Wafer cleaning device

Abstract

The utility model provides a wafer cleaning device, which comprises a cleaning cavity provided with a first cavity wall and a second cavity wall which are oppositely arranged; the bearing seat is arranged in the cleaning cavity and is used for bearing a wafer to be cleaned; the liquid inlet assembly communicates with the first cavity wall and is used for guiding cleaning liquid into the cleaning cavity; the liquid outlet assembly communicates with the second cavity wall and is used for guiding out the cleaning liquid in the cleaning cavity; the liquid inlet assembly and the liquid outlet assembly can adjust the flow speed of cleaning liquid. According to the wafer cleaning device, the liquid inlet assembly and the liquid outlet assembly are connected to the cleaning cavity, the flow speed of the cleaning liquid can be adjusted through the liquid inlet assembly and the liquid outlet assembly, the uniformity of wafer surface cleaning is guaranteed by adjusting the flow speed of the cleaning liquid, and therefore the wafer cleaning efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a wafer cleaning device. Background Technology

[0002] In semiconductor manufacturing, wafer cleaning is a crucial step, designed to remove contaminants from the wafer surface and its pores to ensure the smooth operation of subsequent processes. Current mainstream wet cleaning technologies mainly include chemical cleaning, ultrasonic cleaning, and deionized water rinsing. These traditional methods play a vital role in treating various contaminants, removing various impurity particles adsorbed on the wafer surface, such as microparticles, organic matter, and inorganic metal ions, thus achieving the required surface cleanliness for the wafer.

[0003] In current wafer cleaning equipment, when the wafer is vertically placed into a cleaning tank filled with cleaning solution, the bottom part of the wafer always enters the cleaning solution first. Due to the time difference, the cleaning is uneven from the bottom to the top of the wafer, which reduces the cleaning effect and results in poor overall wafer consistency, thus affecting the performance of semiconductor devices. Utility Model Content

[0004] The purpose of this invention is to provide a wafer cleaning device that ensures the uniformity of wafer surface cleaning and improves the cleaning effect of wafers.

[0005] To achieve the above objectives, in a first aspect, this utility model provides a wafer cleaning apparatus, comprising:

[0006] The cleaning chamber has a first chamber wall and a second chamber wall that are disposed opposite to each other.

[0007] A support base, located inside the cleaning chamber, is used to support the wafer to be cleaned;

[0008] The liquid inlet assembly is connected to the first cavity wall and is used to introduce the cleaning fluid into the cleaning cavity;

[0009] The liquid outlet assembly is connected to the second cavity wall and is used to export the cleaning liquid in the cleaning cavity.

[0010] Both the inlet component and the outlet component can adjust the flow rate of the cleaning fluid.

[0011] The advantages of the wafer cleaning device provided by this utility model are as follows: by connecting the liquid inlet component and the liquid outlet component to the cleaning chamber, and since both the liquid inlet component and the liquid outlet component can adjust the flow rate of the cleaning liquid, the uniformity of the cleaning of the wafer surface can be ensured by adjusting the flow rate of the cleaning liquid, thereby improving the cleaning efficiency of the wafer.

[0012] In some embodiments, the support is used to support the wafer and position the wafer vertically within the cleaning chamber;

[0013] The first cavity wall has a plurality of spaced liquid inlet holes, and at least two of the liquid inlet holes have a height difference;

[0014] The liquid inlet assembly includes a plurality of liquid inlet pipes, each of which is connected to a corresponding liquid inlet hole.

[0015] In some embodiments, the liquid inlet assembly further includes a liquid inlet flow controller;

[0016] Each of the inlet pipes is equipped with an inlet flow controller, which is used to control the flow rate of the cleaning fluid in the inlet pipe;

[0017] During wafer cleaning operation, the flow rate of cleaning fluid in the inlet pipe closer to the bottom of the cleaning chamber is less than the flow rate of cleaning fluid in the inlet pipe farther from the bottom of the cleaning chamber.

[0018] In some embodiments, at least two inlet holes are provided along a first direction and / or a second direction, wherein the first direction is the height direction of the cleaning chamber, and the second direction is on the plane where the first chamber wall is located and is perpendicular to the first direction.

