An overheat prevention memory card

Abstract

The utility model belongs to the memory card technical field especially to prevent overheating's memory card, including memory card main part, the inside installation of memory card main part has the chip, the rear end of memory card main part top installs the contact pin, the front end fixed mounting of memory card main part has the pull -out block, the side surface plug -in installation of pull -out block has terminal heat conduction plate. This prevent overheating's memory card, through the heat conduction block of split body will heat away from the chip, a plurality of equal interval distribution split body heat conduction block can accelerate the flow and dissipation of the heat inside the chip, so can avoid the heat concentration in the chip inside leads to the chip overheating, through the heat conduction plate and the heat conduction connecting plate, the heat transfer inside split body heat conduction block can reach terminal heat conduction plate, the side surface of terminal heat conduction plate is exposed to the outside, so can accelerate the dissipation of the heat in memory card main part, improve the anti -overheating performance of memory card main part.

Description

Technical Field

[0001] This utility model relates to the field of memory card technology, specifically to an overheat-resistant memory card. Background Technology

[0002] A memory card is a standalone storage medium used in mobile phones, digital cameras, laptops, MP3 players, and other digital products. It is generally in the form of a card, hence the general term "memory card," also known as a "digital memory card," "storage card," etc. Memory cards are advantageous due to their small size, portability, and ease of use. Furthermore, most memory cards offer good compatibility, facilitating data exchange between different digital products.

[0003] When a memory card is in operation, its internal chip is powered on and generates heat. Since memory cards are usually inserted into a card slot, and the card slot of an external device is generally designed to match the size of the memory card to ensure connection stability after insertion, the heat generated by the internal chip of the memory card is difficult to dissipate within the card slot. This results in poor heat dissipation of the memory card, which can easily lead to problems such as overheating and interruption of data transmission. Utility Model Content

[0004] In view of the shortcomings of the existing technology, this utility model provides an overheat-proof memory card, which solves the problem of "memory card overheating".

[0005] To achieve the above objectives, this utility model provides the following technical solution: an overheat-resistant memory card, comprising a memory card body, a chip installed on the inner side of the memory card body, contact pins installed at the rear end of the top of the memory card body, a pull block fixedly installed at the front end of the memory card body, a terminal heat-conducting plate inserted into the side of the pull block, multiple equally spaced separate heat-conducting blocks embedded on the upper and lower sides of the memory card body, the multiple separate heat-conducting blocks respectively abutting against the upper and lower sides of the chip, a connecting heat-conducting plate embedded on the inner side of the memory card body, the multiple separate heat-conducting blocks being fixedly connected to the connecting heat-conducting plate, the connecting heat-conducting plate and the terminal heat-conducting plate being fixedly connected by a heat-conducting connecting plate, the heat-conducting connecting plate being installed inside the memory card body.

[0006] As a preferred technical solution of this utility model, the side of the memory card body is provided with a card slot and a buckle, the thickness of the pull block is greater than the thickness of the memory card body, and the side of the pull block near the memory card body is arc-shaped.

[0007] As a preferred technical solution of this utility model, the upper and lower sides of the memory card body are respectively provided with a plurality of equally spaced embedding slots, the split heat conduction block is fixedly installed on the inner side of the embedding slot, the surface of the memory card body is provided with a vertically penetrating mounting slot, and the connecting heat conduction plate is fixedly inserted and installed on the inner side of the mounting slot and abuts against the side of the chip.

[0008] As a preferred technical solution of this utility model, the front end of the memory card body is provided with a connecting groove that communicates with the mounting groove, the heat-conducting connecting plate is inserted and installed inside the connecting groove, the side of the pull block is provided with a through groove that runs from front to back, and the terminal heat-conducting plate is inserted and installed inside the through groove.

[0009] As a preferred technical solution of this utility model, the side of the terminal heat-conducting plate away from the memory card body is arc-shaped and located outside the pull block.

[0010] As a preferred technical solution of this utility model, the terminal heat-conducting plate has multiple equally spaced heat dissipation grooves on the side away from the memory card body.

