Heat dissipation structure for semiconductor packaging

Abstract

The utility model provides a heat dissipation structure for semiconductor packaging, which relates to the technical field of semiconductor packaging and comprises a substrate, a chip, a packaging shell, through holes, a flexible heat conduction piece, a heat conduction pipe, spiral fins and double heat dissipation fins. According to the device, the heat generated by the chip can be discharged out of the packaging shell through the plurality of heat conduction pipes, and the heat dissipation speed to the external environment can be accelerated through arranging the spiral fins on the heat conduction pipes; in addition, on the basis that the heat conduction pipe is matched with the spiral fins, double heat dissipation fins can be installed on the heat conduction pipe, so that the arrangement area range of the heat dissipation piece on the packaging shell is further enlarged, and the heat dissipation effect is further improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and more specifically, to a heat dissipation structure for semiconductor packaging. Background Technology

[0002] Semiconductor devices are electronic devices with conductivity between that of good conductors and insulators. They utilize the unique electrical properties of semiconductor materials to perform specific functions and are widely used to generate, control, receive, convert, and amplify signals and perform energy conversion. The semiconductor materials used in semiconductor devices are silicon, germanium, or gallium arsenide, and they can be used as rectifiers, oscillators, light emitters, amplifiers, photometers, and other equipment.

[0003] While the packaging shell currently covering the outside of the chip and fixed on the substrate can protect the chip inside, it inevitably obstructs the heat dissipation of the chip. As a result, the heat generated by the chip during operation cannot be dissipated quickly, causing the chip temperature to rise and making it prone to damage. The heat dissipation effect after semiconductor packaging needs to be improved. Utility Model Content

[0004] The purpose of this invention is to solve the problems mentioned in the background art and to propose a heat dissipation structure for semiconductor packaging.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A heat dissipation structure for semiconductor packaging includes a substrate, a chip, and a package shell, and further includes through-holes, flexible thermal conductive elements, heat pipes, spiral fins, and dual heat dissipation fins.

[0007] Symmetrical vias are provided on both sides of the package to allow chip pins to pass through;

[0008] The flexible thermal conductive component is located inside the encapsulation shell;

[0009] Several rows of heat pipes with open ends are equidistantly arranged on the encapsulation shell, and the ends of the heat pipes extend through the encapsulation shell into its interior.

[0010] Spiral fins are arranged on the area where the heat pipe is inside the encapsulation shell;

[0011] The dual heat dissipation fins and heat pipes are movably connected in the area outside the encapsulation shell.

[0012] Furthermore, T-shaped blocks are fixed at both ends of the dual heat dissipation fins, and T-shaped grooves that cooperate with the T-shaped blocks are opened on the two heat conduction pipes at both ends of a horizontal row, and the bottom of the dual heat dissipation fins is in contact with the surface of the encapsulation shell.

[0013] Furthermore, the dual heat dissipation fins have several interference grooves on the other side facing away from the T-shaped block.

[0014] Furthermore, the shape of the turbulence groove is one of corrugated, sawtooth, or louvered structures.

[0015] Furthermore, a temperature sensor is installed inside the packaging shell.

[0016] Furthermore, a suction fan is fitted above the encapsulation shell.

[0017] Furthermore, the flexible thermal conductive element is made of thermally conductive silicone.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] Compared to existing technologies, this device can dissipate the heat generated by the chip from the package shell through several heat pipes. Furthermore, by setting spiral fins on the heat pipes, the heat dissipation rate to the external environment can be accelerated. In addition, based on the combination of heat pipes and spiral fins, double heat dissipation fins can be installed on the heat pipes to further increase the coverage area of ​​the heat dissipation components on the package shell, thereby further improving the heat dissipation effect. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram showing the combination of a heat pipe and dual heat dissipation fins.

[0022] Figure 3 This is a schematic diagram of a T-slot;

[0023] Figure 4 This is a schematic diagram of the T-block installation.

[0024] Figure 5 This is a schematic diagram of a turbulence channel;

[0025] Figure 6 A schematic diagram of the temperature sensor installation;

[0026] Figure label:

[0027] 1. Encapsulation shell; 2. Through hole; 3. Flexible heat-conducting component; 4. Heat-conducting pipe; 5. Spiral fins; 6. Double heat dissipation fins; 7. T-block; 8. T-slot; 9. Turbulence groove; 10. Temperature sensor. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model. The present utility model will be further described with reference to the accompanying drawings and embodiments:

[0029] like Figures 1 to 4 As shown, a heat dissipation structure for semiconductor packaging includes a substrate, a chip, and a package shell 1. It also includes a through-hole 2, a flexible thermal conductive element 3, a heat pipe 4, spiral fins 5, and dual heat dissipation fins 6.

[0030] Through-holes 2 are symmetrically opened on both sides of the package housing 1 to allow chip pins to pass through;

[0031] The flexible thermal conductive element 3 is disposed inside the encapsulation shell 1 (specifically, the flexible thermal conductive element 3 is made of thermally conductive silicone).

