Heat dissipation device for vehicle-mounted navigation equipment and vehicle-mounted navigation equipment

Abstract

The utility model provides a heat dissipation device for vehicle-mounted navigation equipment and the vehicle-mounted navigation equipment. The heat dissipation device comprises heat dissipation fins, heat conduction silica gel and a metal shell, the cooling fin comprises a first area, a second area and a third area. The first area is in contact with a heat dissipation surface of a digital power amplifier chip of the vehicle-mounted navigation equipment through heat-conducting silica gel; one bottom edge of the second area is connected with the edge of the first area, and the other bottom edge of the second area is in contact with the metal shell; the first bottom edge of the third area is connected with the opposite edge of the edge of the first area, and the other bottom edge of the third area is in contact with the metal shell. The built-in radiating fin in the radiating device has certain bending on the whole, and after being coupled to the radiating fin, a high-frequency signal generated by the digital power amplifier chip can be attenuated after being conducted by the surface of the bent radiating fin, so that the reflection of the high-frequency signal is reduced, and the electromagnetic radiation interference condition caused by the high-frequency signal in the vehicle-mounted navigation equipment is relieved.

Description

Technical Field

[0001] This utility model relates to the field of vehicle navigation equipment, and in particular to a heat dissipation device for vehicle navigation equipment and vehicle navigation equipment. Background Technology

[0002] As the communication data transmission rates used in in-vehicle navigation terminal products become increasingly higher, these high-frequency signals will also generate a large amount of electromagnetic radiation. These potential radiation sources will not only interfere with the components of the navigation terminal itself, but also interfere with other in-vehicle products, thus causing various malfunctions of in-vehicle products due to electromagnetic interference.

[0003] Currently, all in-vehicle navigation devices use digital amplifiers. Digital amplifiers have advantages such as small size, but they all carry high-frequency signals. These high-frequency signals will indirectly radiate outwards through the heat sink, causing a certain degree of electromagnetic radiation interference. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a heat dissipation device for vehicle navigation equipment and a vehicle navigation equipment. The heat dissipation device has a certain degree of bending in the built-in heat sink. After the high-frequency signal generated by the digital power amplifier chip of the vehicle navigation equipment is coupled to the heat sink, most of the signal will be attenuated after being conducted through the bent heat sink surface, thereby reducing the reflection of high-frequency signals and alleviating the electromagnetic radiation interference caused by high-frequency signals in the vehicle navigation equipment.

[0005] In a first aspect, the present invention provides a heat dissipation device for a vehicle navigation device, which includes: a heat sink, thermally conductive silicone, and a metal shell.

[0006] The heat sink includes a first region, a second region, and a third region.

[0007] The first region is rectangular, and it is in contact with the heat dissipation surface of the digital power amplifier chip of the vehicle navigation device through thermally conductive silicone.

[0008] The second region is trapezoidal, with one base of the second region connected to the edge of the first region, and the other base of the second region in contact with the metal shell;

[0009] The third region is trapezoidal, with its first base connected to the opposite side of the first region, and its other base in contact with the metal shell.

[0010] In one embodiment, the heat sink further includes a fourth region; wherein the fourth region is trapezoidal; one bottom edge of the fourth region is connected to an adjacent edge of the first region, and the other bottom edge of the fourth region is in contact with the metal casing.

[0011] In one embodiment, the heat sink further includes a fifth region; wherein the fifth region is trapezoidal; one base of the fifth region is connected to the opposite side of the adjacent side; and the other base of the fifth region is in contact with the metal casing.

[0012] In one implementation, the second region is a rectangle; wherein a pair of opposite sides of the second region have the same side length as the sides of the first region.

[0013] In one implementation, the third region is a rectangle; wherein a pair of opposite sides of the third region have the same side length as the sides of the first region.

[0014] In one embodiment, the angle between the first region and the second region is 135±15°.

[0015] In one embodiment, the angle between the first region and the third region is 135±15°.

[0016] In one embodiment, the distance between the heat sink and the vehicle navigation device is 2-3 mm.

[0017] In one embodiment, the heat sink is made of aluminum alloy.

[0018] Secondly, this utility model provides a vehicle navigation device, which includes at least a digital power amplifier chip, a PCB motherboard, and the heat dissipation device for vehicle navigation devices mentioned in the first aspect.

[0019] The heat dissipation device for vehicle navigation equipment includes at least: a heat sink, thermally conductive silicone, and a metal casing; the digital power amplifier chip is mounted on the PCB motherboard; the PCB motherboard is mounted inside the metal casing; and the heat sink contacts the heat dissipation surface of the digital power amplifier chip through the thermally conductive silicone.

