Water-cooled radiator with nonlinear fin array structure

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a water-cooling radiator with a nonlinear fin array structure, which comprises a base, a snakelike water-cooling pipeline and a water-cooling layer positioned above the pipeline are integrated in the base, radiating fins which are arranged in a nonlinear manner are arranged on the surface of the base, and two ends of the base are respectively connected with a liquid inlet and a liquid outlet. A mounting frame with mounting holes is arranged on the side of the base, a water cooling pipeline and a water cooling layer are arranged in the base, it is ensured that cooling liquid can flow smoothly, heat can be quickly transferred into the cooling liquid, the local overheating phenomenon is avoided, the cooling fins are of a double-arc structure and are arranged on the base in a staggered mode, the air turbulence effect is improved, the surface area is maximized, and the heat dissipation efficiency is improved. The heat exchange efficiency is improved, the two ends of each fin are of a trapezoid structure, the surface area is further increased, the heat dissipation effect is improved, a plurality of heat dissipation holes are formed in each fin, air flowing is promoted, the air laminar flow phenomenon is reduced, and the convection heat exchange effect is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, specifically a water-cooled heat sink with a nonlinear fin array structure. Background Technology

[0002] With the development of electronic technology, the operating frequency and integration of electronic components (such as CPUs and GPUs) are constantly increasing, leading to a corresponding increase in the heat generated. To ensure these components operate within safe temperature ranges, efficient heat dissipation solutions have become crucial. However, traditional water-cooling radiator designs often have the following shortcomings when facing high-power-density applications:

[0003] Limitations of traditional water-cooled radiators:

[0004] Single fin design: Traditional water cooling radiators usually use a straight or regularly arranged fin design, which cannot make full use of the principles of fluid dynamics to improve heat dissipation efficiency.

[0005] Poor airflow: Due to the small gaps between the fins and their fixed arrangement, airflow is impeded, reducing heat dissipation. Furthermore, traditional fin designs fail to effectively utilize air turbulence to enhance heat dissipation.

[0006] Low thermal conductivity: Many traditional heat sink base materials have poor thermal conductivity and cannot quickly conduct heat from the heat source to the heat sink, resulting in local overheating. Utility Model Content

[0007] (a) Technical problems to be solved

[0008] To address the shortcomings of existing technologies, this invention provides a water-cooled radiator with a nonlinear fin array structure.

[0009] (II) Technical Solution

[0010] To achieve the above objectives, the present invention provides the following technical solution: A water-cooled radiator with a nonlinear fin array structure, comprising a base, wherein a water-cooling pipe is provided inside the base, and a plurality of heat dissipation fins are arranged nonlinearly on the surface of the base, wherein a liquid inlet is provided at one end of the base, and a liquid outlet is provided at the other end of the base, and both the liquid inlet and the liquid outlet are connected to the water-cooling pipe, and a mounting frame is provided on the side of the base, wherein mounting holes are provided on the mounting frame.

[0011] Preferably, the heat dissipation fins adopt a double-arc structure, and the heat dissipation fins are arranged in a staggered manner on the base.

[0012] More preferably, the two ends of the heat dissipation fins are trapezoidal structures.

[0013] Preferably, the heat dissipation fins are provided with a plurality of heat dissipation holes.

[0014] Preferably, the base has a water-cooling layer inside, the water-cooling layer is located above the water-cooling pipe, and the water-cooling pipe is connected to the water-cooling layer.

[0015] More preferably, the heat dissipation fins have a cavity inside, and the cavity is in communication with the water cooling layer.

[0016] Preferably, the water-cooled pipe is arranged inside the base in a serpentine bend structure.

[0017] (III) Beneficial Effects

[0018] Compared with the prior art, this utility model provides a water-cooled radiator with a nonlinear fin array structure, which has the following beneficial effects:

[0019] The base is equipped with water-cooling pipes, with the inlet and outlet located at opposite ends and connected to the water-cooling pipes to ensure smooth coolant flow. The base surface features a non-linear arrangement of several heat dissipation fins in a double-arc, staggered configuration, which enhances air turbulence, maximizes surface area, and improves heat exchange efficiency.

