Immersed thick film heating device

Abstract

The utility model discloses an immersed thick film heating device, which relates to the technical field of thick film heating equipment, and is characterized in that a bottom insulating layer is printed on the outer side of a metal substrate, the outer side of the bottom insulating layer is connected with a heating resistance layer, a heating conductor layer is printed on the inner side of the heating resistance layer, and a middle insulating layer is printed on the outer side of the heating resistance layer; an RTD fluid mechanism is arranged on the outer side of the middle insulating layer, and an outer insulating layer is printed on the outer side of the RTD fluid mechanism; the inner side faces of the metal substrate are all arranged in fluid, the heating efficiency can be effectively improved, the thick film heating layer is arranged in a two-way mode, the situation that a thick film is burnt out due to local high temperature caused by uneven local thickness in a single-way series circuit is prevented, the product yield and the safety coefficient can be effectively improved, and the product quality is improved. And the RTD fluid mechanism is adopted to cover the surface of the outer side of the whole metal substrate, the heating temperature of the thick film can be monitored more accurately, a sealing fixing hole and a sealing surface are designed, and the problem of isolation and sealing between a heater bonding pad and fluid is solved.

Description

Technical Field

[0001] This utility model relates to the technical field of thick film heating equipment, specifically an immersion thick film heating device. Background Technology

[0002] Thick film heating printing technology has the advantages of excellent thermal conductivity, large heat dissipation area, and high safety performance. While the technology is becoming increasingly mature, existing thick film heating devices have some shortcomings, such as:

[0003] Application No.: CN202010044509.1 discloses a flat thick-film heater for thermal management of new energy vehicles and its preparation process. This equipment typically uses a substrate back side in contact with the fluid, while the thick-film surface remains in contact with the liquid. This leads to excessively high thick-film temperatures, making it prone to burnout. To monitor the temperature of the thick-film heating resistor, an NTC resistor is generally installed on the thick-film surface near the heating resistor. However, because the thick film is not in contact with the fluid, its temperature becomes excessively high. Furthermore, the NTC resistor is a certain distance from the heating resistor layer, resulting in delayed and inaccurate temperature regulation feedback.

[0004] Therefore, we propose an immersion-type thick film heating device to solve the problems mentioned above. Utility Model Content

[0005] The purpose of this invention is to provide an immersion-type thick film heating device to solve the problems mentioned in the background art. Currently, existing thick film heating devices on the market generally use a substrate back side that is in contact with the fluid, while the thick film surface is not in contact with the liquid. This leads to excessively high thick film temperatures, which can easily cause burnout. To monitor the temperature of the thick film heating resistor, an NTC resistor is generally installed on the thick film surface near the heating resistor. However, because the thick film is not in contact with the fluid, the thick film temperature is too high. Furthermore, the NTC resistor is a certain distance from the heating resistor layer, resulting in delayed and inaccurate temperature regulation feedback.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an immersion thick film heating device, comprising a metal substrate and a heating resistor layer disposed on the outside of the metal substrate, a bottom insulating layer printed on the outside of the metal substrate, the bottom insulating layer being connected to the heating resistor layer on the outside, a heating conductor layer printed on the inside of the heating resistor layer, an intermediate insulating layer printed on the outside of the heating resistor layer, an RTD fluid mechanism disposed on the outside of the intermediate insulating layer, and an outer insulating layer printed on the outside of the RTD fluid mechanism;

[0007] The inner side of the heating resistor layer is sealed to the heating conductor layer, and the heating resistor layer can generate heat under the action of external power, and the RTD fluid mechanism can also generate heat under the action of external power.

[0008] By placing the inner surface of the metal substrate in the fluid, the heating efficiency can be effectively improved. The thick film heating layer adopts a dual-path layout to prevent localized high-temperature burns of the thick film caused by uneven thickness in a single-path series circuit. This can effectively improve product yield and safety factor. Furthermore, the RTD fluid mechanism covers the entire outer surface of the metal substrate, which can more accurately monitor the temperature of the thick film heating. The design includes sealing fixing holes and sealing surfaces, which can solve the problem of isolation and sealing between the heater pads and the fluid.

