Wafer bearing single body and wafer clamping device

Abstract

The utility model relates to the field of wafer detection equipment, in particular to a wafer bearing single body and a wafer clamping device, the wafer bearing single body comprises a horizontal moving mechanism and a vertical moving mechanism, the horizontal moving mechanism comprises a horizontal driving piece and a horizontal sliding block, the horizontal sliding block reciprocates along the radial direction of a wafer under the action of the horizontal driving piece, and the vertical moving mechanism is used for clamping the wafer. The vertical moving mechanism is arranged on the horizontal sliding block and comprises a vertical driving piece and a vertical sliding block, and the vertical sliding block ascends and descends on the horizontal sliding block in the vertical direction in a reciprocating mode under the action of the vertical driving piece. The vertical sliding block is fixedly connected with a clamping jaw used for clamping a wafer. The wafer clamping device comprises a plurality of wafer bearing single bodies and a rotary table, and the wafer bearing single bodies are circumferentially distributed on the rotary table. According to the utility model, the clamping jaw can be independently controlled and the wafer can be stably supported, and the clamping jaw can be independently withdrawn, so that the edge area of the wafer is completely exposed, and meanwhile, the stability of wafer supporting is not influenced.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection equipment, and in particular to a wafer carrier and wafer clamping device. Background Technology

[0002] In semiconductor manufacturing, wafer edge inspection is necessary to improve yield and meet advanced process requirements. Wafer inspection requires fixtures to clamp and position the wafer, and continuous rotation is required to inspect multiple edge regions or the entire edge. However, in existing technologies, the fixture supports and clamps the wafer from the bottom, causing occlusion at the bottom edge, preventing the inspection process from being completed in a single rotation. To address this issue, existing technologies use a clamping mechanism to lift and rotate the wafer, then place it back to inspect the occluded areas. However, this improved solution is complex in structure and operation, time-consuming, and requires complex processing of multiple inspection results to obtain a complete edge inspection result, resulting in high inspection costs. Utility Model Content

[0003] This utility model aims to solve the above problems and provides a wafer carrier and wafer clamping device, the technical solution of which is as follows:

[0004] A wafer carrier unit includes a horizontal moving mechanism and a vertical moving mechanism. The horizontal moving mechanism includes a horizontal driving member and a horizontal sliding block. The horizontal sliding block reciprocates radially along the wafer under the action of the horizontal driving member. The vertical moving mechanism is disposed on the horizontal sliding block and includes a vertical driving member and a vertical sliding block. The vertical sliding block reciprocates vertically along the horizontal sliding block under the action of the vertical driving member. A clamping jaw for holding the wafer is fixedly connected to the vertical sliding block.

[0005] Based on the above scheme, a limiting mechanism is also included. The limiting mechanism includes a threaded limiting nut and a limiting stud. The limiting stud is vertically disposed on the horizontal sliding block and threadedly connected to the horizontal sliding block. When the vertical sliding block moves to the limit position, the bottom end of the limiting stud abuts against the vertical sliding block.

[0006] Preferably, the gripper includes a receiving arm extending radially outward along the wafer, the outer end of the receiving arm extending upward to form a clamping block, and the clamping block abutting against the outer edge of the wafer.

[0007] Based on the above scheme, the clamping block is provided with a flexible device along the wafer radial direction on the wafer side.

[0008] Based on the above scheme, the flexible device is a spring or a buffer sheet.

[0009] Preferably, the horizontal moving mechanism further includes a horizontal slide rail, and the vertical moving mechanism further includes a vertical slide rail. The horizontal slide rail is arranged radially along the wafer, and the horizontal sliding block is movably arranged on the horizontal slide rail. The vertical slide rail is fixedly arranged on the horizontal sliding block in the vertical direction, and the vertical sliding block is slidably arranged on the vertical slide rail.

[0010] Preferably, the horizontal moving mechanism further includes a first horizontal travel switch and a second horizontal travel switch, and a horizontal sliding member is fixedly connected to the horizontal sliding block; when the horizontal sliding block retracts inward to a first predetermined position, the horizontal sliding member enters the detection range of the first horizontal travel switch, at which point the inner side of the gripper abuts against the edge of the wafer, and the horizontal drive stops operating; when the horizontal sliding block retracts inward to a second predetermined position, the horizontal sliding member enters the detection range of the second horizontal travel switch, at which point the bottom and side surfaces of the wafer at the gripper support position are exposed; the vertical moving mechanism further includes a vertical displacement sensor, when the vertical sliding block moves upward to a third predetermined position, the vertical displacement sensor detects the position signal of the vertical sliding block, at which point the gripper abuts against the bottom surface of the wafer, and the vertical drive stops operating.