[0019] In some embodiments, a plurality of spaced-apart liquid outlet holes are formed on the second cavity wall, and at least two of the liquid outlet holes have a height difference;

[0020] The liquid outlet assembly includes a plurality of liquid outlet pipes, each of which is connected to a corresponding liquid outlet hole.

[0021] In some embodiments, the liquid outlet assembly further includes a liquid outlet flow controller;

[0022] Each of the outlet pipes is equipped with an outlet flow controller, which is used to control the flow rate of the cleaning fluid in the outlet pipe;

[0023] During wafer cleaning operation, the flow rate of cleaning fluid in the outlet pipe closer to the bottom of the cleaning chamber is less than the flow rate of cleaning fluid in the outlet pipe farther from the bottom of the cleaning chamber.

[0024] In some embodiments, at least two outlet holes are provided along a first direction and / or along a second direction.

[0025] In some embodiments, the support base includes a first support member and a second support member;

[0026] The first carrier and the second carrier are arranged opposite to each other, and the top of the first carrier and the top of the second carrier are inclined close to each other. The top of the first carrier and the second carrier are both provided with carrier grooves for carrying wafers.

[0027] In some embodiments, both the first carrier and the second carrier have flow holes along their extension direction.

[0028] In some embodiments, the wafer cleaning apparatus further includes a controller and sensors;

[0029] The controller is electrically connected to the liquid inlet assembly, the liquid outlet assembly, and the sensor. The sensor is located in the cleaning chamber to detect the flow rate of the cleaning liquid and feeds the flow rate back to the controller. The controller controls the liquid inlet assembly to adjust the inlet flow rate and controls the liquid outlet assembly to adjust the outlet flow rate based on the received flow rate. Attached Figure Description

[0030] Figure 1 This is a front view of the wafer cleaning apparatus provided in an embodiment of the present invention;

[0031] Figure 2 A top view of the wafer cleaning apparatus provided in the embodiment of this utility model;

[0032] Figure 3 The front view and top view of the support base provided in the embodiment of this utility model;

[0033] Figure 4 This is a front view of a wafer cleaning apparatus according to another embodiment of the present invention.

[0034] Figure label:

[0035] Cleaning chamber 1, bearing seat 2, bearing groove 21, first bearing component 22, second bearing component 23, flow hole 24.

[0036] Liquid inlet assembly 3, first liquid inlet pipe 31, second liquid inlet pipe 32, third liquid inlet pipe 33, first liquid inlet flow controller 34, second liquid inlet flow controller 35, third liquid inlet flow controller 36, liquid outlet assembly 4, first liquid outlet pipe 41, second liquid outlet pipe 42, third liquid outlet pipe 43, first liquid outlet flow controller 44, second liquid outlet flow controller 45, third liquid outlet flow controller 46, wafer 5, sensor 6. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0038] Furthermore, it should be understood that the orientations or positional relationships indicated by terms such as "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" in this document are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. The terms "first" and "second" in this document are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise stated, "a plurality of" means two or more.

[0039] In existing technologies, during the process of vertically placing a wafer into a cleaning tank filled with cleaning solution, the lower part of the wafer always enters the cleaning solution first. Due to the time difference, the cleaning is uneven from the bottom to the top of the wafer, which reduces the cleaning effect and results in poor consistency of overall wafer cleaning.

[0040] To address the problems existing in the prior art, embodiments of this utility model provide a wafer cleaning device, see reference. Figures 1 to 3As shown, the wafer cleaning apparatus includes a cleaning chamber 1, a support 2, a liquid inlet assembly 3, and a liquid outlet assembly 4. The cleaning chamber 1 has a cuboid structure and has a first chamber wall and a second chamber wall disposed opposite to each other. The support 2 is disposed within the cleaning chamber 1 and is used to support the wafer 5 to be cleaned. One end of the liquid inlet assembly 3 is connected to the first chamber wall, and the other end is connected to an external liquid supply source, for introducing cleaning liquid into the cleaning chamber 1. The liquid outlet assembly 4 is connected to the second chamber wall for exporting the cleaning liquid from the cleaning chamber 1, thereby cleaning the wafer 5 through the flow of cleaning liquid within the cleaning chamber 1. Both the liquid inlet assembly 3 and the liquid outlet assembly 4 can adjust the flow rate of the cleaning liquid.

