Removal device
By designing an automated removal device that combines a shelf structure and a roller structure, the problems of low efficiency and high damage rate in manually removing semiconductor dies or packages are solved, achieving an efficient and reliable semiconductor manufacturing process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2026-03-06
AI Technical Summary
In the existing technology, manually removing semiconductor dies or packages is inefficient and can easily lead to deformation or damage, affecting the capacity and product quality of semiconductor manufacturing plants.
Design a removal device, including a shelf structure and a roller structure, to automatically remove semiconductor dies or packages from a carrier or support. The device utilizes the rotation and drive structure of the rollers to improve removal efficiency and reduce the possibility of deformation and damage.
It increased the number of units per hour (UPH) in semiconductor manufacturing plants, reduced defects, increased product reliability and capacity, and reduced the risks associated with manual operation.
Smart Images
Figure CN223979031U_ABST
Abstract
Description
Technical Field
[0001] Embodiments of this utility model relate to a removal device. Background Technology
[0002] Semiconductor dies or semiconductor packages are manufactured by applying carriers or supports to a stacked structure. For example, a stacked structure may include a substrate on which one or more non-conductive layers and one or more conductive layers are stacked. These one or more non-conductive and conductive layers are formed on the substrate to form one or more functional or electrical structures of the semiconductor die or semiconductor package. At some point during the manufacturing process, the substrate of the stacked structure is coupled to a carrier or support, which may be a non-ultraviolet (non-UV) strip including an adhesive. After the substrate of the stacked structure is coupled to the non-UV strip, the stacked structure may be further processed or trimmed to manufacture the semiconductor die or semiconductor package. At some point in the formation of the semiconductor die or package, the non-UV strip is removed from the substrate. Utility Model Content
[0003] Some embodiments of this utility model provide a removal device, including: a shelf structure comprising: a first shelf portion; a second shelf portion spaced apart from the first shelf portion; a gap between the first shelf portion and the second shelf portion; a first sidewall relative to the first shelf portion and the second shelf portion; and a second sidewall relative to the first shelf portion and the second shelf portion, the second sidewall being relative to the first sidewall; a support structure on the first shelf portion and the first sidewall; a first roller coupled to the support structure, the first roller being coupled to the support structure to rotate freely about the support structure, the first roller overlapping the first shelf portion; a second roller on the second sidewall; and a drive structure on the second sidewall, the drive structure mechanically cooperating with the second roller. Attached Figure Description
[0004] The various aspects of this disclosure can be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with industry standard practice, the various features are not drawn to scale. In fact, for clarity of discussion, the dimensions of the various features may be arbitrarily increased or decreased.
[0005] Figure 1 It is a top view of one or more semiconductor dies or packages coupled to a carrier or support material (which may be a strip).
[0006] Figure 2A It is a perspective view of a tool configured to remove one or more semiconductor dies from a carrier or support during operation, according to some embodiments.
[0007] Figure 2B According to some embodiments, such as Figure 2A The tool shown is a sidewall view and is configured to remove one or more semiconductor dies from a carrier or support during operation.
[0008] Figure 2C According to some embodiments Figure 2A and Figure 2B The tools shown are as follows Figure 2B The enlarged enhanced view of section 2C-2C shown shows the tool configured to remove one or more semiconductor dies from a carrier or support during operation.
[0009] Figure 3 This is based on the utilization of some embodiments, such as Figure 2A-2C The flowchart shows a method for a tool configured to remove one or more semiconductor dies from a carrier or support during operation.
[0010] Figure 4A Is it like this? Figure 2A-2C The tool shown is a perspective view of removing one or more semiconductor dies from a carrier or support during operation.
[0011] Figure 4B Is it like this? Figure 2A-2C The diagram shows a sidewall cross-section of a tool used to remove one or more semiconductor dies from a carrier or support during operation.
[0012] Figure 4C According to some embodiments, such as Figure 2A-2C The tools shown are as follows Figure 4B The enlarged view shown is of section 4C-4C, where the tool is being operated to remove one or more semiconductor dies from a carrier or support.
[0013] Figure 4D It is one or more semiconductor dies in such Figure 2A-2C The diagram shows a top view behind the safety zone of the tool, which is configured to remove one or more semiconductor dies from a carrier or support during operation after performing the following actions.
[0014] Figure 5 This is a flowchart of a method for fabricating one or more semiconductor dies or packages containing MEMS structures using etching processes, followed by methods such as... Figure 2A-2C The tool shown is a method for removing one or more semiconductor dies from a structure.
[0015] Figure 6A Is manufacturing like Figure 5 The flowchart shows a cross-sectional view of the corresponding steps of the method for constructing and assembling a MEMS structure and device.