[0011] Compared with the prior art, this utility model provides a memory card that is resistant to overheating, and has the following beneficial effects:

[0012] 1. This type of overheat-resistant memory card uses separate heat-conducting blocks to conduct heat away from the chip. Multiple equally spaced separate heat-conducting blocks accelerate the flow and dissipation of heat inside the chip, thus preventing heat from concentrating inside the chip and causing overheating. By connecting the heat-conducting plate and the heat-conducting connecting plate, the heat inside the separate heat-conducting blocks can be transferred to the terminal heat-conducting plate. The side of the terminal heat-conducting plate is exposed to the outside, which can accelerate the dissipation of heat inside the memory card body and improve the overheat-resistant performance of the memory card body.

[0013] 2. This type of overheat-proof memory card can disperse heat through multiple separate heat-conducting blocks, avoiding heat concentration inside the chip. The arc-shaped design on the side of the terminal heat-conducting plate can increase the contact area between the terminal heat-conducting plate and the outside air. The design of multiple heat dissipation slots further increases the area of ​​the terminal heat-conducting plate exposed to the outside air, improving the heat dissipation effect inside the memory card body. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the structural distribution near the heat-conducting plate of this utility model;

[0016] Figure 3 This is a schematic diagram of the structural components near the embedded groove of this utility model.

[0017] In the diagram: 1. Memory card body; 11. Contact pin; 12. Card slot; 13. Clip; 14. Embedding slot; 15. Mounting slot; 16. Connecting slot; 2. Pull block; 21. Through slot; 3. Split heat-conducting block; 4. Connecting heat-conducting plate; 41. Heat-conducting connecting plate; 5. Terminal heat-conducting plate; 51. Heat dissipation slot. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Example 1

[0020] Please see Figure 1-3 In this embodiment: an overheat-resistant memory card includes a memory card body 1, a chip installed on the inner side of the memory card body 1, a contact pin 11 installed at the rear end of the top of the memory card body 1, a pull block 2 fixedly installed at the front end of the memory card body 1, a terminal heat-conducting plate 5 inserted into the side of the pull block 2, a plurality of equally spaced split heat-conducting blocks 3 embedded on the upper and lower sides of the memory card body 1, the plurality of split heat-conducting blocks 3 respectively abutting against the upper and lower sides of the chip, a connecting heat-conducting plate 4 embedded on the inner side of the memory card body 1, the plurality of split heat-conducting blocks 3 are all fixedly connected to the connecting heat-conducting plate 4, the connecting heat-conducting plate 4 and the terminal heat-conducting plate 5 are fixedly connected through a heat-conducting connecting plate 41, the heat-conducting connecting plate 41 is installed inside the memory card body 1;

[0021] By setting multiple separate heat-conducting blocks 3 on the upper and lower sides of the memory card body 1, the separate heat-conducting blocks 3 are in contact with the chip. After the chip generates heat during operation, the separate heat-conducting blocks 3 will conduct the heat away from the chip. The multiple equally spaced separate heat-conducting blocks 3 will accelerate the flow and dissipation of heat inside the chip. This can prevent heat from accumulating inside the chip and causing the chip to overheat. By connecting the heat-conducting plate 4 and the heat-conducting connecting plate 41, the heat inside the separate heat-conducting blocks 3 can be transferred to the terminal heat-conducting plate 5. The side of the terminal heat-conducting plate 5 is exposed to the outside, which can accelerate the dissipation of heat inside the memory card body 1 and improve the overheat protection performance of the memory card body 1.

[0022] In the above structure, the split heat-conducting block 3, the connecting heat-conducting plate 4, the heat-conducting connecting plate 41, and the terminal heat-conducting plate 5 are all made of aluminum-copper alloy and are in insulated contact with the chip inside the memory card.

[0023] As a preferred embodiment, the side of the memory card body 1 is provided with a card slot 12 and a buckle 13, the thickness of the pull block 2 is greater than the thickness of the memory card body 1, and the side of the pull block 2 near the memory card body 1 is arc-shaped; this facilitates the insertion and removal of the memory card body 1 from external devices.

