High-frequency integrated circuit module integrated with end-on-fire antenna

Abstract

The utility model discloses a high-frequency integrated circuit module integrated with an end-on-fire antenna, which comprises a packaging seat, a heat conducting seat is mounted on the inner side of the top side of the packaging seat in a clamping manner, and a high-frequency integrated circuit chip is mounted on the top side of the heat conducting seat in a clamping manner. When the high-frequency integrated circuit chip generates heat in the operation and use process, the heat is conducted under the action of the heat conducting seat, the conducted heat is transmitted to the outer side of the heat dissipation box and the heat dissipation copper pipe at the moment, air passes through the ventilation holes in the ventilation plate and then circulates in the heat dissipation copper pipe, and the heat is output from the other end of the heat dissipation copper pipe. And under the action of the two groups of heat dissipation fins, heat on the outer surface of the heat dissipation box can be guided out, so that the heat dissipation efficiency is further improved, the service life of the high-frequency integrated circuit chip and parts is prolonged, and damage caused by too high temperature is avoided.

Description

Technical Field

[0001] This utility model relates to the field of high-frequency integrated circuit chip technology, specifically a high-frequency integrated circuit module with an integrated end-fire antenna. Background Technology

[0002] With social development and technological progress, high-frequency integrated circuits have received increasing attention and become a hot topic in current research and application. For example, 5G communication, high-speed data transmission, automotive collision avoidance radar, and even terahertz imaging systems all have corresponding application requirements for their operating frequencies, ranging from 24GHz, 35GHz, 77GHz to 140GHz and even 220GHz and above. Currently, the large-scale application of high-frequency integrated circuits has been technically solved in terms of design and processing. Whether using III-V group semiconductors or silicon-based semiconductors, the cutoff frequency and maximum oscillation frequency of high-frequency integrated circuits can now exceed 300GHz.

[0003] Patent CN108550571B discloses a high-frequency integrated circuit module with an integrated end-fire antenna and its packaging method. By placing both the functional circuit and the end-fire antenna assembly on an integrated high-frequency integrated circuit chip, the high-frequency output electrode of the functional circuit and the high-frequency input electrode of the end-fire antenna assembly are directly interconnected inside the chip during chip processing. This avoids the wire bonding process in the later packaging process, resulting in very low power loss and good quality consistency. The wire bonding from the integrated high-frequency integrated circuit chip to the pads of the package shell uses DC or low-frequency electrical signals, which can be packaged using commercially available low-cost packaging technology, thus solving the bottleneck problem of high-frequency integrated circuit chip packaging.

[0004] However, during use, the installation of the circuit chip requires soldering and screw fixing to ensure the stability and conductivity of the connection with the package housing, which makes the installation troublesome and time-consuming, and the subsequent disassembly and assembly complicated and cumbersome. At the same time, during use, the circuit chip is prone to heat dissipation and overheating when powered on, which can easily lead to circuit board damage with long-term use, resulting in low heat dissipation and lifespan. Utility Model Content

[0005] The purpose of this utility model is to provide a high-frequency integrated circuit module with an integrated end-fire antenna, which has the advantages of convenient and quick disassembly and assembly, improved ease of use, good heat dissipation, improved service life and avoidance of damage to electronic components, so as to solve the technical problems of complicated disassembly and assembly and easy damage to the circuit board when it is powered on.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A high-frequency integrated circuit module with an integrated end-fire antenna includes a package housing. A heat-conducting base is installed on the inner side of the top side of the package housing via a snap-fit ​​mechanism. A high-frequency integrated circuit chip is installed on the top side of the heat-conducting base via a snap-fit ​​mechanism. A heat sink is installed inside the package housing via bolts. A heat dissipation copper pipe is fixedly installed on the inner side of the heat sink. A vent plate is provided on the front side of the heat sink. Heat dissipation fins are installed on the left side of the package housing via a snap-fit ​​mechanism. Connecting electrodes and pads are respectively provided on the top sides of the high-frequency integrated circuit chip and the package housing. Connecting wires are respectively provided on the top sides of the connecting electrodes and the pads. Coupling sleeves and coupling plates are fixedly installed on the opposite ends of the connecting wires.

[0008] As a preferred embodiment of this utility model, a first heat dissipation vent is provided on the front and rear sides of the package base, and a second heat dissipation vent is provided on the left and right sides of the package base. A positioning groove and a fixing groove are provided on the top side of the package base, and an adhesive sheet is provided on the inner side of the fixing groove. The first heat dissipation vent facilitates air circulation and heat dissipation, thereby improving the heat dissipation effect. At the same time, the addition of the second heat dissipation vent can further improve the heat dissipation efficiency. In addition, during the assembly process, the adhesive sheet facilitates the fixation of the high-frequency integrated circuit chip to the package base.