[0041] In this embodiment, since both the liquid inlet component 3 and the liquid outlet component 4 can adjust the flow rate of the cleaning liquid, the flow rate near the bottom of the wafer 5 can be adjusted to be slower, and the flow rate near the top of the wafer 5 can be adjusted to be faster. In this way, although the bottom of the wafer 5 enters the cleaning chamber 1 first, the cleaning efficiency of the top of the wafer 5 in the cleaning chamber 1 is higher than that of the bottom of the wafer 5, thereby solving the problem of uneven cleaning of the surface of the wafer 5 in the prior art.

[0042] In some embodiments, the support 2 is used to support the wafer 5 and position the wafer 5 vertically within the cleaning chamber 1. The first chamber wall has a plurality of spaced-apart liquid inlet holes, and at least two of the liquid inlet holes have a height difference. The liquid inlet assembly includes a plurality of liquid inlet pipes, each of which communicates with a corresponding liquid inlet hole.

[0043] It is understood that by setting at least two liquid inlet holes on the first cavity wall to have a height difference, and each liquid inlet hole is connected to a liquid inlet pipe, and the flow rate of each liquid inlet pipe is controlled separately, the flow rate of the cleaning liquid in different height areas in the cleaning chamber 1 can be adjusted to ensure the uniformity of cleaning the surface of the wafer 5 and improve the cleaning efficiency of the wafer.

[0044] In some specific embodiments, at least two liquid inlet holes are spaced apart on the first cavity wall along a first direction, so that adjacent liquid inlet holes have a height difference. The liquid inlet assembly 3 includes at least two liquid inlet pipes, each liquid inlet pipe communicating with a corresponding liquid inlet hole.

[0045] In this embodiment, the support base 2 has a support groove 21, which is used to support the wafer 5 so that the wafer 5 can be vertically positioned in the cleaning chamber 1. The first direction is the direction from top to bottom on the first chamber wall, i.e., the height direction. Furthermore, to distinguish the liquid inlet holes at different locations, the liquid inlet holes are defined using the terms "first" and "second". For example, in this embodiment, three liquid inlet holes are spaced apart along the first direction, so the three liquid inlet holes are sequentially defined as the first liquid inlet hole, the second liquid inlet hole, and the third liquid inlet hole. The first liquid inlet hole corresponds to the top of the wafer 5, the second liquid inlet hole corresponds to the middle of the wafer 5, and the third liquid inlet hole corresponds to the bottom of the wafer 5. Similarly, the liquid inlet channels are sequentially defined as a first liquid inlet pipe 31, a second liquid inlet pipe 32, and a third liquid inlet pipe 33. The first liquid inlet pipe 31 is connected to the first liquid inlet hole, the second liquid inlet pipe 32 is connected to the second liquid inlet hole, and the third liquid inlet pipe 33 is connected to the third liquid inlet hole. The first liquid inlet pipe 31, the second liquid inlet pipe 32, and the third liquid inlet pipe 33 are all used to introduce cleaning fluid into the cleaning chamber 1.

[0046] Furthermore, the liquid inlet assembly 3 also includes a liquid inlet flow controller, and each liquid inlet pipe is equipped with the liquid inlet flow controller, which is used to control the flow rate of the cleaning fluid in the liquid inlet pipe.

[0047] In this embodiment, the inlet flow controllers are respectively defined as a first inlet flow controller 34, a second inlet flow controller 35, and a third inlet flow controller 36 corresponding to the first inlet pipe 31, the second inlet pipe 32, and the third inlet pipe 33. The first inlet flow controller 34 is located in the first inlet pipe 31 and is used to control the flow rate of the cleaning fluid in the first inlet pipe 31. The second inlet flow controller 35 is located in the second inlet pipe 32 and is used to control the flow rate of the cleaning fluid in the second inlet pipe 32. The third inlet flow controller 36 is located in the third inlet pipe 33 and is used to control the flow rate of the cleaning fluid in the third inlet pipe 33.

