Clamping tool for integrated circuit wafer processing

Abstract

The utility model discloses a clamping tool for integrated circuit wafer processing, and particularly relates to the technical field of circuit wafer processing, the clamping tool comprises a clamping table, a base and an object placing groove, the surface of the top end of the clamping table is provided with the object placing groove, and the clamping table is internally provided with a synchronous fixing assembly. The synchronous fixing assembly comprises an inner cavity, a rotating table, a rotating shaft, a rotary knob, a boss, a positioning rod, a sleeve, a torsion spring, a clamping block, a gasket, a bottom shaft, a clockwork spring, a fixing hole and a fixing bolt. According to the utility model, through the arrangement of the rotating shaft and the clamping block, when the wafer is placed in the object placing groove, the rotating shaft at the center position can be rotated, and the rotating shaft is contacted with the clamping block in the process of driving the boss to rotate, so that the clamping block can be pushed to enter the object placing groove, clamp the wafer in the object placing groove and assist in fixing the wafer; and the fixing bolt on the outer side of the rotating table is rotated to abut against the rotating shaft and reversely rotate to prevent loosening, so that the convenience of fixing the wafer by the clamping tool is realized.

Description

Technical Field

[0001] This utility model relates to the field of circuit wafer processing technology, specifically a clamping fixture for integrated circuit wafer processing. Background Technology

[0002] Circuit wafers refer to the basic materials used to manufacture semiconductor integrated circuits. They are usually called wafers. Wafers are thin films made of high-purity silicon material. The raw material is silicon, which exists in nature in the form of silicates or silicon dioxide. After being extracted and purified through a series of complex processes, wafers are made. This device is a clamping tool used for integrated circuit wafer processing.

[0003] Clamping fixtures are cumbersome when clamping and fixing multiple sets of wafers, and are not convenient for fixing multiple sets of wafers at the same time.

[0004] Therefore, a clamping fixture is needed for integrated circuit wafer processing. Utility Model Content

[0005] The purpose of this invention is to provide a clamping fixture for integrated circuit wafer processing, so as to solve the problem mentioned in the background art that the clamping fixture is not convenient for clamping and fixing multiple sets of wafers.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a clamping fixture for integrated circuit wafer processing, comprising a clamping platform, a base, and a storage slot. The base is fixed to the bottom end of the clamping platform, and a storage slot is provided on the surface of the top end of the clamping platform. A synchronous fixing assembly is provided inside the clamping platform, comprising an inner cavity, a rotating table, a rotating shaft, a knob, a boss, a positioning rod, a sleeve, a torsion spring, a clamping block, a pad, a bottom shaft, a spring-loaded spring, a fixing hole, and a fixing bolt. An inner cavity is provided at the center of the interior of the clamping platform, and a storage slot is fixed at the center of the top end of the clamping platform. A rotating table has a rotating shaft movably mounted inside. A knob is fixed to the top of the rotating shaft, and the bottom of the rotating shaft extends into the interior of a base. A boss is fixed to the outer wall of the knob. A positioning rod is installed inside the base, and a sleeve is movably mounted to the outer side of the positioning rod. A torsion spring is installed on the inner side of the sleeve, and a clamping block is fixed to the outer wall of the sleeve. A pad is fixed to the surface of the clamping block. A bottom shaft is installed at the bottom of the rotating shaft, and a spring-loaded spring is installed on the outer wall of the bottom shaft. A fixing hole is provided on the right side of the rotating table, and a fixing bolt is provided inside the fixing hole.

[0007] As a further technical solution of this utility model, four sets of storage slots are provided at the top of the clamping platform, and the four sets of storage slots are arranged in a ring.

[0008] As a further technical solution of this utility model, four sets of positioning rods are installed inside the inner cavity, and the four sets of positioning rods are symmetrically distributed.

[0009] As a further technical solution of this utility model, an air distribution platform is installed at the center of the bottom end of the clamping platform, and an air inlet pipe is installed at the bottom end of the air distribution platform.

[0010] As a further technical solution of this utility model, an air supply pipe is installed on the outer wall of the air distribution platform, a nozzle is installed on the right side of the air supply pipe, and a rinsing tank is provided at the bottom of the storage trough.