[0020] This utility model provides a heat dissipation device for in-vehicle navigation equipment and an in-vehicle navigation equipment. Specifically, the heat dissipation device for the in-vehicle navigation equipment includes: a heat sink, thermally conductive silicone, and a metal shell. The heat sink includes a first region, a second region, and a third region. The first region is rectangular and contacts the heat dissipation surface of the digital amplifier chip of the in-vehicle navigation equipment via the thermally conductive silicone. The second region is trapezoidal, with one base connected to a side of the first region and the other base contacting the metal shell. The third region is trapezoidal, with the first base connected to the opposite side of a side of the first region and the other base contacting the metal shell. The heat sink built into this heat dissipation device has a certain degree of curvature. After the high-frequency signals generated by the digital amplifier chip in the in-vehicle navigation equipment are coupled to the heat sink, most of the signals are attenuated after being conducted through the curved surface of the heat sink, thereby reducing the reflection of high-frequency signals and mitigating electromagnetic radiation interference caused by high-frequency signals in the in-vehicle navigation equipment.

[0021] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description, claims, and drawings.

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the structure of a first heat dissipation device for an in-vehicle navigation device provided in an embodiment of this utility model;

[0025] Figure 2 A schematic diagram of the structure of a second heat dissipation device for an in-vehicle navigation device provided in an embodiment of this utility model;

[0026] Figure 3 A schematic diagram of the structure of a third heat dissipation device for vehicle navigation equipment provided in this embodiment of the present utility model;

[0027] Figure 4This is a structural schematic diagram of a vehicle navigation device provided for an embodiment of the present utility model.

[0028] icon:

[0029] 10 - Heatsink; 20 - Thermal silicone balm; 30 - Metal casing; 40 - Digital amplifier chip; 50 - PCB motherboard;

[0030] 10a - Region 1; 10b - Region 2; 10c - Region 3; 10d - Region 4; 10e - Region 5. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0032] As the communication data transmission rates used in in-vehicle navigation terminal products become increasingly higher, these high-frequency signals will also generate a large amount of electromagnetic radiation. These potential radiation sources will not only interfere with the components of the navigation terminal itself, but also interfere with other in-vehicle products, thus causing various malfunctions of in-vehicle products due to electromagnetic interference.

[0033] Currently, all existing in-vehicle navigation devices use digital amplifiers. Digital amplifiers have advantages such as small size, but they all carry high-frequency signals. These high-frequency signals are indirectly radiated outwards through the heat sink, causing a certain degree of electromagnetic interference. Therefore, this invention provides a heat dissipation device and an in-vehicle navigation device. The heat dissipation device for the in-vehicle navigation device has a bent heat sink. After the high-frequency signal generated by the digital amplifier chip of the in-vehicle navigation device is coupled to the heat sink, most of the signal is attenuated after being conducted through the bent surface of the heat sink, thereby reducing the reflection of the high-frequency signal and mitigating the electromagnetic interference caused by the high-frequency signal in the in-vehicle navigation device.

[0034] To facilitate understanding of this embodiment, a detailed description of a heat dissipation device for an in-vehicle navigation device disclosed in this utility model embodiment will be provided first. For example... Figure 1 As shown, the heat dissipation device for vehicle navigation equipment includes: a heat sink 10, thermally conductive silicone 20, and a metal casing 30;

[0035] The heat sink includes a first region 10a, a second region 10b, and a third region 10c.

[0036] The first region 10a is rectangular, and the first region 10a is in contact with the heat dissipation surface of the digital power amplifier chip 40 of the vehicle navigation device through the thermal conductive silicone 20; while the digital power amplifier chip 40 is mounted on the PCB motherboard 50.

[0037] The second region 10b is trapezoidal, with one base of the second region 10b connected to the edge of the first region 10a, and the other base of the second region 10b in contact with the metal casing 30.

[0038] The third region 10c is trapezoidal. The first base of the third region 10c is connected to the opposite side of the first region 10a. The other base of the third region 10c is in contact with the metal shell 30.

[0039] from Figure 1 As can be seen from the shape of the heat sink 10, the heat sink 10 exhibits a certain curvature under the action of the first region 10a, the second region 10b and the third region 10c. After the high-frequency signal generated by the digital power amplifier chip 40 is coupled to the heat sink, most of the signal is conducted and attenuated through the surface of the heat sink 10, thereby reducing signal reflection.

[0040] In practice, the shapes of the second region 10b and the third region 10c can be set to rectangles or squares. For example, in one embodiment, the second region 10b is a rectangle. In this case, a pair of opposite sides of the second region 10b have the same side length as the sides of the first region.

[0041] The third region 10c is also a rectangle; in this region, a pair of opposite sides of the third region 10c have the same side length as the side of the first region 10a.

[0042] In one embodiment, the angle between the first region 10a and the second region 10b is 135±15°.

[0043] In one embodiment, the angle between the first region 10a and the third region 10c is 135±15°.

