Wafer carrying device for vertical furnace

Abstract

The utility model provides a wafer carrying device for a vertical furnace, and belongs to the technical field of wafer carrying. In order to solve the problem that an existing wafer carrying device is low in carrying efficiency, the wafer carrying device for the vertical furnace comprises a box opening platform, a first carrying mechanism, a transfer platform and a second carrying mechanism which are connected in sequence. Rapid box opening operation of wafer boxes is achieved through the box opening platform, and the first carrying mechanism can carry the wafer boxes to at least one transmission channel and a plurality of storage stations of the transfer platform firstly, so that the same batch of wafer boxes can rapidly flow between the box opening platform and the transfer platform; and at least one transmission channel can continuously transmit the wafer boxes, so that the second carrying mechanism can rapidly carry the wafers between the transmission channel and the vertical furnace, redundant wafer boxes can be directly stored on the multiple storage stations, the carrying process is simplified, and the carrying efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of wafer handling technology, and more particularly to a wafer handling device for a vertical furnace. Background Technology

[0002] As a crucial piece of equipment in the front-end processes of semiconductor production lines, vertical furnaces face increasingly stringent requirements for contamination control during wafer processing, demanding higher cleanliness standards from their internal components, especially with the continuous advancement of manufacturing processes. During the wafer loading and unloading process, air can easily enter the vertical furnace, affecting the internal microenvironment and creating a low-oxygen atmosphere, leading to wafer contamination and natural oxidation.

[0003] Therefore, before transferring wafers to a vertical furnace for processing, it is often necessary to first open the wafer cassette, remove the wafer tray containing the wafers, and transport it to the vertical furnace interface. Finally, a robotic arm transfers the wafers from the wafer tray to the vertical furnace for processing. Because wafers require extremely high cleanliness levels inside the vertical furnace, each handling environment necessitates cleanliness control of the exposed wafer environment. This results in low overall transport efficiency of the transfer system and makes it difficult to reduce wafer handling costs. Utility Model Content

[0004] The purpose of this application is to address the problem of low transfer efficiency in existing wafer handling devices for vertical furnaces due to the need to ensure cleanliness during the transfer process. Therefore, this application provides a wafer handling device for a vertical furnace that enables rapid unpacking of wafer cassettes via an unpacking platform. A first handling mechanism can first transport the wafer cassettes to at least one transfer channel and multiple storage stations on a transfer platform, allowing the same batch of wafer cassettes to quickly flow between the unpacking platform and the transfer platform. Furthermore, at least one transfer channel can continuously transport wafer cassettes, facilitating rapid wafer transfer between the transfer channel and the vertical furnace by a second handling mechanism. Excess wafer cassettes can be directly stored on multiple storage stations, simplifying the handling process and improving handling efficiency.

[0005] This application provides a wafer handling device for a vertical furnace, used for handling wafer cassettes, wherein the wafer cassettes carry wafer trays, and the wafer trays carry wafer wafers, including:

[0006] The following components are connected in sequence: the box opening platform, the first handling mechanism, the transfer platform, and the second handling mechanism.

[0007] The unpacking platform is used to hold the wafer cassette and perform the unpacking operation;

[0008] The first handling mechanism is used to handle wafer cassettes between the unpacking platform and the transfer platform;

[0009] The second transport mechanism is used to transport the wafers on the wafer cassette in the transfer platform to the vertical furnace for processing;

[0010] The transfer platform is provided with at least one through transmission channel, and a first door opening mechanism and a second door opening mechanism are respectively provided on both sides of the transmission channel; the transmission channel is used to place the wafer cassette, and the first door opening mechanism and the second door opening mechanism are used to seal the transmission channel.

[0011] The transfer platform has multiple storage stations on the side facing the unpacking platform, and the storage stations are used to store the wafer cassettes;

[0012] The wafer cassette includes a base plate and a wafer cassette cover disposed on the base plate; the cassette opening platform includes a first platform for supporting the wafer cassette cover and a lifting platform for supporting the base plate.

[0013] The first platform is provided with multiple limit blocks and a locking module arranged opposite to each other, and the limit blocks are provided with guide surfaces for guiding the lifting platform; the locking module is used to clamp the wafer cassette cover on the first platform.

