Micro-hemisphere grinding and polishing equipment

Abstract

The utility model discloses micro hemisphere grinding and polishing equipment which comprises a main machine frame, a horizontal sliding mechanism, a vertical sliding mechanism, a clamping mechanism and a grinding and polishing disc, the horizontal sliding mechanism is installed on the main machine frame and is in transmission connection with the vertical sliding mechanism, and the vertical sliding mechanism comprises a motor, an installation frame, a sliding rail and a threaded rod. The mounting frame is arranged on the horizontal sliding mechanism in a sliding mode, the sliding rail and the motor are arranged on the two end faces in the front-back direction of the mounting frame respectively, the clamping mechanism is arranged on the sliding rail in a sliding mode, the grinding and polishing disc is horizontally arranged on the main machine frame in a circumferential rotating mode and arranged below the clamping mechanism, and the screw is in threaded connection with a transverse plate and a supporting block. The transverse plate is supported on the supporting block and fixedly connected with the clamping mechanism, the motor drives the screw in transmission connection with the motor to rotate when started, and then the supporting block and the clamping mechanism are driven to move downwards, so that the micro hemisphere fixed to the lower end of the clamping mechanism abuts against the grinding and polishing disc. According to the utility model, the phenomenon that a sub-damage layer is generated on the micro-hemisphere lip edge due to large grinding and polishing thrust can be avoided.

Description

Technical Field

[0001] This utility model relates to the field of hemispherical resonant gyroscope manufacturing technology, specifically to a micro-hemispherical grinding and polishing device. Background Technology

[0002] Micro-hemispherical gyroscopes belong to the category of hemispherical resonant gyroscopes. They are solid-state wave gyroscopes based on the Coriolis effect, offering the advantage of low cost and representing an important direction for future gyroscope development. Conventional micro-hemispherical gyroscopes are formed by blowing planar quartz sheets. Before becoming a finished product for assembly, the excess skirt after forming needs to be ground to remove excess mass, forming a smooth, chipped, and uniform lip to ensure a high quality factor (Q value).

[0003] Chinese patent CN221364367U discloses a grinding and polishing device for micro-hemispherical resonators. By designing a single-sided double grinding and polishing disc and utilizing a dual-linkage mechanism along the X and Z axes, it can complete the grinding and polishing of the micro-hemispherical lip in one operation. Chinese patent CN118559515B discloses a grinding and polishing method for the lip of a micro-hemispherical sphere. Based on CN221364367U, it designs a rotatable clamping mechanism, allowing the outer circle of the skirt's bottom surface of the micro-hemispherical sphere to make point contact with the grinding disc of the grinding and polishing device, thus performing point grinding on the skirt and minimizing localized chipping at the outermost edge. However, practice shows that during grinding, the micro-hemispherical sphere is subjected to a downward thrust from the Z-axis motor movement. This thrust causes a sub-damage layer on the lip of the micro-hemispherical sphere, which is difficult to remove in subsequent polishing processes. Furthermore, equipment vibration also affects the flatness of the lip of the micro-hemispherical sphere, deepening the sub-damage layer. Utility Model Content

[0004] To address the problems in the background art, this utility model proposes a micro-hemispherical grinding and polishing device, which can avoid the phenomenon of sub-damage layer being generated on the lip edge of the micro-hemispherical due to large grinding and polishing thrust.

[0005] The present invention adopts the following technical solution:

[0006] A micro-hemispherical grinding and polishing device includes a main frame, a horizontal sliding mechanism, a vertical sliding mechanism, a clamping mechanism, and a grinding and polishing disc. The horizontal sliding mechanism is mounted on the main frame and is connected to the vertical sliding mechanism for driving the vertical sliding mechanism to move back and forth. The vertical sliding mechanism includes a first motor, a vertically arranged mounting frame, a first slide rail, and a first screw. The mounting frame slides on the horizontal sliding mechanism. The first slide rail and the first motor are respectively located on two end faces of the mounting frame in the front-rear direction. The clamping mechanism slides on the first slide rail. The grinding and polishing disc is horizontally rotatable and placed on the main frame below the clamping mechanism.