[0044] In one embodiment, the distance between the first region 10a of the heat sink 10 and the vehicle navigation device is 2-3 mm.

[0045] In one embodiment, the heat sink 10 is made of aluminum alloy.

[0046] Specifically, the heat sink 10 is made of aluminum alloy, but other alloy materials can also be used depending on the application. Figure 1In the heat dissipation structure, the heat sink 10 forms a certain curvature through a first region 10a, a second region 10b, and a third region 10c. The first region 10a contacts the heat dissipation surface of the digital power amplifier chip 40 through thermally conductive silicone 20. The contact surface between the first region 10a and the thermally conductive silicone 20 is smooth to ensure good adhesion. The other side of the thermally conductive silicone 20 contacts the heat dissipation surface of the digital power amplifier chip 40, thus achieving a sandwich-like structure. The heat generated by the digital power amplifier chip 40 is transferred to the smooth surface of the first region 10a through the thermally conductive silicone 20, and then transferred to the metal casing through the second region 10b and the third region 10c on both sides.

[0047] Because the heat sink 10 forms a structure with a certain curvature through the first region 10a, the second region 10b, and the third region 10c, most of the high-frequency signal generated by the digital power amplifier chip 40 is attenuated by conduction through the surfaces of the second region 10b and the third region 10c after being coupled to the heat sink 10, thereby reducing the reflection of the high-frequency signal. The anti-interference effect of this heat dissipation device is particularly significant at higher frequencies.

[0048] like Figure 2 The diagram shows another heat dissipation device for in-vehicle navigation equipment. Figure 2 It can be understood as Figure 1 A top view. In one embodiment, the heat sink 10 further includes a fourth region 10d; wherein the fourth region 10d is trapezoidal; one bottom edge of the fourth region 10d is connected to the adjacent edge of the edge of the first region 10a, and the other bottom edge of the fourth region 10d is in contact with the metal casing 30.

[0049] In one embodiment, the heat sink 10 further includes a fifth region 10e; wherein the fifth region 10e is trapezoidal; one bottom edge of the fifth region 10e is connected to the opposite edge of the adjacent side; and the other bottom edge of the fifth region 10e is in contact with the metal casing 30.

[0050] and Figure 1 Similar to the heat dissipation devices used in in-vehicle navigation equipment, Figure 2 The heat dissipation device contains five areas, all made of aluminum alloy. The angle between the first area 10a and the fourth area 10d is 135±15°; the angle between the first area 10a and the fifth area 10e is 135±15°.

[0051] The first region 10a of the heat sink 10 is located directly above the digital amplifier chip 40 and is in contact with the digital amplifier chip 40 via thermally conductive silicone 20. Specifically, the thickness of the thermally conductive silicone 20 is 2mm-3mm, corresponding to the vertical distance between the first region 10a of the heat sink 10 and the digital amplifier chip 40. The fourth region 10d and the fifth region 10e are integrated with the metal casing 30 into a single structure.

[0052] One of the metal surfaces of the metal casing 30 remains flat, and the second region 10b and the third region 10c form a closed area through this metal surface, thereby ensuring that the heat sink 10 remains in contact with the metal casing 30. In actual scenarios, the metal surface of the metal casing 30 is provided with a recessed area, and the bottom of the recessed area is the first region 10a of the heat sink 10, as detailed below. Figure 3 As shown.

[0053] In layman's terms, there is a hole in one of the metal surfaces of the metal casing 30, and the first region 10a of the heat sink 10 is in contact with the heat dissipation surface of the digital power amplifier chip 40; the second region 10b, the third region 10c, the fourth region 10d, and the fifth region 10e of the heat sink 10 are connected in sequence as four surfaces, and all of them are in contact with the first region 10a, and the other ends of the second region 10b, the third region 10c, the fourth region 10d, and the fifth region 10e are in contact with the edge of the hole in the metal casing.

[0054] From the top view, the metal casing 30 has a recess, the bottom of which is the first region 10a of the heat sink 10, and the four sides of the recess are the second region 10b, the third region 10c, the fourth region 10d and the fifth region 10e.

[0055] In summary, this heat dissipation device has the following technical advantages:

[0056] It can effectively reduce radiation generated by high-frequency signals inside the vehicle;

[0057] It can be applied to automotive products as well as other electronic products;

[0058] Low cost and flexible design.

[0059] As can be seen from the heat dissipation device for vehicle navigation devices mentioned in the above embodiments, the heat sink built into the heat dissipation device has a certain degree of curvature. After the high-frequency signal generated by the digital power amplifier chip of the vehicle navigation device is coupled to the heat sink, most of the signal will be attenuated after being conducted through the curved surface of the heat sink, thereby reducing the reflection of high-frequency signals and alleviating the electromagnetic radiation interference caused by high-frequency signals in the vehicle navigation device.