[0014] By adopting the above technical solution, the wafer cassette can be quickly opened through the unpacking platform. The first handling mechanism can first transport the wafer cassette to at least one transmission channel and multiple storage stations on the transfer platform, so that the same batch of wafer cassettes can be quickly transferred between the unpacking platform and the transfer platform. At least one transmission channel can continuously transport wafer cassettes, so that the second handling mechanism can quickly transport wafers between the transmission channel and the vertical furnace. Excess wafer cassettes can be directly stored on multiple storage stations, simplifying the handling process and improving handling efficiency.

[0015] In some embodiments, the sidewall of the transmission channel is provided with a ventilation hole, and the outer wall of the transmission channel is provided with a ventilation mechanism corresponding to the ventilation hole. The ventilation mechanism is used to purify the gas environment in the transmission channel.

[0016] The transmission channel includes a first opening and a second opening located at both ends of the transmission direction; the first opening mechanism is provided corresponding to the first opening and is used to seal the first opening, and the second opening mechanism is provided corresponding to the second opening and is used to seal the second opening;

[0017] The inner bottom surface of the transmission channel is provided with a positioning mechanism, which is used to limit the position of the wafer cassette.

[0018] The at least one transmission channel includes a first transmission channel and a second transmission channel arranged side by side along the height direction, and the first transmission channel and the second transmission channel alternately transmit the wafer cassette.

[0019] By employing the above technical solution, the ventilation mechanism ensures a high level of cleanliness in the gas environment within the transmission channel. Simultaneously, the first and second openings at both ends of the transmission channel can be opened sequentially, preventing direct flow between the two ends and thus avoiding additional contamination. Furthermore, the first and second transmission channels, arranged side-by-side along the height, can alternately transport wafer cassettes, further improving overall handling efficiency while avoiding excessive space occupation by too many transmission channels and reducing the number of storage workstations required.

[0020] In some embodiments, the first door opening mechanism includes a first guide rail disposed on one side of the first opening, a positioning plate slidably disposed on the first guide rail by a first driving member, and a cover plate disposed on the positioning plate;

[0021] The cover plate is movably mounted on the positioning plate via a first telescopic mechanism;

[0022] The first driving component drives the positioning plate to slide to the first opening of the transmission channel, and the cover plate moves toward the first opening under the action of the first telescopic mechanism and seals the first opening.

[0023] In some embodiments, the positioning plate is frame-shaped and may cover the outer edge of the first opening of the transmission channel;

[0024] The first telescopic mechanism includes two first drive motors and two first limit rods arranged symmetrically on the positioning plate;

[0025] The cover plate is movably mounted on the positioning plate via the first drive motor and the first limiting rod, and is provided with a sealing ring that matches the first opening of the transmission channel. The first drive motor drives the cover plate to move relative to the positioning plate toward or away from the first opening of the transmission channel.

[0026] The cover plate can close the first opening of the transmission channel through the sealing ring;

[0027] The first limiting rod guides the movement of the cover plate.

[0028] In some embodiments, the second door opening mechanism includes a second guide rail disposed on one side of the second opening of the transmission channel, and a first sealing plate and a second sealing plate stacked together;

[0029] The second sealing plate is slidably mounted on the second guide rail via the second driving component;

[0030] The first sealing plate is movably mounted on the second sealing plate via a second telescopic mechanism;

[0031] The second telescopic mechanism includes a plurality of drive motors and a plurality of limiting rods disposed on the side of the second sealing plate opposite to the first sealing plate;

[0032] The second telescopic mechanism drives the first sealing plate to move toward or away from the opening of the transmission channel via multiple drive motors; multiple limiting rods are used to guide the movement of the first sealing plate.

[0033] The second sealing plate is provided with a sealing cover for covering the second telescopic mechanism.

[0034] By adopting the above technical solution, on the one hand, the sealing performance of the second door opening mechanism when closing the second opening can be ensured, and on the other hand, the setting of the sealing cover can reduce the particulate contamination gas environment generated during the movement of the second telescopic mechanism, thereby affecting the cleanliness of the wafer transfer process.

