Wafer box transmission device for vertical furnace

Abstract

The utility model provides a wafer box transmission device for a vertical furnace, and belongs to the technical field of wafer carrying. In order to solve the problems that an existing wafer carrying device is low in carrying efficiency and poor in adaptability, the wafer box conveying device for the vertical furnace comprises a box opening platform and a butt joint port, and the box opening platform comprises a first platform used for bearing a wafer box cover and a lifting platform used for bearing a bottom plate; the butt joint port is provided with a first opening and a second opening. A lifting mechanism for driving the lifting platform to lift is arranged at the bottom of the first platform corresponding to the first channel and is used for driving the lifting platform to move in the height direction relative to the first channel. A butt joint opening with double openings is arranged, so that the first opening can allow the crown block to place the wafer box from top to bottom; and meanwhile, the second opening is arranged, so that the wafer box can be conveniently carried from the side surface manually or by a mechanical arm. The applicability of the wafer box transmission device is greatly improved; and the box opening platform can directly open the box after the wafer box is placed, so that the transmission efficiency of the wafer box is improved under the condition that the cleanliness is ensured.

Description

Technical Field

[0001] This application relates to the field of wafer handling technology, and more particularly to a wafer cassette transfer device for a vertical furnace. Background Technology

[0002] As a crucial piece of equipment in the front-end processes of semiconductor production lines, vertical furnaces face increasingly stringent requirements for contamination control during wafer processing, demanding higher cleanliness standards from their internal components, especially with the continuous advancement of manufacturing processes. During the wafer loading and unloading process, air can easily enter the vertical furnace, affecting the internal microenvironment and creating a low-oxygen atmosphere, leading to wafer contamination and natural oxidation.

[0003] Therefore, before transferring wafers to a vertical furnace for processing, it is often necessary to manually or by a robotic arm to move the wafer cassette to a designated location. After ensuring that the designated location is in a clean environment, the wafer cassette is opened to ensure the cleanliness of the wafer transfer.

[0004] However, this method has extremely low transmission efficiency, and with the widespread use of wafer cassette handling cranes, the above transmission method cannot adapt to the adjustment required by crane handling. This results in low transmission efficiency and limited versatility of existing wafer cassette transport devices. Utility Model Content

[0005] The purpose of this application is to address the problem of low transfer efficiency in existing wafer cassette transfer devices for vertical furnaces due to the need to ensure cleanliness during the transfer process. Therefore, this application provides a wafer cassette transfer device for vertical furnaces, featuring a double-opening docking opening. The first opening allows a crane to place wafer cassettes from top to bottom; simultaneously, a second opening facilitates manual or robotic arm handling of wafer cassettes from the side. This significantly increases the applicability of the wafer cassette transfer device; furthermore, the unpacking platform can directly open the wafer cassettes after placement, improving transfer efficiency while ensuring cleanliness.

[0006] This application provides a wafer cassette transfer device for a vertical furnace. The wafer cassette includes a base plate and a wafer cassette cover disposed on the base plate, and the wafer cassette carries a wafer tray, including:

[0007] The box-opening platform and the docking port covered by the box-opening platform;

[0008] The unpacking platform includes a first platform for supporting the wafer case cover, a lifting platform for supporting the base plate, and a first cleanroom device disposed below the lifting platform.

[0009] The top of the docking port has a first opening corresponding to the first platform, and the side of the docking port has a through second opening.

[0010] The wafer cassette can be transmitted to the first platform through the first opening or the second opening;

[0011] The first platform is provided with a first channel for accommodating the lifting platform, and a lifting mechanism is provided at the bottom of the first platform corresponding to the first channel for driving the lifting platform to move up and down. The lifting mechanism is used to drive the lifting platform to move in the height direction relative to the first channel.

[0012] In one embodiment, a sealing flange is provided at the edge of the lifting platform;

[0013] When the lifting platform is raised into the first channel, the sealing flange is sealed to the first channel;

[0014] The lifting platform is provided with an unlocking mechanism at its center, and a ventilation hole is provided on one side of the unlocking mechanism.