[0016] Figure 6B Is manufacturing like Figure 5 The flowchart shows a cross-sectional view of the corresponding steps of the method for constructing and assembling a MEMS structure and device.
[0017] Figure 6C Is manufacturing like Figure 5 The flowchart shows a cross-sectional view of the corresponding steps of the method for constructing and assembling a MEMS structure and device. Detailed Implementation
[0018] The following disclosure provides several different embodiments or examples for implementing various features of the provided object. Specific examples of components and arrangements are described below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. For example, the description of a first feature being formed above or on a second feature in the following description may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, thereby preventing direct contact between the first and second features. Furthermore, reference numerals or letters may be repeated in various instances of this disclosure. Such repetition is for the purpose of brevity and clarity and is not intended to indicate a relationship between the various embodiments or configurations discussed.
[0019] Furthermore, for ease of explanation, spatially relative terms such as "beneath," "below," "lower," "above," "upper," and similar expressions may be used herein to describe the relationship between one component or feature shown in the figures and another component or feature. These spatially relative terms are intended to encompass not only the orientation shown in the figures but also different orientations of the device during use or operation. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein may be interpreted accordingly.
[0020] This disclosure relates to one or more embodiments of a tool configured to remove one or more semiconductor dies or packages from a carrier during operation. The semiconductor dies or packages may include micro-electromechanical systems (MEMS), which comprise microscopic components susceptible to damage and defects when exposed to relatively large external stresses and strains. The tool automatically removes one or more semiconductor dies or packages from the carrier to improve the efficiency of a semiconductor manufacturing plant (FAB) by increasing the number of units per hour (e.g., semiconductor dies) that can be removed from the respective carrier (UPH). The tool is automated to replace manual removal of one or more semiconductor dies or packages from the carrier by employees, thereby reducing a number of defects (e.g., residual adhesive on one or more semiconductor dies, cracks or packages within one or more semiconductor dies, delamination between layers of one or more semiconductor dies or packages, or other similar or comparable defects that may occur due to manual operations performed by employees).
[0021] Semiconductor dies or packages including MEMS can be formed by forming MEMS structures on or above a substrate to form a MEMS device. After forming the MEMS device, the front sidewalls of the MEMS device are coupled to an adhesive layer on or above the substrate. The adhesive layer is resistant to wet etching chemicals. Once the MEMS device is coupled to the adhesive layer of the strip, a wet etching process is performed on the substrate to separate the MEMS device into individual semiconductor dies or packages, each semiconductor die or package including one or more corresponding MEMS devices. After being separated into individual semiconductor dies or packages, the semiconductor dies or packages are removed using a tool of this disclosure, which is configured to remove one or more semiconductor dies or packages from the adhesive layer of the strip in operation to prevent or reduce the possibility of adhesive layer residue remaining on the MEMS device when removed from the adhesive layer of the strip.
[0022] Figure 1 It is a top view of one or more semiconductor dies or packages coupled to a carrier or support material (which may be a strip).
[0023] In some cases, a manual procedure is used to remove one or more semiconductor dies, packages, or components 102 from the adhesive layer of the strip. For example, an employee (i.e., a person) performs consecutive steps of the manual method. This manual method can be performed over and over again (i.e., continuously) to remove all or all of the semiconductor dies or packages 102 from the adhesive layer on the carrier or support material 104 (which may be a strip).
[0024] For example, multiple semiconductor dies or packages are coupled to a support material 104. In this case, the support material 104 is a strip including an adhesive layer or adhesive 107 to which multiple semiconductor dies or packages 102 are coupled. The support material 104 includes a first sidewall 110 and a second sidewall 111 opposite to the first sidewall 110. The adhesive layer or adhesive 107 is on the first sidewall 110 of the support material 104. The support material 104 further includes an end 112 at which it terminates. One or more semiconductor dies or packages 102 are arranged in an array such that each corresponding semiconductor die or package is spaced apart from another adjacent corresponding semiconductor die or package by the support material 104 and the sidewalls 105 of the corresponding one or more semiconductor dies or packages 102 by spaces, gaps, or channels 106a, channels 106b. Channels 106a, channels 106b include one or more first channels 106a extending along a first direction and one or more second channels 106b extending along a second direction transverse to the first direction. In this case, the first channel 106a is perpendicular or orthogonal to the second channel 106b because one or more semiconductor dies or packages 102 have rectangular or square shapes and outlines.
[0025] When employees manually remove all or one semiconductor die or package 102 from the adhesive layer or adhesive on the support material 104, the relatively long time (e.g., 5 minutes or more) spent removing all or one semiconductor die or package 102 from the support material 104 results in a reduction in the number of units per hour (UPH) output of the semiconductor manufacturing plant or manufacturing facility (FAB).
