein the ultrasonic fingerprint identification module is configured to be mounted on a back of a mobile device. The connecting structure comprises a binding wire for electrically connecting the metal pad and the FPC gold finger, and the first protective layer covers the binding wire and covers the metal pad and the FPC gold finger.

23. The ultrasonic fingerprint identification module of claim 22, wherein the ultrasonic fingerprint identification module is configured to be mounted on a mobile device. The interval S3 between the first protective layer and the screen is greater than or equal to 80 μm.

24. The ultrasonic fingerprint identification module of claim 22, wherein the ultrasonic fingerprint identification module is configured to be mounted on a mobile device. The connecting structure comprises a seed layer disposed on the substrate, an RDL redistribution layer formed on the seed layer, and a binding wire, the seed layer is electrically connected to the metal pad, and the binding wire is electrically connected to the seed layer and the FPC gold finger.

25. The ultrasonic fingerprint identification module of claim 24, wherein the ultrasonic fingerprint identification module is configured to be mounted on a back of a mobile device. The substrate comprises a first end surface disposed towards the screen, and a groove region formed on one side of the first end surface, a transition inclined surface is provided between the groove region and the first end surface, the first interconnection layer is disposed on the first end surface, a projection of the second interconnection layer in the thickness direction of the substrate is located in the groove region, and the seed layer extends from the first end surface to the groove region.

26. The ultrasonic fingerprint identification module of claim 25, wherein the ultrasonic fingerprint identification module is configured to be mounted on a back of a mobile device. The connecting structure further comprises a second protective layer covering the seed layer, and a window structure is provided on the second protective layer, the window structure is used for electrically connecting the binding wire and the seed layer.

27. The ultrasonic fingerprint identification module of claim 26, wherein the ultrasonic fingerprint identification module is configured to be mounted on a back of a mobile device. The interval S4 between the first protective layer and the screen is greater than or equal to 80 μm, and the interval S5 between the second protective layer and the screen is greater than or equal to 80 μm. 28.The ultrasonic fingerprint identification module of claim 26, wherein, The connecting structure further comprises a surface treatment layer disposed in the window structure and electrically connected to the seed layer.

29. The ultrasonic fingerprint identification module of claim 28, wherein the ultrasonic fingerprint identification module is configured to be mounted on a back of a mobile device. The first protective layer covers the binding wire and covers the surface treatment layer and the FPC gold finger.

30. An electronic device, comprising: An ultrasonic fingerprint identification module comprising any one of claims 1 to 29.

31. The electronic device of claim 30, wherein, The electronic device comprises a screen, and the insulating layer of the ultrasonic fingerprint identification module is fixed below the screen through a first bonding layer.

32. The electronic device of claim 30, wherein, The electronic device comprises a screen and a structural member, and the ultrasonic fingerprint identification module is fixed below the screen through the structural member.

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