[0035] In some embodiments, the first platform is provided with a first channel for accommodating the lifting platform, and a first slide rail is provided at the bottom of the first platform corresponding to the first channel;

[0036] The lifting platform is slidably mounted on the first slide rail via a drive mechanism, which drives the lifting platform to move in the height direction relative to the first channel.

[0037] By adopting the above technical solution, on the one hand, the lifting platform can achieve efficient opening and transfer of wafer boxes, and on the other hand, the lifting platform can ensure the stability and safety of the opening process.

[0038] In some embodiments, an unlocking mechanism is provided at the center of the lifting platform, and a ventilation hole is provided on one side of the unlocking mechanism;

[0039] The unlocking mechanism is surrounded by positioning protrusions and presence sensors arranged in a triangular pattern;

[0040] The ventilation holes are used to purify the gas environment inside the wafer cassette.

[0041] The unlocking mechanism is used to unlock the wafer cassette cover from the base plate;

[0042] The positioning protrusion is used to position and fix the base plate;

[0043] The presence sensor is used to detect whether the base plate is placed on the lifting platform.

[0044] In some embodiments, the first handling mechanism includes a vertical guide rail, a horizontal guide rail, a telescopic robotic arm, a flipping mechanism, and a gripper.

[0045] The horizontal guide rail is slidably disposed on the vertical guide rail in the vertical direction;

[0046] The telescopic robotic arm is slidably mounted on the horizontal guide rail in the horizontal direction, and the telescopic robotic arm rotates and extends along the horizontal plane.

[0047] The telescopic robotic arm is fixedly provided with a flipping mechanism at its end, and the flipping mechanism includes a flipping plate that is vertically disposed on one side of the fixed plate;

[0048] One side of the gripper is connected to the flipping plate via a transmission mechanism, and a drive motor is installed inside the flipping plate. The drive motor inside the flipping plate drives the transmission mechanism, thereby causing the gripper to flip.

[0049] Using the above technical solution, after the first handling mechanism picks up the wafer cassette, it can flip it so that the opening of the wafer cassette faces upward, thereby avoiding misalignment or falling of the wafers during handling. Furthermore, flipping it also facilitates the storage of the wafer cassette. When the wafer cassette is sent to the transmission channel, it can be flipped again so that the opening of the wafer cassette faces the transmission channel, which is beneficial for the second handling mechanism at the other end of the transmission channel to pick up the wafers in the wafer cassette.

[0050] In some embodiments, the wafer cassette includes an outer wafer cassette and an inner wafer cassette disposed within the outer wafer cassette;

[0051] The storage station includes multiple first positioning blocks, multiple second positioning blocks, a wafer cassette detection sensor, and a wafer detection sensor;

[0052] The plurality of first positioning blocks are movably disposed at the storage station and have a pre-tightening force in the locking direction, and the first positioning blocks are provided with guide surfaces for fixing and locking the outer wafer cassette of the wafer cassette.

[0053] The wafer cassette detection sensor is used to detect the outer wafer cassette of the wafer cassette to determine whether a wafer cassette is stored there.

[0054] The plurality of second positioning blocks include a plurality of second positioning blocks arranged opposite each other along a first direction and a plurality of second positioning blocks arranged opposite each other along a second direction, wherein the first direction and the second direction are perpendicular to each other;

[0055] The wafer inspection sensor is used to detect whether there are wafers placed in the inner wafer cassette of the wafer cassette.

[0056] Other features and corresponding beneficial effects of this application will be described in the latter part of the specification, and it should be understood that at least some of the beneficial effects will become obvious from the description in this application. Attached Figure Description

[0057] Figure 1A schematic diagram of the structure of a wafer handling device for a vertical furnace provided in an embodiment of this application;

[0058] Figure 2 This is a schematic diagram of the structure of the unpacking platform and the first transport mechanism of the wafer transport apparatus provided in the embodiments of this application;

[0059] Figure 3 This is a schematic diagram of the structure of the unpacking platform of the wafer handling device provided in the embodiments of this application;

[0060] Figure 4 A schematic diagram of the unpacking platform from another perspective of the wafer handling device provided in an embodiment of this application;

[0061] Figure 5 A top view of the lifting platform of the wafer handling device provided in the embodiments of this application;