[0015] The unlocking mechanism is used to unlock or lock the wafer cassette cover to the base plate;

[0016] The ventilation hole can penetrate the base plate and connect to the inside of the wafer box, and is connected to a second cleanroom device;

[0017] The second cleanroom device is located on the bottom surface of the lifting platform and purifies the gas environment inside the wafer cassette through the ventilation holes.

[0018] In one embodiment, the unlocking mechanism includes a pair of centrally symmetrical pins and a motor that drives the pins to rotate. The pair of pins are used to insert into the base plate and to unlock or lock the wafer cassette cover from the base plate by rotation.

[0019] The lifting platform is provided with positioning protrusions and presence sensors arranged in a triangle around the unlocking mechanism;

[0020] The positioning protrusion is used to position and fix the base plate;

[0021] The presence sensor is mounted on the base plate via an elastic element. When the presence sensor is pressed by the base plate, it detects that the base plate is placed on the lifting platform.

[0022] In one embodiment, the first platform is provided with a plurality of limiting blocks and a locking module disposed opposite to the first channel, and the limiting blocks are provided with a guide surface for guiding the first channel;

[0023] The locking module is used to clamp the wafer cassette cover on the first platform.

[0024] In one embodiment, the locking module includes a locking plate rotatably disposed on a first platform, a transmission rod, a drive member, and a cover covering the locking plate, the transmission rod, and the drive member;

[0025] The driving component is connected to the locking plate via the transmission rod and drives the locking plate to rotate;

[0026] When the locking piece rotates out of the cover, it can clamp the wafer cassette cover and apply downward pressure.

[0027] In one embodiment, the lifting mechanism includes a first support cantilever and a second support cantilever arranged in parallel, and a first guide rail and a second guide rail respectively corresponding to the first support cantilever and the second support cantilever.

[0028] Both the first support cantilever and the second support cantilever are slidably disposed on the first guide rail and the second guide rail, and are used to support the lifting platform;

[0029] At least one end of the first support cantilever and the second support cantilever is provided with a second driving member;

[0030] The second driving member is used to drive the first support cantilever and the second support cantilever to move up and down on the first guide rail and the second guide rail.

[0031] In one embodiment, positioning sensors are provided at the bottom ends of the first guide rail and the second guide rail;

[0032] The first support cantilever is provided with a first baffle corresponding to the positioning sensor, and the second support cantilever is provided with a second baffle corresponding to the positioning sensor;

[0033] When the first support cantilever and the second support cantilever descend to the first position, the first baffle and the second baffle block the positioning sensor, so that the positioning sensor determines the position of the lifting platform.

[0034] In one embodiment, a housing is provided below the first platform, forming a space for taking and placing items;

[0035] The housing is open on the side opposite to the second opening and is used by an external robotic arm to pick up and place the wafer cassette within the pick-and-place space.

[0036] Beneficial effects:

[0037] (1) The docking port of the wafer box transport device has a first opening facing upward and a second opening through the side; thus, the overhead crane transport device can pick up and place wafer boxes on the box opening platform through the first opening; at the same time, the second opening on the side is retained, which facilitates picking up and placing wafer boxes on the box opening platform by manual and robotic arm transport methods; thus improving the applicability of the wafer box transport device.

[0038] (2) The multiple openings make it difficult to guarantee airtightness. Therefore, the unpacking platform is equipped with a lifting platform. After the wafer cassette is placed on the first platform, the bottom plate of the wafer cassette can be opened through the lifting platform. This ensures that the wafer cassette is not easily contaminated while completing the transfer of the wafer cassette within the wafer cassette. Furthermore, after the wafer cassette is placed on the unpacking platform, the unpacking operation can be performed directly, improving the unpacking efficiency and thus improving the overall transfer efficiency of the wafer cassette.