[0020] The heat dissipation fins feature trapezoidal ends to further increase surface area and improve heat dissipation performance. Multiple ventilation holes on the fins promote airflow, reduce laminar flow, and enhance convective heat transfer. A water-cooling layer is located inside the base, above the water-cooling pipes, ensuring rapid heat transfer to the coolant and preventing localized overheating. Cavities within the heat dissipation fins connect to the water-cooling layer, allowing the coolant to directly contact the fin interior and further improve heat exchange efficiency.

[0021] In addition, the base features a mounting frame with mounting holes on its sides for easy installation and secure fixing of the heatsink, ensuring its stability. The overall design not only improves heat conduction efficiency but also optimizes airflow paths, reduces thermal resistance, and extends the lifespan of electronic components. These improvements significantly enhance heat dissipation performance, making it particularly suitable for applications requiring efficient heat dissipation, such as high-performance CPUs and GPUs, and offering broad application prospects and technological advantages. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a top view sectional structural diagram of the present invention;

[0024] Figure 3 This is a front cross-sectional view of the present invention.

[0025] Figure 4 This is a schematic diagram of the heat dissipation fin structure of this utility model;

[0026] In the diagram: 1. Base; 2. Heat dissipation fins; 3. Mounting frame; 4. Mounting holes; 5. Heat dissipation holes; 6. Water cooling pipes; 7. Water cooling layer. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-4 This utility model discloses a water-cooled radiator with a nonlinear fin array structure, including a base 1, a water-cooling pipe 6 inside the base 1, a plurality of heat dissipation fins 2 arranged nonlinearly on the surface of the base 1, a liquid inlet at one end of the base 1, a liquid outlet at the other end of the base 1, and both the liquid inlet and the liquid outlet are connected to the water-cooling pipe 6. A mounting frame 3 is provided on the side of the base 1, and mounting holes 4 are provided on the mounting frame 3.

[0029] This water-cooled radiator, featuring a nonlinear fin array structure, significantly improves heat dissipation efficiency through optimized heat conduction paths and water flow channel design. The following are the main components of the device and its working principle:

[0030] Base 1 and water cooling pipe 6

[0031] Base 1: The base 1 has water-cooling pipes 6 inside for circulating coolant. Several heat dissipation fins 2 are arranged non-linearly on the surface of the base 1. These fins increase the surface area and improve the heat exchange efficiency.

[0032] Liquid inlet and outlet: One end of the base 1 is equipped with a liquid inlet and the other end is equipped with a liquid outlet, both of which are connected to the water cooling pipe 6 to ensure that the coolant can flow smoothly.

[0033] A circulation pipe can be connected between the inlet and outlet. A liquid cooling pump is configured on the circulation pipe to realize the circulation of coolant in the water cooling pipe 6 and the water cooling layer 7.

[0034] Heat dissipation fins 2

[0035] Double-arc structure and staggered arrangement: The heat dissipation fins 2 adopt a double-arc structure and are staggered on the base 1. This design increases the air turbulence effect and enhances the heat exchange efficiency.

[0036] Trapezoidal structure and heat dissipation holes 5: The two ends of the heat dissipation fin 2 are trapezoidal, further increasing the surface area. Several heat dissipation holes 5 are provided on the fins to improve the heat dissipation effect.

[0037] Water-cooled layer 7 and cavity

[0038] Water-cooled layer 7: The base 1 is equipped with a water-cooled layer 7, which is located above the water-cooled pipe 6 and is connected to the water-cooled pipe 6 to ensure that heat can be quickly transferred to the coolant.

[0039] Cavity inside the fins: The heat dissipation fins 2 have cavities that are connected to the water cooling layer 7, so that the coolant can directly contact the inside of the fins and further improve the heat exchange efficiency.

[0040] 6 water-cooled pipes with serpentine bends

[0041] Snake-shaped bend structure: The water-cooled pipe 6 is arranged in a snake-shaped bend structure inside the base 1, which increases the flow path length of the coolant, prolongs the residence time of the coolant in the base 1, and improves the heat dissipation effect.

[0042] Working principles of various preferred technical solutions

[0043] Double-arc structure and staggered heat dissipation fins 2

[0044] Enhanced air turbulence effect: The double-arc structure and staggered arrangement increase the air turbulence effect, making the air more turbulent as it flows over the fins, thus improving heat exchange efficiency.

[0045] Maximizing surface area: The staggered arrangement can maximize the surface area of ​​the fins in a limited space, increase the heat exchange area, and significantly improve the heat dissipation effect.

