High-temperature-resistant heat dissipation structure for chip packaging

Abstract

The utility model discloses a high-temperature-resistant heat dissipation structure for chip packaging, which comprises a chip body, and the top of the chip body is connected with a protective shell. The protective shell is of a hollow structure, a heat exchange pipe of a U-shaped structure is fixedly connected into the protective shell, and the two ends of the heat exchange pipe extend to the position above the protective shell. The chip comprises a chip body, a protective shell is arranged in the chip body, heat-conducting fins are fixedly connected to the two sides of the protective shell, an exposed bonding pad is embedded in the bottom of the chip body, sleeves are fixedly connected to the two sides of the exposed bonding pad, slots are formed in the sleeves, and the heat-conducting fins extend into the corresponding slots. According to the utility model, an omnibearing heat dissipation system is constructed, the problem of traditional single-side heat dissipation is effectively solved, compared with a conventional means, heat of the chip can be more efficiently conducted and dissipated, heat accumulation is avoided, the heat dissipation effect is obviously improved, the chip is ensured to stably operate at a proper temperature, and the performance and service life problems caused by overheating are reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, and in particular to a high-temperature heat dissipation structure for chip packaging. Background Technology

[0002] In the field of modern electronics, chips are the core components of various electronic devices, and their performance and stability play a crucial role in the operation of the entire system.

[0003] As chip integration and processing speed continue to increase, the heat generated during chip operation also increases dramatically. Excessive temperature can severely affect chip performance, such as causing decreased processing speed, signal transmission errors, and even shortening the chip's lifespan, increasing the risk of system failure.

[0004] Currently, in the field of chip heat dissipation, the most common heat dissipation structure is the addition of heat sinks. While this traditional method can alleviate chip overheating to some extent, it has significant limitations. Heat sinks typically only dissipate heat from one side of the chip; for example, they are usually placed on either the top or bottom, making it difficult to simultaneously cool both sides. This single-sided heat dissipation method cannot effectively and promptly dissipate the heat generated during chip operation, leading to heat accumulation inside the chip. This is especially problematic for high-power, high-performance chips, where single-sided heat dissipation is insufficient to meet their cooling requirements, severely restricting further performance improvements and applications under more complex and demanding conditions.

[0005] To address the above issues, we have introduced a high-temperature heat dissipation structure for chip packaging. Utility Model Content

[0006] This utility model discloses a high-temperature heat dissipation structure for chip packaging, which aims to solve the technical problems in the background art.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A high-temperature heat dissipation structure for chip packaging includes a chip body, and a protective shell is connected to the top of the chip body.

[0009] The protective shell is configured as a hollow structure, and a U-shaped heat exchange tube is fixedly connected inside the protective shell, with both ends of the heat exchange tube extending to the top of the protective shell.

[0010] Both sides of the protective shell are fixedly connected to heat-conducting plates, and the bottom of the chip body is embedded with exposed solder pads. Both sides of the exposed solder pads are fixedly connected to sleeves, and slots are opened inside the sleeves. The heat-conducting plates extend into the corresponding slots.

[0011] In a preferred embodiment, the protective shell is provided with contact pads fixedly connected at equal intervals inside, and the contact pads are all configured with a U-shaped structure, and the contact pads are in contact with the top of the chip body.

[0012] In a preferred embodiment, the chip body is symmetrically and equidistantly connected with pin solder points.

[0013] In a preferred embodiment, both the heat-conducting sheet and the sleeve are made of copper.

[0014] In a preferred embodiment, both ends of the heat exchange tube are provided with threads for connection to external water cooling equipment.