[0009] As a preferred embodiment of this utility model, a heat dissipation fin is respectively installed on the inner side of the second heat dissipation vent via a snap-fit ​​mechanism. The size and shape of the heat dissipation fin matches the second heat dissipation vent, and the smooth surface of the heat dissipation fin is in contact with the left and right sides of the heat dissipation box. Because the smooth surface of the heat dissipation fin is in contact with the left and right sides of the heat dissipation box, it is beneficial to conduct heat away from the surface of the heat dissipation box through the two sets of heat dissipation fins during use, thereby further increasing the heat dissipation efficiency, improving the service life of high-frequency integrated circuit chips and components, and preventing damage caused by excessive temperature.

[0010] As a preferred embodiment of this utility model, a No. 1 positioning post is fixedly installed at the four corners of the bottom side of the heat-conducting base, and a No. 2 positioning post is fixedly installed at the four corners of the top side of the heat-conducting base. A positioning hole is opened on the top side of the high-frequency integrated circuit chip, and the size and shape of the positioning hole match the No. 2 positioning post.

[0011] During assembly and packaging, the No. 1 positioning post on the bottom side of the heat-conducting base is inserted into the fixing groove for positioning and engagement. Then, the positioning hole on the top side of the high-frequency integrated circuit chip is aligned with the No. 2 positioning post and pressed. At this time, the high-frequency integrated circuit chip is fixed to the packaging base by the adhesive sheet. The installation is convenient and quick, and it is easy to position and install, improving the accuracy and convenience of installation.

[0012] As a preferred embodiment of this utility model, several heat dissipation copper pipes are installed at equal intervals on the inner side of the heat dissipation box, and several vent holes are opened at equal intervals on the right side of the vent plate. The top side of the heat dissipation box is in contact with the bottom side of the heat conduction base.

[0013] When a high-frequency integrated circuit chip generates heat during operation, the heat is conducted through the heat sink. The heat is then transferred to the outside of the heat sink and the heat dissipation copper pipe. When air passes through the vents on the vent plate, it flows through the inside of the heat dissipation copper pipe, thus outputting heat from the other end of the heat dissipation copper pipe, thereby improving heat dissipation efficiency.

[0014] As a preferred embodiment of this utility model, the connecting electrode, solder pad, connecting wire, coupling sleeve and coupling plate are arranged as a group, and a total of several groups are provided. They are arranged at equal intervals on the top side of the high-frequency integrated circuit chip and the package base, and the size and shape of the coupling plate are matched with the coupling sleeve.

[0015] During disassembly and assembly, the corresponding coupling piece is inserted into or pulled out of the coupling sleeve to facilitate the connection or disconnection of the connecting wires, reducing repeated soldering operations, making disassembly and assembly convenient and quick, improving ease of use, and reducing the difficulty of disassembly and assembly.

[0016] Compared with the prior art, the high-frequency integrated circuit module with integrated end-fire antenna provided by this utility model has the following beneficial effects:

[0017] 1. When the high-frequency integrated circuit chip generates heat during operation, the heat is conducted through the heat-conducting base. The heat is then transferred to the outside of the heat sink and the heat dissipation copper pipe. When air passes through the vent holes on the vent plate, it flows through the inside of the heat dissipation copper pipe, thus outputting heat from the other end of the heat dissipation copper pipe, thereby improving heat dissipation efficiency. Moreover, under the action of the two sets of heat dissipation fins, it is beneficial to conduct heat away from the surface of the heat sink, thereby further increasing heat dissipation efficiency, improving the service life of the high-frequency integrated circuit chip and components, and avoiding damage caused by excessive temperature.

[0018] 2. During assembly and packaging, insert the No. 1 positioning post on the bottom side of the heat-conducting base into the fixing groove for positioning and engagement. Then, align the positioning hole on the top side of the high-frequency integrated circuit chip with the No. 2 positioning post and press them together. At this time, the high-frequency integrated circuit chip is fixed to the packaging base by the action of the adhesive sheet. Then, insert the corresponding coupling sheet into the coupling sleeve. The assembly and disassembly are convenient and quick, improving the ease of use and reducing the difficulty of assembly and disassembly. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only examples of embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0021] Figure 2 This is a schematic diagram of the main structure of an embodiment of the present utility model;

[0022] Figure 3 This is a schematic diagram of the left-side structure of an embodiment of the present utility model;

[0023] Figure 4 This is an exploded structural diagram of an embodiment of the present utility model;

[0024] Figure 5 This is a cross-sectional view of the heat sink and heat conduction base in an embodiment of this utility model.

