Electrostatic chuck additionally provided with yttrium oxide pvd coating

By adding a yttrium oxide PVD coating to the electrostatic chuck and optimizing the gas channel structure, the problem of the inflexible adjustment of the back-blowing gas channel design of the electrostatic chuck was solved, achieving precise airflow control and improving the temperature stability and accuracy of wafer processing.

CN223979074UActive Publication Date: 2026-03-06WUXI YIQIA HIGH TECH CO LTD
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Patent Information

Application Number
CN202520615417.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-03
Publication Date
2026-03-06
Estimated Expiration
2035-04-03

AI Technical Summary

Technical Problem

The existing electrostatic chuck back-blowing air channel design cannot be flexibly adjusted, resulting in poor temperature control in different wafer processing processes, making it difficult to meet high precision requirements.

Method used

A yttrium oxide PVD coating is added to the electrostatic chuck, and the air passage connection structure is optimized by using a sealing disc and a connecting limiter to achieve precise adjustment of the airflow quantity and distribution. Combined with a motor-driven sealing disc rotation, the opening and closing state of the air passage is controlled.

Benefits of technology

It achieves flexible and precise airflow control, and can dynamically adjust wafer temperature according to different processing requirements, thereby improving processing accuracy and yield, and enhancing the equipment's adaptability to complex environments.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an electrostatic chuck, in particular to an electrostatic chuck additionally provided with an yttrium oxide pvd coating, which comprises a plugging disc rotationally arranged between a base and an insulating seat, and the plugging disc can rotate between the base and the insulating seat and is used for adjusting the communication state of an air passage between the base and the insulating seat. According to the utility model, the back blowing air channel is optimally arranged on the electrostatic chuck, so that the quantity and the distribution condition of the air flow can be accurately adjusted, the air flow control is more flexible and accurate, specifically, the improved design can be dynamically adjusted according to different temperature requirements in the wafer processing process, and the working efficiency is improved. According to the technical scheme, the temperature of the wafer is kept uniform and stable all the time in the processing process, and the direction and strength of the airflow can be adjusted in real time according to different processing links and environmental conditions, so that more reasonable and efficient heat exchange is realized, and the negative influence on the quality of the wafer caused by over-high or over-low temperature is avoided.
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Description

Technical Field

[0001] This utility model relates to an electrostatic chuck, specifically an electrostatic chuck with an additional yttrium oxide PVD coating. Background Technology

[0002] An electrostatic chuck is a precision device that uses electrostatic adsorption to fix wafers. It is widely used in semiconductor manufacturing, flat panel display, photolithography and other processes. Its working principle is based on the attraction of opposite charges, i.e., Coulomb force. When the electrostatic chuck is energized, its electrode layer generates a specific electric field distribution. If a wafer with a uniform internal charge is placed on the chuck, the charge inside the wafer will be redistributed under the action of the electric field. The positive and negative charges will move towards the electrodes with opposite polarities. The attraction of charges formed in this process, i.e., Coulomb force, is enough to firmly adsorb the wafer onto the surface of the electrostatic chuck.

[0003] In semiconductor manufacturing, electrostatic chucks are used to support and hold wafers to ensure their stability during processing. However, wafers generate heat during etching and other processes, which can cause temperature rises, potentially affecting processing accuracy and yield. Therefore, electrostatic chucks need to effectively control the temperature of the wafers they hold.

[0004] Currently, electrostatic chucks are typically equipped with back-blowing gas channels, which regulate wafer temperature by blowing gas (such as helium or argon) onto the back of the wafer. This gas can quickly transfer heat, thereby achieving uniform control of wafer temperature. However, existing back-blowing gas channel designs have certain limitations. Specifically, the number and distribution of back-blowing gas channels are usually fixed and cannot be flexibly adjusted according to different wafer processing requirements. This results in poor performance when controlling the temperature of different wafers, insufficient airflow adjustment, and difficulty in meeting the requirements of high-precision processing. Utility Model Content

[0005] The purpose of this invention is to provide an electrostatic chuck with an additional yttrium oxide PVD coating to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An electrostatic chuck with an added yttrium oxide PVD coating includes a base, a base mounted on the base, and an insulating seat mounted on the base. It also includes a gas passage communication structure disposed between the base and the insulating seat, the gas passage communication structure comprising:

[0008] Rotate the sealing disc between the base and the insulating seat. The sealing disc can rotate between the base and the insulating seat to adjust the communication status of the air passage between the base and the insulating seat.