[0007] The first screw is threadedly connected to a horizontal plate and a support block. The horizontal plate is supported on the support block and fixedly connected to the clamping mechanism. The first screw is driven by the first motor. When the first motor starts, it drives the first screw to rotate, which in turn drives the support block and the clamping mechanism to move down so that the micro-hemispherical fixed at the lower end of the clamping mechanism abuts against the grinding and polishing disc.

[0008] As a further improvement to the above technical solution:

[0009] The mounting bracket includes a mounting plate and two vertical rods fixed to the mounting plate. The mounting plate slides on a horizontal sliding mechanism. There are two first slide rails, each corresponding to one of the two vertical rods. The first slide rails are fixed to the corresponding vertical rods. The clamping mechanism is mounted on a back plate. The back plate slides on the first slide rails. A horizontal plate is fixed to the upper end of the back plate.

[0010] A vertically arranged micrometer is also fixed on the mounting plate, and the end face of the extended end of the micrometer corresponds to the final position of the bottom surface of the horizontal plate after the microsphere is ground / polished.

[0011] The grinding and polishing disc is connected to a rotary drive mechanism, which drives the grinding and polishing disc to rotate horizontally in the circumferential direction.

[0012] The rotary drive mechanism includes a drive motor, a belt drive mechanism, and a spindle. The spindle is rotatably mounted on the main frame via bearings, and the grinding and polishing disc is fixed to the upper end of the spindle.

[0013] A secondary frame is provided on one side of the main frame. The drive motor is fixed on the secondary frame. The belt drive mechanism includes a main pulley, a driven pulley, and a belt. The main pulley is connected to the drive motor. The driven pulley is fixed on the main shaft. The belt is tensioned between the main pulley and the driven pulley.

[0014] The bearing includes an upper bearing and a lower bearing, which are located on opposite sides of the pulley in the axial direction.

[0015] The upper bearing is mounted on the main frame via the upper cover plate, and the lower bearing is mounted on the main frame via the lower cover plate.

[0016] A locking nut is provided at the lower end of the spindle.

[0017] The horizontal sliding mechanism includes a second motor, a second screw, and two second slide rails. The second motor and the second slide rails are mounted on the main frame. The second slide rails and the second screw are both arranged in the front-to-back direction. The mounting frame slides on the two second slide rails. The second screw is drivenly connected to the second motor and threadedly connected to the mounting frame.

[0018] Compared with the prior art, the advantages of this utility model are:

[0019] This invention relates to a device that mounts a vertically moving drive motor on the side of a clamping mechanism. A horizontal plate extends from the clamping mechanism and is threadedly connected to the drive motor's screw. Compared to a structure where the vertical motor is mounted above the clamping mechanism, the pushing force of the vertical motor on the micro-hemispherical becomes a pulling force. Furthermore, a support block is added below the horizontal plate. During the grinding process, the horizontal plate provides upward support, which cancels out the pulling force of the vertical motor on the micro-hemispherical. Therefore, the clamping mechanism for grinding and polishing the micro-hemispherical changes from moving vertically towards the base to using the clamping mechanism's own weight to move the micro-hemispherical downwards for grinding and polishing. Consequently, the micro-hemispherical is not subjected to a downward pushing force (approximately 50-200 kg) from the vertical motor's movement, while the movement generated by its own weight is only 2-3 kg, resulting in more uniform force and preventing the formation of a sub-damage layer on the micro-hemispherical lip due to high pushing force. Attached Figure Description

[0020] To facilitate understanding of this invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of this invention and should not be considered as limiting the scope of protection of this invention.

[0021] Figure 1 This is a three-dimensional structural diagram of the micro-hemispherical grinding and polishing equipment according to an embodiment of the present invention.

[0022] Figure 2 This is a three-dimensional structural schematic diagram of the micro-hemispherical grinding and polishing equipment according to another perspective of an embodiment of this utility model.

