Die bonding auxiliary device for semiconductor packaging

Abstract

The utility model provides a chip bonding auxiliary device for semiconductor packaging, and relates to the technical field of semiconductor packaging chip bonding, and a dispensing mechanism comprises a first chain plate conveying belt, a second chain plate conveying belt, a first limiting frame, a second limiting frame, a mounting rack, a rotating assembly, a disc, a telescopic cylinder and a vacuum adsorption assembly. According to the device, accurate adsorption and transfer of the chips can be automatically completed without manually placing the chips at the bottom of the chip suction head in sequence, and the chips can be immediately bonded with the accurately limited substrate fixing area, so that the bonding effect between the chips and the substrate in the semiconductor packaging process is better.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging and bonding technology, and more specifically, to a bonding auxiliary device for semiconductor packaging. Background Technology

[0002] In the manufacturing process of semiconductor lasers, semiconductor chips need to be bonded to a designated area on a substrate, and then the semiconductor chips are bonded to pins so that the semiconductor chips can work properly. The quality of the bonding between the semiconductor chips and the substrate directly affects whether the semiconductor chips can perform their functions properly.

[0003] The announcement number CN217306939U proposes a chip mounting device for semiconductor laser processing. Although the device can achieve bonding between the chip and the substrate, the chip needs to be manually loaded, and the substrate is prone to displacement during the transfer process. Therefore, the performance of the chip mounting device for semiconductor packaging needs to be improved. Utility Model Content

[0004] The purpose of this invention is to solve the problems mentioned in the background art and to provide a die-attaching auxiliary device for semiconductor packaging.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A die-attachment aid for semiconductor packaging includes a dispensing mechanism, a first chain conveyor belt, a second chain conveyor belt, a first limiting frame, a second limiting frame, a mounting bracket, a rotating assembly, a disk, a telescopic cylinder, and a vacuum adsorption assembly.

[0007] The first and second chain plate conveyor belts are arranged side by side and at the same height, and the glue dispensing mechanism is mounted on the second chain plate conveyor belt.

[0008] The first limiting frame and the second limiting frame are respectively fixed on the conveyor chain plates of the first chain plate conveyor belt and the second chain plate conveyor belt;

[0009] The mounting frame is fixed on the first chain plate conveyor belt and the second chain plate conveyor belt;

[0010] The rotating component is mounted on the mounting bracket, and a disc is connected to one end of the rotating connection;

[0011] Four independently controlled telescopic cylinders are arranged circumferentially on a disc;

[0012] Four independently controlled vacuum adsorption components are connected to the telescopic cylinder one by one, and two of the vacuum adsorption components are located directly above one of the first limiting frames and one of the second limiting frames, respectively.

[0013] Furthermore, the rotating assembly includes a connecting roller and a gear transmission assembly. The mounting frame is rotatably connected to the connecting roller and a gear transmission assembly connected to the connecting roller is fixedly mounted on it. One end of the connecting roller is connected to the disc.

[0014] Furthermore, the vacuum adsorption assembly includes a vacuum pump, a vacuum tube, and a suction nozzle. The vacuum pump is circumferentially fixed at the bottom of the disc, with one end open and the sealed end of the vacuum tube connected to a telescopic cylinder. The vacuum tube is connected to the vacuum pump via a flexible hose, and a suction nozzle is provided at the open end of the vacuum tube.

[0015] Furthermore, rubber pads are respectively provided inside the first limiting frame and the second limiting frame.

[0016] Furthermore, an empty conveyor chain plate is spaced between each of the two adjacent first limiting frames and the two adjacent second limiting frames.

[0017] Furthermore, the diameter of the suction nozzle is smaller than the length and width of the first limiting frame and the second limiting frame.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] Compared to existing technologies, this device eliminates the need for manual placement of chips onto the bottom of the pick-up head. It automatically and accurately picks up and transfers the chips, which are then bonded to the precisely positioned substrate area. This results in better bonding between the chip and the substrate during the semiconductor packaging process. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 A schematic diagram of the installation of the second limiting frame;

[0022] Figure 3 A schematic diagram of the vacuum adsorption assembly installation;

[0023] Figure 4 A schematic diagram of the installation of the first limiting frame;

[0024] Figure label:

[0025] 1. First chain conveyor belt; 2. Second chain conveyor belt; 3. First limit frame; 4. Second limit frame; 5. Mounting frame; 6. Disc; 7. Telescopic cylinder; 8. Connecting roller; 9. Gear transmission assembly; 10. Vacuum pump; 11. Vacuum tube; 12. Suction nozzle. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model. The present utility model will be further described with reference to the accompanying drawings and embodiments:

[0027] like Figures 1 to 4 As shown, a die-attachment auxiliary device for semiconductor packaging includes a dispensing mechanism (using existing technology without modification and not shown in the figure, specifically comprising a mounting frame, a five-axis device, and a silver glue dispensing gun), and also includes a first chain conveyor belt 1, a second chain conveyor belt 2, a first limiting frame 3, a second limiting frame 4, a mounting frame 5, a rotating assembly, a disc 6, a telescopic cylinder 7, and a vacuum adsorption assembly.