[0026] When this procedure is performed manually by employees continuously to remove one or more semiconductor dies or packages 102 from support material 104, the likelihood of at least one or more of the semiconductor dies or packages 102 becoming deformed is relatively high. In some cases, the deformation or damage may be minor, such that the deformed or damaged semiconductor dies or packages 102 remain within the selected tolerances, allowing them to pass quality control and be sold to customers. However, in other cases, the deformation or damage may be significant, causing the damaged or deformed semiconductor dies or packages 102 to exceed the selected tolerances, preventing them from passing quality control and becoming a waste of FAB (Features, Embedded Systems), resulting in lost revenue.
[0027] In light of the foregoing discussion, this disclosure aims to provide a system or apparatus that, when removing one or more semiconductor dies or packages 102 from support material 104, removes them more quickly to increase the UPH of the FAB while reducing the likelihood of deformation or damage. Reducing the time spent removing all or all semiconductor dies and packages 102 from support material 104 increases the UPH of the FAB because a greater number of semiconductor dies or packages 102 can be manufactured. Similarly, reducing the likelihood of deformation or damage when removing one or more semiconductor dies or packages 102 from support material 104 increases the UPH of the FAB because a greater number of semiconductors or packages 102 pass quality control and are sold to customers.
[0028] Figure 2A This is a perspective view relating to a die or package removal tool or apparatus 200. The removal tool 200 includes a structure 202, which may be referred to as a shelf support structure or shelf structure. The shelf structure 202 includes a first sidewall or sidewall portion 204, a second sidewall or sidewall portion 206, and a base or base portion 208. The first sidewall 204 and the second sidewall 206 are connected together through the base 208. As shown in FIG2, the first sidewall 204, the second sidewall 206, and the base 208 have a C-shaped channel structure, a U-shaped channel structure, or a structure similar to or analogous to that of the shelf structure 202. The first shelf or first shelf portion 210 overlaps with the base 208 and extends from the first sidewall 204 to the second sidewall 206. The second shelf or second shelf portion 212 overlaps with the base 208 and extends from the first sidewall 204 to the second sidewall 206. Figure 2A In the embodiment shown, the second shelf 212 is completely separated from the first shelf 210 by a gap 214. Figure 2A In the illustrated embodiment, the gap 214 extends from the first sidewall 204 to the second sidewall 206. In at least one alternative embodiment, the gap 214 may not extend completely from the first sidewall 204 to the second sidewall 206, and the first shelf portion and the second shelf portion may be a single partition portion, wherein the single partition portion replaces the slot extension of the gap 214.
[0029] Support structure 216 extends outward from the first sidewall 218 of the first shelf 210. Support structure 216 includes a first channel structure 217 and a second channel structure 226. The channels of the first channel structure 217 and the second channel structure 226 are opposite to each other, as shown in FIG2. The second channel structure 226 includes an opening 222 aligned with the corresponding channel in the second channel structure 226. The first shelf 210 includes a second sidewall 219 opposite to the first sidewall 218 (see this disclosure). Figure 2B ).
[0030] Support structure 216 supports first roller 228. First roller 228 includes a first end 230 and a second end 232. The first end 230 has a shaft-like structure located within a corresponding channel of the first channel structure 217, and the second end 232 has a shaft-like structure located within a corresponding channel of the second channel structure 226. Second end 232 is inserted into and passes through opening 222. Figure 2A As shown, the first roller is shaped and structured like a rolling pin. The first roller 228 is supported by a first channel structure 217 and a second channel structure 226 of the support structure 216, allowing the first roller 228 to rotate freely about a first rotation axis 234 in a first rotational direction, as indicated by arrow 236 (see this disclosure). Figure 2B The first roller 228 overlaps with the first shelf 210.
[0031] Support structure 216 supports guide structure 238. Although not easily visible, Figure 2A A small, less visible space exists between the lower surface of the guide structure 238 and the first sidewall 218 of the first shelf 210, allowing support material (e.g., strips) coupling multiple dies or packages to pass through easily. In other words, the guide structure 238 is configured to guide support material (e.g., strips) coupling one or more dies or packages along the first sidewall 218 of the first shelf 210 during operation of the tool 200. The guide structure 238 overlaps with the first shelf 210.
[0032] The second shelf 212 includes a third sidewall 240 and a fourth sidewall 242 opposite to the third sidewall 240. The second roller 244 overlaps with the second shelf 212. The second roller 244 is located between the base 208 and the second shelf 212. Similar to the first roller 228, the second roller 244 has a shape and structure like a rolling pin.
