Laser sintering equipment applied to circuit sintering

Abstract

The utility model discloses laser sintering equipment applied to circuit sintering, which comprises a base, a frame body, an X-axis and Y-axis movement mechanism, a material loading part, a laser generating device and a laser transmission system, wherein the top of the base is provided with a bedplate, the frame body is fixedly erected on the bedplate, and the laser sintering equipment further comprises an X-axis and Y-axis movement mechanism, a material loading part, a laser generating device and a laser transmission system mainly composed of a plurality of lenses. The XY-axis movement mechanism is arranged on the bedplate; the material carrying part is arranged on the XY-axis movement mechanism and is driven by the XY-axis movement mechanism to do XY-axis movement, and the material carrying part is provided with a product placing area; the laser generating device is fixed at the top of the frame body; the laser transmission system is composed of a plurality of lenses, the light inlet end of the laser transmission system faces the laser emitting end of the laser generation device, and the light outlet end of the laser transmission system faces downwards and faces the movable track area of the material carrying part. The laser sintering equipment is used for solving the problem of product occasions which are not suitable for high-temperature sintering, and laser sintering can be used for locally sintering products and can also be used for sintering materials according to different paths.

Description

Technical Field

[0001] This utility model relates to circuit sintering equipment, specifically to a laser sintering equipment applied to circuit sintering. Background Technology

[0002] Existing mature sintering technology mainly uses high-temperature baking to sinter the printed silver paste or aluminum paste. This sintering method can obtain a good crystal structure after sintering and the performance is stable after sintering. However, since some assembled products are not resistant to high temperatures, some products are not suitable for this sintering method.

[0003] Laser sintering is a flexible method that can sinter different areas according to actual needs. At the same time, using lasers with different pulse widths can achieve the best sintering effect while minimizing the impact on the surrounding material. Laser sintering is flexible and reliable, reducing the impedance of the printed circuit to the required level. Therefore, this technology is more suitable for sintering some module circuits.

[0004] In view of this, it is necessary to improve the existing line sintering equipment. Utility Model Content

[0005] In view of the shortcomings of the prior art, the technical problem to be solved by this utility model is to provide a laser sintering equipment for circuit sintering. The purpose of designing this laser sintering equipment is to enable local repair of circuits.

[0006] To solve the above-mentioned technical problems, this utility model achieves the following solution: A laser sintering device for circuit sintering according to this utility model includes a base and a frame. The top of the base is a platform, and the frame is fixed to the platform. The laser sintering device further includes:

[0007] The XY axis motion mechanism is mounted on the platform.

[0008] The material loading section is located on the XY axis motion mechanism and is driven by the XY axis motion mechanism to move in the XY axis. The material loading section has a product placement area.

[0009] A laser generator is fixed to the top of the frame.

[0010] A laser transmission system consisting of multiple lenses, wherein the light-inlet end of the laser transmission system faces the laser-emitting end of the laser generator, and the light-outlet end faces downward and toward the movable trajectory area of ​​the material carrier.

[0011] Furthermore, the base is a marble base.

[0012] Furthermore, the X-axis power source and Y-axis power source of the XY-axis motion mechanism are both linear motors.

[0013] Furthermore, the XY axis motion mechanism is equipped with a dust cover.

[0014] Furthermore, the material loading unit includes a lifting frame fixed on the XY axis motion mechanism, a lifting part disposed at the top of the lifting frame, and a material loading plate that is driven to move up and down by the lifting part.

[0015] Furthermore, the lifting mechanism is a manually operated slide.

[0016] Furthermore, the product placement area is located on the carrier plate.

[0017] Furthermore, the laser transmission system includes:

[0018] The first reflecting device is located on the laser emission path of the laser generating device, and is set at a 45-degree angle to the laser emission path of the laser generating device.

[0019] The second reflecting device is located on the laser path reflected by the first reflecting device, and is set at a 45-degree angle to the laser path reflected by the first reflecting device.

[0020] A beam expander is positioned on the laser path reflected by the second reflecting device to expand the laser beam.

[0021] A galvanometer is positioned on the laser path after the beam expander has expanded the laser beam, and it redirects the received laser beam to be emitted downwards.

[0022] A field lens is located at the lower end of the galvanometer and on the light output path of the galvanometer. The laser beam passing through the field lens points downwards and toward the movable trajectory area of ​​the material carrier.

[0023] Furthermore, the laser generating device is an infrared femtosecond laser generating device.