[0015] The high-temperature heat dissipation structure for chip packaging provided by this utility model has the following advantages:

[0016] By mounting the chip onto a PCB board, placing a protective shell, and inserting a heat-conducting plate, while simultaneously circulating coolant into the heat exchange pipes, heat dissipation is achieved from both the top and bottom of the chip. The heat-conducting plate and heat exchange pipes work together to dissipate heat from the top, while the heat exchange pipes remove heat from the bottom of the protective shell, creating a comprehensive heat dissipation system. This effectively solves the problem of traditional single-sided heat dissipation. Compared to conventional methods, it can more efficiently conduct and dissipate chip heat, preventing heat accumulation, significantly improving heat dissipation, ensuring stable chip operation at suitable temperatures, and reducing performance and lifespan issues caused by overheating. Attached Figure Description

[0017] Figure 1 This is a top view of the high-temperature heat dissipation structure for chip packaging proposed in this utility model.

[0018] Figure 2 This is an isometric side view of a high-temperature heat dissipation structure for chip packaging proposed in this utility model, viewed from below.

[0019] Figure 3 This is a bottom isometric side view of the disassembled state of a high-temperature heat dissipation structure for chip packaging proposed in this utility model.

[0020] Figure 4 This is a top-view diagram and a partial enlarged view of a high-temperature heat dissipation structure for chip packaging proposed in this utility model, showing its disassembly state.

[0021] Figure 5 This is a schematic diagram of the internal structure of a protective cover for a high-temperature heat dissipation structure for chip packaging proposed in this utility model.

[0022] Figure 6 This is a cross-sectional schematic diagram of a protective cover for a high-temperature heat dissipation structure for chip packaging proposed in this utility model.

[0023] In the attached diagram: 1. Chip body; 2. Protective shell; 3. Heat exchange tube; 4. Thermal conductive plate; 5. Exposed solder pad; 6. Sleeve; 7. Slot; 8. Contact pad; 9. Pin solder joint. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and marked in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] This utility model discloses a high-temperature heat dissipation structure for chip packaging.

[0026] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 Figure 5 and Figure 6 As shown, a high-temperature heat dissipation structure for chip packaging includes a chip body 1, and a protective shell 2 is connected to the top of the chip body 1.

[0027] The protective shell 2 is designed as a hollow structure, and a U-shaped heat exchange tube 3 is fixedly connected inside the protective shell 2. Both ends of the heat exchange tube 3 extend to the top of the protective shell 2.

[0028] Heat-conducting plates 4 are fixedly connected to both sides of the protective shell 2. An exposed solder pad 5 is embedded at the bottom of the chip body 1. A sleeve 6 is fixedly connected to both sides of the exposed solder pad 5. A slot 7 is opened inside the sleeve 6. The heat-conducting plates 4 extend into the corresponding slot 7.

[0029] In this embodiment: In actual use, the chip body 1 is first installed on the PCB board, then the protective shell 2 is placed on the chip body 1, and the heat-conducting sheet 4 is inserted into the slot 7.

[0030] The dimensions of slot 7 and heat-conducting plate 4 are designed to fit together. When heat-conducting plate 4 is inserted into slot 7, there should theoretically be no excessive gap or wobbling.

[0031] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 Figure 5 and Figure 6 As shown, in a preferred embodiment, contact pads 8 are fixedly connected at equal intervals inside the protective shell 2. The contact pads 8 are all configured with a U-shaped structure and are in contact with the top of the chip body 1.

[0032] In this embodiment, the contact pad 8 contacts the top of the chip body 1. Then, coolant is injected into the heat exchange tube 3 so that the coolant can circulate inside the heat exchange tube 3. In this way, the heat of the protective shell 2 can be carried away through the heat exchange tube 3. At the same time, while the heat of the bottom of the protective shell 2 is carried away through the heat exchange tube 3, the heat of the exposed solder pad 5 can also be carried away through the heat conduction plate 4. In this way, the heat exchange tube 3 can simultaneously improve the heat dissipation effect of the top and bottom of the chip body 1, so as to reduce the temperature of the chip body 1.

[0033] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 Figure 5 and Figure 6 As shown, in a preferred embodiment, pin solder points 9 are symmetrically and equidistantly fixedly connected to the chip body 1;

[0034] In this embodiment, the pin solder joint 9 is used to make contact with the contact point on the PCB board, thus completing the installation of the chip body 1.