[0033] A bearing, drive structure, or motor base 246 extends outward from base 208 and is located between base 208 and the second shelf 212. Drive structure 248, which may be a motor or some other structure or device for driving the second roller 244 to rotate, is connected to drive structure base 246. Drive structure 248 includes a bearing connected to an end (not visible) of the second roller 244. The end of the second roller 244 may be a shaft-like structure. Drive structure 248 is configured to drive the second roller to rotate about a second rotation axis 250 in a second rotational direction indicated by arrow 252 (see this disclosure) during operation of tool 200. Figure 2B The second roller support structure 254 provides support to the end of the second roller that is mechanically coupled to the drive structure 248 and is opposite to the end of the second roller 244.
[0034] Safety zone 256 exists along the third side wall 240 of the second shelf 212. Safety zone 256 is formed by, for example... Figure 2A The dashed area shown is represented as... (In...) Figure 2A In the embodiment of the removal tool 200 shown, the safety area 256 is spaced inwardly from the first sidewall 204 and the second sidewall 206.
[0035] Figure 2B This is a cross-sectional sidewall view of the removal tool 200. The section is taken along a plane passing through the guide structure 238, base 208, first shelf 210, second shelf 212, first roller 228, and second roller 244. Figure 2B As shown, the second shelf 212 is slightly offset downwards relative to the first shelf 210 (see Figure 210). Figure 2C (where the downward offset is more easily visible).
[0036] Figure 2C This is an enlarged and enhanced view of the gap 214 between the first shelf 210 and the second shelf 212. (See image below.) Figure 2C China and Belgium in Figure 2B As is more readily apparent, the second shelf 212 is slightly offset in the downward direction relative to the first shelf 210. A space 255 exists between the first roller 228 and the first sidewall 218 of the first shelf 210. In this embodiment, and considering the preceding discussion, since the first roller 228 rotates freely about the first axis of rotation 234, it is not driven by a motor or drive structure, but rotates based on friction with the outside. The package 102, like the support material 104 and the plurality of packages 102, passes through the space 255.
[0037] A first dimension H1, which may be a height H1, extends from the first sidewall 218 of the first shelf 210 to the third sidewall 240 of the second shelf 212. The first dimension H1 may be less than or equal to 0.2 millimeters (mm). The first dimension H1 may be selected or adjusted based on the plurality of dies or packages 102 removed from the support material 104.
[0038] A second dimension W1 with a width of Wl extends from the first shelf 210 to the second shelf 212. The second dimension W1 is greater than 0 millimeters (mm) and less than or equal to the largest dimension (e.g., width) of the plurality of dies or packages. This results in the plurality of dies or packages 102 being unable to pass through or fall into the gap 214 when they are removed from the support material 104.
[0039] In this embodiment, the controller 258 is a control box, electrically connected to the drive structure 248 to control the drive structure 248. The controller 258 includes an on / off switch 260 for turning the drive structure 248 on and off. The controller 258 includes a torque control input 262 for controlling the torque output by the drive structure 248. Figure 2A In the illustrated embodiment, torque control input 262 is a knob. In some other embodiments, torque control input 262 may be some other type of input device or structure for controlling the torque of drive structure 248. Display 264 (which may be analog or digital) outputs and displays the torque output by drive structure 248. Controller 258 includes fuse 266, which serves as a safety device to prevent damage to drive structure 248, removal tool 100, or the dies or packages 102 when they are removed using removal tool 100.
[0040] Figure 3 A flowchart 300 relates to a method for removing multiple dies or packages 102 from support material 104. Flowchart 300 includes corresponding steps 302, 304, 306, 308, 310, 312, and 314. Details of these corresponding steps 302, 304, 306, 308, 310, 312, and 314 will be detailed in this disclosure. Figures 4A-4D and the previously described Figure 2A-2C Let's discuss the details described in the text.
[0041] In the first step 302, the support material 104 is located between the guide structure 238 and the first sidewall 218 of the first shelf 210. The support material 104 is within and passes through the space defined between the guide structure 238 and the first sidewall 218 of the first shelf 210. In other words, the support material is sandwiched between the guide structure 238 and the first sidewall 218 of the first shelf 210. The support material 104 is located between the first roller 228 and the first sidewall 218 of the first shelf 210. The support material 104 is positioned to pass through the gap 214 between the first shelf 210 and the second shelf 212. The support material 104 includes coupling or adhesion (e.g., via an adhesive on the support material 104) to a corresponding end of the second roller 244. As the removal tool 100 removes multiple dies or packages 102 during operation, the multiple dies or packages 102 coupled or adhered to the support material 104 are positioned upstream of the first roller 228 on the support material 104 in a direction opposite to the direction of travel of the support material 104. The direction of travel of the support material 104 is indicated by arrow 316, as shown below. Figure 4C As shown, its direction is similar. Figure 2B An enhanced, magnified view. However, with Figure 2B Unlike other materials, the support material 104 is present within the removal tool 100 and... Figure 4CAs shown in the image.