[0025] Reference numerals: 1. Package holder; 2. Thermal base; 3. High-frequency integrated circuit chip; 4. Heat sink; 5. Copper heat sink tube; 6. Vent plate; 7. Heat sink fins; 8. Connecting electrode; 9. Solder pad; 10. Connecting wire; 11. Coupling sleeve; 12. Coupling piece; 101. Heat sink vent 1; 102. Heat sink vent 2; 103. Positioning groove; 104. Fixing groove; 201. Positioning post 1; 202. Positioning post 2; 301. Positioning hole; 601. Vent hole. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

[0027] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0028] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present invention should be understood according to the specific circumstances.

[0029] See Figure 1-5As shown, an embodiment of this utility model discloses a high-frequency integrated circuit module for an integrated end-fire antenna, including a package base 1. A heat-conducting base 2 is installed on the inner side of the top side of the package base 1 by a snap-fit. A high-frequency integrated circuit chip 3 is installed on the top side of the heat-conducting base 2 by a snap-fit. A heat sink 4 is installed inside the package base 1 by bolts. A heat dissipation copper pipe 5 is fixedly installed on the inner side of the heat sink 4. A vent plate 6 is provided on the front side of the heat sink 4. A heat dissipation fin 7 is installed on the left side of the package base 1 by a snap-fit. A connecting electrode 8 and a pad 9 are respectively provided on the top side of the high-frequency integrated circuit chip 3 and the package base 1. A connecting wire 10 is respectively provided on the top side of the connecting electrode 8 and the pad 9. A coupling sleeve 11 and a coupling piece 12 are respectively fixedly installed on the opposite ends of the connecting wire 10.

[0030] The package holder 1 has a first heat dissipation vent 101 on its front and rear sides, and a second heat dissipation vent 102 on its left and right sides. The top side of the package holder 1 has a positioning groove 103 and a fixing groove 104, with an adhesive sheet on the inner side of the fixing groove 104. The first heat dissipation vent 101 facilitates airflow to remove heat, thus improving heat dissipation. The addition of the second heat dissipation vent 102 further enhances heat dissipation efficiency. Furthermore, during assembly, the adhesive sheet facilitates the fixation of the high-frequency integrated circuit chip 3 to the package holder 1.

[0031] A heat dissipation fin 7 is installed on the inner side of the second heat dissipation vent 102 via a snap-fit ​​mechanism. The size and shape of the heat dissipation fin 7 match the second heat dissipation vent 102, and the smooth surface of the heat dissipation fin 7 is in contact with the left and right sides of the heat dissipation box 4. The contact between the smooth surface of the heat dissipation fin 7 and the left and right sides of the heat dissipation box 4 facilitates the dissipation of heat from the surface of the heat dissipation box 4 during use, thereby increasing heat dissipation efficiency, extending the lifespan of the high-frequency integrated circuit chip 3 and other components, and preventing damage caused by overheating.

[0032] Positioning posts 201 are fixedly installed at the four corners of the bottom side of the heat-conducting base 2, and positioning posts 202 are fixedly installed at the four corners of the top side of the heat-conducting base 2. Positioning holes 301 are provided on the top side of the high-frequency integrated circuit chip 3, and the size and shape of the positioning holes 301 match the positioning posts 202. Positioning posts 201 on the bottom side of the heat-conducting base 2 are inserted into the fixing groove 104 for positioning and engagement. Then, the positioning holes 301 and positioning posts 202 on the top side of the high-frequency integrated circuit chip 3 are aligned and pressed together. At this time, the adhesive sheet secures the high-frequency integrated circuit chip 3 to the packaging base 1, making installation convenient and quick, facilitating positioning and installation, and improving installation accuracy and convenience.

[0033] Several heat dissipation copper pipes 5 are evenly arranged on the inner side of the heat sink 4, and several equally arranged vent holes 601 are opened on the right side of the vent plate 6. The top side of the heat sink 4 is in contact with the bottom side of the heat conduction base 2. When the high-frequency integrated circuit chip 3 generates heat during operation, the heat is conducted by the heat conduction base 2. The heat is then transferred to the outside of the heat sink 4 and the heat dissipation copper pipes 5. When air passes through the vent holes 601 on the vent plate 6, it flows through the inside of the heat dissipation copper pipes 5, thereby outputting heat from the other end of the heat dissipation copper pipes 5, thus improving the heat dissipation efficiency.

[0034] The connecting electrode 8, solder pad 9, connecting wire 10, coupling sleeve 11, and coupling piece 12 are arranged as a group, and several groups are provided in total. They are equidistantly arranged on the top side of the high-frequency integrated circuit chip 3 and the package holder 1, and the size and shape of the coupling piece 12 are matched with the coupling sleeve 11. By inserting or removing the corresponding coupling piece 12 into the coupling sleeve 11, the connection or disconnection between the connecting wires 10 can be easily achieved, reducing repeated soldering operations, making disassembly and assembly convenient and quick, improving ease of use, and reducing the difficulty of disassembly and assembly.