[0048] During the wafer 5 cleaning process, the first liquid inlet flow controller 34, the second liquid inlet flow controller 35, and the third liquid inlet flow controller 36 are adjusted to ensure that the cleaning fluid flow rate in the first liquid inlet pipe 31 is greater than the cleaning fluid flow rate in the second liquid inlet pipe 32, and the cleaning fluid flow rate in the second liquid inlet pipe 32 is greater than the cleaning fluid flow rate in the third liquid inlet pipe 33, thereby ensuring the uniformity of cleaning the wafer 5 surface.

[0049] In this embodiment, the flow rate adjustment of the first inlet flow controller 34, the second inlet flow controller 35, and the third inlet flow controller 36 can be controlled by electrical signals.

[0050] refer to Figure 1 and Figure 2 As shown, in some embodiments, at least two of the liquid inlet holes are spaced apart along a second direction on the first cavity wall, the second direction being located on the plane of the first cavity wall and perpendicular to the first direction.

[0051] In this embodiment, the number of the first liquid inlet hole, the second liquid inlet hole, and the third liquid inlet hole along the second direction is all set to three. Similarly, the number of the first liquid inlet pipe 31, the second liquid inlet pipe 32, and the third liquid inlet pipe 33 are all set to three, communicating with the corresponding first liquid inlet hole, second liquid inlet hole, and third liquid inlet hole.

[0052] It is understandable that, in actual production, the number of the first liquid inlet, the second liquid inlet, and the third liquid inlet is set according to actual needs. Furthermore, several of the carrier seats 2 are arranged at intervals along the first direction to support multiple wafers 5, ensuring that the cleaning fluid enters from the first cavity wall of the cleaning chamber 1 to clean multiple wafers 5 simultaneously, thereby improving the efficiency of wafer 5 cleaning.

[0053] In some embodiments, the second cavity wall is provided with a plurality of spaced-apart liquid outlet holes, and at least two of the liquid outlet holes have a height difference. The liquid outlet assembly includes a plurality of liquid outlet pipes, and each liquid outlet pipe is connected to a corresponding liquid outlet hole.

[0054] In this embodiment, at least two outlet holes on the second cavity wall are configured with a height difference, and each outlet hole is individually connected to an outlet pipe, with each outlet pipe having its flow rate individually controlled. Furthermore, by cooperating with the inlet holes on the first cavity wall, the reliability of adjusting the flow rate of the cleaning fluid in different height regions within the cleaning chamber 1 is improved.

[0055] In some specific embodiments, at least two of the liquid outlet holes are spaced apart on the second cavity wall along the first direction, and the liquid outlet assembly includes at least two liquid outlet pipes, each of the liquid outlet pipes communicating with a corresponding liquid outlet hole.

[0056] In this embodiment, to distinguish the liquid outlets at different locations, the liquid outlets are defined using the terms "first" and "second". For example, in this embodiment, three liquid outlets are spaced apart along the first direction, so the three liquid outlets are sequentially defined from top to bottom as a first liquid outlet, a second liquid outlet, and a third liquid outlet. The first liquid outlet corresponds to the top of the wafer 5, the second liquid outlet corresponds to the middle of the wafer 5, and the third liquid outlet corresponds to the bottom of the wafer 5. Similarly, the liquid outlet pipes are sequentially defined as a first liquid outlet pipe 41, a second liquid outlet pipe 42, and a third liquid outlet pipe 43. The first liquid outlet pipe 41 communicates with the first liquid outlet, the second liquid outlet pipe 42 communicates with the second liquid outlet, and the third liquid outlet pipe 43 communicates with the third liquid outlet. The first liquid outlet pipe 41, the second liquid outlet pipe 42, and the third liquid outlet pipe 43 are used to export the cleaning fluid in the cleaning chamber 1 so that the cleaning fluid can circulate within the cleaning chamber 1.

[0057] Furthermore, the liquid outlet assembly 4 also includes a liquid outlet flow controller, and each of the liquid outlet pipes is equipped with a liquid outlet flow controller, which is used to control the flow rate of the cleaning fluid in the liquid outlet pipe.

