Semiconductor plastic package outer-frame-free frame precision clamping and releasing device

Abstract

The utility model discloses a semiconductor plastic package outer-frame-free frame precision clamping and placing device, which comprises an upper substrate, a lower substrate, a bridging column, a standing platform assembly, a clamping and placing hook assembly and a relative movement assembly, the standing platform assembly is provided with a profiling anti-settling groove and a positioning pin, and the clamping and placing hook assembly is connected with the upper substrate through the symmetrical linkage design of a sliding shaft, a sliding clamping block and a hook. The clamping precision is improved by combining the adjusting functions of a fixed positioning block and a limiting needle; the relative movement assembly controls sliding clamping blocks to move in the opposite direction or the back-to-back direction through linkage of a push rod, a spring and a linear guide rail, clamping and releasing of the frame are achieved, the device further comprises an anti-loosening pre-pressing device, continuous pressure is applied through a pre-pressing plate and a reset spring, and the frame is prevented from shaking or loosening. The clamping device has compactness and high-temperature adaptability, solves the clamping problem caused by small size and few positioning holes of a frame without an outer frame, remarkably improves clamping stability and operation efficiency, and is suitable for high-precision production requirements of a semiconductor injection molding process.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor molding technology, specifically relating to a precision clamping device for semiconductor molding without an outer frame. Background Technology

[0002] With the booming development of the semiconductor industry, the market demand for power semiconductor devices such as IGBTs (Insulated Gate Bipolar Transistors) is increasing, and their product forms are becoming increasingly diversified. Traditional IGBT products typically adopt a terminal block type (such as...). Figure 1 As shown in the image, this design facilitates the connection of external circuits, and its larger size provides sufficient space for clamping operations during the production process. However, with technological advancements and changing market demands, frameless IGBT products are gradually emerging. These products expose bare copper directly on the surface (e.g., Figure 2 As shown in the figure, it provides an alternative structure for external signals without the need for external terminal blocks.

[0003] In the semiconductor injection molding industry, mold temperatures are typically maintained at approximately 170°C to ensure the fluidity of the injection material and the quality of the molding. During this process, the IGBT frame needs to be accurately and stably placed into the mold. For traditional external lead frames, due to their large size, mature clamping devices are available on the market that can meet their material handling requirements. These clamping devices are rationally designed, easy to operate, and possess high stability and precision.

[0004] However, for frameless IGBT products, the small size and compact structure of the frame result in extremely limited clamping space. Furthermore, these frames have fewer positioning holes, and some are located at the bottom, increasing the difficulty of clamping. More importantly, due to the frame's light weight, it is prone to wobbling during movement after clamping, affecting positioning accuracy. Therefore, traditional injection molding clamping devices are inadequate for frameless frames and cannot meet their high-precision clamping requirements.

[0005] Given the aforementioned challenges, there is an urgent market need for a precision device specifically designed for clamping frameless frames. This device must be compact, possess high clamping accuracy, and be able to stably hold lightweight frames while preventing wobbling, ensuring that IGBT frames can be accurately and stably placed into the mold during injection molding, thereby meeting the semiconductor industry's demand for high-quality products. Summary of the Invention

[0006] The purpose of this invention is to provide a precision clamping device for semiconductor plastic-encapsulated plastic packages without an outer frame, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a precision clamping device for semiconductor plastic encapsulation without an outer frame, comprising an upper substrate, a lower substrate, bridging posts, a stationary platform assembly, a clamping hook assembly, and a relative motion assembly. The lower substrate is connected to the upper substrate via bridging posts, the stationary platform assembly is provided on the lower substrate, and the clamping hook assembly and the relative motion assembly are provided on the upper substrate.

[0008] A stationary platform assembly includes a stationary platform, on which a contoured anti-sinking groove is provided, and positioning pins are provided opposite to each other in the contoured sinking groove. Support columns are symmetrically provided at the four corners of the stationary platform, and guide pins are provided on the stationary platform between two of the support columns.

[0009] The clamping hook assembly includes sliding shafts symmetrically mounted below an upper base plate via fixing blocks, sliding clamping blocks symmetrically mounted between the two sliding shafts, and hooks mounted on the sliding clamping blocks;

[0010] The relative motion assembly includes a linear guide rail, a connecting rod, a connecting column, and a push rod. The lower end of the connecting column is fixed to a sliding gripping block. One end of the connecting rod is connected to the top of the connecting column, and the other end is connected to the linear guide rail. A spring is fitted on the push rod. Pushing the push rod causes a set of oppositely arranged sliding gripping blocks and hooks to move closer together, thereby gripping the frame. Pulling the push rod releases the frame.