[0009] The connecting limiting members located on both sides of the sealing disc are respectively connected to the base and the insulating base. The connecting limiting members are used to make contact with the sealing disc when the sealing disc rotates, thereby controlling the specific number and distribution of airways.

[0010] An electrostatic chuck with an added yttrium oxide PVD coating as described above: the surface of the insulating base is uniformly coated with an etching-resistant layer.

[0011] An electrostatic chuck with an added yttrium oxide PVD coating as described above: the etching-resistant layer is a yttrium oxide PVD layer.

[0012] An electrostatic chuck with an added yttrium oxide PVD coating as described above: a plurality of first air passages are respectively opened on the base.

[0013] An electrostatic chuck with an added yttrium oxide PVD coating as described above: the surface of the insulating base is provided with a back-blowing air channel, and the sealing plate located at the back-blowing air channel is provided with a third air channel corresponding to the first air channel.

[0014] An electrostatic chuck with an added yttrium oxide PVD coating as described above: a motor is mounted on the base, and the output shaft of the motor protrudes from the surface of the base;

[0015] The output shaft of the motor is fixed at the center of the sealing disc and is used to drive the sealing disc to rotate on the base.

[0016] An electrostatic chuck with an added yttrium oxide PVD coating as described above: the sealing disc has multiple second air passages respectively.

[0017] An electrostatic chuck with an added yttrium oxide PVD coating as described above: the connecting limiting member includes a connector that abuts against the sealing disc, a limiting disc fixed on the connector, a plug-in cylinder fixed on the limiting disc, and a spring sleeved on the plug-in cylinder.

[0018] The connector engages with the second airway.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] By optimizing the back-blowing air duct on the electrostatic chuck, the quantity and distribution of airflow can be precisely adjusted. This makes airflow control more flexible and accurate. Specifically, this improved design allows for dynamic adjustment during wafer processing to meet different temperature requirements, ensuring that the wafer maintains a uniform and stable temperature throughout the process. It can also adjust the direction and intensity of airflow in real time according to different processing stages and environmental conditions, thereby achieving more rational and efficient heat exchange and avoiding the negative impact of excessively high or low temperatures on wafer quality.

[0021] Especially in the precision processing of wafers, the stability of temperature control is directly related to the processing accuracy and yield of wafers. By optimizing the back-blowing air duct, not only is the heat exchange efficiency improved, but the adaptability of the equipment to complex processing tasks is also enhanced. For example, the airflow distribution can be precisely adjusted in high or low temperature environments to adapt to the processing needs of different wafers. Attached Figure Description

[0022] Figure 1 A schematic diagram of the structure of an electrostatic chuck with an added yttrium oxide PVD coating.

[0023] Figure 2 A schematic diagram of the structure of an electrostatic chuck with an added yttrium oxide PVD coating.

[0024] Figure 3 A schematic diagram of the electrostatic chuck with an added yttrium oxide PVD coating, viewed from below after disassembly.

[0025] Figure 4 A schematic diagram of the base and pedestal in an electrostatic chuck with an added yttrium oxide PVD coating.

[0026] Figure 5 A schematic diagram of the sealing disk in an electrostatic chuck with an added yttrium oxide PVD coating.

[0027] Figure 6 A schematic diagram of the insulating base in an electrostatic chuck with an added yttrium oxide PVD coating.

[0028] Figure 7 A top-view structural diagram of the insulating base in an electrostatic chuck with an added yttrium oxide PVD coating.

[0029] Figure 8 A schematic diagram of the connecting and limiting components in an electrostatic chuck with an added yttrium oxide PVD coating.

[0030] Figure 9 A schematic diagram of the structure of the yttrium oxide PVD layer on the surface of the insulating base in an electrostatic chuck with an added yttrium oxide PVD coating.