[0062] Figure 6 This is a schematic diagram of the structure of the first transport mechanism of the wafer transport apparatus provided in the embodiments of this application;

[0063] Figure 7 A partial structural schematic diagram of the first transport mechanism of the wafer transport apparatus provided in the embodiments of this application;

[0064] Figure 8 This is a schematic diagram of the structure of the transfer platform of the wafer handling device provided in the embodiments of this application;

[0065] Figure 9 A schematic diagram of the first door opening mechanism and the transmission channel of the wafer handling device provided in the embodiments of this application;

[0066] Figure 10 A schematic diagram of the second door opening mechanism and the transmission channel of the wafer handling device provided in the embodiments of this application;

[0067] Figure 11 This is a schematic diagram of the storage station of the wafer handling device provided in an embodiment of this application.

[0068] Explanation of reference numerals in the attached figures:

[0069] 100. Unboxing platform;

[0070] 110. The First Platform;

[0071] 111. First channel; 112. Limit block; 113. Locking module;

[0072] 120. Lifting platform;

[0073] 121. Unlocking mechanism; 122. Ventilation vent; 123. Positioning protrusion; 124. Presence sensor;

[0074] 130. Slide rail; 140. Drive mechanism;

[0075] 200. First handling mechanism;

[0076] 210. Vertical guide rail; 220. Horizontal guide rail; 230. Telescopic robotic arm;

[0077] 240. Tilting mechanism;

[0078] 241. Fixed plate; 242. Flip-over plate;

[0079] 250. Grasping claw;

[0080] 300, transit platform;

[0081] 310. Transmission channel;

[0082] 311. First opening; 312. Second opening; 313. Ventilation mechanism; 314. Positioning mechanism;

[0083] 320. First door opening mechanism;

[0084] 321. First guide rail; 322. Positioning plate; 323. Cover plate; 324. First telescopic mechanism;

[0085] 330. Second door opening mechanism;

[0086] 331. Second guide rail; 332. Sealing cover;

[0087] 340. Storage station;

[0088] 341. First positioning block; 342. Second positioning block; 343. Wafer cassette inspection sensor; 344. Wafer inspection sensor;

[0089] 400. Wafer cassette. Detailed Implementation

[0090] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with preferred embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0091] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0092] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0093] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this application and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0094] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0095] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0096] Please see Figures 1-11 This application provides a wafer handling device for a vertical furnace, used for handling wafer cassettes, wherein a wafer tray 400 is carried inside the wafer cassette, and the wafer tray 400 carries wafers, including:

[0097] The box opening platform 100, the first handling mechanism 200, the transfer platform 300, and the second handling mechanism are connected in sequence.

[0098] The unpacking platform 100 is used to hold the wafer cassette and perform the unpacking operation;

[0099] The first handling mechanism 200 is used to handle the wafer cassette 400 between the unpacking platform 100 and the transfer platform 300;

[0100] The second handling mechanism is used to transport the wafers on the wafer cassette 400 in the transfer platform 300 to the vertical furnace for processing;

[0101] The transfer platform 300 is provided with at least one through transmission channel 310, and a first door opening mechanism 320 and a second door opening mechanism 330 are respectively provided on both sides of the transmission channel 310; the transmission channel 310 is used to place the wafer cassette 400, and the first door opening mechanism 320 and the second door opening mechanism 330 are used to seal the transmission channel 310.

[0102] The transfer platform 300 has multiple storage stations 340 on the side facing the unpacking platform 100. The storage stations 340 are used to store the wafer cassette 400.

[0103] The wafer cassette includes a base plate and a wafer cassette cover disposed on the base plate;

[0104] The unpacking platform 100 includes a first platform 110 for carrying the wafer cassette cover and a lifting platform 120 for carrying the base plate;

[0105] The first platform 110 is provided with multiple limiting blocks 112 and a locking module 113 arranged opposite to the first channel 111, and the limiting blocks 112 are provided with a guide surface for guiding the first channel 111;

[0106] The locking module 113 is used to clamp the wafer cassette cover on the first platform 110.

