Power supply step-down chip capable of preventing lead from falling off

Abstract

The utility model relates to the technical field of power supply step-down chips, in particular to a power supply step-down chip capable of preventing a lead from falling off, which comprises a step-down chip main body and a heat dissipation mechanism, and the heat dissipation mechanism is arranged on the bottom edge of the step-down chip main body. Heat generated by the chip can be absorbed through two channels of the heat dissipation fins, the closed structure and the heat dissipation mechanism and is discharged through respective heat dissipation structures, heat-conducting glue filled in the heat dissipation fins can greatly improve the heat absorption upper limit of the device and improve the heat dissipation effect, and the step-down chip main body comprises the chip, connecting pins, the heat dissipation fins and the closed structure. According to the power supply step-down chip capable of preventing the lead from falling off, unstable and low-efficiency cold water is replaced with heat-conducting glue with higher stability and heat absorption capacity, so that a heat dissipation structure has better safety and practicability after being used for a long time, meanwhile, a plurality of sheet-shaped heat dissipation metal sheet structures are additionally arranged to serve as auxiliary heat dissipation parts, and the heat dissipation efficiency is improved. And the operation upper limit of the chip is further improved.

Description

Technical Field

[0001] This utility model relates to the field of power step-down chip technology, specifically a power step-down chip that prevents lead wires from falling off. Background Technology

[0002] Power supply step-down chips typically employ a BUCK topology and are commonly found in power supplies for small household appliances and industrial control systems. Typical circuit specifications include 5V / 0.5A, 12V / 0.5A, and 24V / 0.5A, meeting Level VI energy efficiency requirements. They can pass reliability tests such as EFT, lightning strike, and surge tests, and are certified by 3C, UL, and CE. Their characteristics include: simple circuitry, low BOM cost (very few external components: no transformers, inductors, or optocouplers required), small power supply size, no noise, and low heat generation. Existing power supply step-down chips use a sponge layer for water cooling and heat absorption. However, in electrical applications, water as a heat dissipation medium lacks high heat absorption capacity and can easily damage the circuit, compromising safe operation. Utility Model Content

[0003] The purpose of this invention is to provide a power step-down chip that prevents lead wires from falling off, so as to solve the problems mentioned in the background art.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a power step-down chip for preventing lead wire detachment, comprising a step-down chip body and a heat dissipation mechanism, wherein the heat dissipation mechanism is installed on the bottom edge of the step-down chip body.

[0005] When the chip is running, the heat generated by the chip is absorbed through two channels: the heat sink fins and the enclosed structure, and the heat dissipation mechanism. The heat is then dissipated through their respective heat dissipation structures. The thermally conductive adhesive filled inside the heat sink fins can significantly increase the upper limit of heat absorption of the device and improve the heat dissipation effect.

[0006] Preferably, the buck chip body includes a chip, connection pins, heat sink fins, and a closed structure. The connection pins are mounted on both sides of the chip and consist of multiple pins. The heat sink fins are composed of multiple single-piece metal fixtures and are mounted inside the closed structure. The heat sink fins and the closed structure are mounted together on the top of the chip.

[0007] Preferably, the heat dissipation fin includes thermally conductive adhesive and a metal extension sheet. The thermally conductive adhesive is disposed inside the heat dissipation fin, and the metal extension sheet is located above the thermally conductive adhesive and is an extended metal sheet structure.

[0008] Thermally conductive adhesive is filled inside the heat dissipation fins to increase the upper limit of heat absorption, and heat is dissipated through metal extension plates.

[0009] Preferably, the heat dissipation mechanism includes a support frame and a second heat dissipation fin. The support frame is a square metal frame structure, and the second heat dissipation fin is located on both sides of the support frame and is composed of multiple crescent-shaped thin metal sheets.

[0010] Preferably, the support frame can support the bottom of the chip without affecting the connection pins, and the second heat dissipation fin is in contact with the closed structure.

[0011] The support frame can provide a second heat absorption channel from the bottom of the chip and dissipate heat through the second heat dissipation fins.

[0012] Compared with the prior art, this utility model provides a power step-down chip that prevents lead wire detachment, which has the following beneficial effects: This power step-down chip that prevents lead wire detachment replaces unstable and inefficient cold water with thermally conductive adhesive with stronger stability and heat absorption capacity, so that the heat dissipation structure has better safety and practicality under long-term use. At the same time, multiple additional sheet-type heat dissipation metal sheet structures are added as auxiliary heat dissipation components, further improving the upper limit of chip operation. Attached Figure Description

[0013] Figure 1 This is a three-dimensional diagram illustrating the structure of this utility model.