[0042] After the first step 302 (in which the support material 104 coupled with multiple dies or packages 102) is positioned within the removal tool 100, in the second step 304, the drive structure 248 is activated by flipping the on / off switch 260 from the "off" position to the "off" position. The torque output by the drive structure 248 can be adjusted using the torque control input 262. When the drive structure 248 is activated, the drive structure 248, driven by a power source (not shown), causes the second roller 244 (e.g., the drive roller) to rotate along a second rotation direction, such as... Figure 2B As shown by arrow 252. The rotation of the second roller 244 causes the support material to move along the direction of travel indicated by arrow 316, as in this disclosure. Figure 4C As shown.
[0043] When removing multiple dies or packages 102 from the support material 104 using the removal tool 100, the drive structure can output a torque in the range of 0.1 N (Newtons) to 0.5 N, or an output equal to the upper or lower end of this range. In some cases, when removing multiple dies or packages 102 from the support material 104 using the removal tool 100, the torque output by the drive structure 248 can be less than 0.2 N (Newtons), or the torque output by the drive structure 248 can be less than 0.2 N (Newtons).
[0044] In the second step 304, the drive structure 248 is activated and opened to drive the second roller 244 to rotate in the second rotation direction 252. In the third step 306, the plurality of dies or packages 102 begin to pass through the space 255 between the first sidewall 218 of the first shelf 210 below the first roller 228 and below the first roller 228. In other words, the movement of the support material 104 in the direction of travel indicated by arrow 316 causes the plurality of dies or packages 102 coupled to the support material 104 to move in the direction of travel indicated by arrow 316. As the plurality of dies or packages 102 move in the direction of travel indicated by arrow 316, the respective upper surfaces 318 of the plurality of dies and packages 102 (e.g., the surfaces opposite to the surfaces of the adhesive attached to the support material 104) come into contact with the first roller 228. This contact between the upper surfaces 318 of the plurality of dies or packages 102 and the first roller 228 causes the first roller 228 to rotate in the first rotation direction, as shown in the third step 306. Figure 2B and Figure 4C As indicated by arrow 236 shown. Since the first roller 228 is freely rotatable, this causes the first roller 228 to rotate, as previously described herein with respect to this disclosure. Figure 2A-2C The contact between the upper surface 318 of the plurality of dies or packages 102 and the first roller 228 causes the first roller 228 to apply pressure or force to the upper surface 318 of the plurality of dies or packages 102.
[0045] Multiple dies or packages 102 include corresponding lower surfaces 320 opposite to the upper surface 318. The respective lower surfaces 320 of the multiple dies or packages 102 are coupled to an adhesive on the support material 104.
[0046] Following the third step 306, in which multiple dies or packages 102 pass through space 255 and their respective upper surfaces 318 contact the first roller 228, in the fourth step 308, multiple dies or packages 102 are removed from support material 104, and in the fifth step 310, support material 104 passes through gap 214. The fourth step 308 and the fifth step 310 occur substantially simultaneously with each other.
[0047] In steps 308 and 310, the support material 104 bends around the end sidewall 322 of the first shelf 210. As the support material 104 bends around the end sidewall 322 of the first shelf and a corresponding die or package among the plurality of dies or packages 102 reaches the end sidewall 322, the first roller 228 remains in contact with the area of the corresponding upper surface 318 of the corresponding die or package 102 that has just reached the end sidewall 322. As the initial portion of the corresponding die or package 102 moves past the end sidewall 322, the support material 104 bends around the end sidewall 322, causing the support material to begin peeling off from the corresponding lower surface 320 of the corresponding die or package 102. As the corresponding die or package 102 is removed from the support material 104, the corresponding lower surface 320 of the corresponding die or package 102 contacts the third sidewall 240 of the second shelf 212, preventing the corresponding die or package 102 from passing through the gap. The size W2 of the plurality of packages or dies 102 between the corresponding opposite ends 324 is greater than the second size W1 of the gap 214.
[0048] In some cases, when the support material 104 is only partially removed from the corresponding lower surface 320 of the corresponding die or package (e.g., see the leftmost corresponding die or package 102, such as...), Figure 4C As shown, the corresponding die or package 102 removed from the support material contacts the third sidewall 240 of the second shelf 212. This contact between the corresponding die or package 102 and the third sidewall 240 of the second shelf 212 further facilitates the removal of the support material 104 from the corresponding lower surface 320 of the corresponding die or package 102 before the support material 104 is completely removed from the corresponding lower surface 320.