[0107] The wafer cassette is opened quickly via the unpacking platform 100. The first transport mechanism 200 can transport the wafer cassette 400 to at least one transport channel 310 and multiple storage stations 340 of the transfer platform 300, enabling the same batch of wafer cassettes to flow quickly between the unpacking platform 100 and the transfer platform 300. At least one transport channel 310 can continuously transport the wafer cassette 400, so that the second transport mechanism can quickly transport wafers between the transport channel 310 and the vertical furnace. Excess wafer cassettes 400 can be directly stored on multiple storage stations 340, simplifying the transport process and improving transport efficiency.

[0108] In one embodiment, the side wall of the transmission channel 310 is provided with a ventilation hole 122, and the outer wall of the transmission channel 310 is provided with a ventilation mechanism 313 corresponding to the ventilation hole 122. The ventilation mechanism 313 is used to purify the gas environment inside the transmission channel 310.

[0109] The transmission channel 310 includes a first opening 311 and a second opening 312 located at both ends of the transmission direction; a first door opening mechanism 320 is provided corresponding to the first opening 311 and is used to seal the first opening 311; a second door opening mechanism 330 is provided corresponding to the second opening 312 and is used to seal the second opening 312.

[0110] The inner bottom surface of the transmission channel 310 is provided with a positioning mechanism 314, which is used to limit the wafer cassette 400.

[0111] At least one transmission channel 310 includes a first transmission channel 310 and a second transmission channel 310 arranged side by side along the height direction, and the first transmission channel 310 and the second transmission channel 310 alternately transmit the wafer cassette 400.

[0112] The ventilation mechanism 313 ensures a high level of cleanliness in the gas environment within the transfer channel 310. Simultaneously, the first opening 311 and the second opening 312 at both ends of the transfer channel 310 can be opened sequentially to prevent direct flow at both ends and thus avoid additional contamination. Furthermore, the first and second transfer channels 310, arranged side-by-side along the height direction, can alternately transfer the wafer cassette 400, further improving overall handling efficiency while avoiding an excessive number of transfer channels 310 that would occupy too much space and reduce the number of storage stations 340 required.

[0113] In one embodiment, the first door opening mechanism 320 includes a first guide rail 321 disposed on one side of the first opening 311, a positioning plate 322 slidably disposed on the first guide rail 321 by a first driving member, and a cover plate 323 disposed on the positioning plate 322.

[0114] The cover plate 323 is movably mounted on the positioning plate 322 via the first telescopic mechanism 324;

[0115] The first driving member drives the positioning plate 322 to slide to the first opening 311 of the transmission channel 310, and the cover plate 323 moves toward the first opening 311 and seals the first opening 311 under the action of the first telescopic mechanism 324.

[0116] In one embodiment, the positioning plate 322 is frame-shaped and can cover the outer edge of the first opening 311 of the transmission channel 310;

[0117] The first telescopic mechanism 324 includes two first drive motors and two first limit rods arranged symmetrically on the positioning plate 322.

[0118] The cover plate 323 is movably mounted on the positioning plate 322 via the first drive motor and the first limiting rod, and is provided with a sealing ring that matches the first opening 311 of the transmission channel 310. The first drive motor drives the cover plate 323 to move relative to the positioning plate 322 toward or away from the first opening 311 of the transmission channel 310.

[0119] The cover plate 323 can seal the first opening 311 of the transmission channel 310 through the sealing ring;

[0120] The first limit rod guides the movement of the cover plate 323.

[0121] In one embodiment, the second door opening mechanism 330 includes a second guide rail 331 disposed on one side of the second opening 312 of the transmission channel 310, and a first sealing plate and a second sealing plate stacked together.

[0122] The second sealing plate is slidably mounted on the second guide rail 331 via the second driving component;

[0123] The first sealing plate is movably mounted on the second sealing plate via the second telescopic mechanism;

[0124] The second telescopic mechanism includes multiple drive motors and multiple limit rods disposed on the side of the second sealing plate opposite to the first sealing plate;

[0125] The second telescopic mechanism drives the first sealing plate to move toward or away from the opening of the transmission channel 310 via multiple drive motors; multiple limit rods are used to guide the movement of the first sealing plate.

[0126] The second sealing plate is provided with a sealing cover 335 for covering the second telescopic mechanism.

