Wafer carrying equipment

Abstract

The utility model relates to the technical field of wafer processing, and relates to wafer carrying equipment. According to the utility model, after the position of the wafer is positioned through the positioning jig, the driving assembly drives the carrying gripper to carry out material taking and carrying on the wafer on the positioning jig, and the moving assembly drives the wafer on the carrying gripper to move to a designated position, so that carrying and feeding of the wafer are completed, multi-angle carrying and moving of the wafer are realized, and the working efficiency is improved. The production and processing efficiency of the wafer is effectively improved; the material blocking mechanism can isolate the positioning jig and the carrying mechanism, thereby effectively preventing impurities generated by processing from influencing the quality of the wafer, and improving the forming quality of the product.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and specifically to a wafer handling device. Background Technology

[0002] In the semiconductor manufacturing process, a large number of wafers are indispensable. Operations such as etching and photolithography are required on the wafers. Therefore, the wafers need to be transported between various workstations. The faster and more stable the transport, the higher the processing efficiency of the wafers.

[0003] In existing technologies, wafer handling mechanisms can only handle wafers of the same size at a time. When the operator needs to change the size of the wafer to be handled, the control parameters of the equipment need to be adjusted and the equipment needs to be debugged, which results in low work efficiency and is not conducive to enterprise production. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a wafer handling equipment that realizes multi-angle handling and movement of wafers, effectively improving wafer production and processing efficiency and product forming quality.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] A wafer handling device, comprising:

[0007] A loading rack is provided with a loading station, and a positioning fixture is provided on the loading station. The positioning fixture is used to position the wafer.

[0008] A transport mechanism is disposed opposite to the loading rack. The transport mechanism includes a drive component and a transport gripper. The transport gripper is drivenly connected to the drive component. The drive component is used to drive the transport gripper to pick up and transport the wafers on the positioning fixture.

[0009] A moving mechanism is connected to the driving component. The moving mechanism includes a moving component that is driven to a moving base. The driving component is disposed on the moving base. The moving component is used to move the wafer on the handling gripper to a designated position.

[0010] A material blocking mechanism is provided on the loading rack and is located between the positioning fixture and the conveying mechanism. The material blocking mechanism is used to block the wafers on the positioning fixture.

[0011] In one embodiment of this utility model, the movable component includes a movable frame, a movable module is disposed on the movable frame, a slide rail is disposed on one side of the movable frame, the slide rail is disposed parallel to the movable module, the movable base is drivenly connected to the movable module, and a slider is disposed on the slide rail, the slider being connected to the movable base.

[0012] In one embodiment of this utility model, the driving component is a multi-axis manipulator, which is mounted on the movable base and is driven by a handling gripper.

[0013] In one embodiment of this utility model, the handling gripper includes a handling frame, a handling plate is provided on the handling frame, a plurality of air suction holes are provided on the handling plate, and vacuum nozzles are provided on the air suction holes.

[0014] In one embodiment of this utility model, the transport frame is provided with an adjustment groove, the transport plate is provided with an adjustment plate that matches the adjustment groove, the adjustment plate passes through the adjustment groove, an adjustment bolt is provided on one side of the adjustment groove, the adjustment plate and the adjustment groove are connected by the adjustment bolt, and the adjustment plate is provided with scale lines.

[0015] In one embodiment of this utility model, the transport plate is provided with a slot, the positioning fixture is provided with a positioning slot that matches the slot, the slot on the transport plate has an arc-shaped structure, and the vacuum nozzle is provided on the edge of the slot.

[0016] In one embodiment of the present invention, the positioning fixture includes a fixture plate, a fixture block is provided on the fixture plate, a support platform for placing a wafer is provided on the fixture block, fixing grooves are provided on both sides of the fixture block, a positioning hole is provided on the support platform, and a detection sensor for detecting the position of the wafer is provided on the positioning hole.

[0017] In one embodiment of the present invention, the material blocking mechanism includes a material blocking frame, which is disposed on the material feeding frame. The material blocking frame is provided with a feeding window, which is disposed opposite to the positioning fixture. A baffle assembly is provided on the feeding window, which is used to open and close the feeding window.

[0018] In one embodiment of the present invention, the baffle assembly includes a baffle plate, a lifting cylinder is provided on the feeding frame, the lifting cylinder is drivenly connected to the baffle plate, guide frames are provided on both sides of the baffle frame, and the two sides of the baffle plate are slidably mounted on the guide frames.

