Package structure
By setting protrusions in the packaging structure, the problem of inconsistent thermal conductivity layer thickness is solved, ensuring uniform contact between the packaging structure and the heat sink, thereby improving heat dissipation and overall lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-03-06
AI Technical Summary
In existing top-heat-dissipation packaging structures, the thickness of thermal grease applied to chips and devices is inconsistent, resulting in poor contact between some devices and the heat sink, affecting heat dissipation performance and the overall lifespan of the device.
Several bosses are provided in the packaging structure to make the thickness of the first thermal conductive layer between the packaging structure and the heat sink consistent. The bosses abut against the heat sink to ensure the uniformity of the thermal conductive layer thickness.
This achieves good bonding between different package structures and heat sinks on the same circuit board, avoiding the problem of excessive temperature caused by inconsistent thermal conductive layer thickness, and improving the heat dissipation performance and service life of the package structure.
Smart Images
Figure CN223979117U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging technology, and in particular to a packaging structure. Background Technology
[0002] Current top-heat-dissipating package structures employ various methods. Some use an insulating substrate to support the chip and / or device, typically using DBC (Direct Bonded Copper). DBC bonds copper foil to a ceramic substrate, with another layer of copper added to the other side of the ceramic substrate for heat dissipation. In practical applications, only thermal grease needs to be applied to the heatsink for heat dissipation. Others use traditional leadframes to achieve the same chip and / or device support and external connectivity. In this case, an insulating pad is added in addition to the thermal grease before being attached to the heatsink. If the chip and / or device surface has a certain height for auxiliary positioning, inconsistent thermal grease thickness can occur. On circuit boards of power electronic devices, if different chips and / or devices are mounted on a single heatsink with inconsistent thermal grease thickness, it can lead to poor contact between the thinner devices and the heatsink, resulting in poor heat dissipation. Utility Model Content
[0003] In view of this, the purpose of this utility model is to provide a packaging structure that ensures the thickness of the first thermally conductive layer between the packaging structure and the heat sink is consistent by setting a number of bosses.
[0004] This utility model embodiment provides a packaging structure, the packaging structure comprising: a substrate; a chip and / or device located on a first surface of the substrate; a pin, one end of which is electrically connected to the chip and / or device and a portion of the first surface of the substrate, and the other end of which is connected to a circuit board; a molding compound, which encapsulates the portion of the first surface of the substrate not covered by the chip and / or device, a side surface of the substrate, the chip and / or device, and one end of the pin, and the other end of which extends out of the molding compound; and a plurality of bosses located on a second surface of the molding compound and / or the second surface of the substrate and spaced apart from each other, the molding compound comprising a parallel first surface and a second surface, wherein the distance between the second surface of the molding compound and the second surface of the substrate is less than the distance between the first surface of the molding compound and the second surface of the substrate.
[0005] Preferably, the boss abuts against the heat sink.
[0006] Preferably, the packaging structure further includes a first thermally conductive layer, which is located on the second surface of the substrate, surrounds the boss, and has a uniform thickness.
[0007] Preferably, the first thermally conductive layer is a thermally conductive silicone grease layer or a thermally conductive gel layer.
[0008] Preferably, there are four bosses, which are spaced apart at the four corners of the second surface of the substrate.
[0009] Preferably, there are six bosses, which are distributed in a rectangular array at intervals at the edge of the second surface of the substrate.
[0010] Preferably, there are three bosses, which are distributed in a triangular pattern at the edge of the second surface of the substrate.
[0011] Preferably, the boss is configured as a columnar structure with a rectangular cross-section.
[0012] Preferably, the boss is configured as a columnar structure with a circular cross-section.
[0013] Preferably, the boss is configured as a columnar structure with an L-shaped cross-section.
[0014] Preferably, the boss is configured as a columnar structure with an L-shaped cross-section, and the boss has a rounded structure at the bend.
[0015] Preferably, the packaging structure (A) is a surface mount structure or a plug-in structure.
[0016] Preferably, the boss and the molding body are an integral structure.
[0017] Preferably, the height of the boss is less than 500 micrometers.