[0024] In a preferred embodiment, the upper and lower sides of the memory card body 1 are provided with multiple equally spaced embedding slots 14. The split heat conduction block 3 is fixedly installed inside the embedding slot 14. The surface of the memory card body 1 is provided with a vertically penetrating mounting slot 15. The connecting heat conduction plate 4 is fixedly inserted and installed inside the mounting slot 15 and abuts against the side of the chip. This ensures the stability of the installation of the split heat conduction block 3 and the connecting heat conduction plate 4, improves its heat conduction effect, and the multiple split heat conduction blocks 3 can disperse the heat and avoid the heat from concentrating inside the chip, which would affect its function.

[0025] Example 2

[0026] Please see Figure 1-3 In this embodiment: the front end of the memory card body 1 is provided with a connecting groove 16 that communicates with the mounting groove 15. The heat-conducting connecting plate 41 is inserted and installed inside the connecting groove 16. The side of the pull block 2 is provided with a through groove 21 that runs from front to back. The terminal heat-conducting plate 5 is inserted and installed inside the through groove 21. This improves the stability of the installation of the heat-conducting connecting plate 41 and the terminal heat-conducting plate 5, facilitates the dissipation of heat inside the memory card body 1, and improves the heat dissipation effect.

[0027] As a preferred embodiment, the side of the terminal heat-conducting plate 5 away from the memory card body 1 is designed in an arc shape and located outside the pull block 2. The arc shape design can increase the contact area between the terminal heat-conducting plate 5 and the outside air, further accelerating the dissipation of heat.

[0028] As a preferred embodiment, the terminal heat-conducting plate 5 has multiple equally spaced heat dissipation slots 51 on the side away from the memory card body 1. The design of multiple heat dissipation slots 51 further increases the area of ​​the terminal heat-conducting plate 5 exposed to the outside air, thereby improving the heat dissipation effect inside the memory card body 1.

[0029] Finally, it should be noted that the above are merely preferred embodiments of this utility model and are not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A memory card resistant to overheating, comprising a memory card body (1), wherein a chip is mounted on the inner side of the memory card body (1), characterized in that: The memory card body (1) has a contact pin (11) installed at the rear end of the top. The memory card body (1) has a pull block (2) fixedly installed at the front end. The pull block (2) has a terminal heat-conducting plate (5) inserted into its side. The memory card body (1) has multiple equally spaced split heat-conducting blocks (3) embedded on its upper and lower sides. The multiple split heat-conducting blocks (3) abut against the upper and lower sides of the chip respectively. The memory card body (1) has a connecting heat-conducting plate (4) embedded inside its inner side. The multiple split heat-conducting blocks (3) are all fixedly connected to the connecting heat-conducting plate (4). The connecting heat-conducting plate (4) and the terminal heat-conducting plate (5) are fixedly connected by a heat-conducting connecting plate (41). The heat-conducting connecting plate (41) is installed inside the memory card body (1).

2. The overheat-resistant memory card according to claim 1, characterized in that: The side of the memory card body (1) is provided with a card slot (12) and a buckle (13). The thickness of the pull block (2) is greater than the thickness of the memory card body (1). The side of the pull block (2) near the memory card body (1) is arc-shaped.

3. The overheat-resistant memory card according to claim 1, characterized in that: The memory card body (1) has multiple equally spaced embedding slots (14) on its upper and lower sides respectively. The split heat-conducting block (3) is fixedly installed inside the embedding slot (14). The surface of the memory card body (1) has a through mounting slot (15) that runs vertically through it. The connecting heat-conducting plate (4) is fixedly inserted and installed inside the mounting slot (15) and abuts against the side of the chip.

4. The overheat-resistant memory card according to claim 1, characterized in that: The front end of the memory card body (1) is provided with a connecting groove (16) that communicates with the mounting groove (15). The heat-conducting connecting plate (41) is inserted and installed inside the connecting groove (16). The side of the pull block (2) is provided with a through groove (21) that runs through the front and back. The terminal heat-conducting plate (5) is inserted and installed inside the through groove (21).

5. A memory card resistant to overheating according to claim 1, characterized in that: The terminal heat-conducting plate (5) is arc-shaped on the side away from the memory card body (1) and is located outside the pull block (2).

6. A memory card resistant to overheating according to claim 5, characterized in that: The terminal heat-conducting plate (5) has multiple equally spaced heat dissipation slots (51) on the side away from the memory card body (1).

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