[0019] In one embodiment of this utility model, an antistatic mechanism is further included. The antistatic mechanism includes a mounting frame, which is disposed on the loading rack. An antistatic device is disposed on the mounting frame and is used to perform antistatic treatment on the wafers gripped by the handling gripper.

[0020] The beneficial effects of this utility model are:

[0021] This invention uses a positioning fixture to position the wafer, then a drive component drives a transport gripper to pick up and transport the wafer from the positioning fixture. A moving component then moves the wafer on the transport gripper to a designated position, thus completing the wafer handling and loading. This enables multi-angle transport and movement of the wafer, effectively improving wafer production efficiency. The blocking mechanism isolates the positioning fixture and the transport mechanism, effectively preventing impurities generated during processing from affecting wafer quality and improving product molding quality. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a wafer handling device according to the present invention.

[0023] Figure 2 This is a schematic diagram of the handling mechanism of this utility model.

[0024] Figure 3 This is a schematic diagram of the feeding rack of this utility model.

[0025] The following are the labels in the diagram: 1. Loading rack; 2. Positioning fixture; 21. Fixture plate; 22. Fixture block; 23. Positioning slot; 24. Fixing groove; 3. Baffle plate; 31. Lifting cylinder; 32. Guide frame; 33. Mounting frame; 34. Static eliminator; 4. Moving component; 41. Moving frame; 42. Moving module; 43. Slide rail; 44. Slider; 5. Moving seat; 6. Multi-axis robot; 7. Handling gripper; 71. Handling frame; 72. Handling plate; 73. Vacuum nozzle; 74. Adjusting plate; 75. Adjusting groove; 76. Adjusting bolt; 77. Slot. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0027] Reference Figure 1-3 As shown, a wafer handling device includes:

[0028] The loading rack 1 is provided with a loading station, and the loading station is provided with a positioning fixture 2, which is used to position the wafer.

[0029] A transport mechanism is disposed opposite to the loading rack 1. The transport mechanism includes a drive component and a transport gripper 7. The transport gripper 7 is drivenly connected to the drive component. The drive component is used to drive the transport gripper 7 to pick up and transport the wafers on the positioning fixture 2.

[0030] A moving mechanism is connected to the driving component. The moving mechanism includes a moving component 4, which is drivenly connected to a moving base 5. The driving component is disposed on the moving base 5. The moving component 4 is used to move the wafer on the handling gripper 7 to a designated position.

[0031] A material blocking mechanism is provided on the loading rack 1 and is located between the positioning fixture 2 and the conveying mechanism. The material blocking mechanism is used to block the wafers on the positioning fixture 2.

[0032] This invention uses a positioning fixture 2 to position the wafer, then a drive assembly drives a transport gripper 7 to pick up and transport the wafer from the positioning fixture 2. A moving assembly 4 then moves the wafer on the transport gripper 7 to a designated position, thus completing the wafer transport and loading. This enables multi-angle transport and movement of the wafer, effectively improving the wafer production and processing efficiency. The baffle mechanism can isolate the positioning fixture 2 and the transport mechanism, effectively preventing impurities generated during processing from affecting the quality of the wafer and improving the product molding quality.

[0033] In one embodiment of the present invention, the movable component 4 includes a movable frame 41, a movable module 42 is disposed on the movable frame 41, a slide rail 43 is disposed on one side of the movable frame 41, the slide rail 43 is disposed parallel to the movable module 42, the movable seat 5 is drivenly connected to the movable module 42, and a slider 44 is disposed on the slide rail 43, the slider 44 is connected to the movable seat 5.

[0034] In one embodiment of this utility model, the driving component is a multi-axis robot 6, which is mounted on the moving base 5. The multi-axis robot 6 is driven to connect with the handling gripper 7. The multi-axis robot 6 realizes multi-angle handling and movement of the wafer, effectively adapting to processing and handling needs.

[0035] In one embodiment of this utility model, the handling gripper 7 includes a handling frame 71, a handling plate 72 is provided on the handling frame 71, a plurality of suction holes are provided on the handling plate 72, and a vacuum nozzle 73 is provided on the suction holes. The vacuum nozzle 73 is connected to a vacuum generating device, so that the vacuum nozzle 73 picks up the bottom surface of the wafer, which can prevent the wafer from shaking and falling during the handling process and ensure the stability of wafer transmission.