[0127] On the one hand, it can ensure the sealing performance of the second opening mechanism 330 when closing the second opening 312. On the other hand, the setting of the sealing cover 335 can reduce the particulate contamination gas environment generated during the movement of the second telescopic mechanism, thereby affecting the cleanliness of the wafer transfer process.

[0128] In one embodiment, the first platform 110 is provided with a first channel 111 for accommodating the lifting platform 120 through it, and a first slide rail 130 is provided at the bottom of the first platform 110 corresponding to the first channel 111.

[0129] The lifting platform 120 is slidably mounted on the first slide rail 130 via the drive mechanism 140, which is used to drive the lifting platform 120 to move in the height direction relative to the first channel 111.

[0130] On the one hand, the lifting platform 120 can achieve efficient opening and transfer of wafer boxes; on the other hand, the lifting platform 120 can ensure the stability and safety of the opening process.

[0131] In one embodiment, an unlocking mechanism 121 is provided at the center of the lifting platform 120, and a ventilation hole 122 is provided on one side of the unlocking mechanism 121.

[0132] A triangularly distributed positioning protrusion 123 and an presence sensor 124 are provided around the unlocking mechanism 121;

[0133] Vent 122 is used to purify the gas environment inside the wafer cell;

[0134] The unlocking mechanism 121 is used to unlock the wafer cassette cover from the base plate;

[0135] Positioning protrusion 123 is used to position and fix the base plate;

[0136] Sensor 124 is used to detect whether the base plate is placed on the lifting platform 120.

[0137] In one embodiment, the first handling mechanism 200 includes a vertical guide rail 210, a horizontal guide rail 220, a telescopic robotic arm 230, a flipping mechanism 240, and a gripper 250.

[0138] The horizontal guide rail 220 is slidably mounted on the vertical guide rail 210 in the vertical direction;

[0139] The telescopic robotic arm 230 is slidably mounted on the horizontal guide rail 220 in the horizontal direction, and the telescopic robotic arm 230 rotates and extends along the horizontal plane.

[0140] The end of the telescopic robotic arm 230 is fixedly provided with a flipping mechanism 240, which includes a flipping plate 242 that is vertically disposed on one side of the fixed plate 241;

[0141] One side of the gripper 250 is connected to the flipping plate 242 via a transmission mechanism, and a drive motor is installed inside the flipping plate 242. The drive motor inside the flipping plate 242 drives the transmission mechanism, thereby causing the gripper 250 to flip.

[0142] The first conveying mechanism 200 can flip the wafer cassette 400 after it grabs it, so that the opening of the wafer cassette 400 faces upward, thereby preventing the wafers from being misplaced or falling during the conveying process. Furthermore, flipping the wafer cassette 400 also facilitates its storage. When the wafer cassette 400 is sent to the transmission channel 310, it can be flipped again so that the opening of the wafer cassette 400 faces the transmission channel 310, which is beneficial for the second conveying mechanism at the other end of the transmission channel 310 to grab the wafers in the wafer cassette 400.

[0143] In one embodiment, the wafer cassette 400 includes an outer wafer cassette and an inner wafer cassette disposed within the outer wafer cassette;

[0144] The storage station 340 includes multiple first positioning blocks 341, multiple second positioning blocks 342, a wafer cassette 400 detection sensor 343, and a wafer detection sensor;

[0145] Multiple first positioning blocks 341 are movably disposed in the storage station 340 and have a pre-tightening force in the locking direction, and the first positioning blocks 341 are provided with guide surfaces for fixing and locking the outer wafer cassette of the wafer cassette 400.

[0146] The wafer cassette 400 detection sensor 343 is used to detect the outer wafer cassette of the wafer cassette 400 to determine whether a wafer cassette 400 is stored there.

[0147] The plurality of second positioning blocks 342 include a plurality of second positioning blocks 342 disposed opposite to each other along a first direction and a plurality of second positioning blocks 342 disposed opposite to each other along a second direction, wherein the first direction and the second direction are perpendicular to each other;

[0148] The wafer inspection sensor 344 is used to detect whether there are wafers placed in the inner wafer cassette of the wafer cassette 400.