[0011] As a further technical solution of this utility model, the cross-section of the nozzle tip is smaller than the cross-section of the rinsing tank, and the nozzle tip extends into the interior of the rinsing tank.

[0012] As a further technical solution of this utility model, the outer wall of the clamping platform is provided with a side groove, and the top of the side groove is provided with a through groove, the top of the through groove extending into the interior of the storage groove.

[0013] As a further technical solution of this utility model, a balance plate is movably installed inside the side groove, a push block is fixed on the right side of the top of the balance plate, and a limit platform is fixed on the inner side wall of the side groove.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: by setting a rotating shaft and a clamping block, after the wafer is placed inside the storage slot, the rotating shaft at the center position can be rotated. During the rotation of the rotating shaft driving the boss, it contacts the clamping block and pushes the clamping block into the storage slot to clamp the wafer inside the storage slot and assist in fixing it. Afterwards, the fixing bolt on the outside of the rotating table is rotated to hold the rotating shaft in reverse to prevent loosening. This achieves the convenience of fixing the wafer with this clamping fixture.

[0015] The device is equipped with a nozzle and a rinsing tank. The rinsing tank is located at the center of the bottom of the storage tank. The nozzle is installed inside the tank, and the air inlet pipe is connected to an air pump or similar device to allow high-speed gas to be introduced. The high-speed gas is sprayed into the storage tank along the nozzle and the rinsing tank, which can assist in cleaning the inside of the storage tank. This realizes the air jet cleaning function inside the storage tank of the clamping device.

[0016] By setting up a balance plate, which is movably installed inside the side slot, during use, by pressing down the balance plate with the help of the side slot outside the clamping platform, the pusher block can be pushed up and moved into the storage slot along the through slot. During this process, the wafer inside the storage slot can be pushed up to assist in the wafer removal operation, thus realizing the auxiliary unloading function when using this clamping fixture. Attached Figure Description

[0017] Figure 1This is a front view cross-sectional structural diagram of the present invention;

[0018] Figure 2 This is a top view cross-sectional structural diagram of the present invention;

[0019] Figure 3 This is a schematic diagram of the front cross-sectional structure of the inner cavity of this utility model;

[0020] Figure 4 This is a front view cross-sectional structural diagram of the side groove of this utility model.

[0021] In the diagram: 1. Clamping platform; 2. Base; 3. Inner cavity; 4. Storage slot; 5. Rotary platform; 6. Shaft; 7. Knob; 8. Boss; 9. Positioning rod; 10. Sleeve; 11. Torsion spring; 12. Clamping block; 13. Pad; 14. Bottom shaft; 15. Spring spring; 16. Fixing hole; 17. Fixing bolt; 18. Air distribution platform; 19. Air inlet pipe; 20. Air delivery pipe; 21. Nozzle; 22. Rinsing tank; 23. Side tank; 24. Through slot; 25. Balance plate; 26. Push block; 27. Limiting platform. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4This utility model provides an embodiment of a clamping fixture for integrated circuit wafer processing, comprising a clamping platform 1, a base 2, and a storage slot 4. The base 2 is fixed to the bottom end of the clamping platform 1, and the storage slot 4 is provided on the surface of the top end of the clamping platform 1. Four sets of storage slots 4 are provided at the top end of the clamping platform 1, and the four sets of storage slots 4 are arranged in a ring. A synchronous fixing assembly is provided inside the clamping platform 1, which includes an inner cavity 3, a rotating table 5, a rotating shaft 6, a knob 7, a boss 8, a positioning rod 9, a sleeve 10, a torsion spring 11, a clamping block 12, a pad 13, a bottom shaft 14, a spring-loaded spring 15, a fixing hole 16, and a fixing bolt 17. The inner cavity 3 is provided at the center of the interior of the clamping platform 1, and a clamping block is fixed at the center of the top end of the clamping platform 1. A rotating table 5 has a rotating shaft 6 movably installed inside it. A knob 7 is fixed to the top of the rotating shaft 6. The bottom of the rotating shaft 6 extends into the interior of the base 2. A boss 8 is fixed to the outer wall of the knob 7. A positioning rod 9 is installed inside the base 2. Four sets of positioning rods 9 are installed inside the inner cavity 3. The four sets of positioning rods 9 are symmetrically distributed. A sleeve 10 is movably installed on the outer side of the positioning rod 9. A torsion spring 11 is installed on the inner side of the sleeve 10. A clamping block 12 is fixed to the outer wall of the sleeve 10. A pad 13 is fixed to the surface of the clamping block 12. A bottom shaft 14 is installed at the bottom of the rotating shaft 6. A spring spring 15 is installed on the outer wall of the bottom shaft 14. A fixing hole 16 is provided on the right side of the rotating table 5. A fixing bolt 17 is provided inside the fixing hole 16.