[0036] In one embodiment of this utility model, the transport frame 71 is provided with an adjustment groove 75, the transport plate 72 is provided with an adjustment plate 74 that matches the adjustment groove 75, the adjustment plate 74 passes through the adjustment groove 75, an adjustment bolt 76 is provided on one side of the adjustment groove 75, the adjustment plate 74 is connected to the adjustment groove 75 by the adjustment bolt 76, and the adjustment plate 74 is provided with scale lines.

[0037] Specifically, the position of the adjustment plate 74 passing through the adjustment slot 75 is adjusted according to the different specifications of the wafers. The adjustment plate 74 and the adjustment slot 75 are connected by the adjustment bolt 76, so as to adapt to the handling of wafers of various specifications, with a wide range of applications and reduced production costs.

[0038] In one embodiment of the present invention, the transport plate 72 is provided with a slot 77, the positioning fixture 2 is provided with a positioning slot 23 that matches the slot 77, the slot 77 on the transport plate 72 has an arc-shaped structure, and the vacuum nozzle 73 is provided on the edge of the slot 77.

[0039] Specifically, the multi-axis robot 6 drives the transport plate 72 to move, causing the transport plate 72 to move into the positioning slot 23 of the positioning fixture 2. The positioning slot 23 can facilitate the position avoidance of the transport gripper 7, which facilitates the rapid picking of the wafer. At the same time, it can also play a certain positioning role for the transport plate 72, ensuring the accuracy of the positioning plate in picking up the wafer. The transport plate 72 is provided with a slot 77 that matches the unloading position, which can ensure the positional accuracy of the wafer after transport and improve the transport quality of the wafer.

[0040] In one embodiment of the present invention, the positioning fixture 2 includes a fixture plate 21, a fixture block 22 is provided on the fixture plate 21, a support platform for placing a wafer is provided on the fixture block 22, fixing grooves 24 are provided on both sides of the fixture block 22, a positioning hole is provided on the support platform, and a detection sensor for detecting the position of the wafer is provided on the positioning hole.

[0041] Specifically, the wafer product is placed on the support platform of the jig block 22. The position of the wafer is detected by the detection sensor, which can locate the wafer and ensure the wafer picking accuracy. The fixing grooves 24 set on both sides of the jig block 22 can facilitate the handling of the jig block 22, so that the appropriate jig block 22 can be quickly replaced according to the requirements of different wafer specifications, thereby improving processing efficiency and ensuring loading accuracy.

[0042] In one embodiment of the present invention, the material blocking mechanism includes a material blocking frame, which is disposed on the material feeding frame 1. The material blocking frame is provided with a feeding window, which is disposed opposite to the positioning fixture 2. A baffle assembly is provided on the feeding window, which is used to open and close the feeding window.

[0043] In one embodiment of the present invention, the baffle assembly includes a baffle plate 3, a lifting cylinder 31 is provided on the feeding frame 1, the lifting cylinder 31 is drivenly connected to the baffle plate 3, and guide frames 32 are provided on both sides of the baffle frame, and the two sides of the baffle plate 3 are slidably mounted on the guide frames 32.

[0044] Specifically, the lifting cylinder 31 drives the baffle plate 3 to move up and down along the guide frame 32, so that the loading window can cover or expose the wafer position, which can facilitate the rapid loading of the wafer. The baffle plate 3 isolates the positioning fixture 2 and the handling mechanism, effectively preventing impurities generated during processing from affecting the quality of the wafer and improving the product forming quality.

[0045] In one embodiment of the present invention, an antistatic mechanism is further included. The antistatic mechanism includes a mounting frame 33, which is disposed on the loading rack 1. An antistatic device 34 is disposed on the mounting frame 33. The antistatic device 34 is used to perform antistatic treatment on the wafer gripped by the handling gripper 7.

[0046] Specifically, when the wafer passes through the loading window, the static eliminator 34 located above the loading window performs static elimination treatment on the wafer gripped by the handling gripper 7, effectively reducing impurities attached to the wafer surface and ensuring the surface cleanliness of the wafer.