[0009] As a preferred technical solution of this utility model, the metal substrate is fixedly connected to the heating conductor layer through the bottom insulating layer, and the insulating paste used in the bottom insulating layer is ESL4924 or ESL4931, etc.

[0010] The above technical solution enables the outer side of the metal substrate to be more stable when connected to the heating conductor layer, thereby increasing the robustness of the device.

[0011] As a preferred embodiment of this utility model, the outer side of the heating conductor layer is bonded to the heating resistor layer, and the heating resistor layer includes a resistor cable, with a resistor port connected to the front end of the resistor cable and an external resistor interface connected to the bottom of the resistor cable.

[0012] The above technical solution makes it easier to add heating resistor paste to the heating resistor layer, and the setting of the resistor port can seal the port of the resistor cable, thereby preventing leakage.

[0013] As a preferred technical solution of this utility model, the inner side of the resistance cable and the resistance port is fixedly attached to the heating conductor layer, and the heating resistance paste used inside the resistance cable is ESL29115 or ESL29225, etc.

[0014] As a preferred technical solution of this utility model, the outer side of the heating conductor layer is sealed and bonded to the middle insulating layer, and the middle insulating layer and the bottom insulating layer are made of the same material.

[0015] The above technical solution enables the heating conductor layer to be more firmly connected to the intermediate insulation layer, thereby increasing the sealing performance of the device.

[0016] As a preferred technical solution of this utility model, the outer side of the intermediate insulating layer is sealed to the RTD fluid mechanism, and the RTD fluid mechanism includes an RTD resistance layer, and an RTD conductor layer is provided on the inner side of the RTD resistance layer. The paste inside the RTD resistance layer is the same as the paste inside the heating resistance layer.

[0017] The above technical solution enables the intermediate insulation layer to be more stable when connected to the RTD fluid mechanism, including the RTD resistance layer, thereby increasing the sealing performance of the device.

[0018] As a preferred technical solution of this utility model, the gap between the RTD resistor layer and the RTD conductor layer is covered by an outer insulating layer, thereby achieving a sealing effect.

[0019] As a preferred embodiment of the present invention, the bottom of the RTD conductor layer is provided with a bottom pad, which is welded to the bottom of the metal substrate, and the top of the RTD conductor layer is provided with a top pad, which is welded to the top of the metal substrate.

[0020] The above technical solution enables the device to seal the mechanism on the outside of the metal substrate through the bottom pad and the top pad, thereby increasing the sealing performance of the device.

[0021] As a preferred technical solution of this utility model, the RTD conductor layer and the RTD resistor layer are bonded and sealed together, and the bottom of the RTD resistor layer is connected to the conductor layer interface.

[0022] The above technical solution can enable

[0023] As a preferred technical solution of this utility model, a sealing area is provided on the front side of the outer insulating layer, and several sealing holes are provided on the outer side of the sealing area.

[0024] The above technical solution enables the device to connect with internal components through sealing holes in the sealed area when connected to other devices, thereby increasing the device's expandability.

[0025] Compared with the prior art, the beneficial effects of this utility model are: by placing the inner side of the metal substrate in the fluid, the heating efficiency can be effectively improved; the thick film heating layer adopts a dual-path layout to prevent local uneven thickness and local high temperature burn-out of the thick film that occurs in a single-path series circuit, which can effectively improve product yield and safety factor; and the use of RTD fluid mechanism to cover the entire outer surface of the metal substrate can more accurately monitor the temperature of the thick film heating; the design of sealing fixing holes and sealing surfaces can solve the problem of isolation and sealing between the heater pads and the fluid.

[0026] Furthermore, the bottom insulating layer makes the connection between the outer side of the metal substrate and the heating conductor layer more stable, thereby increasing the robustness of the device.