[0024] Compared with the prior art, the beneficial effects of this utility model are:

[0025] 1. The purpose of this utility model is to use laser sintering equipment to solve some product applications where high-temperature sintering is not suitable. Laser sintering can sinter products locally or sinter materials according to different paths.

[0026] 2. This utility model uses laser sintering equipment for sintering. The laser pulse width is narrow, which causes little damage to the material and can perform local repair sintering work on complex circuits. At the same time, the laser can adjust the sintering parameters according to the circuit thickness and material characteristics, making it suitable for a wide range of applications. Attached Figure Description

[0027] Figure 1 This is a complete drawing of the laser sintering equipment of this utility model.

[0028] Figure 2 This is a structural diagram of the laser generating device and laser transmission system of this utility model.

[0029] Figure 3 This is a structural diagram of the XY axis motion mechanism and the material loading section of this utility model.

[0030] Figure 4 This is a schematic diagram of the optical path of the laser transmission system of this utility model.

[0031] The attached diagram is labeled as follows: 1. Laser generating device; 2. Second reflection device; 3. Beam expander; 4. Galvanometer; 5. Field mirror; 6. XY axis motion mechanism; 7. Base; 8. Material loading section; 81. Lifting frame; 82. Lifting section; 83. Product placement area. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present utility model. Obviously, the embodiments described in this utility model are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0033] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0034] Example 1: The specific structure of this utility model is as follows:

[0035] Please refer to the appendix. Figure 1-4 This utility model discloses a laser sintering equipment for circuit sintering, including a base 7 and a frame. The top of the base 7 is a platform, and the frame is fixed to the platform. The base 7 is a marble base, which is cheaper than a metal base.

[0036] The laser sintering equipment also includes an XY axis motion mechanism 6, a material loading section 8, a laser generating device 1, and a laser transmission system composed of multiple lenses.

[0037] The XY-axis motion mechanism 6 is mounted on the platform; both the X-axis and Y-axis power sources of the XY-axis motion mechanism 6 are linear motors. A material loading section 8 is mounted on the XY-axis motion mechanism 6 and driven by it to move along the XY axes. This material loading section 8 has a product placement area 83; specifically, as shown... Figure 3As shown, the Y-axis linear motor is mounted on the X-axis movable plate of the X-axis linear motor. That is, the X-axis linear motor drives the Y-axis linear motor to move along the X-axis, and the drive unit of the Y-axis linear motor drives and connects to the Y-axis movable plate. The material loading unit 8 is mounted on the Y-axis movable plate, and the material loading unit 8 moves along the XY axis through the cooperative drive of the X-axis linear motor and the Y-axis linear motor.

[0038] The XY axis motion mechanism 6 is equipped with a dust cover, such as Figure 3 As shown, the dust cover is a folding and telescopic type. When the X-axis movable plate moves along the X-axis, one side of the dust cover on the X-axis retracts while the other side extends. Similarly, the dust covers on both sides of the material loading section 8 also retract while the other side extends. The dust cover effectively prevents dust and also prevents oil leakage.

[0039] The material loading section 8 includes a lifting frame 81 fixed to the XY-axis motion mechanism 6, a lifting part 82 located at the top of the lifting frame 81, and a material loading plate driven by and connected to the lifting part 82 for lifting motion. The lifting part 82 is a manual slide, used for fine-tuning the height of the material loading plate along the Z-axis. Two vertical plates of the lifting frame 81 are fixed to the Y-axis movable plate at a distance from each other. A platform is mounted on the upper end of the two vertical plates, and a manual slide is installed on the platform. The upper end of the manual slide is driven to connect to the material loading plate. The product placement area 83 is located on the material loading plate and is a recessed groove.

[0040] like Figure 2 As shown, Figure 2 This is a structural diagram of the laser generating device and laser transmission system of this utility model. Figure 2 Too Figure 1 Enlarged view of part A. The laser generator 1 is fixed to the top of the frame and is used to generate laser light. Preferably, the laser generator 1 is an infrared femtosecond laser generator. The laser transmission system consists of multiple lenses. The light-inlet end of the laser transmission system faces the laser-emitting end of the laser generator 1, and its light-outlet end faces downwards and towards the movable trajectory area of ​​the material carrier 8.

[0041] The laser transmission system includes:

[0042] The first reflecting device 10 is disposed on the laser emission path of the laser generating device 1, and is set at a 45-degree angle to the laser emission path of the laser generating device 1.