[0047] Usage process

[0048] The wafer is placed on the support platform of fixture block 22. The position of the wafer is detected by the detection sensor. The lifting cylinder 31 drives the baffle plate 3 to move downward along the guide frame 32, exposing the wafer position through the loading window. The moving module 42 drives the conveying mechanism on the moving base 5 to move to the opened loading window. The multi-axis robot 6 drives the conveying plate 72 to move into the positioning slot 23 of the positioning fixture 2. At this time, the conveying plate 72 is located below the wafer, and the vacuum suction... The nozzle 73 is connected to the vacuum generator, so that the vacuum nozzle 73 picks up the bottom surface of the wafer. Driven by the multi-axis robot 6, the wafer is lifted and transported to the next process. When the wafer passes through the loading window, the static eliminator 34 located above the loading window removes static electricity from the wafer picked up by the handling gripper 7. The lifting cylinder 31 drives the baffle plate 3 to move upward along the guide frame 32, so that the loading window is blocked. The moving module 42 moves the wafer on the handling gripper 7 to the designated position, thereby completing the wafer handling and loading.

[0049] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A wafer handling apparatus, characterized by, The utility model relates to a wafer loading and unloading device, which comprises a loading rack, a carrying mechanism, a moving mechanism and a material blocking mechanism. The loading rack is provided with a loading station on the top, and a positioning jig is arranged on the loading station. The carrying mechanism is arranged opposite to the loading rack. The carrying mechanism comprises a driving assembly and a carrying gripper. The driving assembly is used to drive the carrying gripper to take and carry the wafer on the positioning jig.

2. The wafer handling apparatus of claim 1, wherein The moving mechanism is connected with the driving assembly.

3. The wafer handling apparatus of claim 1, wherein The moving mechanism comprises a moving assembly.

4. The wafer handling apparatus of claim 1, wherein The moving assembly is drivingly connected with a moving seat.

5. The wafer handling apparatus of claim 4, wherein The driving assembly is arranged on the moving seat.

6. The wafer handling apparatus of claim 4, wherein The moving assembly is used to drive the wafer on the carrying gripper to move to a designated position.

7. The wafer handling apparatus of claim 1, wherein The material blocking mechanism is arranged between the positioning jig and the carrying mechanism on the loading rack.

8. The wafer handling apparatus of claim 1, wherein The material blocking mechanism is used to block the wafer on the positioning jig.

9. The wafer handling apparatus of claim 8, wherein The moving assembly comprises a moving frame.

10. The wafer handling apparatus of claim 1, wherein The moving frame is provided with a moving module. One side of the moving frame is provided with a sliding rail. The sliding rail is arranged in parallel with the moving module. The moving seat is drivingly connected with the moving module. The sliding rail is provided with a sliding block. The sliding block is connected with the moving seat. The driving assembly is a multi-axis robot. The multi-axis robot is arranged on the moving seat. The multi-axis robot is drivingly connected with the carrying gripper. The carrying gripper comprises a carrying frame. The carrying frame is provided with a carrying plate. A plurality of air suction holes are arranged on the carrying plate. A vacuum suction nozzle is arranged on the air suction hole. The carrying frame is provided with an adjusting groove. The carrying plate is provided with an adjusting plate matched with the adjusting groove. The adjusting plate is arranged on the adjusting groove. One side of the adjusting groove is provided with an adjusting bolt. The adjusting plate is connected with the adjusting groove through the adjusting bolt. The adjusting plate is provided with a scale line. The carrying plate is provided with a slot. The positioning jig is provided with a positioning slot matched with the slot. The slot on the carrying plate is in an arc structure. The vacuum suction nozzle is arranged on the edge of the slot. The positioning jig comprises a jig plate. The jig plate is provided with a jig block. The jig block is provided with a support surface for placing the wafer. Both sides of the jig block are provided with a fixed groove. The support surface is provided with a positioning hole. A detection sensor for detecting the position of the wafer is arranged on the positioning hole. The material blocking mechanism comprises a material blocking frame. The material blocking frame is arranged on the loading rack. The material blocking frame is provided with a loading window. The loading window is arranged opposite to the positioning jig. The loading window is provided with a baffle assembly. The baffle assembly is used to open and close the loading window. The baffle assembly comprises a material blocking plate. The loading rack is provided with a lifting cylinder. The lifting cylinder is drivingly connected with the material blocking plate. Both sides of the material blocking plate are slidingly arranged on the guide frame. The utility model further comprises an electrostatic removal mechanism. The electrostatic removal mechanism comprises a mounting frame. The mounting frame is arranged on the loading rack. The mounting frame is provided with an electrostatic removal device. The electrostatic removal device is used to remove static electricity from the wafer gripped by the carrying gripper.

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