[0018] Preferably, the second surface of the substrate exposes the encapsulant.
[0019] Preferably, the encapsulation structure is located on the heat sink via an insulating pad and a second thermally conductive layer.
[0020] Preferably, the second thermally conductive layer is a thermally conductive silicone grease layer or a thermally conductive gel layer.
[0021] This utility model provides a packaging structure including a substrate, a chip and / or device, pins, a molding compound, and a plurality of bosses. Specifically, the chip and / or device is located on a first surface of the substrate. One end of the pin is electrically connected to the chip and / or device and a portion of the first surface of the substrate, and the other end of the pin is connected to a circuit board. The molding compound covers the portion of the first surface of the substrate not covered by the chip and / or device, the side of the substrate, and one end of the pin. The other end of the pin extends out of the molding compound. The bosses are located on a second surface of the molding compound and / or the second surface of the substrate and are spaced apart from each other. The molding compound includes a first surface and a second surface that are parallel. The distance between the second surface of the molding compound and the second surface of the substrate is less than the distance between the first surface of the molding compound and the second surface of the substrate. The packaging structure abuts against a heat sink through the bosses, thereby ensuring that the thickness of the first thermally conductive layer between the second surface of the substrate and the heat sink is consistent. Therefore, the thickness of the first thermal conductive layer can be controlled by setting bosses in the packaging structure. This is beneficial in practical applications so that different packaging structures on the same circuit board can fit well into a whole heat sink, avoiding excessive temperature of some packaging structures due to inconsistent thickness of the first thermal conductive layer. Attached Figure Description
[0022] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:
[0023] Figure 1 These are application diagrams of several existing packaging structures;
[0024] Figure 2 This is a cross-sectional schematic diagram of a packaging structure provided in an embodiment of this utility model;
[0025] Figure 3 This is a schematic diagram illustrating the application of a packaging structure provided in an embodiment of this utility model;
[0026] Figure 4 This is a schematic diagram illustrating the application of multiple packaging structures provided in the embodiments of this utility model;
[0027] Figure 5 This is a top view schematic diagram of the first packaging structure provided in this embodiment of the utility model;
[0028] Figure 6 This is a top view schematic diagram of the second packaging structure provided in this embodiment of the utility model;
[0029] Figure 7 This is a top view schematic diagram of the third packaging structure provided in this embodiment of the utility model;
[0030] Figure 8This is a top view schematic diagram of the fourth packaging structure provided in this embodiment of the utility model;
[0031] Figure 9 This is a top view schematic diagram of the fifth packaging structure provided in this embodiment of the utility model;
[0032] Figure 10 This is a top view schematic diagram of the sixth packaging structure provided in this embodiment of the utility model;
[0033] Figure 11 This is a top view schematic diagram of the seventh packaging structure provided in this embodiment of the utility model;
[0034] Figure 12 This is a cross-sectional schematic diagram of another packaging structure provided in an embodiment of the present utility model;
[0035] Figure 13 This is a schematic diagram illustrating the application of another packaging structure provided in this embodiment of the utility model.
[0036] Explanation of reference numerals in the attached figures:
[0037] 1-Substrate; 11-Second surface of substrate; 2-Chip and / or device; 3-Pin; 4-Molded body; 5-Boss; A-Package structure; B-Circuit board; C-Heat sink; C1-Second thermal conductive layer; C2-Insulating pad; D-First thermal conductive layer; E-Existing package structure; F-Inferior silicone grease. Detailed Implementation
[0038] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.
[0039] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.
[0040] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0041] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.
[0042] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".
[0043] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0044] Figure 1 These are application diagrams of several existing packaging structures, such as... Figure 1 As shown, if the existing package structure E is not coated with silicone grease evenly, it will produce unqualified silicone grease F, that is, the thickness of unqualified silicone grease F is too thin, which will cause the corresponding existing package structure E to have poor heat dissipation, and thus affect the life of the whole machine.