[0031] Figure 10 A schematic diagram of the insulating base in an electrostatic chuck with an added yttrium oxide PVD coating.

[0032] Figure 11 A schematic diagram of the sealing disk in an electrostatic chuck with an added yttrium oxide PVD coating.

[0033] Figure 12 A schematic diagram of the back-blowing air passages distributed in a manner A in an electrostatic chuck with an added yttrium oxide PVD coating.

[0034] Figure 13 A schematic diagram of the back-blowing air passages distributed in a B-mode in an electrostatic chuck with an added yttrium oxide PVD coating.

[0035] Figure 14 A schematic diagram of the back-blowing air channels distributed in a C-shape in an electrostatic chuck with an added yttrium oxide PVD coating.

[0036] Figure 15 A schematic diagram of the back-blowing air passages distributed in a D-mode in an electrostatic chuck with an added yttrium oxide PVD coating.

[0037] Figure 16 A schematic diagram of the back-blowing air passages distributed in an E-mode in an electrostatic chuck with an added yttrium oxide PVD coating.

[0038] Figure 17 A schematic diagram of the back-blowing air channels distributed in an F-shaped manner in an electrostatic chuck with an added yttrium oxide PVD coating.

[0039] Figure 18 A schematic diagram of the back-blowing air passages distributed in a G-mode in an electrostatic chuck with an added yttrium oxide PVD coating.

[0040] In the diagram: 1. Base; 2. Base plate; 3. First air passage; 4. Sealing plate; 5. Second air passage; 6. Motor; 7. Insulating seat; 8. Back-blowing air passage; 9. Third air passage; 10. Connector; 11. Limiting plate; 12. Insertion tube; 13. Spring; 14. Yttrium oxide PVD layer. Detailed Implementation

[0041] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0042] Please see Figures 1-7In this embodiment of the present invention, an electrostatic chuck with an added yttrium oxide PVD coating includes a base 1, a base 2 mounted on the base 1, and an insulating seat 7 mounted on the base 2. It also includes an air passage communication structure disposed between the base 2 and the insulating seat 7, the air passage communication structure comprising:

[0043] Rotate the sealing disc 4 between the base 2 and the insulating seat 7. The sealing disc 4 can rotate between the base 2 and the insulating seat 7 to adjust the communication state of the air passage between the base 2 and the insulating seat 7.

[0044] The connecting limiting members located on both sides of the sealing disc 4 are respectively connected to the base 2 and the insulating base 7. The connecting limiting members are used to make contact with the sealing disc 4 when the sealing disc 4 rotates, thereby controlling the specific number and distribution of airways.

[0045] In this embodiment, the sealing disc 4 rotates between the base 2 and the insulating seat 7. During the rotation, the connection state of the air passages provided on the base 2 and the insulating seat 7 can be precisely adjusted. As the sealing disc 4 rotates, the opening and closing state of the air passages will change accordingly, thereby achieving precise control of the airflow. Specifically, when the sealing disc 4 rotates, it will interact with the connection limiting components on the base 2 and the insulating seat 7. The connection limiting components can restrict the connection of the air passages, ensuring that the opening and closing of the air passages meet the preset effect. Both the base 2 and the insulating seat 7 on both sides of the sealing disc 4 are equipped with connection limiting components. The connection limiting components play a crucial role in the rotation adjustment process of the sealing disc 4, ensuring that the distribution and quantity of airflow are precisely controlled.

[0046] This design allows for flexible adjustment of the airflow path and flow rate under different working conditions, thereby enabling precise control of the airflow connection between the base 2 and the insulating base 7. This adjustment mechanism is particularly suitable for wafer fabrication, allowing for precise control of the airflow intensity and distribution throughout the entire process based on actual needs, thus better controlling the wafer temperature.

[0047] Please see Figure 9 As a further embodiment of this utility model, the surface of the insulating base 7 is uniformly coated with an etch-resistant layer.

[0048] The etching-resistant layer is a yttrium oxide PVD layer 14.