[0011] A wafer clamping device includes the aforementioned wafer carrier unit and a turntable, wherein the turntable is arranged in a horizontal direction and the number of the carrier units is multiple and distributed circumferentially on the turntable.

[0012] Based on the above scheme, the number of the supporting units is 5, and they are evenly distributed circumferentially on the turntable.

[0013] Preferably, it further includes a rotary drive component that drives the turntable to rotate in a horizontal plane.

[0014] The beneficial effects of this invention are as follows: the carrier unit can be controlled independently and stably support the wafer. During the wafer edge detection process, the carrier unit at the detection position can retract its grippers independently, thereby completely exposing the wafer edge area without affecting the stability of the wafer support or causing detection result errors due to wafer position displacement. The entire edge area of ​​the wafer can be detected with a single rotation, without the need for coordination with other equipment, effectively simplifying the device structure, shortening the detection time, and improving the accuracy and quality of the detection results. Attached Figure Description

[0015] Figure 1 : Schematic diagram of the installation state of the wafer carrier unit of this utility model;

[0016] Figure 2 : Schematic diagram of the wafer carrier unit structure of this utility model;

[0017] Figure 3 : Another structural diagram of the wafer carrier unit of this utility model;

[0018] Figure 4 : Schematic diagram of the limiting mechanism of this utility model;

[0019] Figure 5 : Schematic diagram of the wafer clamping device of this utility model;

[0020] Figure 6 : Schematic diagram of the wafer bearing state of this utility model. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0023] In the description of this utility model, it should be understood that the terms "center," "length," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," and "inner," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] like Figure 1 and Figure 3 As shown, a wafer carrier unit includes a horizontal moving mechanism and a vertical moving mechanism. The horizontal moving mechanism includes a horizontal driving component 31 and a horizontal sliding block 33. The horizontal sliding block 33 reciprocates radially along the wafer 6 under the action of the horizontal driving component 31. The vertical moving mechanism is disposed on the horizontal sliding block 33 and includes a vertical driving component 41 and a vertical sliding block 43. The vertical sliding block 43 reciprocates vertically along the horizontal sliding block 33 under the action of the vertical driving component 41. The horizontal driving component 31 and the vertical driving component 41 can be linear drive elements such as motors, cylinders, and hydraulic cylinders. Preferably, the horizontal moving mechanism further includes a horizontal slide rail 32, and the vertical moving mechanism further includes a vertical slide rail 44. The horizontal slide rail 32 is arranged radially along the wafer 6, and the horizontal sliding block 33 is movably arranged on the horizontal slide rail 32. The vertical slide rail 44 is fixedly arranged on the horizontal sliding block 33 in the vertical direction, and the vertical sliding block 43 is slidably arranged on the vertical slide rail 44. The horizontal slide rail 32 and the vertical slide rail 44 ensure the stability and accuracy of the movement path of the horizontal sliding block 33 and the vertical sliding block 43.

[0026] A gripper 5 for holding the wafer 6 is fixedly connected to the vertical sliding block 43. The gripper 5 includes a receiving arm extending radially outward along the wafer 6. The outer end of the receiving arm extends upward to form a clamping block, which abuts against the outer edge of the wafer 6. The receiving arm supports the wafer 6 from the bottom, and combined with the abutting action of the clamping block against the edge of the wafer 6, it completes the support and positioning of the wafer 6.

[0027] Because the edge of wafer 6 is relatively thin, excessive clamping force during radial clamping at the edge can easily cause damage such as chipping, while insufficient clamping force may lead to unstable positioning and clamping, wafer misalignment, and other problems. Therefore, a flexible device is provided radially along wafer 6 on the side of the clamping block facing wafer 6 to improve the clamping effect while preventing damage to the wafer edge. The flexible device can be a spring, buffer sheet, or other structure that undergoes dimensional changes such as elastic deformation along the radial direction of wafer 6.