[0049] like Figure 4CAs shown, the second shelf 212 is positioned slightly downward from the first shelf 210 to facilitate the removal of the support material 104 from the corresponding lower surface 320 of the respective die or package 102, while reducing the possibility of deformation, defects, or damage to the respective die or package 102. In other words, the slight downward displacement of the second shelf 212 relative to the first shelf 210 improves the reliability of completely removing the support material 104 from the corresponding lower surface 320 of the respective package or die 102, while reducing or mitigating any stress or strain that may be caused by the removal of the support material 104 from the corresponding lower surface 320 of the corresponding die or package 102.
[0050] like Figure 4C As shown, the support material 104 is located at an angle 321 relative to the second sidewall 219 of the first shelf 210. The angle is less than ninety (90) degrees. When multiple dies or packages 102 are moved from the support material 104 onto the second shelf 212 within the safety area 256, the angle 321 being less than 90 degrees causes the strip to move away from the second shelf 212.
[0051] Following steps 308 and 310 (where support material 104 passes through gap 214 and multiple dies or packages 102 are removed from support material 104), in step 312, the multiple dies or packages 102 are placed in safety area 256 on the second shelf 212 within step 314, where support material 104 is wound around the second roller 244. Steps 312 and 314 occur substantially simultaneously with each other.
[0052] In step 312, when multiple dies or packages 102 are removed from the support material, the array pattern of the multiple dies or packages 102 is relative to the pattern described earlier in this document. Figures 4A-4D The array pattern shown and discussed is the same or similar, with multiple dies or packages 102 stored on the third sidewall 240 of the second shelf 212 within the safety area 256. As the multiple dies or packages 102 are successively removed from the support material 104, they push against the corresponding dies or packages 102 previously removed from the support material 104 until an array of multiple dies or packages 102 exists on the third sidewall 240 of the second shelf 212 within the safety area 256. The array of multiple dies or packages 102 removed from the support material 104, the third sidewall 240 of the second shelf 212, and within the safety area 256 can be [displayed / contained / etc.] within this disclosure. Figure 4D It is easy to see in the middle. For example, Figure 4D As shown, once removed from the support material 104, multiple dies or packages 102 organized into an array can be adjacent to each other within the safety area 256.
[0053] In the seventh step 314, the support material 104 is wound along the outer surface of the second roller 244. The result of winding the support material 104 along the outer surface of the second roller 244 can be described in this disclosure. Figure 4B It's easy to see from the middle.
[0054] Once such Figure 4C As shown, multiple dies or packages 102 are completely removed from the support material 104, and the multiple dies or packages 102 can then be transported to another area within the FAB for further processing or finishing. Alternatively, after removing the multiple dies or packages 102 from the support material 104, if no further processing or finishing is required, the multiple dies or packages 102 can be transported and sold to customers.
[0055] Figure 5 This is a flowchart 400 of a method for manufacturing one or more semiconductor dies or packages 102 containing MEMS structures. Flowchart 400 includes a first step 402 (see...). Figure 6A Step 2 404 (see Figure 6B ) and third step 406 (see Figure 6C ). Figure 6A Is manufacturing like Figure 5 The flowchart 400 shows the first step of the method for the MEMS structure and device, 402, in cross-sectional view. Figure 6B Is manufacturing like Figure 5 The flowchart 400 shows the second step of the method for the MEMS structure and device, 404 cross-sectional view. Figure 6C Is manufacturing like Figure 5 The flowchart 400 shows the third step of the method for the MEMS structure and device, 406, in cross-sectional view.
[0056] exist Figure 6A In the first step 402 shown, one or more conductive and non-conductive layers 410 are formed on the substrate 412. While forming the one or more conductive and non-conductive layers 410, one or more MEMS structures 414 are formed. One or more MEMS structures 414 may include cantilever, film, or some other similar or analogous type of MEMS structure that can be formed within one or more conductive and non-conductive layers 410. MEMS structures 414 formed within one or more conductive or non-conductive layers 410 are indicated by dashed rectangles. Once one or more conductive and non-conductive layers 410 are formed on the surface 416 of the substrate 412, a substrate assembly 418 is formed, which includes the substrate 412, one or more conductive and non-conductive layers 410, and one or more MEMS structures 414 within the substrate assembly 418. The substrate assembly 418 includes a first surface 421 and a second surface 423 opposite to the first surface 421. Figure 6A After the first step 402 shown, as Figure 6BIn the second step 404 shown, one or more conductive and non-conductive layers 410 are coupled to the adhesive layer or adhesive 107, such that the first surface 421 of the substrate assembly 418 is coupled to the support material 104 layer or adhesive 107 through the adhesive. Figure 6B After the second step 404 shown, in the following... Figure 6C In the third step 406 shown, etching is performed to divide the substrate assembly 418 into individual and divided semiconductor dies or packages within one or more semiconductor dies or packages 102. This etching can be wet etching. When the etching is wet etching, the adhesive layer or binder 107 is resistant to one or more chemicals used to etch the substrate assembly 418. Figure 6C After wet etching is performed in the third step 406 shown, a first channel 106a and a second channel 106b are formed, such that one or more semiconductor dies and packages 102 have been formed and remain attached to the adhesive layer or adhesive 107. In other words, after performing wet etching, one or more semiconductor dies or packages 102 are organized as follows: Figure 1 The pattern shown is as previously discussed in this disclosure. The results for the first channel 106a and the second channel 106b are as follows. Figure 6C and Figure 1 As shown. After the third step 406, one or more semiconductor dies or packages 102 are removed from the adhesive layer or adhesive 107 by using the removal tool 200 to perform the method of flowchart 300 as previously discussed in detail in this disclosure.
