Heat dissipation structure and magnetic field control device

Abstract

The utility model relates to the technical field of magnetic field control device protection, and discloses a heat dissipation structure and a magnetic field control device. The heat dissipation structure comprises an upper connecting shell and a lower mounting shell which are arranged outside the magnetic field control PCB, the upper connecting shell and the lower mounting shell are buckled to form a bidirectional cavity outside the magnetic field control PCB, and a heat dissipation fan is arranged on one side of the bidirectional cavity. The heat dissipation fan is electrically connected with the magnetic field control PCB to guide hot air in the bidirectional cavity, and the guided hot air is discharged out of the bidirectional cavity from the other side of the bidirectional cavity to complete heat dissipation of the magnetic field control PCB. The bidirectional cavity is divided into the heat collection cavity and the speed increasing cavity through the upper shell face and the lower shell face, the heat collection cavity achieves accumulation of heat dissipated by the magnetic field control PCB, the accumulated heat enters the speed increasing cavity under pushing of the cooling fan, the flow speed of the heat is increased through the speed increasing cavity, and the heat dissipation efficiency is improved. And the heat is quickly pushed to the heat dissipation opening to be discharged.

Description

Technical Field

[0001] This utility model relates to the technical field of magnetic field control device protection, and more specifically, to a heat dissipation structure and a magnetic field control device. Background Technology

[0002] A magnetic field control device, also known as a constant current source, is a current output device used to provide a stable current to a coil, enabling the coil to generate a stable magnetic field to meet the needs of chip manufacturing. With the advancement of technology, in the chip manufacturing process, it is necessary to test or adjust different parameter information of semiconductor equipment in the same processing technology to obtain the optimal method for chip manufacturing.

[0003] In the process of improving semiconductor manufacturing processes, it is also necessary to confirm the degree of interference between different coils after they generate magnetic fields. It is necessary to provide current to multiple different coils separately to meet the testing requirements. In the wafer manufacturing process, multiple magnetic field control devices are often required to provide stable current to different semiconductor devices, or to output stable current to different coils through multiple magnetic field control devices. Simultaneously controlling multiple magnetic field control devices, when the magnetic field control device is processing and outputting control signals, the internal circuit board will generate a lot of heat due to continuous operation. If the heat cannot be dissipated in time, it will damage the lifespan of the components on the internal circuit board, thereby affecting the continuous and stable current provided by the magnetic field control device to the coil. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation structure and a magnetic field control device. By setting the upper and lower shell surfaces, the bidirectional cavity is divided into a heat collection cavity and a speed-up cavity. The heat collection cavity accumulates the heat dissipated by the magnetic field-controlled PCB board. The accumulated heat enters the speed-up cavity under the drive of the cooling fan. Since the inner diameter of the heat collection cavity is larger than that of the speed-up cavity, the heat flow rate in the heat collection cavity is slow. This results in an increased flow rate when entering the speed-up cavity, which quickly pushes the heat to the heat dissipation port for discharge, aiming to solve the problem of slow heat dissipation in the prior art.

[0005] To achieve rapid heat dissipation during the operation of the magnetic field control device, this utility model discloses a heat dissipation structure, including an upper connecting shell and a lower mounting shell disposed outside the magnetic field control PCB board. The upper connecting shell and the lower mounting shell are interlocked to form a bidirectional cavity outside the magnetic field control PCB board. A cooling fan is disposed on one side of the bidirectional cavity. The cooling fan is electrically connected to the magnetic field control PCB board to guide the hot air in the bidirectional cavity. The guided hot air is discharged from the other side of the bidirectional cavity, thus completing the heat dissipation of the magnetic field control PCB board.

[0006] Furthermore, the upper connecting shell is stepped and includes an upper shell surface and a lower shell surface. A network interface and a DIP switch interface are provided on the upper shell surface. The network interface and the DIP switch interface are respectively connected to the corresponding sockets on the magnetic field control PCB board.

[0007] Furthermore, the lower shell surface is provided with an output interface, a power interface, and a safety interlock interface in sequence, and the output interface, power interface, and safety interlock interface are respectively connected to the sockets on the magnetic field control PCB board.

[0008] Furthermore, a heat dissipation vent is provided at the lower shell end on the other side of the bidirectional cavity, and the cooling fan guides the hot air in the bidirectional cavity so that the hot air can be quickly discharged from the bidirectional cavity through the heat dissipation vent.

[0009] Furthermore, a plurality of mounting pins are provided extending upward on the lower mounting shell side on the side of the heat dissipation vent, and each mounting pin is provided with a screw hole.