[0011] Preferably, a fixed positioning block is also installed between the two sliding shafts, and a limiting pin is provided on the lower end face of the fixed positioning block, and the fixed positioning block is located between the two sliding clamping blocks.

[0012] Preferably, it also includes an anti-loosening pre-compression device, which includes a pre-compression plate, a slide rod, a return spring, and an oil-free bushing. The slide rod is fitted to the lower end of the upper base plate through the oil-free bushing, the pre-compression plate is mounted on the lower end face of the slide rod, and a return spring is fitted on the slide rod.

[0013] Preferably, the pre-pressing plate is a frame conformal plate. The pressing area between the conformal plate and the frame should not be too large, and the pressing position needs to be close to the hook position to reduce the return spring force on the frame.

[0014] Preferably, the front end of the push rod is mounted on the sliding clamping block via an L-shaped power connecting block, and a first push rod mounting seat and a second push rod mounting seat are mounted on the upper base plate, with a spring mounted on the push rod between the first push rod mounting seat and the L-shaped power connecting block.

[0015] Preferably, a limiting block is provided on the push rod, and a matching limiting slot is provided on the second push rod mounting seat.

[0016] Preferably, the push rod is provided with a first limiting ring and a second limiting ring, the first limiting ring and the second limiting ring are located between the first push rod mounting seat and the second push rod mounting seat, and the first limiting ring is close to the first push rod mounting seat and the second limiting ring is close to the second push rod mounting seat.

[0017] The technical effects and advantages of this utility model are as follows:

[0018] 1. High-precision positioning and stable clamping: The frame is guaranteed by both coarse and fine positioning through the contour anti-sinking groove and positioning pin of the stationary platform component. Combined with the adjustment function of the fixed positioning block and the limit pin, the clamping accuracy of the frameless frame is significantly improved, which solves the positioning difficulties caused by the small frame size and few positioning holes of the traditional device.

[0019] 2. Anti-swaying and anti-loosening design: The anti-loosening pre-compression device applies continuous pre-pressure after clamping the frame through a pre-compression plate and a return spring, ensuring that the frame fits tightly during movement and avoiding swaying or misalignment caused by the light weight of the frame. At the same time, the spring force assists the frame to fall into place quickly when released, improving operational stability.

[0020] 3. Highly efficient and controllable clamping mechanism: The relative motion component adopts a linkage design of push rod, spring and linear guide rail. When the push rod is pushed, the spring compression realizes the opposite movement of the sliding clamping block and hook, and the clamping action is fast and controllable; pulling the push rod can easily release the frame, simplifying the operation process and improving production efficiency.

[0021] 4. Compact structure and strong adaptability: The overall device has a compact structure through the modular design of upper and lower base plates and connecting columns, making it suitable for high-temperature mold environments (such as injection molding conditions of 170℃); the limiting block, limiting slot and limiting ring further constrain the push rod stroke, ensuring the reliability and durability of the device under complex working conditions.

[0022] 5. This utility model solves the problems of difficult positioning, easy shaking, and complicated operation in frameless IGBT frame clamping through multi-component collaborative design. It has the advantages of high precision, high stability, simple operation and strong environmental adaptability, and can significantly improve the yield and efficiency of semiconductor molding process. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a conventional IGBT structure;

[0024] Figure 2 This is a schematic diagram of a frameless IGBT structure;

[0025] Figure 3 This is a schematic diagram of the structure of this utility model;

[0026] Figure 4 This is a structural diagram of the stationary platform component;

[0027] Figure 5 This is a schematic diagram of the clamping hook assembly;

[0028] Figure 6 This is a schematic diagram of the structure of the relative motion component;

[0029] Figure 7 A schematic diagram of the pre-compression device to prevent loosening;

[0030] Figure 8 This is a partial detail view of the relatively moving components.

[0031] In the diagram: Guide pin-1, stationary platform-2, support column-3, positioning pin-4, sliding shaft-5, fixing block-6, sliding clamping block-7, hook-8, fixed positioning block-9, limit pin-10, linear guide rail-11, connecting rod-12, power connection block-13, push rod-14, spring-15, connecting column-16, sliding rod-17, preload plate-19, reset spring-18, oil-free bushing-20, contoured sinker-21, upper base plate-100, lower base plate-101, bridging column-102, first push rod mounting seat-401, second push rod mounting seat-402, limit block-403, limit slot-404, first limit ring-405, second limit ring-406. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] This utility model provides a precision clamping device for semiconductor plastic encapsulation without an outer frame. The technical solution of this utility model will be described in detail below with reference to the accompanying drawings and embodiments.

