Anti-static precision circuit board

By combining multilayer board design with antistatic coating and conductive edging, the problem of static electricity accumulation in precision circuit boards is solved, achieving effective consumption and release of static electricity, and improving the antistatic performance and service life of the circuit boards.

CN223978804UActive Publication Date: 2026-03-06SUICHUAN YAHENG CIRCUIT CO LTD
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Patent Information

Application Number
CN202520353188.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-03
Publication Date
2026-03-06
Estimated Expiration
2035-03-03

AI Technical Summary

Technical Problem

Precision circuit boards generate and accumulate static electricity during use. If this static electricity is not guided and released in a timely manner, it can lead to damage and reduce their service life.

Method used

It adopts a multilayer board design, including a substrate layer, a conductive layer, an adhesive layer, a pad layer, and an electrostatic protection diode. The surface is coated with an antistatic coating and wrapped with a conductive edge. The electrostatic protection diode consumes electrostatic energy, the antistatic coating reduces static electricity generation, and the conductive edge prevents external electrostatic interference.

Benefits of technology

It effectively consumes and releases static electricity, prevents arc damage, improves the anti-static and antistatic functions of circuit boards, and extends their service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an anti-static precision circuit board, which relates to the technical field of circuit boards and comprises a substrate layer, conductive layers are fixedly mounted on two sides of the substrate layer, one side of each conductive layer is coated with a bonding layer, one side of each bonding layer is connected with a bonding pad layer, and the bonding pad layers are arranged on the substrate layer. Wherein two sides of the surface of one bonding pad layer are respectively provided with an electrostatic protection diode, the surface of the bonding pad layer is coated with an anti-static coating, and the surface of the bonding pad layer is provided with a conductive covered edge. According to the utility model, the multi-layer board design is adopted, a complete ground plane is close to the wiring, static electricity can be more quickly coupled to a low-impedance plane so as to protect key signals, and the two static electricity protection diodes are designed on the surface of the bonding pad layer so as to consume static electricity energy and prevent electric arcs released by static electricity accumulation from damaging the circuit board; therefore, the circuit board is protected in the aspects of electrostatic consumption and release.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to an anti-static precision circuit board. Background Technology

[0002] Circuit boards are named as follows: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board (copper etching technology), etc. Circuit boards make circuits miniaturized and intuitive, playing an important role in the mass production of fixed circuits and the optimization of electrical appliance layout.

[0003] In the existing technology, precision circuit boards generate and accumulate static electricity during use. If the static electricity is not guided and released in time, it will damage the precision circuit board and reduce its service life.

[0004] To address this issue, an anti-static precision circuit board was proposed. Utility Model Content

[0005] The purpose of this invention is to solve the problems existing in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an anti-static precision circuit board, comprising: a substrate layer, conductive layers fixedly mounted on both sides of the substrate layer, an adhesive layer coated on one side of each of the two conductive layers, a pad layer connected to one side of each of the two adhesive layers, an electrostatic protection diode mounted on both sides of the surface of one of the pad layers, an anti-static coating coated on the surface of the pad layer, and a conductive edge provided on the surface of the pad layer.

[0007] In a preferred embodiment, the adhesive layer is made of epoxy resin adhesive material.

[0008] In a preferred embodiment, the electrostatic protection diode uses avalanche diode material.

[0009] In a preferred embodiment, the antistatic coating is applied around the surfaces of the substrate layer, the two conductive layers, the two adhesive layers, and the two pad layers.

[0010] In a preferred embodiment, the conductive edging surrounds the surfaces of the substrate layer, the two conductive layers, the two adhesive layers, and the two pad layers.

[0011] In a preferred embodiment, the antistatic coating is made of acrylic material.

[0012] In a preferred embodiment, the conductive edging is made of copper foil.

[0013] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0014] 1. In terms of design, this utility model adopts a multi-layer board design with a complete ground plane close to the trace, which allows static electricity to be coupled to the low impedance plane more quickly, thereby protecting critical signals. Furthermore, by designing two static protection diodes on the surface of the pad layer, static energy is consumed, preventing the arcing caused by the accumulation of static electricity from damaging the circuit board. This provides protection for the circuit board in terms of static electricity consumption and discharge.

[0015] 2. This utility model reduces static electricity generation by coating the circuit board surface with an antistatic coating. The antistatic coating is made of acrylic material, which, in addition to its antistatic function, also has good wear resistance and anti-fouling properties. Finally, conductive edging is wrapped around the circuit board surface. The conductive edging is made of copper foil material, which has good conductivity and can prevent the circuit board from being affected by external static interference. Through multiple antistatic designs, the overall antistatic and antistatic functions of the device are improved, and the service life of the device is extended. Attached Figure Description

[0016] Figure 1 A schematic diagram of the main body of an anti-static precision circuit board provided by this utility model;

[0017] Figure 2 A cross-sectional view of an anti-static precision circuit board provided by this utility model;

[0018] Figure 3 This utility model provides an anti-static precision circuit board. Figure 2 Enlarged view of point A in the middle;

[0019] Figure 4 A side view of a multilayer board for an anti-static precision circuit board provided by this utility model.