[0058] In this embodiment, specifically, the liquid flow controllers corresponding to the first liquid outlet pipe 41, the second liquid outlet pipe 42, and the third liquid outlet pipe 43 are respectively defined as a first liquid flow controller 44, a second liquid flow controller 45, and a third liquid flow controller 46. The first liquid flow controller 44 is located in the first liquid outlet pipe 41 and is used to control the flow rate of the cleaning fluid in the first liquid outlet pipe 41. The second liquid flow controller 45 is located in the second liquid outlet pipe 42 and is used to control the flow rate of the cleaning fluid in the second liquid outlet pipe 42. The third liquid flow controller 46 is located in the third liquid outlet pipe 43 and is used to control the flow rate of the cleaning fluid in the third liquid outlet pipe 43.

[0059] During the wafer 5 cleaning process, by controlling the first liquid outlet flow controller 44, the second liquid outlet flow controller 45, and the third liquid outlet flow controller 46, the flow rate of the cleaning fluid in the first liquid outlet pipe 41 is greater than the flow rate of the cleaning fluid in the second liquid outlet pipe 42, and the flow rate of the cleaning fluid in the second liquid outlet pipe 42 is greater than the flow rate of the cleaning fluid in the third liquid outlet pipe 43. This ensures that the flow rate of the cleaning fluid at the top of the wafer 5 in the cleaning chamber 1 is greater than the flow rate of the cleaning fluid at the middle of the wafer 5, and the flow rate of the cleaning fluid at the middle of the wafer 5 is greater than the flow rate of the cleaning fluid at the bottom of the wafer 5.

[0060] In this embodiment, the first liquid flow controller 44, the second liquid flow controller 45, and the third liquid flow controller 46 can use electrical signals to control the flow rate adjustment.

[0061] In some embodiments, at least two of the liquid outlet holes are spaced apart along the second direction on the second cavity wall.

[0062] In this embodiment, the number of the first liquid outlet, the second liquid outlet, and the third liquid outlet along the second direction is set to two. Similarly, the number of the first liquid outlet pipe 41, the second liquid outlet pipe 42, and the third liquid outlet pipe 43 are also set to two, communicating with the corresponding first liquid outlet, second liquid outlet, and third liquid outlet.

[0063] In some embodiments, the number of the first liquid outlet pipe 41, the second liquid outlet pipe 42, and the third liquid outlet pipe 43 is the same as the number of the first liquid inlet pipe 31, the second liquid inlet pipe 32, and the third liquid inlet pipe 33, so as to ensure the reliability of adjusting the flow rate of the cleaning fluid at different positions in the cleaning chamber 1.

[0064] refer to Figure 1 and Figure 3 As shown, in some embodiments, the support base 2 includes a first support member 22 and a second support member 23. The first support member 22 and the second support member 23 are disposed opposite to each other, with the tops of the first support member 22 and the second support member 23 inclined towards each other. The tops of both the first support member 22 and the second support member 23 are provided with the support groove 21.

[0065] In this embodiment, the first support member 22 and the second support member 23 are two independent support rods. By setting the first support member 22 and the second support member 23 opposite to each other, and opening the support groove 21 on the top of the first support member 22 and the second support member 23, the wafer 5 is fixed while avoiding excessive contact between the wafer 5 and the first support member 22 and the second support member 23, which would affect the cleaning effect on the surface of the wafer 5, thereby improving the reliability of cleaning the wafer 5.

[0066] In some embodiments, the first support member 22 and the second support member 23 are both provided with flow holes 24 along their extension direction.

[0067] In this embodiment, by opening flow holes 24 in the first support member 22 and the second support member 23, the degree of interference when the cleaning fluid flows in the cleaning chamber 1 is reduced, thereby improving the cleaning effect of the cleaning fluid on the bottom of the wafer 5.

[0068] refer to Figure 4 As shown, in some embodiments, the wafer 5 cleaning apparatus further includes a controller and a sensor 6. The controller is electrically connected to the liquid inlet assembly 3, the liquid outlet assembly 4, and the sensor 6. The sensor 6 is disposed in the cleaning chamber 1 to detect the flow rate of the cleaning liquid and feeds the flow rate back to the controller. The controller controls the liquid inlet assembly 3 to adjust the inlet flow rate and controls the liquid outlet assembly 4 to adjust the outlet flow rate based on the received flow rate.