[0028] The first chain plate conveyor belt 1 and the second chain plate conveyor belt 2 are arranged side by side and at the same height, and the glue dispensing mechanism is mounted on the second chain plate conveyor belt 2.

[0029] The first limiting frame 3 and the second limiting frame 4 are respectively fixed on the conveyor chain plates of the first chain plate conveyor belt 1 and the second chain plate conveyor belt 2;

[0030] Mounting frame 5 is fixedly mounted on the first chain plate conveyor belt 1 and the second chain plate conveyor belt 2;

[0031] The rotating assembly is mounted on the mounting bracket 5, and one end of the rotating connection is connected to a disc 6;

[0032] Four independently controlled telescopic cylinders 7 are arranged circumferentially on the disc 6;

[0033] Four independently controlled vacuum adsorption components are connected to the telescopic cylinder 7 one by one, and two of the vacuum adsorption components are located directly above one of the first limiting frames 3 and one of the second limiting frames 4.

[0034] Further refinements of the embodiments of this utility model, such as... Figure 1 As shown, the rotating assembly includes a connecting roller 8 and a gear transmission assembly 9. The mounting frame 5 is rotatably connected to the connecting roller 8 and the gear transmission assembly 9, which is fixedly connected to the connecting roller 8. One end of the connecting roller 8 is connected to the disc 6.

[0035] Further refinements of the embodiments of this utility model, such as... Figure 1 and Figure 3As shown, the vacuum adsorption assembly includes a vacuum pump 10, a vacuum tube 11, and a suction nozzle 12. The vacuum pump 10 is circumferentially fixed at the bottom of the disc 6. One end of the vacuum tube 11 is open and connected to the sealed end of the vacuum tube 11, which is connected to a telescopic cylinder 7. The vacuum tube 11 is connected to the vacuum pump 10 through a flexible tube, and the open end of the vacuum tube 11 is provided with a suction nozzle 12.

[0036] To ensure that the nozzle 12 can smoothly enter the first limiting frame 3 and the second limiting frame 4 for the bonding process of the chip and the substrate, the design is optimized so that the diameter of the nozzle 12 is smaller than the length and width of the first limiting frame 3 and the second limiting frame 4.

[0037] Secondly, in order to further avoid surface wear when the chip and substrate are placed into the first limiting frame 3 and the second limiting frame 4 respectively, the solution is optimized by providing rubber pads in the first limiting frame 3 and the second limiting frame 4 respectively. The rubber pads are not shown in the figure.

[0038] To ensure that the telescopic cylinder 7 and the vacuum adsorption assembly have sufficient operating time to complete the chip picking, transfer, and bonding process, the solution is optimized by placing an empty conveyor chain plate between each of the two adjacent first limiting frames 3 and the two adjacent second limiting frames 4.

[0039] It should be noted that the dispensing mechanism, the first chain conveyor belt 1, the second chain conveyor belt 2, the gear transmission assembly 9, the telescopic cylinder 7, and the vacuum pump 10 are all electrically connected to the controller. In particular, several telescopic cylinders 7 and several vacuum pumps 10 are independently electrically connected to the controller. The controller is not shown in the figure, but can be specifically arranged on the baffle on one side of the second chain conveyor belt 2.

[0040] Meanwhile, in order to achieve automatic feeding of chips and substrates into the upper limit frames of the two chain conveyor belts, the scheme is optimized by setting a six-degree-of-freedom robotic arm on one side of the initial end of the first chain conveyor belt 1 and the second chain conveyor belt 2. The two six-degree-of-freedom robotic arms are respectively connected to a die bonding nozzle 12 and a substrate nozzle 12. The die bonding nozzle 12 and the substrate nozzle 12 are respectively connected to a feeding vacuum pump. The six-degree-of-freedom robotic arms are not shown in the figure.