[0057] As will readily apparent from the discussion above and herein, this disclosure relates to one or more embodiments of tool 100 configured to remove one or more semiconductor dies or packages 102 from support material 104 in operation. The semiconductor dies or packages 102 may include micro-electromechanical systems (MEMS), comprising microscopic components susceptible to damage and defects when exposed to relatively large external stresses and strains. Tool 100 automatically removes one or more semiconductor dies or packages 102 from support material 104 to improve the efficiency of a semiconductor manufacturing plant (FAB) by increasing the number of units per hour (e.g., semiconductor dies) that can be removed from support material 104. Tool 100 automates the replacement of manual removal of one or more semiconductor dies or packages 102 from support material 104, improving the FAB's UPH (units per hour) by reducing multiple defects (e.g., adhesive residue on one or more semiconductors). Some other similar or analogous defects occur due to a single employee. In other words, the removal of one or more semiconductor dies or packages 102 increases the speed of removing semiconductor dies or packages 102 from support material 104, while simultaneously improving the reliability of removing semiconductor dies or packages 102 from support material 104. With the increase in UPH, the improved speed and reliability enhance the profitability of the FAB.
[0058] At least one embodiment of the apparatus disclosed herein can be summarized as including: a shelf structure comprising: a first shelf portion; a second shelf portion spaced apart from the first shelf portion; a gap between the first shelf portion and the second shelf portion; a first sidewall relative to the first shelf portion and the second shelf portion; a second sidewall relative to the first shelf portion and the second shelf portion, the second sidewall being opposite to the first sidewall; a support structure on the first shelf portion and the first sidewall; a first roller coupled to the support structure, the first roller being coupled to the support structure to rotate freely about the support structure, and the first roller overlapping the first shelf portion; a second roller on the second sidewall; and a drive structure on the second sidewall, the drive structure being mechanically engaged with the second roller.
[0059] In an embodiment of this utility model, the support structure includes one or more openings; and the first roller includes one or more protrusions inserted into the one or more openings.
[0060] In an embodiment of the present invention, the one or more openings and the one or more protrusions define a free rotation axis about which the first roller rotates freely.
[0061] In an embodiment of this utility model, the device further includes a guide structure coupled to the support structure.
[0062] In an embodiment of the present invention, the first roller is downstream of the guide structure along the path of the belt and semiconductor die.
[0063] In an embodiment of the present invention, the device further includes a controller configured to control the drive structure during operation.
[0064] In an embodiment of the present invention, the gap has a first dimension extending from the first shelf portion to the second shelf portion, and the first dimension is smaller than a second dimension of the semiconductor die or package extending between the opposing sidewalls of the semiconductor die or package.
[0065] In an embodiment of this utility model, the second shelf portion is offset from the second shelf portion.
[0066] In an embodiment of this utility model, wherein: the first shelf portion includes a first surface, and in operation, the strip moves along the first surface; and the second shelf portion includes a second surface offset relative to the first surface, and in operation, one or more semiconductor dies removed from the strip are positioned along the second surface.
[0067] In an embodiment of this invention, during operation, the belt moves through the gap and winds along the outer surface of the second roller.
[0068] At least one embodiment of the method disclosed herein can be summarized as including: moving a carrier coupled to one or more semiconductor dies using a first roller, the movement of the carrier including: moving the carrier along a carrier path through a gap located between a first shelf portion and a second shelf portion of a shelf structure; applying a first force to the one or more semiconductor dies having a second roller; removing the one or more semiconductor dies from the carrier; and positioning the one or more semiconductor dies removed from the carrier on the second shelf portion of the shelf structure.
[0069] In an embodiment of this invention, the carrier is a tape containing adhesive, and the carrier path is a tape path.
[0070] In an embodiment of the present invention, the method further includes positioning the carrier between the guide structure of the shelf structure and the first shelf portion, and between the second roller and the first shelf portion.
[0071] In embodiments of the present invention, the carrier coupled to the one or more semiconductor dies by means of the movement of the first roller further includes driving the first roller by means of a drive structure that mechanically cooperates with the first roller.