[0039] Other features and corresponding beneficial effects of this application will be described in the latter part of the specification, and it should be understood that at least some of the beneficial effects will become obvious from the description in this application. Attached Figure Description

[0040] Figure 1 A schematic diagram of the structure of a wafer cassette transport device for a vertical furnace provided in an embodiment of this application;

[0041] Figure 2 This is a schematic diagram of the structure of the unpacking platform of the wafer handling device provided in the embodiments of this application;

[0042] Figure 3 A schematic diagram of the lifting mechanism of the unpacking platform of the wafer handling device provided in this application embodiment;

[0043] Figure 4 This is a schematic diagram of the lifting platform of the wafer handling device provided in the embodiments of this application.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100. Unboxing platform;

[0046] 110. The First Platform;

[0047] 111. First channel; 112. Limit block;

[0048] 113. Locking module; 114. Locking plate; 115. Transmission rod; 116. Driving component; 117. Cover;

[0049] 120. Lifting platform;

[0050] 121. Unlocking mechanism; 122. Ventilation vent; 123. Positioning protrusion; 124. Presence sensor; 125. Sealing flange; 126. Second cleanroom device;

[0051] 130. Lifting mechanism;

[0052] 131. First support cantilever; 132. First guide rail; 133. First baffle; 134. Positioning sensor;

[0053] 140. First Cleanroom Unit;

[0054] 200. Dating port;

[0055] 210. First opening; 220. Second opening. Detailed Implementation

[0056] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with preferred embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0057] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0058] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0059] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this application and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0060] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0061] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0062] Please see Figures 1-4 , Figure 1 This is a schematic diagram of the structure of a wafer cassette transport device for a vertical furnace provided in an embodiment of this application. Figure 2 This is a schematic diagram of the unpacking platform of the wafer handling device provided in the embodiments of this application. Figure 3 This is a schematic diagram of the lifting mechanism of the unpacking platform of the wafer handling device provided in the embodiments of this application. Figure 4 This is a schematic diagram of the lifting platform of the wafer handling device provided in the embodiments of this application.

[0063] like Figures 1 to 4 As shown, this application provides a wafer cassette transfer device for a vertical furnace. The wafer cassette includes a base plate and a wafer cassette cover disposed on the base plate, and the wafer cassette carries a wafer tray, including:

[0064] The box-opening platform 100 and the docking port 200 covered by the box-opening platform 100;

[0065] The unpacking platform 100 includes a first platform 110 for carrying the wafer cassette cover, a lifting platform 200 for carrying the base plate, and a first cleanroom device 140 disposed below the lifting platform 200.

[0066] The top of the docking port 200 is provided with a first opening 210 corresponding to the first platform 110, and the side of the docking port 200 is provided with a through second opening 220.

[0067] The wafer cassette can be transferred to the first platform 110 through the first opening 210 or the second opening 220;

[0068] The first platform 110 is provided with a first channel 111 for accommodating the lifting platform 200, and the bottom of the first platform 110 is provided with a lifting mechanism 130 for driving the lifting platform 200 to move up and down corresponding to the first channel 111. The lifting mechanism 130 is used to drive the lifting platform 200 to move in the height direction relative to the first channel 111.

[0069] In the above-described embodiment, the docking port 200 of the wafer cassette transport device has an upward-facing first opening 210 and a side-through second opening 220; thereby allowing the overhead crane transport device to pick up and place wafer cassettes on the unpacking platform 100 through the first opening 210; at the same time, the side-through second opening 220 is retained to facilitate the picking up and placing of wafer cassettes on the unpacking platform 100 by manual or robotic arm handling; thus improving the applicability of the wafer cassette transport device.

[0070] Multiple openings make it difficult to guarantee a tight seal. Therefore, the unpacking platform 100 is equipped with a lifting platform 200. After the wafer cassette is placed on the first platform 110, the bottom plate of the wafer cassette can be opened via the lifting platform 200. This ensures that the wafer cassette is not easily contaminated while completing the transfer of wafer cassettes within the wafer cassette. Furthermore, after the wafer cassette is placed on the unpacking platform 100, the unpacking operation can be performed directly, improving the unpacking efficiency and thus enhancing the overall transfer efficiency of the wafer cassette.

[0071] In one embodiment, a sealing flange 125 is provided at the edge of the lifting platform 200;

[0072] When the lifting platform 200 is raised into the first channel 111, the sealing flange 125 is sealed to the first channel 111.

[0073] The lifting platform 200 has an unlocking mechanism 121 at its center, and a ventilation hole 122 is provided on one side of the unlocking mechanism 121.