[0041] The working process of this utility model:

[0042] First, two six-degree-of-freedom robotic arms, together with an adsorption component, automatically feed the chip and substrate onto the first limiting frame 3 and the second limiting frame 4 respectively. During the feeding process, the presence of rubber pads prevents the limiting frames from causing wear on the surface of the chip and substrate. After placement, the two can be transported and transferred by the chain conveyor belt.

[0043] The intermittent running cycle of the two chain conveyor belts is preset. Then the substrate can pass through the dispensing mechanism in sequence to perform the dispensing process for the surface fixing area in preparation for subsequent bonding with the chip. When the first chip is fed, it moves intermittently with the first limiting frame 3 to a set of vacuum adsorption components directly above it. Then the set of vacuum adsorption components can approach the chip under the action of the telescopic cylinder 7 and adsorb the chip. Then the chip is driven to leave the first limiting frame 3 and rise to the preset height. Then the controller controls the gear transmission component 9 to work so that the set of vacuum adsorption components can rotate. When the set of vacuum adsorption components and the chip rotate to the second limiting frame 4 where the first substrate is located, the corresponding telescopic cylinder 7 can drive the chip to move down again and bond it with the substrate that has been dispensed. Then the bonding process of a set of chips and substrates can be completed.

[0044] After a set of vacuum adsorption components moves and changes position, a new set of empty vacuum adsorption components can move to the position directly above the next chip. The above process is repeated to adsorb and transfer the next chip. In summary, the chip and substrate can be accurately bonded in a continuous flow. It should be noted that when the first substrate moves to the position directly below a set of vacuum adsorption components, it stops moving. When the first chip is bonded to the substrate, the two chain conveyor belts start and stop synchronously to start the subsequent continuous bonding.

[0045] Compared to existing technologies, this device eliminates the need for manual placement of chips onto the bottom of the pick-up head. It automatically and accurately picks up and transfers the chips, which are then bonded to the precisely positioned substrate area. This results in better bonding between the chip and the substrate during semiconductor packaging.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An adhesive dispensing aid for semiconductor packaging, comprising a dispensing mechanism, characterized in that, The first chain plate conveying belt (1), the second chain plate conveying belt (2), the first limiting frame (3), the second limiting frame (4), the mounting frame (5), the rotating assembly, the disc (6), the telescopic cylinder (7) and the vacuum suction assembly are further included, The first chain plate conveying belt (1) and the second chain plate conveying belt (2) are arranged side by side and have the same height, and the dispensing mechanism is arranged on the second chain plate conveying belt (2); The first limiting frame (3) and the second limiting frame (4) are respectively fixed on the conveying chain plates of the first chain plate conveying belt (1) and the second chain plate conveying belt (2); The mounting frame (5) is fixed on the first chain plate conveying belt (1) and the second chain plate conveying belt (2); The rotating assembly is arranged on the mounting frame (5) and is connected with the disc (6) at one end in a rotating mode; The four independently controlled telescopic cylinders (7) are circumferentially arranged on the disc (6); The four groups of independently controlled vacuum suction assemblies correspond to and are connected with the telescopic cylinders (7), and two groups of oppositely distributed vacuum suction assemblies are respectively located above one of the first limiting frames (3) and one of the second limiting frames (4).

2. The die-bonding aid for a semiconductor package according to claim 1, wherein The rotating assembly includes a connecting roller (8) and a gear transmission assembly (9), the mounting frame (5) is rotatably connected with the connecting roller (8) and is fixedly connected with the gear transmission assembly (9) connected with the connecting roller (8), and one end of the connecting roller (8) is connected with the disc (6).

3. The die-bonding aid for a semiconductor package according to claim 1, wherein The vacuum suction assembly includes a vacuum pump (10), a vacuum pipe (11) and a suction nozzle (12), the vacuum pump (10) is circumferentially fixed at the bottom of the disc (6), the open end of the vacuum pipe (11) is connected with the telescopic cylinder (7), the vacuum pipe (11) is connected with the vacuum pump (10) in a communication mode through a hose, and the open end of the vacuum pipe (11) is provided with the suction nozzle (12).

4. The die-bonding aid for a semiconductor package according to claim 1, wherein The first limiting frame (3) and the second limiting frame (4) are respectively provided with rubber pads.

5. The die-bonding aid for a semiconductor package according to claim 1, wherein Adjacent two first limiting frames (3) and adjacent two second limiting frames (4) are both spaced apart by an empty conveying chain plate.

6. The die-bonding aid for a semiconductor package according to claim 3, wherein The diameter of the suction nozzle (12) is smaller than the length and width of the first limiting frame (3) and the second limiting frame (4).

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