[0072] In an embodiment of the present invention, applying the first force to the one or more semiconductor dies by the second roller further includes freely rotating the second roller about a free rotation axis.
[0073] In embodiments of the present invention, removing the one or more semiconductor dies from the carrier further includes applying a second force to the one or more semiconductor dies with the second shelf portion of the shelf structure.
[0074] In an embodiment of the present invention, the second shelf portion of the shelf structure is offset from the first shelf portion of the shelf structure.
[0075] At least one embodiment of the apparatus disclosed herein can be summarized as including: a shelf structure comprising: a first shelf portion; a second shelf portion spaced apart from the first shelf portion; a gap between the first shelf portion and the second shelf portion; a first sidewall relative to the first shelf portion and the second shelf portion; a second sidewall relative to the first shelf portion and the second shelf portion, the second sidewall being opposite to the first sidewall; a support structure on the first shelf portion and the first sidewall; a first roller coupled to the support structure, the first roller being coupled to the support structure to rotate freely about the support structure, and the first roller overlapping the first shelf portion; a second roller on the second sidewall and the second roller overlapping the first shelf portion, the second shelf portion and the gap; and a drive structure on the second sidewall mechanically cooperating with the second roller.
[0076] At least one embodiment of the method of the present invention can be summarized as including: forming a substrate assembly by forming one or more MEMS structures on a substrate; coupling a first surface of the substrate assembly, wherein the one or more MEMS structures are adjacent to an adhesive on a carrier; etching a second surface of the substrate assembly opposite to the first surface to form one or more channels extending through the substrate assembly to the adhesive and defining one or more diced semiconductor components; and removing one or more diced semiconductor components from the adhesive on the carrier by moving the carrier coupled with the one or more semiconductor components using a first roller of a removal tool, the moving of the carrier including: moving the carrier along the carrier through a channel gap of a gap removal tool located between a first shelf portion and a second shelf portion of a shelf structure of a removal tool; applying a first force to the one or more semiconductor components using a second roller of the removal tool; removing the one or more semiconductor components from the carrier by overcoming the adhesive force of the adhesive; and positioning the one or more semiconductor components removed from the carrier on the second shelf portion of the shelf structure of the removal tool.
[0077] In an embodiment of the present invention, the method wherein the etching of the second surface of the substrate assembly is wet etching.
[0078] In an embodiment of this invention, applying the first force to the one or more semiconductor components using the second roller further includes freely rotating the second roller about its free rotation axis.
[0079] The foregoing has outlined features of several embodiments to enable those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art will understand that they can readily use this disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or advantages as the embodiments described herein. Those skilled in the art will also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and modifications can be made without departing from the spirit and scope of this disclosure.
Claims
1. A removal device, characterized in that Comprising: a shelving structure comprising: a first shelving portion; a second shelving portion spaced apart from the first shelving portion; a gap between the first shelving portion and the second shelving portion; a first sidewall relative to the first shelving portion and the second shelving portion; and a second sidewall relative to the first shelving portion and the second shelving portion, the second sidewall being relative to the first sidewall; a support structure on the first shelving portion and the first sidewall; a first roller coupled to the support structure, the first roller being coupled to the support structure to freely rotate about the support structure, the first roller overlapping the first shelving portion; a second roller on the second sidewall; and a drive structure on the second sidewall, the drive structure being in mechanical cooperation with the second roller.
2. The apparatus of claim 1, wherein, Wherein: the support structure comprises one or more openings; and the first roller comprises one or more protrusions inserted into the one or more openings.
3. The apparatus of claim 2, wherein, Wherein the one or more openings and the one or more protrusions define a free rotation axis about which the first roller freely rotates.
4. The apparatus of claim 1, wherein, Further comprising a guide structure coupled to the support structure.
5. The apparatus of claim 4, wherein, Wherein the first roller is downstream of the guide structure along a tape and semiconductor die path.
6. The apparatus of claim 1, wherein, Further comprising a controller configured to control, in operation, the drive structure.
7. The apparatus of claim 1, wherein, Wherein the gap has a first dimension extending from the first shelving portion to the second shelving portion, and the first dimension is less than a second dimension of a semiconductor die or package extending between opposing sidewalls of the semiconductor die or package.
8. The apparatus of claim 1, wherein, Wherein the second shelving portion is offset from the second shelving portion.
9. The apparatus of claim 1, wherein, Wherein: the first shelving portion comprises a first surface, and in operation, a tape moves along the first surface; and the second shelving portion comprises a second surface offset relative to the first surface, and in operation, one or more semiconductor dies removed from the tape are positioned along the second surface.
10. The apparatus of claim 9, wherein, Wherein, in operation, the tape moves through the gap and wraps along an exterior surface of the second roller.