[0010] Furthermore, the diameter of the lower mounting shell is larger than that of the upper connecting shell, and multiple communication ports are evenly provided on the bottom wall of the lower mounting shell, which enable bidirectional cavity to communicate with the outside.

[0011] Furthermore, a connecting plate is provided on the side of the upper shell surface away from the lower shell surface, and multiple air inlets are evenly arranged on the connecting plate, with the air inlets and the cooling fan located on the same straight line.

[0012] Furthermore, multiple connecting screws are provided on the connecting plate on the outer side of the air inlet. The connecting screws pass through the connecting plate and connect to the cooling fan, thereby fixing the cooling fan in the bidirectional cavity.

[0013] Furthermore, the upper and lower shell surfaces divide the bidirectional cavity into a heat collection cavity and a speed-increasing cavity. The inner diameter of the heat collection cavity is larger than that of the speed-increasing cavity. The heat collection cavity accumulates the heat dissipated by the magnetic field-controlled PCB board. The accumulated heat enters the speed-increasing cavity, and the flow rate increases due to the reduced inner diameter. Under the action of the cooling fan, the heat is quickly pushed to the heat dissipation port for discharge.

[0014] Compared with the prior art, the heat dissipation structure and magnetic field control device provided by this utility model have the following beneficial effects:

[0015] 1. The bidirectional cavity is divided into a heat collection cavity and a speed-up cavity by setting the upper and lower shell surfaces. The heat collection cavity accumulates the heat dissipated by the magnetic field-controlled PCB board. The accumulated heat enters the speed-up cavity under the push of the cooling fan. Since the inner diameter of the heat collection cavity is larger than that of the speed-up cavity, the heat flow rate in the heat collection cavity is slow. This results in an increased flow rate when entering the speed-up cavity, which quickly pushes the heat to the heat dissipation port for discharge. In addition, the air inlet set on one side of the cooling fan has a small diameter, which can filter out larger dust when external air is drawn in, thereby avoiding dust accumulation in the bidirectional cavity and facilitating continuous heat dissipation of the magnetic field-controlled PCB board.

[0016] 2. By providing a network interface and a DIP switch interface on the upper shell, which are connected to the sockets on the magnetic field control PCB board, and by providing an output interface, a power interface, and a safety interlock interface on the lower shell, which are also connected to the sockets on the magnetic field control PCB board, external current can flow into the magnetic field control PCB board for subsequent current control. Furthermore, the separate locations of the sockets ensure that heat generated at each socket does not accumulate excessively and can be dissipated promptly, preventing the socket temperature from becoming too high. This effectively protects the internal components of the magnetic field control device from damage caused by excessive heat.

[0017] A magnetic field control device includes a magnetic field control PCB board and a housing. The magnetic field control PCB board is disposed in a space formed inside the housing. The housing includes a heat dissipation structure, in which a plurality of positioning posts are provided. The positioning posts fix the magnetic field control PCB board in the heat dissipation structure. The heat dissipation structure is the aforementioned heat dissipation structure. Attached Figure Description

[0018] Figure 1 This is a front view of the heat dissipation structure proposed in this utility model.

[0019] Figure 2 This is a schematic diagram of the back structure of the heat dissipation structure proposed in this utility model;

[0020] Figure 3 This is a schematic diagram of the upper connecting shell in the heat dissipation structure proposed in this utility model;

[0021] Figure 4 This is a cross-sectional view of the magnetic field control device proposed in this utility model.

[0022] In the diagram: 1-Upper connecting shell, 2-Lower mounting shell, 3-Output interface, 4-Power interface, 5-Safety interlock interface, 6-Network interface, 7-DIP switch interface, 8-Heat dissipation vent, 9-Air inlet, 10-Cooling fan, 11-Connecting screw, 12-Positioning post, 13-Heat collection cavity, 14-Speed-increasing cavity, 15-Connecting port, 16-Mounting pin, 17-Magnetic field control PCB board. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0024] The implementation of this utility model will be described in detail below with reference to specific embodiments.