[0069] In this embodiment, there are three sensors, which are located in the cleaning chamber 1 and respectively corresponding to the top, middle and bottom of the wafer 5, for detecting the flow rate of the cleaning fluid at the top, middle and bottom of the wafer 5.

[0070] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A wafer cleaning apparatus, characterized by comprising: The utility model relates to a wafer cleaning device, comprising: a cleaning cavity with a first cavity wall and a second cavity wall arranged oppositely; a bearing seat arranged in the cleaning cavity for bearing a wafer to be cleaned; a liquid inlet assembly in communication with the first cavity wall for guiding cleaning liquid into the cleaning cavity; a liquid outlet assembly in communication with the second cavity wall for guiding the cleaning liquid in the cleaning cavity out; wherein the liquid inlet assembly and the liquid outlet assembly can adjust the flow rate of the cleaning liquid.

2. The wafer cleaning apparatus according to claim 1, wherein The bearing seat is used for bearing the wafer and vertically locating the wafer in the cleaning cavity; a plurality of liquid inlet holes are arranged on the first cavity wall, and at least two of the liquid inlet holes have a height difference; the liquid inlet assembly comprises a plurality of liquid inlet pipelines, and each liquid inlet pipeline is in communication with a corresponding liquid inlet hole.

3. The wafer cleaning apparatus according to claim 2, wherein The liquid inlet assembly further comprises a liquid inlet flow controller; each liquid inlet pipeline is provided with the liquid inlet flow controller, and the liquid inlet flow controller is used for controlling the flow rate of the cleaning liquid in the liquid inlet pipeline; in a wafer cleaning working state, the flow rate of the cleaning liquid in the liquid inlet pipeline close to the bottom of the cleaning cavity is less than that in the liquid inlet pipeline far from the bottom of the cleaning cavity.

4. The wafer cleaning apparatus according to claim 2, wherein The liquid inlet holes are arranged at least two in the first direction and / or the second direction, the first direction is the height direction of the cleaning cavity, and the second direction is perpendicular to the first direction in the plane where the first cavity wall is located.

5. The wafer cleaning apparatus according to any one of claims 2 to 4, wherein a plurality of liquid outlet holes are arranged on the second cavity wall, and at least two of the liquid outlet holes have a height difference; the liquid outlet assembly comprises a plurality of liquid outlet pipelines, and each liquid outlet pipeline is in communication with a corresponding liquid outlet hole.

6. The wafer cleaning apparatus according to claim 5, wherein The liquid outlet assembly further comprises a liquid outlet flow controller; each liquid outlet pipeline is provided with the liquid outlet flow controller, and the liquid outlet flow controller is used for controlling the flow rate of the cleaning liquid in the liquid outlet pipeline; in a wafer cleaning working state, the flow rate of the cleaning liquid in the liquid outlet pipeline close to the bottom of the cleaning cavity is less than that in the liquid outlet pipeline far from the bottom of the cleaning cavity.

7. The wafer cleaning apparatus of claim 5, wherein The liquid outlet holes are arranged at least two in the first direction and / or the second direction.

8. The wafer cleaning apparatus of claim 2, wherein The bearing seat comprises a first bearing member and a second bearing member; the first bearing member and the second bearing member are arranged oppositely, and the top of the first bearing member and the top of the second bearing member are inclined to each other and close to each other, and the top of the first bearing member and the top of the second bearing member are both provided with a bearing groove for bearing the wafer.

9. The wafer cleaning apparatus according to claim 8, wherein The first bearing member and the second bearing member are both provided with a flow-through hole along the extension direction thereof.

10. The wafer cleaning apparatus of claim 1, wherein The utility model further comprises a controller and a sensor; the controller is electrically connected with the liquid inlet assembly, the liquid outlet assembly and the sensor, the sensor is arranged in the cleaning cavity for detecting the flow speed of the cleaning liquid and feeding back the flow speed to the controller, the controller controls the liquid inlet assembly to adjust the flow rate of the liquid inlet according to the received flow speed, and controls the liquid outlet assembly to adjust the flow rate of the liquid outlet.

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