[0023] Figure 3 This is a cross-sectional structural diagram of the micro-hemispherical grinding and polishing equipment according to an embodiment of the present invention.

[0024] Figure 4 This is a cross-sectional structural diagram of the rotary drive mechanism in an embodiment of the present utility model.

[0025] Figure 5 This is an exploded structural diagram of the rotary drive mechanism in an embodiment of the present invention.

[0026] Figure label:

[0027] 1. Clamping mechanism; 11. Back plate; 12. Support block; 13. Horizontal plate; 2. Water baffle ring; 3. Rotary drive mechanism; 31. Drive motor; 32. Main spindle; 33. Upper bearing; 34. Upper cover plate; 35. Driven pulley; 36. Lower cover plate; 37. Locking nut; 38. Belt; 39. Lower bearing; 40. Main pulley; 4. Grinding and polishing disc; 5. Main frame; 6. Base; 7. Horizontal sliding mechanism; 71. Second motor; 72. Second screw; 73. Second slide rail; 8. Vertical sliding mechanism; 81. First motor; 82. First screw; 83. First slide rail; 84. Mounting plate; 85. Vertical rod; 86. Support plate; 9. Micrometer; 10. Sub-frame. Detailed Implementation

[0028] The embodiments of the present invention are described below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0029] like Figures 1-3 As shown, this embodiment provides a micro-hemispherical grinding and polishing device, including a main frame 5, a horizontal sliding mechanism 7, a vertical sliding mechanism 8, a clamping mechanism 1, and a grinding and polishing disc 4. The horizontal sliding mechanism 7 is mounted on the main frame 5 and is connected to the vertical sliding mechanism 8 for driving the vertical sliding mechanism 8 to move back and forth. The vertical sliding mechanism 8 includes a first motor 81, a vertically arranged mounting frame, a first slide rail 83, and a first screw 82. The mounting frame slides on the horizontal sliding mechanism 7. The first slide rail 83 and the first motor 81 are respectively located on two end faces of the mounting frame in the front-back direction. The clamping mechanism 1 slides on the first slide rail 83. The grinding and polishing disc 4 is horizontally rotatable on the main frame 5 and arranged below the clamping mechanism 1.

[0030] The first screw 82 is threadedly connected to a horizontal plate 13 and a support block 12. The horizontal plate 13 is supported on the support block 12 and fixedly connected to the clamping mechanism 1. The first screw 82 is connected to the first motor 81 for transmission. When the first motor 81 starts, it drives the first screw 82 to rotate, which in turn drives the support block 12 and the clamping mechanism 1 to move down, so that the micro-hemispherical fixed at the lower end of the clamping mechanism 1 abuts against the grinding and polishing disc 4.

[0031] Therefore, this equipment mounts the vertically moving drive motor on the side of the clamping mechanism. A horizontal plate extends from the clamping mechanism and is threadedly connected to the drive motor's screw. Compared to a structure where the vertical motor is mounted above the clamping mechanism, the pushing force of the vertical motor on the micro-hemispheric becomes a pulling force. Furthermore, a support block is added below the horizontal plate. During the grinding process, the horizontal plate provides upward support, which cancels out the pulling force of the vertical motor on the micro-hemispheric. Thus, the clamping mechanism for grinding and polishing the micro-hemispheric changes from moving vertically towards the base to using the clamping mechanism's own weight to move the micro-hemispheric downwards for grinding and polishing. Therefore, the micro-hemispheric is not subjected to a downward pushing force from the vertical motor (approximately 50-200 kg), while the movement generated by its own weight is only 2-3 kg, resulting in more uniform force and preventing the formation of a sub-damage layer on the micro-hemispheric lip due to high pushing force.

[0032] In this embodiment, the mounting frame includes a mounting plate 84 and two vertical rods 85 fixed on the mounting plate 84. The mounting plate 84 is slidably mounted on the horizontal sliding mechanism 7. The first slide rail 83 has two rails that correspond one-to-one with the two vertical rods 85. The first slide rail 83 is fixed on the corresponding vertical rod 85. The clamping mechanism 1 is mounted on a back plate 11. The back plate 11 is slidably mounted on the first slide rail 83. The horizontal plate 13 is fixed to the upper end of the back plate 11.