[0028] The supporting unit also includes a limiting mechanism, such as Figure 4As shown, the limiting mechanism includes a threaded limiting nut 45 and a limiting stud 46. The limiting nut 45 is sleeved on the limiting stud 46 to position it. The limiting stud 46 is vertically mounted on the horizontal sliding block 33 and threadedly connected to it. When the vertical sliding block 43 moves to its limit position, the bottom end of the limiting stud 46 abuts against the vertical sliding block 43. By rotating the limiting stud 46, the height can be adjusted, limiting the vertical sliding block 43 and the gripper 5 to their limit positions when they reach the top. This allows for leveling operations when the bearing device carries the wafer 6, ensuring the accuracy of the wafer 6's horizontal position and angle.

[0029] The horizontal movement mechanism also includes a first horizontal travel switch 35 and a second horizontal travel switch 36. A horizontal sliding member 34 is fixedly connected to the horizontal sliding block 33. When the horizontal sliding block 33 retracts inward to a first predetermined position, the horizontal sliding member 34 enters the detection range of the first horizontal travel switch 35. At this time, the inner side of the gripper 5 abuts against the edge of the wafer 6, and the horizontal drive member 31 stops operating. When the horizontal sliding block 33 retracts inward to a second predetermined position, the horizontal sliding member 34 enters the detection range of the second horizontal travel switch 36. At this time, the bottom and side surfaces of the wafer 6 at the gripper 5 support position are exposed, and the horizontal drive member 31 stops operating. The vertical movement mechanism also includes a vertical displacement sensor 42. When the vertical sliding block 43 moves upward to a third predetermined position, the vertical displacement sensor 42 detects the position signal of the vertical sliding block 43. At this time, the top surface of the gripper 5 receiving arm abuts against the bottom surface of the wafer 6, and the vertical drive member 41 stops operating.

[0030] A wafer clamping device, such as Figure 5 and Figure 6 As shown, the wafer carrier unit mentioned above also includes a turntable 22, which is arranged horizontally. The number of carrier units is multiple and they are circumferentially distributed on the turntable 22. Preferably, the number of carrier units is 5 and they are evenly distributed on the turntable 22, thereby achieving stable support for the wafer 6 and ensuring that the wafer 6 can still maintain a stable position and will not deflect or shake when any one of the carrier units does not provide a support function.

[0031] It also includes a rotary drive component 21, which drives the turntable 22 to rotate in the horizontal plane, thereby facilitating the detection of various positions on the edge of the wafer 6; the rotary drive component 21 can be a rotary drive element such as a motor, gear mechanism, etc.

[0032] The testing process includes the following steps:

[0033] S1. Adjust the relative positions of each bearing unit so that each gripper 5 is in the same horizontal plane, and the center of the circle formed by the gripping positions of each gripper 5 is coaxial with the turntable 22.

[0034] S2. Place the wafer 6 to be inspected on each of the jaws 5 of the carrier device, with the inner side of each jaw 5 abutting against the edge of the wafer 6;

[0035] S3. Rotary drive component 21 drives turntable 22 to rotate;

[0036] S4. When a certain gripper 5 moves toward the detection position and there is a predetermined distance from the detection position, the gripper 5 moves downward and retracts radially inward, exposing the bottom and side surfaces of the wafer 6 at the gripper 5 support position to the detection range of the detection mechanism.

[0037] S5. After the inspection mechanism completes the inspection of the wafer 6 at this location, the gripper 5 extends outward radially and moves upward until it returns to its original position and abuts against the gripper 5.

[0038] S6. Repeat steps S4 and S5 until the area to be inspected at the edge of wafer 6 is inspected.

[0039] In steps S2 and S5, when the horizontal sliding block 33 retracts inward to the first predetermined position, the first horizontal travel switch 35 is triggered, and the horizontal drive 31 stops operating. At this time, the inner side of the gripper 5 abuts against the edge of the wafer 6, completing the gripping action of the wafer 6. When the vertical sliding block 43 moves upward to the third predetermined position, the gripper 5 abuts against the wafer 6, specifically, the top surface of the gripper 5 receiving arm abuts against the bottom surface of the wafer 6, and the vertical drive 41 stops operating, ensuring the horizontal state of the wafer 6.