[0149] In one application scenario, a wafer cassette is transported to the unpacking platform 100 by a wafer cassette transport crane, either manually or automatically. The guide surfaces of multiple limit blocks 112 on the first platform 110 of the unpacking platform 100 guide the wafer cassette, ensuring that it is accurately placed on the first platform 110. After the presence sensor 124 on the lifting platform 120 senses that the base plate has been placed on the lifting platform 120, the locking module 113 of the first platform 110 clamps and fixes the wafer cassette cover, and the ventilation port 122 of the lifting platform 120 purifies the gas environment inside the wafer cassette.

[0150] Then, the unlocking mechanism 121 of the lifting platform 120 unlocks the wafer cassette cover from the base plate, and the lifting platform 120 drives the base plate to descend, so that the first conveying mechanism 200 can move the wafer cassette 400.

[0151] At this time, the first opening mechanism 320 of the first opening 311 of the transfer channel 310 opens, and the first transport mechanism 200 transports the wafer cassette 400 into the transfer channel 310. The first opening mechanism 320 closes, and the ventilation mechanism 313 on the side wall of the transfer channel 310 purifies the gas environment inside the transfer channel 310. During this process, the first transport mechanism 200 can transport excess wafer cassettes 400 to the storage station 340. After the gas environment inside the transfer channel 310 is purified, the second opening mechanism 330 of the second opening 312 of the transfer channel 310 opens, and the second transport mechanism transports the wafers on the wafer cassette 400 to the vertical furnace. After the transport is completed, the second opening mechanism 330 closes, thus completing one wafer transfer.

[0152] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A wafer handling device for a vertical furnace for handling a wafer cassette, said wafer cassette having a wafer boat carried therein, said wafer boat having wafer pieces carried thereon, characterized by, The device comprises: a box opening platform, a first conveying mechanism, a transfer platform and a second conveying mechanism connected in sequence; the box opening platform is used for carrying a wafer box and performing a box opening operation; the first conveying mechanism is used for conveying a wafer cassette between the box opening platform and the transfer platform; the second conveying mechanism is used for conveying a wafer on the wafer cassette in the transfer platform to the vertical furnace for processing; the transfer platform is provided with at least one transmission channel penetrating through, and first and second door opening mechanisms are arranged on both sides of the transmission channel respectively; the transmission channel is used for placing the wafer cassette, and the first and second door opening mechanisms are used for sealing the transmission channel; a plurality of storage stations are arranged on the side of the transfer platform facing the box opening platform, and the storage stations are used for storing the wafer cassette; the wafer box comprises a bottom plate and a wafer box cover covering the bottom plate; the box opening platform comprises a first platform for carrying the wafer box cover and a lifting table for carrying the bottom plate; the first platform is provided with a plurality of limiting blocks and oppositely arranged locking modules, and the limiting blocks are provided with a guide surface guiding the lifting table; the locking modules are used for clamping the wafer box cover on the first platform.

2. The wafer conveying device for a vertical furnace according to claim 1, wherein a ventilation hole is arranged on the side wall of the transmission channel, a ventilation mechanism is arranged on the outer wall surface of the transmission channel corresponding to the ventilation hole, and the ventilation mechanism is used for purifying the gas environment in the transmission channel; the transmission channel comprises first and second openings at both ends in the transmission direction; the first door opening mechanism is arranged corresponding to the first opening and is used for sealing the first opening, and the second door opening mechanism is arranged corresponding to the second opening and is used for sealing the second opening; a positioning mechanism is arranged on the inner bottom surface of the transmission channel, and the positioning mechanism is used for limiting the wafer cassette; the at least one transmission channel comprises first and second transmission channels arranged side by side in the height direction, and the first and second transmission channels alternately convey the wafer cassette.

3. The wafer handling device for a vertical furnace according to claim 2, wherein the first door opening mechanism comprises a first guide rail arranged on one side of the first opening, a positioning plate slidably arranged on the first guide rail through a first driving member, and a cover plate arranged on the positioning plate; the cover plate is movably arranged on the positioning plate through a first telescopic mechanism; the first driving member drives the positioning plate to slide to the first opening of the transmission channel, and the cover plate moves towards the first opening and seals the first opening under the action of the first telescopic mechanism.