[0025] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this utility model. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0026] Reference Figure 1-4 As shown, the heat dissipation structure includes an upper connecting shell 1 and a lower mounting shell 2 disposed outside the magnetic field control PCB board 17. The upper connecting shell 1 and the lower mounting shell 2 are interlocked to form a bidirectional cavity outside the magnetic field control PCB board 17. A cooling fan 10 is disposed on one side of the bidirectional cavity. The cooling fan 10 is electrically connected to the magnetic field control PCB board 17 to guide the hot air in the bidirectional cavity. The guided hot air is discharged from the other side of the bidirectional cavity to complete the heat dissipation of the magnetic field control PCB board 17. The upper connecting shell 1 is stepped and includes an upper shell surface and a lower shell surface. The upper shell surface and the lower shell surface divide the bidirectional cavity into a heat collection cavity 13 and a speed-increasing cavity 14. The inner diameter of the heat collection cavity 13 is larger than that of the speed-increasing cavity 14. The heat collection cavity 13 accumulates the heat dissipated by the magnetic field control PCB board 17. The accumulated heat enters the speed-increasing cavity 14. Due to the decrease in inner diameter, the flow rate increases. Under the action of the cooling fan 10, the heat is quickly pushed to the heat dissipation port 8 for discharge.

[0027] In this embodiment, the upper connecting shell 1 is stepped and includes an upper shell surface and a lower shell surface. A network interface 6 and a DIP switch interface 7 are provided on the upper shell surface. The network interface 6 and the DIP switch interface 7 are respectively connected to the corresponding sockets on the magnetic field control PCB board 17. An output interface 3, a power interface 4, and a safety interlock interface 5 are sequentially provided on the lower shell surface. The output interface 3, the power interface 4, and the safety interlock interface 5 are respectively connected to the sockets on the magnetic field control PCB board 17, so that external current flows into the magnetic field control PCB board 17 for subsequent current control. The sockets are separated, which can ensure that the heat generated on each socket will not accumulate too much and can be discharged in time, so that the temperature of the socket part will not be too high, thereby effectively protecting the internal components of the magnetic field control device and avoiding damage to the components due to high temperature.

[0028] In this embodiment, a heat dissipation port 8 is provided at the end of the lower shell surface on the other side of the bidirectional cavity. The cooling fan 10 guides the hot air in the bidirectional cavity so that the hot air can be quickly discharged from the bidirectional cavity through the heat dissipation port 8. Multiple mounting pins 16 are provided on the lower mounting shell 2 side on the side of the heat dissipation port 8. Each mounting pin 16 is provided with a screw hole to facilitate the installation of the magnetic field control device.

[0029] In this embodiment, the diameter of the lower mounting shell 2 is larger than that of the upper connecting shell 1, and multiple connecting ports 15 are evenly arranged on the bottom wall of the lower mounting shell 2. The connecting ports 15 enable bidirectional cavity to be connected to the outside. In this way, when the fan acts on the bottom of the magnetic field-controlled PCB board, the heat at the bottom will be directly exchanged and dissipated with the outside through the connecting ports 15.

[0030] In this embodiment, a connecting plate is provided on the side of the upper shell away from the lower shell. Multiple air inlets 9 are evenly arranged on the connecting plate. The air inlets 9 and the cooling fan 10 are located on the same straight line. Multiple connecting screws 11 are provided on the connecting plate outside the air inlets 9. The connecting screws 11 pass through the connecting plate and connect to the cooling fan 10, so as to fix the cooling fan 10 in the bidirectional cavity. The air inlet 9 provided on one side of the cooling fan 10 has a small diameter, so that larger dust can be filtered out when external air is drawn in, thereby avoiding dust accumulation in the bidirectional cavity and facilitating the continuous heat dissipation of the PCB board 17 under magnetic field control.

[0031] This technical solution divides the bidirectional cavity into a heat collection cavity 13 and a speed-up cavity 14 by setting the upper and lower shell surfaces. The heat collection cavity 13 accumulates the heat dissipated by the magnetic field-controlled PCB board 17. The accumulated heat enters the speed-up cavity 14 under the push of the cooling fan 10. Since the inner diameter of the heat collection cavity 13 is larger than that of the speed-up cavity 14, the heat flow rate in the heat collection cavity 13 is slow. This results in an increased flow rate when entering the speed-up cavity 14, which quickly pushes the heat to the heat dissipation port 8 for discharge. Furthermore, the air inlet 9 set on one side of the cooling fan 10 has a small diameter, which can filter out larger dust particles when external air is drawn in, thereby avoiding dust accumulation in the bidirectional cavity and facilitating continuous heat dissipation of the magnetic field-controlled PCB board 17.