[0040] In step S4, after the gripper 5 extends outward radially and moves downward, it retracts radially inward to the second predetermined position, triggering the second horizontal travel switch 36. At this time, the gripper 5 moves out of the detection range of the detection mechanism, and the gripper 5 does not interfere with the detection mechanism. The horizontal drive 31 stops moving, thereby preventing the gripper 5 from colliding with the detection mechanism during rotation and ensuring that the detection mechanism can perform complete detection or sampling of the wafer edge area.

[0041] By setting various limit switches and sensors, the movement range of each actuator can be limited, and corresponding action signals can be sent to the host computer to accurately monitor and control the detection process.

[0042] The present invention has been described above by way of example, but the present invention is not limited to the specific embodiments described above. Any modifications or variations made based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A wafer carrier unit, characterized by, The horizontal moving mechanism comprises a horizontal driving member (31) and a horizontal sliding block (33), the horizontal sliding block (33) moves along the wafer (6) radially under the action of the horizontal driving member (31), the vertical moving mechanism is arranged on the horizontal sliding block (33) and comprises a vertical driving member (41) and a vertical sliding block (43), the vertical sliding block (43) moves up and down along the vertical direction on the horizontal sliding block (33) under the action of the vertical driving member (41); the vertical sliding block (43) is fixedly connected with a clamping jaw (5) for clamping the wafer (6).

2. A wafer carrying unit according to claim 1, characterized in that The limiting mechanism comprises a limiting nut (45) and a limiting stud (46) which are threadedly connected, the limiting stud (46) is arranged on the horizontal sliding block (33) along the vertical direction and is threadedly connected with the horizontal sliding block (33); when the vertical sliding block (43) moves to the limit position, the bottom end of the limiting stud (46) abuts against the vertical sliding block (43).

3. The wafer carrier singlet of claim 1, wherein, The clamping jaw (5) comprises a receiving arm which extends radially outward along the wafer (6), the outside end of the receiving arm extends upward to form a clamping block, and the clamping block abuts against the outer edge of the wafer (6).

4. A wafer carrying unit according to claim 3, characterized in that The flexible device is arranged on the side of the clamping block which faces the wafer (6) along the wafer (6) radially.

5. A wafer carrying unit according to claim 4, characterized in that The flexible device is a spring or a buffer sheet.

6. The wafer carrier singlet of claim 1, wherein, The horizontal moving mechanism further comprises a horizontal sliding rail (32), the vertical moving mechanism further comprises a vertical sliding rail (44), the horizontal sliding rail (32) is arranged along the wafer (6) radially, the horizontal sliding block (33) is movably arranged on the horizontal sliding rail (32), the vertical sliding rail (44) is fixedly arranged on the horizontal sliding block (33) along the vertical direction, and the vertical sliding block (43) is slidably arranged on the vertical sliding rail (44).

7. The wafer carrier singlet of claim 1, wherein, The horizontal moving mechanism further comprises a first horizontal travel switch (35) and a second horizontal travel switch (36), and a horizontal sliding member (34) is fixedly connected to the horizontal sliding block (33); when the horizontal sliding block (33) is retracted inwardly to a first predetermined position, the horizontal sliding member (34) enters the detection range of the first horizontal travel switch (35), at this time, the inside of the clamping jaw (5) abuts against the edge of the wafer (6), and the horizontal driving member (31) stops working; when the horizontal sliding block (33) is retracted inwardly to a second predetermined position, the horizontal sliding member (34) enters the detection range of the second horizontal travel switch (36), at this time, the bottom surface and the side surface of the wafer (6) at the supporting position of the clamping jaw (5) are exposed; the vertical moving mechanism further comprises a vertical displacement sensor (42), when the vertical sliding block (43) moves upwardly to a third predetermined position, the vertical displacement sensor (42) detects the position signal of the vertical sliding block (43), at this time, the clamping jaw (5) abuts against the bottom surface of the wafer (6), and the vertical driving member (41) stops working.

8. A wafer clamping device, characterized by The wafer carrier unit comprises the wafer carrier unit according to any one of claims 1 to 7, and a turntable (22) which is arranged along the horizontal direction, the number of the carrier units is plural, and the carrier units are distributed circumferentially on the turntable (22).

9. The wafer chucking apparatus of claim 8, wherein The number of the bearing units is 5, and the bearing units are evenly distributed in the circumferential direction of the turntable (22).

10. The wafer chucking apparatus of claim 8, wherein The rotary driving member (21) drives the turntable (22) to rotate in the horizontal plane.

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