[0049] In this embodiment, a yttrium oxide PVD layer 14 is uniformly coated on the surface of the insulating base 7. This coating is precisely adhered to the surface of the insulating base 7 by physical vapor deposition (PVD) technology to form a uniform and dense protective film. As a ceramic material with excellent performance, yttrium oxide can significantly improve the etching resistance of the insulating base 7. This means that during the processing, the yttrium oxide PVD layer 14 can effectively resist the erosion from chemicals or etching environments, and prevent the surface of the insulating base 7 from being damaged or degraded due to prolonged contact with corrosive gases or chemical reagents.

[0050] Please see Figure 2 and Figure 4 As a further embodiment of this utility model, a plurality of first air passages 3 are respectively provided on the base 2.

[0051] In this embodiment, the base 2, as an important component of the entire system, is closely connected to the external airflow supply equipment and undertakes the key task of airflow input. Through this connection, the base 2 can receive a stable airflow supply from the outside, providing a sufficient air source for subsequent airflow adjustment and distribution. In this process, the first air passage 3 in the base 2 plays a crucial role, and the airflow can flow out through the first air passage 3 to realize the supply and use of airflow.

[0052] Please see Figure 6 As a further embodiment of this utility model, the surface of the insulating base 7 is provided with a back-blowing air channel 8, and the sealing plate 4 located at the back-blowing air channel 8 is provided with a third air channel 9 corresponding to the first air channel 3.

[0053] In this embodiment, the third air passage 9 is located at the back-blowing air passage 8, specifically on the surface of the sealing disk 4, to ensure that when the gas flows out through the third air passage 9, the gas can flow smoothly through the back-blowing air passage 8 and diffuse to a wider area. This gas flow path not only ensures the effective transmission of gas, but also enables efficient cooling of the wafer.

[0054] In particular, when the sealing disk 4 is used to support the wafer, the synergistic effect of the third air channel 9 and the back-blowing air channel 8 allows the gas to be blown evenly onto the wafer surface, thereby achieving large-area cooling of the wafer to avoid thermal damage or wafer deformation caused by excessive temperature.

[0055] Please see Figure 5 As a further embodiment of this utility model, a motor 6 is mounted on the base 1, and the output shaft of the motor 6 protrudes from the surface of the base 2;

[0056] The output shaft of the motor 6 is fixed at the center of the sealing disc 4, and is used to drive the sealing disc 4 to rotate on the base 2.

[0057] The sealing disc 4 is provided with multiple second air passages 5.

[0058] In this embodiment, the motor 6 is installed inside the base 1, and its output shaft protrudes from the base 2 and is fixedly connected to the center of the sealing disc 4, so that when the motor 6 starts to operate, it can drive the sealing disc 4 to rotate on the surface of the base 2. Multiple second air passages 5 are precisely opened on the sealing disc 4. The second air passages 5 cooperate with the first air passage 3 opened on the base 2 and the third air passage 9 provided on the insulating seat 7. As the sealing disc 4 rotates, the multiple second air passages 5 will connect with the first air passage 3 and the third air passage 9 one by one in sequence.

[0059] This design not only enhances the flexible adjustment function of the airflow inside the system, but also ensures a high degree of coordination between different air passages. The rotation of the sealing disc 4 enables precise docking and flow control between air passages, and can adjust the distribution and quantity of airflow according to needs.

[0060] Please see Figures 7-18 As a further embodiment of this utility model, the connecting limiting member includes a connector 10 that abuts against the sealing disc 4, a limiting disc 11 fixed on the connector 10, a plug-in cylinder 12 fixed on the limiting disc 11, and a spring 13 sleeved on the plug-in cylinder 12.

[0061] The connector 10 engages with the second airway 5.

[0062] In this embodiment, when the sealing disc 4 is rotated for adjustment, it can control the contact between the second air passage 5 and the connector 10. The sealing disc 4 is designed with multiple second air passages 5, and each time the sealing disc 4 rotates by 15 degrees, the second air passages 5 at different positions will connect with the connector 10. Through this design, the connection between the connectors 10 on both sides of the sealing disc 4 creates a passage between the corresponding second air passage 5 and the first air passage 3 on the base 2, and the third air passage 9 on the insulating base 7, thus realizing the supply and use of airflow. Furthermore, there are seven different ways to change the distribution and quantity of this airflow, such as... Figures 12 to 18 As shown, the dashed line indicates that the vent is blocked, while the solid line indicates that the vent is open. By adjusting the rotation angle of the sealing disc 4, the distribution and quantity of airflow can be flexibly adjusted.