[0035] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 Figure 5 and Figure 6 As shown, in a preferred embodiment, both the heat-conducting plate 4 and the sleeve 6 are made of copper.

[0036] In this embodiment, using copper material can improve the durability of the device. Copper is relatively soft, and using copper material allows the heat-conducting plate 4 to be bent, making it convenient to insert the heat-conducting plate 4 into the sleeve 6.

[0037] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 Figure 5 and Figure 6 As shown, in a preferred embodiment, both ends of the heat exchange tube 3 are provided with threads for connection to external water cooling equipment;

[0038] In this embodiment, this design allows for easy connection to water-cooled equipment, and the threaded structure, once tightened, ensures that there is no leakage.

[0039] It should be noted that:

[0040] The heat exchange tube 3 can be formed by bending a copper tube with an outer diameter of 1.5 mm and a wall thickness of 0.2 mm.

[0041] The heat-conducting plate 4 can be made of a copper sheet with a thickness of 0.1 mm;

[0042] There is no hard connection between the protective shell 2 and the chip body 1, the heat-conducting plate 4 and the sleeve 6, but they can be connected by the corresponding soldering agent or other soldering materials to prevent them from falling off.

[0043] The parameters mentioned above are common types in the market and meet the requirements of this embodiment, and can be used to verify the feasibility of this embodiment.

[0044] Working Principle: In actual use, the chip body 1 is first mounted on the PCB board. Next, the protective shell 2 is placed on top of the chip body 1, and the heat-conducting plate 4 is inserted into the slot 7, so that the contact pad 8 contacts the top of the chip body 1. Then, coolant is injected into the heat exchange tube 3, allowing the coolant to circulate within it. This allows the heat exchange tube 3 to remove heat from the protective shell 2. Simultaneously, while the heat exchange tube 3 removes heat from the bottom of the protective shell 2, the heat-conducting plate 4 also removes heat from the exposed solder pads 5. Through this method, the heat exchange tube 3 can simultaneously improve the heat dissipation efficiency of both the top and bottom of the chip body 1, thereby reducing the temperature of the chip body 1.

[0045] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. The substitutions may be replacements of some structures, devices, or method steps, or they may be complete technical solutions. Equivalent substitutions or modifications made based on the technical solution and inventive concept of this utility model should all be covered within the protection scope of this utility model.

Claims

1. A high-temperature-resistant heat dissipation structure for a chip package, comprising a chip body (1), characterized in that, The top of the chip body (1) is connected with a protective shell (2); The protective shell (2) is provided as a hollow structure, the inside of the protective shell (2) is fixedly connected with a heat exchange pipe (3) of U-shaped structure, both ends of the heat exchange pipe (3) extend to above the protective shell (2); Both sides of the protective shell (2) are fixedly connected with heat conduction fins (4), the bottom of the chip body (1) is embedded with exposed pads (5), both sides of the exposed pads (5) are fixedly connected with sleeves (6), the inside of the sleeves (6) are all provided with insertion grooves (7), the heat conduction fins (4) all extend to the inside of the corresponding insertion grooves (7).

2. The high-temperature-resistant heat dissipation structure for a chip package according to claim 1, wherein The inside of the protective shell (2) is fixedly connected with contact gaskets (8) at equal intervals, the contact gaskets (8) are all provided as U-shaped structure, the contact gaskets (8) are in contact with the top of the chip body (1).

3. The high-temperature-resistant heat dissipation structure for a chip package according to claim 1, wherein Symmetrical lead solder joints (9) are fixedly connected on the chip body (1).

4. The high-temperature-resistant heat dissipation structure for a chip package according to claim 1, wherein The heat conduction fins (4) and the sleeves (6) are all provided as copper material.

5. The high-temperature-resistant heat dissipation structure for a chip package according to claim 1, wherein Both ends of the heat exchange pipe (3) are provided with threads connected with external water cooling equipment.

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