[0033] In this embodiment, a vertically arranged micrometer 9 is also fixed on the mounting plate 84, and the end face of the extended end of the micrometer 9 corresponds to the final position of the bottom surface of the horizontal plate 13 after micro-hemispherical grinding / polishing.

[0034] The micrometer setting can stop the clamping mechanism from continuing to move downwards even if the sensor fails and the microsphere is ground to the desired position without stopping the machine, thus preventing the microsphere from being scrapped due to over-grinding.

[0035] In this embodiment, the grinding and polishing disc 4 is connected to a rotary drive mechanism 3, which is used to drive the grinding and polishing disc 4 to rotate horizontally in the circumferential direction.

[0036] In this embodiment, as Figure 4 and Figure 5 As shown, the rotary drive mechanism 3 includes a drive motor 31, a belt drive mechanism, and a main shaft 32. The main shaft 32 is rotatably mounted on the main frame 5 via bearings, and the grinding and polishing disc 4 is fixed to the upper end of the main shaft 32.

[0037] A secondary frame 10 is provided on one side of the main frame 5. The drive motor 31 is fixed on the secondary frame 10. The belt drive mechanism includes a main pulley 40, a driven pulley 35 and a belt 38. The main pulley 40 is connected to the drive motor 31 for transmission. The driven pulley 35 is fixed on the main shaft 32. The belt 38 is tensioned between the main pulley 40 and the driven pulley 35.

[0038] Therefore, the motor that drives the grinding wheel is separated from the integrated design and fixed separately on the equipment base, so that the vibration generated by the motor is isolated from the grinding and polishing body of the micro-hemispherical. This protects the micro-hemispherical from the influence of motor vibration, further reduces the formation of sub-damage layer on the surface of the micro-hemispherical lip, and improves the flatness of its surface.

[0039] In this embodiment, the bearing includes an upper bearing 33 and a lower bearing 39, which are respectively disposed on both sides of the pulley 35 in the axial direction.

[0040] In this embodiment, the upper bearing 33 is mounted on the main frame 5 via the upper cover plate 34, and the lower bearing 39 is mounted on the main frame 5 via the lower cover plate 36.

[0041] In this embodiment, a locking nut 37 is provided at the lower end of the spindle 32.

[0042] In this embodiment, the horizontal sliding mechanism 7 includes a second motor 71, a second screw 72, and two second slide rails 73. The second motor 71 and the second slide rails 73 are mounted on the main frame 5. The second slide rails 73 and the second screw 72 are both arranged in the front-back direction. Support plates 86 are provided at both ends of the mounting frame in the left-right direction. The two support plates 86 are respectively slidably mounted on the two second slide rails 73. The second screw 72 is connected to the second motor 71 for transmission and is threadedly connected to the mounting frame.

[0043] The process of using this equipment to perform micro-hemispherical grinding and polishing is as follows:

[0044] Step 1: Fix the main frame 5 and the auxiliary frame 10 onto the base 6. Install the horizontal sliding mechanism 7 onto the main frame 5, then install the assembled vertical sliding mechanism 8 onto the slide rail of the horizontal sliding mechanism 7. Finally, install the clamping mechanism 1 onto the slide rail of the vertical sliding mechanism 8 via its back plate 11. The horizontal plate 13 and the support block 12 are threadedly connected to the motor of the vertical sliding mechanism 8, and the horizontal plate 13 is fixedly connected to the back plate 11 to form the basic grinding and polishing equipment body. To enhance the structural stability of the equipment, diagonal bracing 15 is added between the longitudinal and transverse beams of the main frame 5, and between the two support plates 86 and the mounting plate 84 of the mounting frame. Rubber washers are added between the diagonal bracing 15 and the support plates 86 to increase elastic friction, increase structural stability, and reduce vibration.