[0074] The unlocking mechanism 121 is used to unlock or lock the wafer cassette cover from the base plate;

[0075] The ventilation hole 122 can penetrate the bottom plate and connect to the inside of the wafer box, and is connected to the second cleanroom device 126;

[0076] The second cleanroom device 126 is located on the bottom surface of the lifting platform 200 and purifies the gas environment inside the wafer cassette through the ventilation port 122.

[0077] In one embodiment, the unlocking mechanism 121 includes a pair of centrally symmetrical pins and a motor for driving the pins to rotate. The pair of pins are used to insert into the base plate and to unlock or lock the wafer cassette cover from the base plate by rotation.

[0078] The lifting platform 200 is provided with positioning protrusions 123 and presence sensors 124 arranged in a triangle around the unlocking mechanism 121;

[0079] Positioning protrusion 123 is used to position and fix the base plate;

[0080] The presence sensor 124 is mounted on the base plate via an elastic element. When the presence sensor 124 is pressed by the base plate, it is detected that the base plate is placed on the lifting platform 200.

[0081] In one embodiment, the first platform 110 is provided with a plurality of limiting blocks 112 and a locking module 113 arranged opposite to the first channel 111, and the limiting blocks 112 are provided with a guide surface for guiding the first channel 111;

[0082] The locking module 113 is used to clamp the wafer cassette cover on the first platform 110.

[0083] In one embodiment, the locking module 113 includes a locking plate 114 rotatably disposed with the first platform 110, a transmission rod 115, a drive member 116, and a cover 117 covering the locking plate 114, the transmission rod 115, and the drive member 116.

[0084] The driving component 116 is connected to the locking plate 114 via the transmission rod 115 and drives the locking plate 114 to rotate;

[0085] When the locking plate 114 rotates and extends out of the cover 117, it can clamp the wafer cassette cover and apply downward pressure.

[0086] In one embodiment, the lifting mechanism 130 includes a first support arm 131 and a second support arm arranged in parallel, and a first guide rail 132 and a second guide rail respectively corresponding to the first support arm 131 and the second support arm.

[0087] The first support cantilever 131 and the second support cantilever are both slidably disposed on the first guide rail 132 and the second guide rail, and are used to support the lifting platform 200;

[0088] A second drive element 116 is provided at at least one end of the first support cantilever 131 and the second support cantilever;

[0089] The second drive component 116 is used to drive the first support cantilever 131 and the second support cantilever to move up and down on the first guide rail 132 and the second guide rail.

[0090] In one embodiment, a positioning sensor 134 is provided at the bottom end of the first guide rail 132 and the second guide rail;

[0091] The first support cantilever 131 is provided with a first baffle 133 corresponding to the positioning sensor 134, and the second support cantilever is provided with a second baffle corresponding to the positioning sensor 134.

[0092] When the first support cantilever 131 and the second support cantilever descend to the first position, the first baffle 133 and the second baffle block the positioning sensor 134, so that the positioning sensor 134 determines the position of the lifting platform 200.

[0093] In one embodiment, a housing is provided below the first platform 110, forming a space for taking and placing items;

[0094] The housing is open on the side opposite to the second opening 220 and is used by an external robotic arm to pick up and place wafer cassettes within the pick-and-place space.

[0095] In a practical scenario, an overhead crane picks up a wafer cassette and places it into the opening platform 100 through the first opening 210. The wafer cassette is precisely positioned on the first platform 110 and the lifting platform 200 under the limiting action of the limiting block 112, and is further positioned by the positioning protrusion 123 on the lifting platform 200. At this time, the locking module 113 of the first platform 110 controls the locking plate 114 to rotate and press the wafer cassette tightly, while the unlocking mechanism 121 and the ventilation hole 122 on the lifting platform 200 extend into the bottom plate of the wafer cassette. Simultaneously, the presence sensor 124 detects that the wafer cassette is in place.

[0096] However, the second cleanroom device 126 replaces the gas inside the wafer cassette with clean gas through the ventilation port 122. After completion, the unlocking mechanism 121 unlocks the base plate; the lifting mechanism 130 lowers the base plate to the first position; at the same time, the first cleanroom device 140 continuously replaces the gas in the pick-up and put-out space with clean gas.