[0032] Reference Figure 4 As shown, the magnetic field control device includes a magnetic field control PCB board 17. A heat dissipation structure is provided on the outer side of the magnetic field control PCB board 17. Multiple positioning posts 12 are provided in the heat dissipation structure. The positioning posts 12 fix the magnetic field control PCB board 17 and the upper connecting shell 1 and lower mounting shell 2. The positioning posts 12 fix the magnetic field control PCB board 17 in the heat dissipation structure. The heat dissipation structure divides the bidirectional cavity into a heat collection cavity 13 and a speed-increasing cavity 14 through the upper and lower shell surfaces. The heat collection cavity 13 accumulates the heat dissipated by the magnetic field control PCB board 17. The accumulated heat enters the speed-increasing cavity 14 under the push of the cooling fan 10. Because the inner diameter of the heat collection cavity 13 is larger than that of the speed-increasing cavity 14, the heat flow rate in the heat collection cavity 13 is slow, thus slowing the heat flow rate into the speed-increasing cavity 14. The increased flow rate allows heat to be quickly pushed to the heat dissipation vent 8 for exhaust. Furthermore, the upper shell has a network interface 6 and a DIP switch interface 7, which are connected to the ports on the magnetic field control PCB board 17. The lower shell has an output interface 3, a power interface 4, and a safety interlock interface 5, all connected to the ports on the magnetic field control PCB board 17. This allows external current to flow into the magnetic field control PCB board 17 for subsequent current control. The separate ports ensure that heat generated at each port does not accumulate excessively and can be dissipated promptly, preventing the port temperature from becoming too high. This effectively protects the internal components of the magnetic field control device from damage due to excessive heat.

[0033] In this embodiment, the entire operation process can be controlled by a computer, and in each operation stage, sensors can be set to provide signal feedback to ensure that the steps are performed sequentially. These are all conventional knowledge in current automation control, and will not be elaborated on in this embodiment.

[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipating structure, characterized by, The application relates to a magnetic field control PCB board cooling structure.

2. The heat dissipating structure according to claim 1, wherein The upper connecting shell is in a stepped shape and comprises an upper shell surface and a lower shell surface, a network interface and a dial interface are arranged on the upper shell surface, and the network interface and the dial interface are respectively connected with corresponding sockets on the magnetic field control PCB board.

3. The heat dissipating structure according to claim 2, wherein The lower shell surface is sequentially provided with an output interface, a power supply interface and a safety interlocking interface, and the output interface, the power supply interface and the safety interlocking interface are respectively connected with sockets on the magnetic field control PCB board.

4. The heat dissipating structure according to claim 3, wherein The lower shell surface end of the other side of the bidirectional cavity is provided with a heat dissipation port, the heat dissipation fan guides the hot air in the bidirectional cavity, and the hot air can be quickly discharged from the heat dissipation port.

5. The heat dissipating structure according to claim 4, wherein A plurality of mounting pins are upwardly arranged on one side of the lower mounting shell on the side of the heat dissipation port, and screw holes are arranged on the mounting pins.

6. The heat dissipating structure according to claim 5, wherein The diameter of the lower mounting shell is greater than that of the upper connecting shell, and a plurality of communication ports are uniformly arranged on the bottom wall of the lower mounting shell.

7. The heat dissipating structure according to claim 6, wherein A connecting plate is arranged on the side of the upper shell surface away from the lower shell surface, a plurality of air inlets are uniformly arranged on the connecting plate, and the air inlets and the heat dissipation fan are located on the same straight line.

8. The heat dissipating structure according to claim 7, wherein A plurality of connecting screws are arranged on the connecting plate outside the air inlets, the connecting screws penetrate through the connecting plate and are connected with the heat dissipation fan, and the heat dissipation fan is fixed in the bidirectional cavity.

9. The heat dissipating structure according to claim 8, wherein The upper shell surface and the lower shell surface divide the bidirectional cavity into a heat collecting cavity and a speed increasing cavity, the inner diameter of the heat collecting cavity is greater than that of the speed increasing cavity, the heat collecting cavity accumulates the heat generated by the magnetic field control PCB board, the accumulated heat enters the speed increasing cavity and the flow rate is increased due to the reduced inner diameter, and under the action of the heat dissipation fan, the heat is quickly pushed to the heat dissipation port and discharged.

10. A magnetic field control device comprising a magnetic field control PCB and a housing, the magnetic field control PCB being arranged in a space formed inside the housing, the housing comprising a heat dissipation structure, a plurality of positioning posts being arranged in the heat dissipation structure, the positioning posts enabling the magnetic field control PCB to be fixed in the heat dissipation structure, characterized in that, The cooling structure is the cooling structure in any one of claims 1-9.

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