Metal oxide semiconductor (MOS) transistor preforming tool

Abstract

The utility model discloses an MOS (Metal Oxide Semiconductor) transistor preforming tool, which comprises a support consisting of a base and a side plate, a lower template is arranged on the base, an upper template is arranged above the lower template, and a driving assembly for driving the upper template to move vertically is arranged on the side plate; a tool limiting groove is formed in the lower die plate, a carrier plate for placing a product is arranged at one end of the tool limiting groove, and a notch is formed in the carrier plate; an elastic pressing mechanism with a buffering function is arranged on the upper die plate, and when the upper die plate is pressed downwards, a profiling block on the elastic pressing mechanism directly faces the position of the notch and can press and bend the pin at the position of the notch downwards. According to the pin bending and cutting device, device damage to a part body caused by stress in the product pin bending and cutting process can be effectively relieved, the bending pre-machining precision is improved, operation is easy, the bending or cutting operation of the product pin can be improved, and the machining efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of electronic manufacturing and relates to a MOS transistor preforming tooling. Background Technology

[0002] In the manufacturing process of MOS transistors, existing MOS transistor processing fixtures have many drawbacks. On the one hand, their processing technology is complex, leading to processing difficulties and requiring a large investment of manpower, resources, and time. On the other hand, the yield rate of products is low during processing. Furthermore, the operation procedures of existing fixtures are cumbersome and lack operability, making it difficult for workers to master them, resulting in low processing efficiency, low consistency between different batches of products, and difficulty in ensuring product quality stability.

[0003] Therefore, it is necessary to improve existing technologies to overcome their shortcomings. Utility Model Content

[0004] The purpose of this invention is to provide a MOS transistor preforming tooling to solve at least one problem in the background art.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A MOS transistor preforming fixture includes a support consisting of a base and side plates. A lower template is disposed on the base, and an upper template is disposed above the lower template. A driving component for driving the upper template to move vertically is disposed on the side plates. A fixture limiting groove is disposed on the lower template, and a carrier plate for placing the product is disposed at one end of the fixture limiting groove. A notch is disposed on the carrier plate. An elastic pressing mechanism with a buffer function is disposed on the upper template. When the upper template is pressed down, the contour block on the elastic pressing mechanism is aligned with the notch position and can press down and bend the pin at the notch.

[0007] As a further improvement of one embodiment of the present invention, the carrier plate is a rectangular aluminum alloy carrier plate.

[0008] As a further improvement of one embodiment of the present utility model, the elastic pressing mechanism includes a stamping plate and a contour block disposed on the stamping plate, the contour block being consistent with the shape of the notch, and an elastic component being disposed between the stamping plate and the upper template.

[0009] As a further improvement of one embodiment of the present invention, the contour block is exposed outside the stamping plate and forms a pressing surface with the side wall of the stamping plate. The pressing surface can be pressed down and bent on the product pins of the notch and its edge.

[0010] As a further improvement of one embodiment of the present invention, the elastic component includes bolts distributed at the four corners of the stamping plate. The bolts pass through the through holes in the stamping plate and are threaded into the threaded holes of the upper template. A spring is sleeved on the bolt, with one end of the spring abutting against the stamping plate and the other end abutting against the upper template. A vertically upward guide post is provided on the stamping plate, and a guide through hole for the guide post to be inserted is provided on the upper template at the location of the guide through hole. A guide sleeve is provided on the upper template at the location of the guide through hole.

[0011] As a further improvement of one embodiment of the present invention, the tooling limiting groove is provided in the upper middle area of ​​the lower template, and both sides of the lower end face of the carrier plate have positioning posts and positioning protrusions. The tooling limiting groove is provided with positioning holes corresponding to the positioning posts and positioning grooves corresponding to the positioning protrusions.

[0012] As a further improvement of one embodiment of the present invention, the carrier plate has a number of notches evenly spaced apart, each notch corresponding to a product installation position, and the product installation positions are distributed on the carrier plate.

[0013] The above technical solution has the following beneficial effects: it can effectively alleviate the stress caused by bending and cutting product leads, thus preventing damage to the component body, improve the bending pre-processing accuracy, simplify the operation, and help improve the bending or cutting operation of product leads, thereby increasing processing efficiency. Attached Figure Description

[0014] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0015] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0016] Figure 1 A schematic diagram of the first state structure provided by this utility model.