[0024] Specifically, such as Figure 1 , Figure 2 and Figure 3 As shown, during use, four sets of placement slots 4 are distributed on the top surface of the clamping platform 1. After the wafer is placed inside the placement slot 4, the rotating shaft 6 can be rotated. When the boss 8 on the outer wall of the rotating shaft 6 rotates with it, it contacts the clamping block 12 and pushes the clamping block 12 to move into the placement slot 4. During the movement, the wafer can be fixed against the inside of the placement slot 4 to complete the wafer clamping operation. Finally, the fixing bolt 17 on the outer side of the rotating platform 5 is tightened to prevent the rotating shaft 6 from reversing.

[0025] An air distribution platform 18 is installed at the center of the bottom of the clamping platform 1. An air inlet pipe 19 is installed at the bottom of the air distribution platform 18. An air supply pipe 20 is installed on the outer side wall of the air distribution platform 18. A nozzle 21 is installed on the right side of the air supply pipe 20. A rinsing tank 22 is provided at the bottom of the storage tank 4. The cross-section of the top of the nozzle 21 is smaller than the cross-section of the rinsing tank 22. The top of the nozzle 21 extends into the interior of the rinsing tank 22.

[0026] Specifically, such as Figure 1 and Figure 3As shown, when in use, after the air inlet pipe 19 is connected to the air pump, high-speed gas can be delivered to the nozzle 21 through the air distribution platform 18 and the air delivery pipe 20. The nozzle 21 sprays out gas, which can enter the storage tank 4 along the rinsing tank 22. The sprayed high-speed gas can help carry away the debris inside the storage tank 4 and clean it.

[0027] The outer wall of the clamping platform 1 is provided with a side groove 23, and the top of the inside of the side groove 23 is provided with a through groove 24. The top of the through groove 24 extends into the inside of the storage groove 4. A balance plate 25 is movably installed inside the side groove 23. A push block 26 is fixed on the right side of the top of the balance plate 25. A limit platform 27 is fixed on the inner side wall of the side groove 23.

[0028] Specifically, such as Figure 1 and Figure 4 As shown, when the balance plate 25 on the inner side of the outer side groove 23 of the clamping platform 1 is pressed down, the other end of the balance plate 25 is lifted up, and the push block 26 at the top position can enter the storage groove 4 from the bottom side along the through groove 24, which can lift the wafer inside the storage groove 4 and assist in the wafer unloading operation.