[0045] Step 2: Fix the bonded micro-hemispherical onto the clamping mechanism 1;

[0046] Step 3: Install or inspect the grinding and polishing mechanism. Secure the water-retaining ring 2, upper cover plate 34, and lower cover plate 36 to the main frame 5 with screws. An absorbent sponge can be added around the circumference of the water-retaining ring 2 to absorb grinding and polishing waste such as quartz, while preventing water splashing. Next, install the upper bearing 33, which is positioned on the upper cover plate 34, onto the main shaft 32 using an interference fit and shoulder positioning. Then, fix the grinding and polishing disc 4 to the upper end of the main shaft 32 with screws, ensuring the disc is located within the space enclosed by the water-retaining ring 2. Secure the pulley 35 to the main shaft 32 with screws and connect it to the main pulley 40 on the drive motor 31 via a belt 38. Finally, connect the lower bearing 33 on the lower cover plate 36 to the connecting shaft 32 and lock it with a lock nut 37 to minimize unevenness during grinding wheel rotation. Finally, use screws to further tighten the locking nut 37 and the main shaft 32 to ensure that the grinding wheel dressing mechanism can operate normally in both forward and reverse rotation without loosening.

[0047] The structure in which the pulley 35 maintains a certain gap with the upper cover plate 34 and the lower cover plate 36 and is fastened with screws is for adjusting the belt drive mechanism. That is, when the vibration of the grinding wheel is aggravated due to shaking after the transmission mechanism has been running for a certain period of time, the effect of transmission wear can be eliminated by adjusting the fixed position of the pulley 35 and the main shaft 32.

[0048] The back-to-back installation of the upper cover plate 34 and the lower cover plate 36 makes the bearing installation more stable and the grinding and polishing mechanism run more smoothly.

[0049] Step 4: Use a diamond grinding wheel to rough grind the lip of the micro-hemispherical to remove excess lip. Since this device adds a support block 12 to the vertical motor (i.e., the first motor 81), the support block 12 is connected to the lead screw of the first motor 81 to support the clamping mechanism 1 and the back plate 9. The overall structure moves downward by its own weight, so the micro-hemispherical will not be subjected to the downward thrust from the movement of the vertical motor, thus avoiding the phenomenon of sub-damage layer on the lip of the micro-hemispherical due to large thrust. The support block 12 is positioned at the edge of the horizontal plate only by the sinking step (that is, the two are not fixedly connected). This ensures that during the micro-hemispherical grinding process, when the horizontal plate does not contact the micro micrometer 9, the overall structure of the clamping mechanism 1 and the back plate 9 is supported and moved by the support block 12. Once it contacts the probe of the micro micrometer 9 (the probe extension size is determined by the calculated grinding amount), the micro micrometer 9 replaces the support block 12 for support. At this time, the support block 12 continues to move downward with the lead screw, while the overall structure of the clamping mechanism 1 and the back plate 9 is stopped by the micrometer stop, ensuring that the grinding amount of the micro-hemispherical lip is still controllable when the sensing device fails.

[0050] Simultaneous vertical and horizontal motor linkage grinding expands the grinding process from grinding only on specific rings of the grinding wheel to grinding the entire surface of the grinding wheel, improving grinding efficiency and extending the service life of the grinding wheel. It also ensures the flatness and consistency of the grinding wheel during use, making the contact stress on the edge of the micro-hemispherical more uniform and effectively reducing edge chipping and sub-damage layers.