[0020] Legend:

[0021] 1. Substrate layer; 2. Conductive layer; 3. Adhesive layer; 4. Pad layer; 401, ESD protection diode; 5. Antistatic coating; 6. Conductive edging. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a technical solution: an anti-static precision circuit board, comprising: a substrate layer 1, conductive layers 2 fixedly installed on both sides of the substrate layer 1, adhesive layers 3 coated on one side of each of the two conductive layers 2, solder pad layers 4 connected to one side of each of the two adhesive layers 3, electrostatic protection diodes 401 installed on both sides of the surface of one of the solder pad layers 4, an anti-static coating 5 coated on the surface of the solder pad layer 4, and conductive edging 6 provided on the surface of the solder pad layer 4.

[0024] Specifically: Through the multi-layer board design of substrate layer 1, conductive layer 2, adhesive layer 3, and pad layer 4, the circuit board has a complete ground plane close to the trace, which can make static electricity couple to the low impedance plane more quickly. The static protection diode 401 can consume the static electricity generated on the circuit board, the anti-static coating 5 can reduce the generation of static electricity, and the conductive edge 6 can avoid interference from external static electricity.

[0025] In one embodiment, the adhesive layer 3 is made of epoxy resin adhesive material.

[0026] Specifically: Epoxy resin adhesive is often called electronic adhesive or white adhesive because it is white at room temperature. This type of adhesive is a polymer compound with good sealing, insulation, and corrosion resistance properties.

[0027] In one embodiment, the electrostatic discharge protection diode 401 uses an avalanche diode material.

[0028] Specifically: Avalanche diodes, also known as varactor diodes, have two characteristics: a sudden high current source and capacitance matching, which makes them widely used for circuit protection and overload discharge functions.

[0029] In one embodiment, an antistatic coating 5 is applied around the surface of the substrate layer 1, two conductive layers 2, two adhesive layers 3, and two pad layers 4.

[0030] Specifically: Antistatic coating 5 is applied to the exposed surfaces of substrate layer 1, two conductive layers 2, two adhesive layers 3, and two pad layers 4.

[0031] In one embodiment, the conductive rim 6 is formed on the surface of the substrate layer 1, two conductive layers 2, two adhesive layers 3, and two pad layers 4.

[0032] Specifically: the conductive edging 6 wraps around the pad layer 4 and the two conductive layers 2; the two adhesive layers 3 and the exposed portions around the two pad layers 4.

[0033] In one embodiment, the antistatic coating 5 is made of acrylic material.

[0034] Specifically: Acrylic material, in addition to its antistatic function, also has good wear resistance and stain resistance.

[0035] In one embodiment, the conductive edging 6 is made of copper foil.

[0036] Specifically: Copper foil has good electrical conductivity, which can prevent the board from being affected by static electricity from the outside world.

[0037] Working Principle: In terms of design, this utility model adopts a multi-layer board design with a complete ground plane close to the traces, which allows static electricity to couple more quickly to the low-impedance plane, thereby protecting critical signals. Two electrostatic discharge protection diodes 401 are designed on the surface of the pad layer 4 to dissipate static energy and prevent the arcing from accumulated static electricity from damaging the circuit board, thus providing protection against static electricity. An anti-static coating 5 is applied to the surface of the circuit board to reduce static electricity generation. The anti-static coating 5 is made of acrylic material, which, in addition to its anti-static function, also has good wear resistance and anti-fouling properties. Finally, a conductive edge 6 is wrapped around the surface of the circuit board. The conductive edge 6 is made of copper foil, which has good conductivity and can prevent the board from receiving static interference from the outside world. Through multiple anti-static designs, the overall anti-static and anti-static functions of the device are improved, extending the device's service life.

[0038] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. An anti-static precision circuit board, characterized in that, Include: The substrate layer (1), both sides of the substrate layer (1) are fixedly installed with conductive layer (2), one side of two conductive layer (2) is coated with adhesive layer (3), one side of two adhesive layer (3) is connected with pad layer (4), one of the surface of the pad layer (4) is installed with static protection diode (401), the surface of the pad layer (4) is coated with anti-static coating (5), the surface of the pad layer (4) is provided with conductive edge (6).

2. The anti-static fine line circuit board according to claim 1, wherein: The adhesive layer (3) adopts epoxy resin glue material.

3. The anti-static precision circuit board of claim 1, wherein: The static protection diode (401) uses avalanche diode material.

4. The anti-static precision circuit board of claim 1, wherein: The anti-static coating (5) is coated around the surface of the substrate layer (1), two conductive layers (2), two adhesive layers (3) and two pad layers (4).

5. The anti-static precision circuit board of claim 1, wherein: The conductive edge (6) is wrapped around the surface of the substrate layer (1), two conductive layers (2), two adhesive layers (3) and two pad layers (4).

6. The anti-static precision circuit board of claim 1, wherein: The anti-static coating (5) adopts acrylic material.

7. The anti-static precision circuit board of claim 1, wherein: The conductive edge (6) adopts copper foil material.