[0032] Several rows of heat pipes 4 with open ends are equidistantly arranged on the encapsulation shell 1, and the ends of the heat pipes 4 extend through the encapsulation shell 1 into its interior.

[0033] Spiral fins 5 are arranged on the area where the heat pipe 4 is located inside the encapsulation shell 1;

[0034] The dual heat dissipation fins 6 and the heat pipe 4 are movably connected in the area outside the encapsulation shell 1.

[0035] Further refinements of the embodiments of this utility model, such as... Figures 2 to 4 As shown, T-shaped blocks 7 are fixed at both ends of the dual heat dissipation fins 6, and T-shaped grooves 8 that cooperate with the T-shaped blocks 7 are opened on the two heat conduction pipes 4 at both ends of a horizontal row, and the bottom of the dual heat dissipation fins 6 is in contact with the surface of the encapsulation shell 1.

[0036] To increase the effective heat dissipation area and enhance convective heat transfer, further optimizations to the solution are needed, such as... Figure 5 As shown, the dual heat dissipation fins 6 have a small interference flow groove 9 on the other side away from the T-shaped block 7;

[0037] Specifically, the shape of the turbulence channel 9 is one of corrugated, sawtooth, or louvered structures, thereby enhancing the local turbulence disturbance and increasing the convective heat transfer coefficient by 25%-40%.

[0038] The working process of this utility model:

[0039] During chip operation, heat is generated, which then flows upward and enters the heat pipe 4. During the heat transfer process, the spiral fins 5 on the heat pipe 4 can accelerate the dissipation of heat to the external environment. In addition to the heat pipe 4 and spiral fins 5, a second set of heat dissipation fins 6 can be installed on the heat pipe 4 to further increase the coverage area of ​​the heat dissipation components on the package shell 1, thereby further improving the heat dissipation effect. In this way, the heat generated during chip operation can be effectively dissipated while covering and protecting the chip, resulting in better heat dissipation of the semiconductor package shell 1.

[0040] In some embodiments, such as Figure 6 As shown, a temperature sensor 10 is installed inside the encapsulation shell 1;

[0041] A further optimization of the above embodiment involves an exhaust fan mounted on top of the package shell 1. In this embodiment, the temperature sensor 10 can detect the internal temperature of the package shell 1 in real time and transmit the signal to the controller. If the temperature is high (exceeding a preset upper limit), the exhaust fan is activated to further accelerate heat dissipation to the outside and enhance air convection, thus improving the heat dissipation effect of the semiconductor package shell 1. (The exhaust fan and controller are not shown in the figure.)

[0042] Meanwhile, in order to further improve the heat dissipation effect, in other embodiments, the inner wall of the package shell 1 is coated with thermally conductive silicone grease; in this embodiment, by coating the inner wall of the package shell 1 with thermally conductive silicone grease, the air gap can be effectively filled, the thermal resistance can be reduced, and the heat dissipation efficiency can be significantly improved. It is especially suitable for high power density devices, and the heat dissipation effect can be further improved when used with the double heat dissipation fins 6.

[0043] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A heat dissipating structure for a semiconductor package, comprising a substrate, a chip, and a package case (1), characterized by, It also includes through holes (2), flexible heat conductive parts (3), heat conductive tubes (4), spiral fins (5) and double heat dissipation fins (6), The through holes (2) are symmetrically arranged on both sides of the packaging shell (1) to allow the chip pins to pass out; The flexible heat conductive parts (3) are arranged inside the packaging shell (1); Several rows of open-ended heat conductive tubes (4) are arranged equidistantly on the packaging shell (1), and the heat conductive tubes (4) extend to the inside of the packaging shell (1) through the packaging shell (1); The spiral fins (5) are arranged on the area where the heat conductive tubes (4) are inside the packaging shell (1); The double heat dissipation fins (6) are movably connected with the area where the heat conductive tubes (4) are outside the packaging shell (1).

2. The heat dissipating structure for semiconductor package according to claim 1, wherein T-shaped blocks (7) are fixed at both ends of the double heat dissipation fins (6), T-shaped grooves (8) are arranged on the two heat conductive tubes (4) at both ends of a horizontal row to match the T-shaped blocks (7), and the bottom of the double heat dissipation fins (6) is in contact with the surface of the packaging shell (1).

3. The heat dissipation structure for a semiconductor package according to claim 1, wherein A plurality of turbulence grooves (9) are arranged on the side of the double heat dissipation fins (6) opposite to the T-shaped blocks (7).

4. The heat dissipating structure for semiconductor package according to claim 3, wherein The shape of the turbulence grooves (9) is one of corrugated, zigzag or louver structure.

5. The heat dissipating structure for semiconductor package according to claim 1, wherein A temperature sensor (10) is arranged inside the packaging shell (1).

6. The heat dissipating structure for semiconductor package according to claim 5, wherein An air suction fan is arranged above the packaging shell (1).

7. The heat dissipating structure for semiconductor package according to claim 1, wherein The flexible heat conductive parts (3) are made of heat conductive silica gel.

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