[0043] The second reflecting device 2 is disposed on the laser path reflected by the first reflecting device 10, and is set at a 45-degree angle to the laser path reflected by the first reflecting device 10.

[0044] A beam expander 3 is disposed on the laser path reflected by the second reflecting device 2 and is used for laser beam expansion;

[0045] The galvanometer 4 is positioned on the laser path after the beam expander 3 expands the laser beam, and it redirects the received laser beam to be emitted downwards.

[0046] The field lens 5 is located at the lower end of the galvanometer 4 and is on the light output path of the galvanometer 4. The laser light emitted through the field lens 5 is directed downwards and toward the movable trajectory area of ​​the material carrier 8.

[0047] Example 2:

[0048] The following is the working process of the laser sintering equipment of this utility model:

[0049] like Figure 1-4 As shown, the product is placed in the product placement area 83 and sent to the sintering area by the XY axis motion mechanism 6. While the laser generating device 1 is working, the XY axis motion mechanism 6 moves synchronously to sinter the corresponding parts of the product.

[0050] The laser generated by the laser generator 1 passes sequentially through the second reflection device 2, the beam expander 3, and the galvanometer 4, and then is emitted through the field mirror 5 onto the material surface to heat and solidify the material and modify its internal crystal structure. The control system of the laser sintering equipment controls the tilt of the galvanometer 4 to sinter and modify the circuits along different paths. The control system can also control the switching on and off of the laser beam.

[0051] In summary, this utility model employs laser sintering equipment to address situations where high-temperature sintering is unsuitable. Laser sintering can perform localized sintering on products and can also sinter materials along different paths. Furthermore, the use of a laser generator for sintering, with its narrow pulse width, minimizes material damage and enables localized repair sintering of complex circuits. Additionally, the laser's sintering parameters can be adjusted according to the circuit thickness and material properties, making it widely adaptable.

[0052] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural or procedural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. A laser sintering apparatus for line sintering, comprising a base (7) having a top portion in the form of a table, and a frame which is fastened to the table, characterized in that The laser sintering equipment further comprises: An XY-axis moving mechanism (6) arranged on the table plate; A material loading part (8) arranged on the XY-axis moving mechanism (6) and driven by the XY-axis moving mechanism (6) to move in the XY-axis direction, the material loading part (8) having a product placing area (83); A laser generating device (1) fixed on the top of the frame body; A laser transmission system composed of multiple lenses, the light inlet end of the laser transmission system facing the laser emitting end of the laser generating device (1), the light outlet end of the laser transmission system facing downward and towards the movable track area of the material loading part (8).

2. The laser sintering apparatus for line sintering according to claim 1, wherein The base (7) is a marble base.

3. The laser sintering apparatus for line sintering according to claim 1, wherein The X-axis power source and the Y-axis power source of the XY-axis moving mechanism (6) are both linear motors.

4. The laser sintering apparatus for line sintering according to claim 1, wherein The XY-axis moving mechanism (6) is provided with a dustproof cover.

5. The laser sintering apparatus for line sintering according to claim 1, wherein The material loading part (8) comprises a lifting frame (81) fixed on the XY-axis moving mechanism (6), a lifting part (82) arranged at the top end of the lifting frame (81), and a material loading plate driven by the lifting part (82) to move up and down.

6. The laser sintering apparatus for line sintering according to claim 5, wherein The lifting part (82) is a manual sliding table.

7. The laser sintering apparatus for line sintering according to claim 5, wherein The product placing area (83) is arranged on the material loading plate.

8. The laser sintering apparatus for line sintering according to claim 1, wherein The laser transmission system comprises: A first reflecting device (10) arranged on the laser emitting path of the laser generating device (1) and arranged at a 45-degree angle with the laser emitting path of the laser generating device (1); A second reflecting device (2) arranged on the laser path reflected by the first reflecting device (10) and arranged at a 45-degree angle with the laser path reflected by the first reflecting device (10); A beam expander (3) arranged on the laser path reflected by the second reflecting device (2) and used for laser beam expansion; A galvanometer (4) arranged on the laser path after the beam expansion of the beam expander (3) and used for redirecting the received laser to be emitted downward; A field lens (5) arranged at the lower end of the galvanometer (4) and on the light emitting path of the galvanometer (4), the laser passing through the field lens (5) being emitted downward and towards the movable track area of the material loading part (8).

9. The laser sintering apparatus for line sintering according to claim 1, wherein The laser generating device (1) is an infrared femtosecond laser generating device.

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