[0017] Figure 2 A schematic diagram of the second state structure provided for this utility model (lacking driving components).

[0018] Figure 3 A schematic diagram showing the distribution of the carrier plate and the stamping plate provided by this utility model.

[0019] Figure 4 A schematic diagram of the upper template upper elastic pressing mechanism provided by this utility model.

[0020] In the picture:

[0021] 1-Base;

[0022] 2-Side panels;

[0023] 3-Below template;

[0024] 4-Use the template;

[0025] 5-Driver components;

[0026] 6-Carrier plate; 61-Notch;

[0027] 7-Elastic pressing mechanism;

[0028] 71-Shaped block;

[0029] 72 - Stamped plate;

[0030] 73 - Spring;

[0031] 74 - Guide column;

[0032] 8-Products. Detailed Implementation

[0033] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0034] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0035] In this utility model, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model. Example

[0036] See Figures 1-4As shown, a MOS transistor preforming fixture includes a support frame consisting of a base 1 and a side plate 2, providing a stable support foundation for the entire fixture. A lower template 3 is mounted on the base 1, and an upper template 4 that mates with the lower template 3 is mounted above the lower template 3. The two are linked by a drive assembly 5 on the side plate 2. The drive assembly 5 can be a cylinder, a hydraulic cylinder, or an electric push rod, etc. In this embodiment, the drive assembly 5 is a manual quick clamp (which can be purchased directly) to achieve the vertical up and down movement of the upper template 4.

[0037] The lower template 3 is provided with a tooling limiting groove, and a carrier plate 6 for placing the product is provided at one end of the tooling limiting groove. The carrier plate 6 is provided with a notch 61 to reserve space for the placement of the product 8 pins and subsequent processing. The upper template 4 is provided with an elastic pressing mechanism 7 with a buffer function. When the upper template 4 is pressed down, the contour block 71 on the elastic pressing mechanism 7 will be precisely aligned with the notch 61, applying pressure to the pins at the notch 61 to realize the pressing and bending operation, ensuring the accuracy and quality of pin forming.

[0038] In this embodiment, the carrier plate 6 is a rectangular aluminum alloy carrier plate, which is lightweight, high-strength and corrosion-resistant, ensuring the stability and service life of the carrier plate 6.

[0039] The tooling limiting groove is located in the upper middle area of ​​the lower template 3, and its function is to provide a precise positioning and installation space for the carrier plate 6. Specifically, positioning posts and positioning protrusions are designed on both sides of the lower end face of the carrier plate 6. Correspondingly, the tooling limiting groove is provided with positioning holes that fit the positioning posts and positioning grooves that fit the positioning protrusions. The carrier plate is accurately fixed by inserting the positioning posts into the positioning holes and the positioning protrusions into the positioning grooves.

[0040] The elastic pressing mechanism 7 is a key component of the MOS transistor preforming fixture for pin bending. It mainly consists of a stamping plate 72 and a contour block 71 mounted on the stamping plate 72. The shape of the contour block 71 matches the notch 61 on the carrier plate 6, ensuring precise operation when pressing down to bend the pin.

[0041] The elastic component between the stamping plate 72 and the upper template 4 can realize the buffer function. Specifically, the elastic component is a bolt distributed at the four corners of the stamping plate 72. The bolt passes through the through hole on the stamping plate 72 and is threadedly connected to the threaded hole of the upper template 4. At the same time, a spring 73 is sleeved on the bolt. The two ends of the spring 73 abut against the stamping plate 72 and the upper template 4 respectively, providing elastic buffer force.

[0042] Meanwhile, in order to ensure stable operation, the stamping plate 72 is provided with vertically upward guide posts 74, which are matched with guide through holes on the upper template 4. Furthermore, a guide sleeve is provided on the upper template at the guide through hole, which can effectively ensure the stability and accuracy of the stamping plate during its up and down movement.

[0043] The elastic component in this embodiment can also be other equivalent elastic structures such as rubber pads to achieve similar buffering and elastic compression effects.