4. The wafer conveying device for a vertical furnace according to claim 3, wherein the positioning plate is arranged in a frame shape and can cover the outer edge of the first opening of the transmission channel; the first telescopic mechanism comprises two first driving motors and two first limiting rods arranged symmetrically on the positioning plate. The cover plate is movably arranged on the positioning plate by the first driving motor and the first limiting rod, and is provided with a sealing ring matched with the first opening of the transmission channel, and the first driving motor drives the cover plate to move towards or away from the first opening of the transmission channel relative to the positioning plate; The cover plate can close the first opening of the transmission channel by the sealing ring; The first limiting rod plays a guiding role in the movement of the cover plate.

5. The wafer carrying device for vertical furnace according to claim 1, wherein The second door opening mechanism comprises a second guide rail arranged on one side of the second opening of the transmission channel, and a first sealing plate and a second sealing plate arranged in layers; The second sealing plate is slidably arranged on the second guide rail by a second driving member; The first sealing plate is movably arranged on the second sealing plate by a second telescopic mechanism; The second telescopic mechanism comprises a plurality of driving motors and a plurality of limiting rods arranged on the side of the second sealing plate away from the first sealing plate; The second telescopic mechanism drives the first sealing plate to move towards or away from the opening of the transmission channel by the plurality of driving motors; The plurality of limiting rods are used to guide the movement of the first sealing plate; The second sealing plate is provided with a sealing cover for covering the second telescopic mechanism.

6. The wafer carrying device for vertical furnace according to claim 1, wherein The first platform is provided with a first channel for accommodating the lifting platform, and the bottom of the first platform is provided with a first sliding rail corresponding to the first channel; The lifting platform is slidably arranged on the first sliding rail by a driving mechanism, and the driving mechanism is used to drive the lifting platform to move in the height direction relative to the first channel.

7. The wafer carrying device for vertical furnace according to claim 6, wherein The center of the lifting platform is provided with an unlocking mechanism, and one side of the unlocking mechanism is provided with an air exchange hole; A positioning protrusion and a presence sensor are arranged around the unlocking mechanism in a triangular distribution; The air exchange hole is used to purify the gas environment in the wafer box; The unlocking mechanism is used to unlock the wafer box cover and the bottom plate; The positioning protrusion is used to position and fix the bottom plate; The presence sensor is used to detect whether the bottom plate is placed on the lifting platform.

8. The wafer carrying device for vertical furnace according to claim 1, wherein The first carrying mechanism comprises a vertical guide rail, a horizontal guide rail, a telescopic mechanical arm, a turnover mechanism and a grabbing claw; The horizontal guide rail is slidably arranged on the vertical guide rail in the vertical direction; The telescopic mechanical arm is slidably arranged on the horizontal guide rail in the horizontal direction, and the telescopic mechanical arm is rotatably telescopic in the horizontal plane; The end of the telescopic mechanical arm is fixedly provided with a turnover mechanism, and the turnover mechanism comprises a fixed plate and a turnover plate vertically arranged on one side of the fixed plate; One side of the grabbing claw is connected with the turnover plate by a transmission mechanism, and the turnover plate is internally provided with a driving motor, and the driving motor in the turnover plate drives the transmission mechanism, thereby driving the grabbing claw to turn over. 9.The wafer carrying device for a vertical furnace according to claim 1, wherein, the wafer cassette comprises an outer wafer cassette and an inner wafer cassette arranged in the outer wafer cassette; the storage station comprises a plurality of first positioning blocks, a plurality of second positioning blocks, a wafer cassette detection sensor and a wafer detection sensor; the plurality of first positioning blocks are movably arranged in the storage station and have a pre-tightening force in a locking direction, and the first positioning blocks are provided with a guide surface for fixing and locking the outer wafer cassette of the wafer cassette; the wafer cassette detection sensor is used for detecting the outer wafer cassette of the wafer cassette to determine whether the wafer cassette is stored; the plurality of second positioning blocks comprise a plurality of second positioning blocks arranged opposite to each other along a first direction and a plurality of second positioning blocks arranged opposite to each other along a second direction, and the first direction and the second direction are perpendicular to each other; the wafer detection sensor is used for detecting whether the inner wafer cassette of the wafer cassette is placed with a wafer.

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