[0045] Figure 2 This is a cross-sectional schematic diagram of a packaging structure provided in an embodiment of this utility model. Figure 3 This is an application diagram of a packaging structure provided by an embodiment of the present utility model, combined with... Figure 2 and Figure 3As shown, the top-heat-dissipating package structure A includes a substrate 1, a chip and / or device 2, pins 3, a molding compound 4, and several bosses 5. Further, the chip and / or device 2 is located on the first surface of the substrate 1. One end of the pin 3 is electrically connected to a portion of the first surface of the substrate 1 and the chip and / or device 2. The molding compound 4 covers the portion of the first surface of the substrate 1 not covered by the chip and / or device, the side of the substrate 1, and one end of the pin 3 for protection. The other end of the pin 3 extends from within the molding compound 4 and extends in a first direction to connect to the circuit board B. Further still, the molding compound 4 includes parallel first and second surfaces. The bosses 5 are located on the second surface of the molding compound 4 and / or the second surface of the substrate 1 and are spaced apart from each other. The distance between the second surface of the molding compound 4 and the second surface of the substrate 1 is less than the distance between the first surface of the molding compound 4 and the second surface of the substrate 1. It should be noted that the first direction and the second direction are opposite directions. It is easy to understand that the package structure A abuts against the heat sink C via the boss 5, thereby helping to make the thickness of the first thermally conductive layer D between the second surface 11 of the substrate and the heat sink C consistent.
[0046] It should be noted that when the first thermally conductive layer D is formed on the second surface 11 of the substrate, the boss 5 pressing against the heat sink C will compress the first thermally conductive layer D, thereby making the thickness of the first thermally conductive layer D equal to the height of the boss 5. Simultaneously, the boss 5 can also provide a certain positioning function for the first thermally conductive layer D. For example, Figure 4 This is a schematic diagram illustrating the application of multiple packaging structures provided in embodiments of this utility model, such as... Figure 4 As shown, the first thermally conductive layer D can achieve a consistent thickness based on the height of the boss 5. This facilitates the proper adhesion of different package structures A on the same circuit board B to a single heat sink C in practical applications, preventing overheating of some package structures A due to inconsistent coating thickness of the first thermally conductive layer D. Optionally, the height of the boss 5 is less than 500 micrometers, thus controlling the thickness of the first thermally conductive layer D within 500 micrometers. Therefore, the thickness error of the first thermally conductive layer D can be controlled by the boss 5, ensuring good consistency in the thickness of the first thermally conductive layer D for all package structures A of the power module. This, in turn, ensures consistent heat dissipation performance for all package structures A, improving their lifespan.
[0047] Figure 5 This is a top view schematic diagram of the first packaging structure provided in this embodiment of the utility model, as shown below. Figure 5 As shown, in one embodiment, the second surface 11 of the substrate is formed into a rectangle, and four bosses 5 are spaced apart at the four corners of the second surface 11 of the substrate. Thus, the package structure A can ensure a smooth contact with the heat sink C by means of the bosses 5, while avoiding occupying too much area, thereby ensuring the heat conduction effect of the first thermally conductive layer D.
[0048] Figure 6 This is a top view schematic diagram of the second packaging structure provided in this embodiment of the utility model, as shown below. Figure 6 As shown, in one embodiment, the second surface 11 of the substrate is formed into a rectangle, and six protrusions 5 are distributed in a rectangular array at intervals along the edge of the second surface 11. Specifically, four protrusions 5 are located at the four corners of the second surface 11, and the other two protrusions 5 are located at two opposite sides of the second surface 11. Thus, the protrusions 5 ensure a smooth contact with the heat sink C while avoiding excessive area occupation, thereby ensuring the thermal conductivity of the first thermally conductive layer D.
[0049] Figure 7 This is a top view schematic diagram of the third packaging structure provided in this embodiment of the utility model, as shown below. Figure 7 As shown, in one embodiment, the second surface 11 of the substrate is formed into a rectangle, and three protrusions 5 are distributed in a triangular interval at the edge of the second surface 11. Specifically, two protrusions 5 are located at the two corners of the same side of the second surface 11, and the third protrusion 5 is located at the middle of the opposite side. It should be noted that the number of protrusions 5 needs to be more than three, and the distribution position needs to be able to define a plane. Thus, the package structure A can ensure a smooth contact with the heat sink C through the protrusions 5, while avoiding occupying too much area, thereby ensuring the heat conduction effect of the first thermally conductive layer D.