[0034] This utility model discloses a precision clamping device for semiconductor plastic-encapsulated frames without outer frames, mainly comprising an upper substrate 100, a lower substrate 101, a bridging post 102, a stationary platform assembly, a clamping hook assembly, and a relative motion assembly. The lower substrate 101 is connected to the upper substrate 100 through the bridging post 102 to ensure the stability and rigidity of the device. The stationary platform assembly is provided on the lower substrate 101 for placing and initially positioning the semiconductor frame to be clamped. The clamping hook assembly and the relative motion assembly are provided on the upper substrate 101 for achieving precise clamping and release of the frame.

[0035] The structure of the stationary platform component is as follows Figure 4As shown, it mainly includes a stationary platform 2, a contoured anti-sinking groove 21, positioning pins 4, and support columns 3. The stationary platform 2 is provided with a contoured anti-sinking groove 21, the shape of which matches the semiconductor frame to be clamped, for coarse positioning. Positioning pins 4 are provided opposite each other in the contoured anti-sinking groove 21 for further precise positioning of the frame. Support columns 3 are symmetrically provided at the four corners of the stationary platform 2 for supporting the entire stationary platform assembly. In addition, guide pins 1 are provided on the stationary platform 2 between two support columns 3 for guiding the placement position of the frame.

[0036] The structure of the clip hook assembly is as follows Figure 5 As shown, it mainly includes a sliding shaft 5, a fixing block 6, a sliding gripping block 7, a hook 8, a fixing positioning block 9, and a limiting pin 10. The sliding shaft 5 is symmetrically installed below the upper base plate 100 through the fixing block 6, and the sliding gripping block 7 is symmetrically installed between the two sliding shafts 5. The sliding gripping block 7 is equipped with a hook 8 for gripping the frame. The fixing positioning block 9 is located between the two sliding gripping blocks 7, and its lower end face is provided with a limiting pin 10 for further limiting the frame and improving the positioning accuracy during gripping.

[0037] The structure of the relative motion component is as follows Figure 6 , Figure 8 As shown, the frame mainly includes a linear guide rail 11, a connecting rod 12, an L-shaped power connecting block 13, a push rod 14, a spring 15, and a connecting column 16. The lower end of the connecting column 16 is fixed to the sliding clamping block 7. One end of the connecting rod 12 is connected to the top of the connecting column 16, and the other end is connected to the linear guide rail 11. The push rod 14 is mounted on the sliding clamping block 7 via the L-shaped power connecting block 13, and the spring 15 is sleeved on the push rod 14. A first push rod mounting seat 401 and a second push rod mounting seat 402 are mounted on the upper base plate 100. The spring 15 is mounted on the push rod 14 between the first push rod mounting seat 401 and the L-shaped power connecting block 13. When the push rod 14 is pushed, the push rod 14 drives a set of oppositely arranged sliding clamping blocks 7 and hooks 8 to move closer to each other, thereby clamping the frame. When the push rod 14 is pulled, the frame is released.

[0038] The device of this utility model also includes an anti-loosening pre-compression device, the structure of which is as follows: Figure 7 As shown, it mainly includes a pre-pressing plate 19, a sliding rod 17, a return spring 18, and an oil-free bushing 20. The sliding rod 17 is mounted on the lower end of the upper base plate 100 through the oil-free bushing 20, and the pre-pressing plate 19 is mounted on the lower end face of the sliding rod 17. The return spring 18 is sleeved on the sliding rod 17. When the frame is gripped, the sliding rod 17 is compressed by the weight of the entire device, and after the frame is gripped, the return spring 18 rebounds and firmly presses the frame, preventing the frame from shaking or misaligning during movement. When the frame is released, the spring force of the return spring 18 can also quickly push the frame into the mold, preventing the frame from falling out of place.

[0039] Operation process

[0040] When using this invention, the semiconductor frame to be clamped is first placed on the stationary platform assembly. Initial positioning is achieved using the contoured anti-sinking groove 21 and the positioning pin 4. Then, the push rod 14 is pushed, causing a set of opposing sliding clamping blocks 7 and hooks 8 to move towards each other, thus clamping the frame. After clamping, the entire device can be moved to transport the frame to the mold. To release the frame, simply pull the push rod 14. Due to the presence of the anti-loosening pre-pressure device, the frame is less prone to shaking or misalignment during movement, ensuring accurate positioning.