[0014] Figure 2 This is a half-sectional view of the main body of the step-down chip of this utility model;

[0015] Figure 3 This is a three-dimensional demonstration diagram of the heat dissipation mechanism of this utility model.

[0016] The components are: 1. Buck chip body; 101. Chip; 102. Connecting pin; 103. Heat sink fin; 1031. Thermal adhesive; 1032. Metal extension sheet; 104. Enclosed structure; 2. Heat dissipation mechanism; 201. Support frame; 202. Second heat sink fin. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figure 1-3 This utility model provides a technical solution: a power step-down chip to prevent lead wires from falling off, including a step-down chip body 1 and a heat dissipation mechanism 2, wherein the heat dissipation mechanism 2 is installed on the bottom edge of the step-down chip body 1.

[0019] In the first embodiment of this utility model, during chip operation, the heat generated by the chip 101 is absorbed through two channels: the heat dissipation fins 103 and the enclosed structure 104, and the heat dissipation mechanism 2. The heat is then dissipated through their respective heat dissipation structures. The thermally conductive adhesive 1031 filling the heat dissipation fins 103 significantly increases the upper limit of heat absorption and improves heat dissipation. The buck chip body 1 includes the chip 101, connection pins 102, heat dissipation fins 103, and enclosed structure 104. The connection pins 102 are mounted on both sides of the chip 101 and consist of multiple pins. The heat dissipation fins 103 are composed of multiple individual sheet-shaped metal fixtures and are installed inside the enclosed structure 104. The heat dissipation fins 103 and the enclosed structure 104 are mounted together on top of the chip 101.

[0020] In the second embodiment of this utility model, the heat dissipation fin 103 includes thermally conductive adhesive 1031 and a metal extension sheet 1032. The thermally conductive adhesive 1031 is disposed inside the heat dissipation fin 103, and the metal extension sheet 1032 is located above the thermally conductive adhesive 1031, extending out as a metal sheet structure. Through the above technical solution, the heat dissipation fin 103 is filled with thermally conductive adhesive 1031, increasing the heat absorption limit of the heat dissipation fin 103, and the heat is dissipated through the metal extension sheet. The heat dissipation mechanism 2 includes a support frame 201 and a second heat dissipation fin 202. The support frame 201 is a square metal frame structure, and the second heat dissipation fin 202 is located on both sides of the support frame 201, composed of multiple crescent-shaped thin metal sheets. The support frame 201 can support the bottom of the chip 101 without affecting the connection pins 102. The second heat dissipation fin 202 is in contact with the closed structure 104. Through the above technical solution, the support frame 201 can form a second heat absorption channel from the bottom of the chip 101 and dissipate heat through the second heat dissipation fin 202.

[0021] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A power supply step-down chip for preventing lead drop, comprising a step-down chip body (1) and a heat dissipation mechanism (2), characterized in that: The heat dissipation mechanism (2) is installed on the bottom edge of the voltage reduction chip body (1), the voltage reduction chip body (1) comprises a chip (101), connecting pins (102), heat dissipation fins (103) and a closed structure (104), the connecting pins (102) are installed on both sides of the chip (101) and are composed of a plurality of pins, the heat dissipation fins (103) are composed of a plurality of single sheet type metal devices and are installed inside the closed structure (104), the heat dissipation fins (103) and the closed structure (104) are installed on the top of the chip (101) together, the heat dissipation fins (103) comprise heat-conducting glue (1031) and metal extension sheets (1032), the heat-conducting glue (1031) is arranged inside the heat dissipation fins (103), and the metal extension sheets (1032) are located above the heat-conducting glue (1031) and are sheet body structures extended out of metal.

2. The power supply step-down chip for preventing lead falling according to claim 1, characterized in that: The heat dissipation mechanism (2) comprises a support frame (201) and second heat dissipation fins (202), the support frame (201) is a metal square frame structure, and the second heat dissipation fins (202) are located on both sides of the support frame (201) and are composed of a plurality of half-moon shaped thin metal sheets.

3. The power supply step-down chip of claim 2, wherein: The support frame (201) can frame the bottom of the chip (101) without affecting the connecting pins (102), and the second heat dissipation fins (202) are in contact with the closed structure (104).

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