[0050] Combination Figures 5 to 7 As shown, in one embodiment, the boss 5 is configured as a columnar structure with a rectangular cross-section. This facilitates the contact between the package structure A and the heat sink C, and also improves the stability of the contact between the package structure A and the heat sink C.
[0051] Figure 8 This is a top view schematic diagram of the fourth packaging structure provided in this embodiment of the utility model, as shown below. Figure 8 As shown, in one embodiment, the second surface 11 of the substrate is formed into a rectangle, and four bosses 5 are spaced apart at the four corners of the second surface 11. The bosses 5 are also configured as columnar structures with circular cross-sections. Therefore, the cylindrical bosses 5, compared to a cuboid structure, provide superior mechanical properties to ensure a stable connection between the package structure A and the heat sink C, while also helping to reduce space requirements and improve the thermal conductivity of the first thermally conductive layer D. Furthermore, they help prevent damage to components from impacts.
[0052] Figure 9 This is a top view schematic diagram of the fifth packaging structure provided in this embodiment of the utility model, as shown below. Figure 9As shown, in one embodiment, the second surface 11 of the substrate is formed into a rectangle, and four bosses 5 are spaced apart at the four corners of the second surface 11. The bosses 5 are configured as columnar structures with an L-shaped cross-section. Therefore, the bosses 5 can reduce the space occupied while fully utilizing the corner areas of the second surface 11 of the substrate, thereby helping to ensure the thermal conductivity of the first thermally conductive layer D.
[0053] Figure 10 This is a top view schematic diagram of the sixth packaging structure provided in this embodiment of the utility model, as shown below. Figure 10 As shown, in one embodiment, the second surface 11 of the substrate is formed into a rectangle, and four bosses 5 are spaced apart at the four corners of the second surface 11. The bosses 5 are configured as columnar structures with an L-shaped cross-section, and the bends of the bosses 5 are rounded. Therefore, the structural strength of the bosses 5 can be relatively improved, and the first thermally conductive layer D can better cover the entire area when compressed.
[0054] Figure 11 This is a top view schematic diagram of the seventh packaging structure provided in this embodiment of the utility model, as shown below. Figure 11 As shown, in one embodiment, the packaging structure A is also suitable for a larger packaging form. Exemplarily, the second surface 11 of the substrate is a larger rectangular surface, and there are four bosses 5 which are spaced apart at the four corners of the second surface 11 of the substrate.
[0055] It should be noted that the number and shape of the bosses 5 can be combined in any way, such as setting one cuboid boss 5 or six cylindrical bosses 5, etc.
[0056] Combination Figures 2 to 4 As shown, as an optional implementation, the packaging structure A is configured as a surface mount structure. Figure 12 This is a cross-sectional schematic diagram of another packaging structure provided in an embodiment of this utility model, as shown below. Figure 12 As shown, as another optional implementation, the encapsulation structure A is configured as a plug-in structure.
[0057] It should be noted that, as an optional implementation, the boss 5 in the packaging structure A is integrally formed with the molding compound 4. Alternatively, the boss 5 in the packaging structure A can also be fixed to the molding compound 4 by means of bonding or other methods.
[0058] It should be noted that, in one embodiment, the second surface of the substrate 1, that is, the side opposite to the first surface, exposes the molding compound 4, so that it can directly contact the first thermally conductive layer D, thereby improving the thermal conductivity of the first thermally conductive layer D and thus improving the heat dissipation effect of the packaging structure A.
[0059] This embodiment of the invention also provides a power module, which includes a package structure A, a circuit board B, a heat sink C, and a first thermally conductive layer D. The specific structure of the package structure A is as described above and will not be repeated here. Further, the circuit board B is connected to the pins 3 of the package structure A, the heat sink C abuts against the boss 5 of the package structure A, and the first thermally conductive layer D is located between the second surface 11 of the substrate of the plastic encapsulation body 4 of the package structure A and the heat sink C. Thus, the package structure A with the boss 5, in conjunction with the heat sink C, ensures that the thickness of the first thermally conductive layer D is consistent.