[0041] This invention relates to a precision clamping and releasing device for frameless semiconductor plastic-encapsulated frames. It features small size, high clamping accuracy, and the ability to stably clamp lightweight frames while preventing wobbling. Through the coordinated action of the stationary platform assembly, the clamping hook assembly, and the relative motion assembly, precise clamping and releasing of the frameless frame is achieved. Simultaneously, the anti-loosening pre-pressure device further enhances the stability and accuracy of clamping. This invention meets the semiconductor industry's demand for high-quality products and has broad market application prospects.

[0042] The applicant further declares that while the above embodiments illustrate the implementation method and apparatus structure of this utility model, this utility model is not limited to the above-described embodiments, meaning that this utility model must rely on the above methods and structures to be implemented. Those skilled in the art should understand that any improvements to this utility model, equivalent substitutions for the selected implementation methods, additions of steps, and selection of specific methods all fall within the protection and disclosure scope of this utility model.

[0043] This utility model is not limited to the above-described embodiments. All methods that use similar structures and methods to achieve the purpose of this utility model are within the protection scope of this utility model.

Claims

1. A precision clamping device for semiconductor plastic-encapsulated plastic packages without an outer frame, characterized in that: The utility model relates to a frame clamping and taking device, including upper substrate (100), lower substrate (101), bridging column (102), stationary platform component, clamping hook component and relative motion component, the lower substrate (101) is connected with upper substrate (100) through bridging column (102), and stationary platform component is equipped on the lower substrate (101), and clamping hook component and relative motion component are equipped on the upper substrate (100), The stationary platform component includes a stationary table (2), a profiling sink (21) is provided on the stationary table (2), a positioning needle (4) is oppositely provided in the profiling sink (21), and support columns (3) are symmetrically provided on the four corners of the stationary table (2), and a guide pin (1) is provided on the stationary table (2) between the two support columns (3); The clamping hook component includes sliding shafts (5) symmetrically installed below the upper substrate (100) through fixing blocks (6), sliding clamping blocks (7) are symmetrically installed between the two sliding shafts (5), and hooks (8) are installed on the sliding clamping blocks (7). The relative motion component includes linear guides (11), connecting rods (12), connecting columns (16) and push rods (14), the lower ends of the connecting columns (16) are fixed on the sliding clamping blocks (7), one end of each connecting rod (12) is connected to the top of each connecting column (16), the other end of each connecting rod (12) is connected to each linear guide (11), springs (15) are sleeved on the push rods (14), the push rods (14) are pushed, the push rods (14) drive a set of oppositely arranged sliding clamping blocks (7) and hooks (8) to move towards each other, thereby achieving the clamping of the frame, and the frame can be released by pulling the push rods (14).

2. The semiconductor plastic package frameless frame precision clamping device according to claim 1, wherein: Fixed positioning blocks (9) are also installed between the two sliding shafts (5), limit needles (10) are provided on the lower end faces of the fixed positioning blocks (9), and the fixed positioning blocks (9) are located between the two sliding clamping blocks (7).

3. The semiconductor plastic package frameless frame precision clamping device according to claim 1, characterized in that: The utility model also includes a loosening prevention and pre-pressing device, which includes a pre-pressing plate (19), a sliding rod (17), a return spring (18) and an oil-free bushing (20), the sliding rod (17) is installed at the lower end of the upper substrate (100) through the oil-free bushing (20), the pre-pressing plate (19) is installed on the lower end face of the sliding rod (17), and the return spring (18) is sleeved on the sliding rod (17).

4. The semiconductor plastic package frameless frame precision clamping device according to claim 3, characterized in that: The pre-pressing plate (19) is a frame contour plate.

5. The semiconductor plastic package frameless frame precision clamping device according to claim 1, characterized in that: The front end of the push rod (14) is installed on the sliding clamping block (7) through an L-shaped power connection block (13), a first push rod mounting seat (401) and a second push rod mounting seat (402) are installed on the upper substrate (100), and the spring (15) is installed on the push rod (14) between the first push rod mounting seat (401) and the L-shaped power connection block (13).

6. The semiconductor plastic package frameless frame precision clamping device according to claim 5, characterized in that: Limiting blocks (403) are provided on the push rods (14), and limiting clamping grooves (404) matching the limiting blocks (403) are formed in the second push rod mounting seat (402).

7. The semiconductor plastic package frameless frame precision clamping device according to claim 5, characterized in that: First limit ring (405) and second limit ring (406) are arranged on the push rod (14), the first limit ring (405) and second limit ring (406) are arranged between first push rod mounting seat (401) and second push rod mounting seat (402), and the first limit ring (405) is close to first push rod mounting seat (401), and the second limit ring (406) is close to second push rod mounting seat (402) between.

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