[0063] The connector 10 is designed with a hemispherical structure. Therefore, when the motor 6 drives the sealing disc 4 to rotate 15 degrees each time, if there is a slight difference in the rotation of the sealing disc 4, causing the connector 10 to not be precisely aligned with the second air passage 5, the connector 10 will extend towards the sealing disc 4 due to the compression and rebound force of the spring 13. Even if the alignment position of the second air passage 5 and the connector 10 is not completely and accurately aligned, the rebound force of the spring 13 will still cause the sealing disc 4 to continue to rotate slightly until the connector 10 is fully inserted into the second air passage 5, thereby achieving smooth air passage connection.

[0064] In this design, spring 13 plays a crucial role. It not only ensures that connector 10 retains its elasticity after motor 6 stops running, pushing sealing disc 4 for fine-tuning to avoid deviations during airflow adjustment, but also ensures that sealing disc 4 maintains a stable position during airflow, preventing misalignment of air passages due to motion errors. Thus, sealing disc 4 maintains precise positioning throughout airflow, ensuring the efficiency and stability of the airflow channel, further improving the reliability and accuracy of the overall system. This design optimizes the flexibility and precision of airflow control. Driven by motor 6, sealing disc 4 can precisely adjust the coordination of each air passage, while spring 13 effectively solves the problem of minor errors in the connection between air passages, ensuring the stability and efficiency of the entire system during airflow supply.

[0065] The above embodiments are exemplary and not restrictive. Therefore, without departing from the spirit or basic characteristics of this utility model, any technical solutions that can be implemented in other specific forms are included in this utility model.

Claims

1. An electrostatic chuck provided with a yttrium oxide PVD coating, comprising a base (1), a susceptor (2) mounted on the base (1), and an insulating seat (7) mounted on the susceptor (2), characterized in that, Also include the airway communication structure arranged between the base (2) and the insulating seat (7), the airway communication structure includes: The sealing disc (4) is rotatable between the base (2) and the insulating seat (7), and is used for adjusting the communication state of the airway between the base (2) and the insulating seat (7); The communication limiting piece is connected to the base (2) and the insulating seat (7) on both sides of the sealing disc (4), respectively, and is used for abutting and communicating with the sealing disc (4) when the sealing disc (4) rotates, so as to control the specific number and distribution of the airway.

2. The electrostatic chuck with a yttrium oxide PVD coating according to claim 1, characterized in that, The surface of the insulating seat (7) is uniformly coated with an etching-resistant layer.

3. The electrostatic chuck with a yttrium oxide PVD coating according to claim 2, characterized in that, The etching-resistant layer is a yttrium oxide pvd layer (14).

4. The electrostatic chuck with a yttrium oxide PVD coating of claim 1, wherein, A plurality of first airways (3) are formed on the base (2), respectively.

5. The electrostatic chuck with a yttrium oxide PVD coating of claim 4, wherein, The surface of the insulating seat (7) is provided with a back blowing airway (8), and the sealing disc (4) at the position of the back blowing airway (8) is provided with a third airway (9) corresponding to the first airway (3), respectively.

6. The electrostatic chuck with a yttrium oxide PVD coating of claim 1, wherein, The base (1) is provided with a motor (6), and the output shaft of the motor (6) protrudes from the surface of the base (2); The output shaft of the motor (6) is fixed at the center of the sealing disc (4), and is used for driving the sealing disc (4) to rotate on the base (2).

7. The electrostatic chuck with a yttrium oxide PVD coating of claim 1, wherein, A plurality of second airways (5) are formed on the sealing disc (4), respectively.

8. The electrostatic chuck with a yttrium oxide PVD coating of claim 7, wherein, The communication limiting piece includes a connecting head (10) abutting against the sealing disc (4), a limiting disc (11) fixed on the connecting head (10), a plug-in barrel (12) fixed on the limiting disc (11), and a spring (13) sleeved on the plug-in barrel (12); The connecting head (10) is matched with the second airway (5) to abut.