[0029] Working principle: During use, four sets of storage slots 4 are arranged in a ring on the top surface of the clamping platform 1. A nozzle 21 is installed in the rinsing tank 22 at the bottom center. After the air inlet pipe 19 is connected to an air pump, high-speed gas can be delivered to the nozzle 21 through the air distribution platform 18 and the air supply pipe 20. The nozzle 21 sprays out gas, which can enter the storage slot 4 along the rinsing tank 22. The sprayed high-speed gas can help remove debris inside the storage slot 4 and clean it. After cleaning, the wafer is placed inside the storage slot 4. After placement, the rotating shaft 6 is rotated by the knob 7. During this process, the boss 8 on the outer wall of the rotating shaft 6 rotates with it and contacts the clamping block 12, which can push the clamping block 12 into the storage slot 4. During the movement, the wafer can be fixed inside the storage slot 4 to complete the wafer clamping operation. Finally, tighten the fixing bolt 17 on the outside of the rotary table 5 to prevent the rotating shaft 6 from reversing. After processing, tighten the fixing bolt 17 until it is loose. At this time, the rotating shaft 6 can reverse and reset under the elastic release of the spring 15. At the same time, the spring 15 can reset with the assistance of the torsion spring 11 and move back into the inner cavity 3, releasing the clamping of the wafer. At this time, when the balance plate 25 on the inner side of the outer side groove 23 of the clamping table 1 is pressed down, the other end of the balance plate 25 is lifted up, and the push block 26 at the top position can enter the storage slot 4 from the bottom side along the through groove 24, which can lift the wafer inside the storage slot 4, and then the wafer can be taken out.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A clamping tool for integrated circuit wafer processing, comprising a clamping table (1), a base (2) and a storage slot (4), characterized in that: The bottom end of the clamp (1) is fixed with a base (2), the top end of the clamp (1) is provided with a storage groove (4), and the inside of the clamp (1) is provided with a synchronous fixing assembly. The synchronous fixing assembly comprises an inner cavity (3), a rotating table (5), a rotating shaft (6), a knob (7), a boss (8), a positioning rod (9), a sleeve (10), a torsion spring (11), a clamping block (12), a gasket (13), a bottom shaft (14), a clockwork spring (15), a fixing hole (16) and a fixing bolt (17), the inside of the clamp (1) is provided with an inner cavity (3) at the center position, the top end of the clamp (1) is fixed with a rotating table (5) at the center position, the rotating table (5) is movably installed with a rotating shaft (6) inside, the rotating shaft (6) is fixed with a knob (7) at the top end, the rotating shaft (6) extends to the inside of the base (2) at the bottom end, the outer side wall of the knob (7) is fixed with a boss (8), the inside of the base (2) is installed with a positioning rod (9), the outer side of the positioning rod (9) is movably installed with a sleeve (10), the inside of the sleeve (10) is installed with a torsion spring (11), the outer side wall of the sleeve (10) is fixed with a clamping block (12), the surface of the clamping block (12) is fixed with a gasket (13), the bottom end of the rotating shaft (6) is installed with a bottom shaft (14), the outer side wall of the bottom shaft (14) is installed with a clockwork spring (15), the right side of the rotating table (5) is provided with a fixing hole (16), and the inside of the fixing hole (16) is provided with a fixing bolt (17).

2. The clamping tool for processing an integrated circuit wafer according to claim 1, wherein: The storage groove (4) is provided with four groups at the top end of the clamp (1), and the four groups of storage grooves (4) are annularly distributed.

3. The holding tool for processing an integrated circuit wafer according to claim 1, wherein: Four groups of positioning rods (9) are installed inside the inner cavity (3), and the four groups of positioning rods (9) are symmetrically distributed.

4. The holding tool for processing an integrated circuit wafer according to claim 1, wherein: A gas distribution table (18) is installed at the center position of the bottom end of the clamp (1), and the bottom end of the gas distribution table (18) is installed with an air inlet pipe (19).

5. The holding tool for processing an integrated circuit wafer according to claim 4, wherein: A gas conveying pipe (20) is installed on the outer side wall of the gas distribution table (18), a spray head (21) is installed on the right side of the gas conveying pipe (20), and a flushing groove (22) is arranged at the bottom end inside the storage groove (4).

6. The holding tool for processing an integrated circuit wafer according to claim 5, wherein: The cross section of the top end of the spray head (21) is smaller than the cross section of the flushing groove (22), and the top end of the spray head (21) extends to the inside of the flushing groove (22).

7. The holding tool for processing an integrated circuit wafer according to claim 1, wherein: The outer side wall of the clamp (1) is provided with a side groove (23), the top end of the inside of the side groove (23) is provided with a through groove (24), and the top end of the through groove (24) extends to the inside of the storage groove (4).

8. The holding tool for processing an integrated circuit wafer according to claim 7, wherein: A balance plate (25) is movably installed inside the side groove (23), a push block (26) is fixed to the right side of the top end of the balance plate (25), and a limiting table (27) is fixed to the inner side wall of the side groove (23).

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