[0027] Furthermore, the addition of the resistance cable makes it easier to add heating resistor slurry to the heating resistor layer, and the resistor port design allows for sealing of the cable port to prevent leakage. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the elevation structure of this utility model;

[0029] Figure 2 This is a three-dimensional structural diagram showing the disassembled bottom insulating layer and heating resistor layer of this utility model;

[0030] Figure 3 This is a schematic diagram of the RTD resistor layer and outer insulating layer structure of this utility model;

[0031] Figure 4 This is a three-dimensional structural diagram showing the disassembly of the heating resistor layer of this utility model.

[0032] Figure 5 This is a three-dimensional structural diagram showing the disassembled RTD resistor layer and RTD conductor layer of this utility model.

[0033] Figure 6 This is a front view structural diagram of the present invention.

[0034] In the diagram: 1. Metal substrate; 2. Bottom insulating layer; 3. Heating resistor layer; 301. Resistor cable; 302. Resistor port; 303. Resistor external interface; 4. Heating conductor layer; 5. Middle insulating layer; 6. RTD resistor layer; 7. RTD conductor layer; 8. Outer insulating layer; 9. Sealing area; 10. Bottom pad; 11. Top pad; 12. Conductor layer interface. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0036] To address the issues of delayed and inaccurate temperature regulation feedback in existing technologies, the following solution is disclosed. Please refer to [link / reference]. Figures 1-6 This utility model provides a technical solution: an immersion thick film heating device, including a metal substrate 1 and a heating resistor layer 3 disposed on the outside of the metal substrate 1. A bottom insulating layer 2 is printed on the outside of the metal substrate 1, and the outside of the bottom insulating layer 2 is connected to the heating resistor layer 3. A heating conductor layer 4 is printed on the inside of the heating resistor layer 3. An intermediate insulating layer 5 is printed on the outside of the heating resistor layer 3, and an RTD fluid mechanism is disposed on the outside of the intermediate insulating layer 5. An outer insulating layer 8 is printed on the outside of the RTD fluid mechanism.

[0037] The inner side of the heating resistor layer 3 is sealed to the heating conductor layer 4, and the heating resistor layer 3 can generate heat under the drive of external power, and the RTD fluid mechanism can also generate heat under the drive of external power;

[0038] The metal substrate 1 is fixedly connected to the heating conductor layer 4 through the bottom insulating layer 2, and the insulating paste used in the bottom insulating layer 2 is ESL4924 or ESL4931, etc.; the outer side of the heating conductor layer 4 is bonded to the heating resistor layer 3, and the heating resistor layer 3 includes a resistor cable 301, and the front end of the resistor cable 301 is connected to a resistor port 302, and the bottom of the resistor cable 301 is connected to a resistor external interface 303.

[0039] The inner sides of the resistance cable 301 and the resistance port 302 are fixedly attached to the heating conductor layer 4, and the heating resistance paste used inside the resistance cable 301 is ESL29115 or ESL29225, etc.; the outer side of the heating conductor layer 4 is sealed and attached to the middle insulation layer 5, and the middle insulation layer 5 and the bottom insulation layer 2 are made of the same material.

[0040] The outer side of the intermediate insulating layer 5 is sealed to the RTD fluid mechanism, and the RTD fluid mechanism includes an RTD resistive layer 6, and an RTD conductor layer 7 is provided inside the RTD resistive layer 6. The paste inside the RTD resistive layer 6 is the same as the paste inside the heating resistor layer 3. The gap between the RTD resistive layer 6 and the RTD conductor layer 7 is covered by the outer insulating layer 8, thereby achieving a sealing effect.

[0041] The bottom of the RTD conductor layer 7 is provided with a bottom pad 10, which is soldered to the bottom of the metal substrate 1. The top of the RTD conductor layer 7 is provided with a top pad 11, which is soldered to the top of the metal substrate 1. The bottom pad 10 and the top pad 11 are hollowed out. The RTD conductor layer 7 is bonded and sealed to the RTD resistor layer 6, and the bottom of the RTD resistor layer 6 is connected to the conductor layer interface 12. The front side of the outer insulating layer 8 is provided with a sealing area 9, and several sealing holes are provided on the outside of the sealing area 9.