[0051] The embodiments described above are merely preferred embodiments of this utility model. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. A micro-hemisphere lapping and polishing apparatus, characterized by, The polishing device comprises a main frame (5), a horizontal sliding mechanism (7), a vertical sliding mechanism (8), a clamping mechanism (1) and a polishing disc (4), the horizontal sliding mechanism (7) is installed on the main frame (5) and is connected with the vertical sliding mechanism (8) in transmission, and is used for driving the vertical sliding mechanism (8) to move forward and backward, the vertical sliding mechanism (8) comprises a first motor (81), a vertically arranged mounting frame, a first sliding rail (83) and a first screw rod (82), the mounting frame is slidably arranged on the horizontal sliding mechanism (7), the first sliding rail (83) and the first motor (81) are separately arranged on two end faces of the mounting frame in the front and back direction, the clamping mechanism (1) is slidably arranged on the first sliding rail (83), and the polishing disc (4) is horizontally and circumferentially rotatable arranged on the main frame (5) and is arranged below the clamping mechanism (1), The first screw rod (82) is threadedly connected with a cross plate (13) and a supporting block (12), the cross plate (13) is supported on the supporting block (12) and is fixedly connected with the clamping mechanism (1), the first screw rod (82) is connected with the first motor (81) in transmission, the first motor (81) is started to drive the first screw rod (82) to rotate, and then the supporting block (12) and the clamping mechanism (1) are driven to move downward, so that the micro hemispherical end fixedly connected with the clamping mechanism (1) is abutted against the polishing disc (4).

2. The micro-hemisphere lapping and polishing apparatus of claim 1, wherein, The mounting frame comprises a mounting plate (84) and two vertical rods (85) fixedly connected with the mounting plate (84), the mounting plate (84) is slidably arranged on the horizontal sliding mechanism (7), the first sliding rail (83) is provided with two first sliding rails and corresponds to the two vertical rods (85), the first sliding rail (83) is fixedly connected with the corresponding vertical rod (85), the clamping mechanism (1) is installed on a back plate (11), the back plate (11) is slidably arranged on the first sliding rail (83), and the cross plate (13) is fixedly connected with the upper end of the back plate (11).

3. The micro-hemispherical-lens polishing apparatus according to claim 2, wherein The mounting plate (84) is further fixedly connected with a micrometer (9) arranged in the vertical direction, and the end face position of the extending end of the micrometer (9) corresponds to the final position of the bottom surface of the cross plate (13) after the micro hemispherical grinding / polishing.

4. The micro-hemisphere lapping and polishing apparatus according to any one of claims 1 to 3, wherein The polishing disc (4) is connected with a rotating driving mechanism (3) in transmission, and the rotating driving mechanism (3) is used for driving the polishing disc (4) to horizontally and circumferentially rotate.

5. The micro-hemisphere lapping and polishing apparatus of claim 4, wherein, The rotating driving mechanism (3) comprises a driving motor (31), a belt transmission mechanism and a main shaft (32), the main shaft (32) is rotatably arranged on the main frame (5) through a bearing, the polishing disc (4) is fixedly connected with the upper end of the main shaft (32), One side of the main frame (5) is provided with a sub-frame (10), the driving motor (31) is fixedly connected with the sub-frame (10), the belt transmission mechanism comprises a main pulley (40), a driven pulley (35) and a belt (38), the main pulley (40) is connected with the driving motor (31) in transmission, the driven pulley (35) is fixedly connected with the main shaft (32), and the belt (38) is tensioned between the main pulley (40) and the driven pulley (35).

6. The micro-hemisphere lapping and polishing apparatus of claim 5, wherein, The bearing comprises an upper bearing (33) and a lower bearing (39), and the upper bearing (33) and the lower bearing (39) are separately arranged on the two sides of the driven pulley (35) in the axial direction.

7. The micro-hemisphere lapping and polishing apparatus of claim 6, wherein, The upper bearing (33) is installed on the main frame (5) through an upper cover plate (34), and the lower bearing (39) is installed on the main frame (5) through a lower cover plate (36).

8. The micro-hemisphere lapping and polishing apparatus of any one of claims 5-7, wherein, The lower end of the main shaft (32) is provided with a locking nut (37).

9. The micro-hemispherical abrasive polishing apparatus according to any one of claims 1 to 3, wherein The horizontal sliding mechanism (7) comprises a second motor (71), a second screw rod (72) and two second sliding rails (73). The second motor (71) and the second sliding rails (73) are installed on the main frame (5). The second sliding rails (73) and the second screw rod (72) are arranged along the front-rear direction. The mounting frame is slidably arranged on the two second sliding rails (73). The second screw rod (72) is in transmission connection with the second motor (71) and is in threaded connection with the mounting frame.

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