[0060] Figure 13 This is an application diagram of another packaging structure provided by an embodiment of the present invention, such as... Figure 13 As shown, in one embodiment, for a non-internally insulated package structure A, a second thermally conductive layer C1 and an insulating pad C2 are sequentially provided on the side of the heat sink C facing the package structure A. The heat sink C abuts against the boss 5 through the insulating pad C2, and the thickness of the first thermally conductive layer D between the second surface 11 of the substrate and the insulating pad C2 can be controlled. It should be noted that for an internally insulated package structure A, it is not necessary to provide a second thermally conductive layer C1 and an insulating pad C2.
[0061] Therefore, the thickness of the first thermal conductive layer can be controlled by setting bosses in the packaging structure. This is beneficial in practical applications so that different packaging structures on the same circuit board can fit well into a whole heat sink, avoiding excessive temperature of some packaging structures due to inconsistent coating thickness of the first thermal conductive layer.
[0062] Therefore, by applying a package structure A with bosses, the power module can ensure that different package structures A on the same circuit board B can fit well into the entire heat sink C, avoiding overheating of some package structures A due to inconsistent coating thickness of the first thermal conductive layer D, thereby improving service life.
[0063] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A package structure, characterized by, The packaging structure comprises: a substrate; a chip and / or a device on a first surface of the substrate; a pin, one end of which is electrically connected to the chip and / or the device and part of the first surface of the substrate, and the other end of which is connected to a circuit board; a plastic package, which covers the part of the first surface of the substrate not covered by the chip and / or the device, the side surface of the substrate, the chip and / or the device, and one end of the pin, and the other end of the pin extends out of the plastic package; and a plurality of bosses, which are located on a second surface of the plastic package and / or a second surface of the substrate and are spaced apart from each other, the plastic package comprising parallel first and second surfaces, the distance between the second surface of the plastic package and the second surface of the substrate being less than the distance between the first surface of the plastic package and the second surface of the substrate.
2. The package structure of claim 1, wherein, The bosses abut against a heat sink.
3. The package structure of claim 2, wherein, The packaging structure further comprises a first heat-conductive layer, which is located on the second surface of the substrate, surrounds the bosses, and has a uniform thickness.
4. The package structure of claim 3, wherein, The first heat-conductive layer is a heat-conductive silicone grease layer or a heat-conductive gel layer.
5. The package structure of claim 1, wherein, The bosses are four in number and are spaced apart at positions of four corners of the second surface of the substrate.
6. The package structure of claim 1, wherein, The bosses are six in number and are spaced apart in a rectangular array at edge positions of the second surface of the substrate.
7. The package structure of claim 1, wherein, The bosses are three in number and are spaced apart in a triangular array at edge positions of the second surface of the substrate.
8. The package structure of claim 1, wherein, The bosses are provided in a columnar structure and have a rectangular cross section.
9. The package structure of claim 1, wherein, The bosses are provided in a columnar structure and have a circular cross section.
10. The package structure of claim 1, wherein, The bosses are provided in a columnar structure and have an L-shaped cross section.
11. The package structure of claim 1, wherein, The bosses are provided in a columnar structure and have an L-shaped cross section, and a rounding structure is provided at a bending position of the bosses.
12. The package structure of claim 1, wherein, The packaging structure (A) is a patch type structure or a plug-in type structure.
13. The package structure of claim 1, wherein, The bosses are in an integral structure with the plastic package.
14. The package structure of claim 1, wherein, The height of the bosses is less than 500 microns.
15. The package structure of claim 1, wherein, The second surface of the substrate is exposed to the outside of the plastic package.
16. The package structure of claim 1, wherein, The packaging structure is sequentially located on a heat sink via an insulating gasket and a second heat-conductive layer.
17. The package structure of claim 16, wherein, The second heat-conductive layer is a heat-conductive silicone grease layer or a heat-conductive gel layer.