[0042] Working principle: When using the immersion thick film heating device, first connect the device power supply and the power grid to supply power, so that the heating resistor layer 3 and the RTD resistor layer 6 are connected to the external power, so that the heating resistor layer 3 and the RTD resistor layer 6 continuously heat up. The heating resistor layer 3 will transfer heat to the metal substrate 1 through the heating conductor layer 4, and the RTD resistor layer 6 will also transfer heat to the metal substrate 1 through the RTD conductor layer 7, thus achieving continuous heating.

[0043] When the heating resistor layer 3 is filled with heating resistor slurry, the heating resistor slurry can be transferred to the resistor cable 301. After the transfer is completed, the resistor port 302 will seal the port of the resistor cable 301, thereby increasing the sealing performance of the resistor cable 301 during use.

[0044] This completes a series of tasks. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0045] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An immersion type thick film heating device comprising a metal substrate (1), a heating resistor layer (3) provided on the outer side of the metal substrate (1), characterized in that, The metal substrate (1) is printed with a bottom insulating layer (2) on the outside, and the bottom insulating layer (2) is connected with a heating resistor layer (3) on the outside, and the heating resistor layer (3) is printed with a heating conductor layer (4) on the inside, the heating resistor layer (3) is printed with an intermediate insulating layer (5) on the outside, and the intermediate insulating layer (5) is provided with an RTD fluid mechanism on the outside, and the RTD fluid mechanism is printed with an outside insulating layer (8) on the outside. The heating resistor layer (3) is sealingly connected with the heating conductor layer (4) on the inside, and the heating resistor layer (3) can heat under the driving of external power, and the RTD fluid mechanism can also heat under the driving of external power.

2. The immersion thick film heating device of claim 1, wherein, The metal substrate (1) is fixedly connected with the heating conductor layer (4) through the bottom insulating layer (2), and the insulating paste used by the bottom insulating layer (2) is ESL4924 or ESL4931.

3. The immersion thick film heating device of claim 2, wherein, The heating resistor layer (3) includes a resistor cable (301), and the resistor cable (301) is connected with a resistor port (302) at the front end, and the resistor cable (301) is connected with a resistor external interface (303) at the bottom.

4. The immersion thick film heating device of claim 3, wherein, The resistor cable (301) and the resistor port (302) are fixedly and tightly attached to the heating conductor layer (4) on the inside, and the heating resistor paste used in the resistor cable (301) is ESL29115 or ESL29225.

5. The immersion thick film heating device of claim 4, wherein, The heating conductor layer (4) is sealingly and tightly connected with the intermediate insulating layer (5) on the outside, and the intermediate insulating layer (5) and the bottom insulating layer (2) are of the same material.

6. The immersion thick film heating device of claim 5, wherein, The intermediate insulating layer (5) is sealingly and tightly attached to the RTD fluid mechanism on the outside, and the RTD fluid mechanism includes an RTD resistor layer (6), and the RTD resistor layer (6) is provided with an RTD conductor layer (7) on the inside, and the paste in the RTD resistor layer (6) is consistent with the paste in the heating resistor layer (3).

7. The immersion thick film heating device of claim 6, wherein, The gaps of the RTD resistor layer (6) and the RTD conductor layer (7) are covered by the outside insulating layer (8), so as to achieve the sealing effect.

8. The immersion thick film heating device of claim 7, wherein, The RTD conductor layer (7) is provided with a bottom pad (10) at the bottom, and the bottom pad (10) is welded to the bottom of the metal substrate (1), and the RTD conductor layer (7) is provided with a top pad (11) at the top, and the top pad (11) is welded to the top of the metal substrate (1).

9. The immersion thick film heating device of claim 8, wherein, The RTD conductor layer (7) is sealingly and tightly attached to the RTD resistor layer (6), and the RTD resistor layer (6) is connected with a conductor layer interface (12) at the bottom.

10. The immersion thick film heating device of claim 7, wherein, The outside insulating layer (8) is provided with a sealing area (9) on the front side, and a plurality of sealing holes are provided on the outside of the sealing area (9).

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