[0046] Trapezoidal structure and heat dissipation holes 5

[0047] Increased surface area: The trapezoidal structure further increases the surface area of ​​the fins, improving heat dissipation.

[0048] Promotes airflow: The design of heat dissipation hole 5 promotes airflow, reduces laminar airflow, and enhances convective heat transfer.

[0049] Water-cooled layer 7 and the cavity within the fins

[0050] Rapid heat conduction: The water-cooled layer 7 is located above the water-cooled pipe 6, ensuring that heat can be quickly transferred to the coolant and avoiding local overheating.

[0051] Direct contact with coolant: The cavity inside the fins is connected to the water-cooling layer 7, allowing the coolant to directly contact the inside of the fins, further improving heat exchange efficiency.

[0052] 6 water-cooled pipes with serpentine bends

[0053] Extended coolant residence time: The serpentine bend structure increases the flow path length of the coolant, prolongs the residence time of the coolant in the base 1, and improves the heat dissipation effect.

[0054] Uniform heat distribution: The serpentine bend structure ensures that the coolant can be evenly distributed throughout the base 1, reducing local overheating.

[0055] Detailed Workflow

[0056] Design and manufacturing

[0057] Define requirements: Based on the size and power requirements of the target electronic components, determine the specific parameters of the heat sink, such as the number of fins and their arrangement.

[0058] Material selection: The base 1 and fins are made of metal materials with high thermal conductivity (such as copper or aluminum) to ensure good thermal conductivity.

[0059] Manufacturing process: The fins are manufactured using precision machining technology to ensure that their shape and arrangement meet the design requirements. The fins adopt a double-arc structure and are staggered on the base 1, with trapezoidal structures at both ends and heat dissipation holes 5 on the surface.

[0060] Assembly and Testing

[0061] Install the fin group: Install the heat dissipation fins 2 on the surface of the base 1 according to the designed staggered arrangement, and ensure that each fin can be evenly contacted with the air to maximize the heat dissipation area.

[0062] Connecting the water-cooled pipe 6: Install the serpentine water-cooled pipe 6 inside the base 1, ensuring it is connected to the inlet and outlet. The water-cooled layer 7 is located above the water-cooled pipe 6, ensuring that heat can be quickly transferred to the coolant.

[0063] Install fan module: Configure a high-efficiency fan above base 1 to ensure sufficient airflow covers the entire heat dissipation area.

[0064] During installation, bolts can pass through the outer casing of the fan module. The bolts are threaded through the outer casing of the fan module and connected to the mounting holes 4 on the mounting frame 3.

[0065] Preliminary testing: After assembly, a series of temperature rise experiments were conducted to verify the actual heat dissipation effect of the radiator, and the water flow rate and other parameters were adjusted based on the test results.

[0066] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A water-cooled heat sink having a non-linear fin array structure, characterized by, The utility model provides a water cooling radiator, including base (1), the inside of base (1) is equipped with water cooling pipeline (6), the surface of base (1) is provided with a plurality of radiating fins (2) in nonlinear arrangement, one end of base (1) is equipped with liquid inlet, the other end of base (1) is equipped with liquid outlet, and the liquid inlet and liquid outlet are communicated with water cooling pipeline (6), and the side of base (1) is provided with mounting frame (3), and is equipped with mounting hole (4) on mounting frame (3).

2. The water-cooled heat sink with a non-linear fin array structure according to claim 1, wherein, The radiating fin (2) is arranged in a staggered manner on the base (1).

3. The water-cooled heat sink with a non-linear fin array structure according to claim 2, wherein, The radiating fin (2) has a trapezoidal structure at both ends.

4. The water-cooled heat sink with a non-linear fin array structure according to claim 3, wherein, The radiating fin (2) is provided with a plurality of heat dissipation holes (5).

5. The water-cooled heat sink with a non-linear fin array structure according to claim 4, wherein, The base (1) is provided with a water cooling layer (7) inside, and the water cooling layer (7) is located above the water cooling pipeline (6).

6. The water-cooled heat sink with a non-linear fin array structure according to claim 5, wherein, The radiating fin (2) is provided with a cavity, and the cavity is communicated with the water cooling layer (7).

7. The water-cooled heat sink with a non-linear fin array structure of claim 6, wherein, The water cooling pipeline (6) is arranged in a serpentine bending structure inside the base (1).

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