[0060] This utility model embodiment provides a vehicle navigation device, such as... Figure 4 As shown, the in-vehicle navigation device includes at least a digital power amplifier chip 40, a PCB motherboard 50, and the heat dissipation device for the in-vehicle navigation device mentioned in the above embodiment.

[0061] The heat dissipation device for the vehicle navigation equipment includes at least: a heat sink, thermally conductive silicone, and a metal casing; the digital power amplifier chip 40 is disposed in the PCB motherboard 50; the PCB motherboard 50 is disposed inside the metal casing; the heat sink is in contact with the heat dissipation surface of the digital power amplifier chip 40 through the thermally conductive silicone.

[0062] This heat dissipation device is suitable for in-vehicle navigation and entertainment terminals and other in-vehicle navigation products. It can alleviate the problem of high frequency signal radiation in in-vehicle navigation equipment products and reduce the radiation interference of high frequency radiation to the product itself and other in-vehicle products.

[0063] It is worth mentioning that the heat dissipation device for only one digital power amplifier chip 40 is described in this in-vehicle navigation device. When the PCB motherboard 50 is equipped with multiple digital power amplifier chips 40, it also includes a corresponding heat dissipation device, which will not be described in detail here.

[0064] The heat dissipation device in the vehicle navigation device provided in this embodiment of the present invention has the same implementation principle and technical effect as the aforementioned heat dissipation device embodiment for vehicle navigation devices. For the sake of brevity, any parts not mentioned in the device embodiment can be referred to the corresponding content in the aforementioned embodiment.

[0065] In the several embodiments provided in this application, it should be understood that the disclosed systems and devices can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0066] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0067] In addition, in the various embodiments of this utility model, each functional unit can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0068] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a processor-executable, non-volatile, computer-readable storage medium. Based on this understanding, the technical solution of this utility model, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this utility model. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0069] Finally, it should be noted that the above-described embodiments are merely specific implementations of this utility model, used to illustrate the technical solution of this utility model, and not to limit it. The protection scope of this utility model is not limited thereto. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this utility model. These modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A heat dissipating device for a car navigation device, characterized by, The heat dissipation device for the vehicle-mounted navigation device comprises a heat dissipation sheet, heat-conducting silica gel and a metal shell. The heat dissipation sheet comprises a first area, a second area and a third area. The first area is rectangular, and the first area is in contact with the heat dissipation surface of the digital power amplifier chip of the vehicle-mounted navigation device through the heat-conducting silica gel. The second area is trapezoidal, one of the bottom edges of the second area is connected with the side of the first area, and the other bottom edge of the second area is in contact with the metal shell. The third area is trapezoidal, the first bottom edge of the third area is connected with the opposite side of the side of the first area, and the other bottom edge of the third area is in contact with the metal shell.

2. The heat dissipating device for a car navigation device according to claim 1, wherein The heat dissipation sheet further comprises a fourth area; the fourth area is trapezoidal; one of the bottom edges of the fourth area is connected with the adjacent side of the side of the first area, and the other bottom edge of the fourth area is in contact with the metal shell.

3. The heat dissipating device for a car navigation device according to claim 2, wherein The heat dissipation sheet further comprises a fifth area; the fifth area is trapezoidal; one of the bottom edges of the fifth area is connected with the opposite side of the adjacent side, and the other bottom edge of the fifth area is in contact with the metal shell.

4. The heat dissipating device for a car navigation device according to claim 1, wherein The second area is rectangular; the length of a group of opposite sides of the second area is the same as that of the side of the first area.

5. The heat dissipating device for a car navigation device, according to claim 1, wherein The third area is rectangular; the length of a group of opposite sides of the third area is the same as that of the side of the first area.

6. The heat dissipating device for a car navigation device according to claim 1, wherein The included angle between the first area and the second area is 135±15°.

7. The heat dissipating device for a car navigation device, according to claim 1, wherein The included angle between the first area and the third area is 135±15°.

8. The heat dissipating device for a car navigation device, according to claim 1, wherein, The distance between the heat dissipation sheet and the vehicle-mounted navigation device is 2-3mm.

9. The heat dissipating device for a car navigation device, according to claim 1, wherein, The heat dissipation sheet is made of aluminum alloy.

10. An in-vehicle navigation device characterized by comprising: The vehicle-mounted navigation device comprises at least a digital power amplifier chip, a PCB mainboard and the heat dissipation device for the vehicle-mounted navigation device according to any one of claims 1 to 9. The heat dissipation device for the vehicle-mounted navigation device comprises at least a heat dissipation sheet, heat-conducting silica gel and a metal shell; the digital power amplifier chip is arranged in the PCB mainboard; the PCB mainboard is arranged in the metal shell; and the heat dissipation sheet is in contact with the heat dissipation surface of the digital power amplifier chip through the heat-conducting silica gel.

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