[0035] When the high-frequency integrated circuit chip 3 generates heat during operation, the heat is conducted through the heat-conducting base 2. The heat is then transferred to the outside of the heat sink 4 and the heat dissipation copper pipe 5. When air passes through the vent holes 601 on the vent plate 6, it flows through the inside of the heat dissipation copper pipe 5, thereby outputting heat from the other end of the heat dissipation copper pipe 5, thus improving heat dissipation efficiency. Moreover, under the action of the two sets of heat dissipation fins 7, it is beneficial to conduct heat away from the surface of the heat sink 4, thereby further increasing heat dissipation efficiency, improving the service life of the high-frequency integrated circuit chip 3 and components, and avoiding damage caused by excessive temperature.

[0036] During assembly and packaging, the first positioning post 201 on the bottom side of the heat-conducting base 2 is inserted into the fixing groove 104 for positioning and engagement. Then, the positioning hole 301 on the top side of the high-frequency integrated circuit chip 3 is inserted into the second positioning post 202 and pressed. At this time, the high-frequency integrated circuit chip 3 is fixed to the packaging base 1 under the action of the adhesive sheet. Then, the corresponding coupling piece 12 is inserted into the coupling sleeve 11. The assembly and disassembly are convenient and quick, improving the ease of use and reducing the difficulty of assembly and disassembly.

[0037] The foregoing has shown and described the basic principles of the present invention. The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. The above embodiments and descriptions in the specification are only illustrative of the principles of the present invention. Any modifications, equivalent substitutions, and improvements made within the scope of the present invention without departing from the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. A high frequency integrated circuit module integrated with an end-fire antenna, comprising a package base (1), characterized in that: The inner side of the top side of the packaging seat (1) is provided with a heat conduction seat (2) through clamping installation, the top side of the heat conduction seat (2) is provided with a high-frequency integrated circuit chip (3) through clamping installation, the inside of the packaging seat (1) is provided with a heat dissipation box (4) through bolt installation, the inner side of the heat dissipation box (4) is fixedly provided with a heat dissipation copper pipe (5), the front side of the heat dissipation box (4) is provided with a breathable plate (6), the left side of the packaging seat (1) is provided with a heat dissipation fin (7) through clamping installation, the top side of the high-frequency integrated circuit chip (3) and the packaging seat (1) is respectively provided with a connecting electrode (8) and a pad (9), the top side of the connecting electrode (8) and the pad (9) is respectively provided with a connecting wire (10), the opposite ends of the connecting wire (10) are respectively fixedly provided with a coupling sleeve (11) and a coupling sheet (12).

2. The high-frequency integrated circuit module integrated with an end-fire antenna according to claim 1, characterized in that: The front side and the back side of the packaging seat (1) are respectively provided with a first heat dissipation opening (101), the left side and the right side of the packaging seat (1) are respectively provided with a second heat dissipation opening (102), the top side of the packaging seat (1) is provided with a positioning groove (103) and a fixed groove (104), the inner side of the fixed groove (104) is provided with a sticky sheet.

3. A high-frequency integrated circuit module integrated with an end-fire antenna according to claim 2, characterized in that: The inner side of the second heat dissipation opening (102) is respectively provided with a heat dissipation fin (7) through clamping installation, the size and shape of the heat dissipation fin (7) are matched with the second heat dissipation opening (102), and the smooth surface of the heat dissipation fin (7) is attached to the left side and the right side of the heat dissipation box (4).

4. The high-frequency IC module integrated with an end-fire antenna according to claim 1, characterized by: The bottom side of the heat conduction seat (2) is fixedly provided with a first positioning column (201) at four corners, the top side of the heat conduction seat (2) is respectively fixedly provided with a second positioning column (202) at four corner positions, the top side of the high-frequency integrated circuit chip (3) is provided with a positioning hole (301), the size and shape of the positioning hole (301) are matched with the second positioning column (202).

5. The high-frequency IC module integrated with an end-fire antenna according to claim 1, characterized by: The inner side of the heat dissipation box (4) is installed with a plurality of heat dissipation copper pipes (5) at equal intervals, the right side of the breathable plate (6) is respectively provided with a plurality of breathable holes (601) arranged at equal intervals, and the top side of the heat dissipation box (4) is attached to the bottom side of the heat conduction seat (2).

6. The high-frequency IC module integrated with an end-fire antenna according to claim 1, characterized by: The connecting electrode (8), the pad (9), the connecting wire (10), the coupling sleeve (11) and the coupling sheet (12) form a group, a plurality of groups are provided in total, and are respectively arranged at equal intervals on the top side of the high-frequency integrated circuit chip (3) and the packaging seat (1), and the size and shape of the coupling sheet (12) are matched with the coupling sleeve (11).

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