[0097] Finally, the external robotic arm grabs the wafer cassette from the base plate within the pick-and-place space, completing one transfer of the wafer cassette.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A wafer boat transfer apparatus for a vertical furnace, the wafer boat comprising a base plate and a wafer boat cover covering the base plate, and a wafer cassette being carried in the wafer boat, characterized by, The device comprises: an open-box platform and a docking port arranged on the open-box platform; the open-box platform comprises a first platform for carrying a wafer box cover, a lifting table for carrying the bottom plate, and a first cleaning device arranged below the lifting table; the docking port is provided with a first opening corresponding to the first platform, and the side of the docking port is provided with a second opening penetrating through; the wafer box can be transported to the first platform through the first opening or the second opening; the first platform is provided with a first channel for accommodating the lifting table, and the bottom of the first platform is provided with a lifting mechanism corresponding to the first channel for driving the lifting table to move in the height direction relative to the first channel.

2. The wafer box conveying device for the vertical furnace according to claim 1, wherein: the edge of the lifting table is provided with a sealing flange; when the lifting table is lifted into the first channel, the sealing flange is sealingly connected with the first channel; the center of the lifting table is provided with an unlocking mechanism, and one side of the unlocking mechanism is provided with an air exchange hole; the unlocking mechanism is used for unlocking or locking the wafer box cover and the bottom plate; the air exchange hole can communicate with the inside of the wafer box through the bottom plate and is connected with a second cleaning device; the second cleaning device is arranged on the bottom surface of the lifting table and purifies the gas environment in the wafer box through the air exchange hole.

3. The wafer box conveying device for the vertical furnace according to claim 2, wherein: the unlocking mechanism comprises a pair of center-symmetric latches and a motor for driving the latches to rotate, and the pair of latches are used for inserting into the bottom plate and unlocking or locking the wafer box cover and the bottom plate by rotating; the lifting table is provided with positioning protrusions and presence sensors in a triangular distribution around the unlocking mechanism; the positioning protrusions are used for positioning and fixing the bottom plate; the presence sensors are arranged on the bottom plate through elastic members, and when the presence sensors are pressed by the bottom plate, it is detected that the bottom plate is placed on the lifting table.

4. The wafer box conveying device for the vertical furnace according to claim 1, wherein: the first platform is provided with a plurality of limiting blocks and oppositely arranged locking modules around the first channel, and the limiting blocks are provided with a guide surface guiding the first channel; the locking modules are used for clamping the wafer box cover on the first platform.

5. The wafer box conveying device for the vertical furnace according to claim 4, wherein: the locking module comprises a locking piece rotatably arranged on the first platform, a transmission rod, a driving member, and a cover covering the locking piece, the transmission rod, and the driving member; the driving member is in transmission connection with the locking piece through the transmission rod and drives the locking piece to rotate; when the locking piece rotates to extend out of the cover, the wafer box cover can be clamped and a downward pressure can be applied.

6. The wafer box conveying device for the vertical furnace according to claim 1, wherein: The lifting mechanism comprises a first supporting cantilever and a second supporting cantilever arranged in parallel, and a first guide rail and a second guide rail arranged correspondingly to the first supporting cantilever and the second supporting cantilever respectively; The first supporting cantilever and the second supporting cantilever are slidingly arranged in the first guide rail and the second guide rail and are used for supporting the lifting platform; At least one end of the first supporting cantilever and the second supporting cantilever is provided with a second driving member; The second driving member is used for driving the first supporting cantilever and the second supporting cantilever to move up and down in the first guide rail and the second guide rail.

7. The wafer cassette transfer device for a vertical furnace according to claim 6, wherein, The first guide rail and the second guide rail are provided at the bottom end with a position sensor; The first supporting cantilever is provided with a first baffle corresponding to the position sensor, and the second supporting cantilever is provided with a second baffle corresponding to the position sensor; When the first supporting cantilever and the second supporting cantilever are lowered to a first position, the first baffle and the second baffle shield the position sensor, so that the position sensor determines the position of the lifting platform.

8. The wafer cassette transfer device for a vertical furnace according to claim 1, wherein, A housing is arranged below the first platform and forms a taking and placing space; The side of the housing away from the second opening is open and is used for an external mechanical arm to take and place the wafer cassette in the taking and placing space.

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