[0044] In this embodiment, the contour block 71 is exposed outside the stamping plate 72, and together with the sidewall of the stamping plate 72, it forms a pressing surface. This pressing surface can be used for the product pins of the notch 61 and its edges. During pressing, by applying appropriate pressure, the pins are bent downwards.

[0045] In this embodiment, several notches 61 on the carrier plate 6 are evenly spaced, and each notch corresponds to a product mounting position. These product mounting positions are orderly distributed on the carrier plate 6. This layout allows each product to find a suitable mounting position on the carrier plate and facilitates the subsequent pressing and bending operation of the product pins by the elastic pressing mechanism 7.

[0046] This invention offers significant advantages in bending and cutting MOS transistor leads. Firstly, its unique structural design, such as the spring buffer in the elastic pressing mechanism and the cooperation between the guide post and guide sleeve, effectively buffers the stress impact during lead bending and cutting. During lead bending, the elastic pressing mechanism applies force evenly, preventing stress concentration from damaging the component and ensuring the integrity and performance stability of the device.

[0047] In terms of improving the pre-processing accuracy of bending, the precise matching between the tooling limiting groove and the carrier plate positioning structure, as well as the accurate correspondence between the contour block and the notch, ensures that the pin is accurately positioned during the bending process, effectively reducing deviations and improving processing accuracy.

[0048] In terms of operation, the entire fixture has a simple and clear structure. Bending or lead cutting operations can be completed by controlling the vertical movement of the upper template through the drive component. There is no complicated operating procedure, and operators can quickly get started, which helps to improve the efficiency of bending or cutting product leads. In addition, the fixture can also be adapted to the processing requirements of different products by fine-tuning the structure, such as changing the springs with different elastic coefficients, thereby further improving processing efficiency.

[0049] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0050] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0051] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0052] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A MOS transistor preforming tool comprising a holder consisting of a base and side plates, characterized in that: The base is provided with a lower mold plate, the upper mold plate is arranged above the lower mold plate, the side plate is provided with a driving assembly for driving the vertical movement of the upper mold plate; the lower mold plate is provided with a tool limiting groove, one end of the tool limiting groove is provided with a carrier plate for placing products, the carrier plate is provided with a notch; the upper mold plate is provided with an elastic pressing mechanism with a buffering function, when the upper mold plate is pressed down, the profiling block on the elastic pressing mechanism is opposite to the notch position and can press and bend the pin at the notch.

2. The MOS transistor pre-forming tooling of claim 1, wherein: The carrier plate is an oblong aluminum alloy carrier plate.

3. The MOS transistor pre-forming tooling of claim 1, wherein: The elastic pressing mechanism comprises a stamping plate and a profiling block arranged on the stamping plate, the profiling block is consistent with the shape of the notch, and an elastic assembly is arranged between the stamping plate and the upper mold plate.

4. The MOS transistor pre-forming tooling of claim 3, wherein: The profiling block is exposed outside the stamping plate and forms a pressure bonding surface with the side wall of the stamping plate, the pressure bonding surface can press and bend the product pin at the notch and the edge thereof.

5. The MOS transistor pre-forming tooling of claim 3, wherein: The elastic assembly comprises bolts distributed at four corners of the stamping plate, the bolts pass through through holes on the stamping plate and are threadedly connected in threaded holes of the upper mold plate, springs are sleeved on the bolts, one end of the spring abuts against the stamping plate and the other end abuts against the upper mold plate; the stamping plate is provided with a vertically upward guiding column, the upper mold plate is provided with a guiding through hole for inserting the guiding column, and the upper mold plate where the guiding through hole is located is provided with a guiding sleeve.

6. The MOS transistor pre-forming tooling of claim 1, wherein: The tool limiting groove is arranged in the upper middle region of the lower mold plate, the lower end surface of the carrier plate is provided with positioning columns and positioning blocks on both sides, the tool limiting groove is provided with positioning holes corresponding to the positioning columns and positioning grooves corresponding to the positioning blocks.

7. The MOS transistor pre-forming tooling of claim 1, wherein: The carrier plate is provided with a plurality of notches distributed at equal intervals, each notch corresponds to a product mounting position, and the product mounting positions are distributed on the carrier plate. The carrier plate is provided with a plurality of notches distributed at equal intervals, each notch corresponds to a product mounting position, and the product mounting positions are distributed on the carrier plate.

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