Glue pouring and mold reversing device

Abstract

The embodiment of the utility model provides a glue pouring and mold reversing device. The glue pouring and mold reversing device comprises a first assembly and a second assembly, a first glue filling cavity is formed in the first assembly, and a second glue filling cavity is formed in the second assembly; the section of the first glue pouring cavity is annular, the second glue pouring cavity comprises a first sub-cavity and a second sub-cavity which have annular sections and are coaxially communicated, the annular outer diameter of the first sub-cavity is larger than that of the second sub-cavity, and the annular inner diameter of the first glue pouring cavity is larger than that of the second sub-cavity and smaller than that of the first sub-cavity. According to the glue pouring and mold reversing device provided by the embodiment of the utility model, the glue pouring mold formed after mold reversing operation is used for glue pouring and molding of electronic equipment such as intelligent rings. The upper mold is formed by pouring glue into the first glue pouring cavity, and the lower mold is formed by pouring glue into the second glue pouring cavity, namely, the mode of respective glue pouring forming is adopted, and compared with the mode of manually cutting out the upper mold and the lower mold in the conventional technology, the manufacturing efficiency and the precision are higher.

Description

Technical Field

[0001] This utility model belongs to the field of injection molding technology, specifically relating to a glue-pouring and molding device. Background Technology

[0002] Smart wearable electronic devices include, but are not limited to, smart rings or smart finger rings. During the product potting process, the semi-finished product needs to be placed between the upper and lower silicone molds for potting to form the final product.

[0003] In conventional silicone mold manufacturing technology, a simple partition is usually made by hand based on the physical product. The partition is then assembled to form a cavity, and silicone is poured into the cavity to form a silicone mold. The silicone mold is then manually cut into a silicone upper mold and a silicone lower mold.

[0004] Manual cutting reduces the accuracy of mold dimensions and is not conducive to improving manufacturing efficiency. Utility Model Content

[0005] The purpose of this utility model embodiment is to provide a glue-pouring and molding device that can solve the problem of low manufacturing efficiency and accuracy of silicone molds in conventional technology.

[0006] To solve the above-mentioned technical problems, this utility model is implemented as follows:

[0007] This utility model embodiment provides a glue-pouring and molding device, including a first component and a second component;

[0008] The first component has a first potting cavity, and the second component has a second potting cavity;

[0009] The first glue-filling cavity has an annular cross-section, and the second glue-filling cavity includes a first sub-cavity and a second sub-cavity, both of which have annular cross-sections and are coaxially connected. The annular outer diameter of the first sub-cavity is larger than the annular outer diameter of the second sub-cavity, and the annular inner diameter of the first glue-filling cavity is larger than the annular outer diameter of the second sub-cavity but smaller than the annular outer diameter of the first sub-cavity.

[0010] Optionally, the first component includes a first fixing mechanism and a first molding mechanism, wherein the first molding mechanism is disposed inside the first fixing mechanism and between the first fixing mechanism to form the first potting cavity;

[0011] And / or, the second component includes a second fixing mechanism and a second molding mechanism, wherein the second molding mechanism is disposed inside the second fixing mechanism and between the second fixing mechanism to form the second potting cavity.

[0012] Optionally, the first potting cavity includes a fourth sub-cavity and a fifth sub-cavity, both of which have annular cross-sections and are coaxially connected.

[0013] The annular inner diameter of the fourth sub-cavity is larger than the annular inner diameter of the fifth sub-cavity.

[0014] Optionally, the second potting cavity further includes a third sub-cavity with an annular cross-section;

[0015] The third sub-cavity is connected to the outer periphery of the second sub-cavity. The third sub-cavity and the first sub-cavity are spaced apart along the axial direction. The annular outer diameter of the third sub-cavity is smaller than the annular outer diameter of the first sub-cavity. The annular outer diameter of the third sub-cavity is equal to the annular inner diameter of the fifth sub-cavity.

[0016] Optionally, the first forming mechanism includes a first forming ring and a first positioning post;

[0017] The first positioning post presses against the first forming ring, the fifth sub-cavity is located on the outer periphery of the first forming ring, and the fourth sub-cavity is located on the outer periphery of the first positioning post.

[0018] Optionally, the second forming mechanism includes a second forming ring and a second positioning post;

[0019] The second forming ring is spaced out and sleeved around the outer periphery of the second positioning post. The second sub-cavity is located between the second forming ring and the second positioning post. The first sub-cavity is located around the outer periphery of the second forming ring. The second forming ring and the first forming ring have the same size.

[0020] Optionally, the first fixing mechanism includes a first base and a first sealing cover, and the second fixing mechanism includes a second base and a second sealing cover;

[0021] The first base and the first sealing cover are fastened together to form a first receiving cavity, and the first molding mechanism is disposed in the first receiving cavity. The second base and the second sealing cover are fastened together to form a second receiving cavity, and the second molding mechanism is disposed in the second receiving cavity.

[0022] Optionally, the first sealing cap has a first potting hole, and the second sealing cap has a second potting hole;

[0023] The first dispensing hole is connected to the first dispensing cavity, and the second dispensing hole is connected to the second dispensing cavity.

[0024] Optionally, the potting and molding device further includes a first fastener and / or a second fastener;

[0025] The first fastener is inserted and fixed inside the first sealing cover and the first base, and the second fastener is inserted and fixed inside the second sealing cover and the second base.

[0026] Optionally, the potting and molding device further includes a fixing plate;

[0027] Both the first base and the second base are fixedly connected to the fixing plate.

[0028] The potting and molding device provided in this embodiment of the invention forms a potting mold, including an upper mold and a lower mold, after the molding operation. This potting mold is used for potting and molding wearable electronic devices, such as smart rings. A first component has a first potting cavity, and a second component has a second potting cavity. The first potting cavity has an annular cross-section. The upper mold is formed by potting and molding through the first potting cavity, and the lower mold is formed by potting and molding through the second potting cavity. The second potting cavity includes a first sub-cavity and a second sub-cavity. The annular outer diameter of the first sub-cavity is larger than the annular outer diameter of the second sub-cavity. Therefore, the first sub-cavity is used to pot the support plate of the lower mold, and the second sub-cavity is used to form the support cylinder of the lower mold. The annular inner diameter of the first potting cavity is larger than the annular outer diameter of the second sub-cavity but smaller than the annular outer diameter of the first sub-cavity. This allows the upper mold to cooperate with the lower mold, forming a potting space for the smart ring between the upper mold and the support plate and support cylinder. Therefore, the glue-pouring and molding device provided in this utility model embodiment, which forms an upper mold by pouring glue into the first glue-pouring cavity and forms a lower mold by pouring glue into the second glue-pouring cavity, and then separately pouring glue into the mold to form the upper mold, has higher manufacturing efficiency and accuracy compared to the conventional technology of manually cutting out the upper and lower molds.

[0029] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more obvious and understandable, specific embodiments of this utility model are given below. Attached Figure Description

[0030] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0031] Figure 1 This is a schematic diagram of the glue-pouring and molding device provided in this embodiment of the utility model;

[0032] Figure 2 This is a cross-sectional view of the first component in an embodiment of this utility model;

[0033] Figure 3 This is a cross-sectional view of the second component in an embodiment of this utility model;

[0034] Figure 4 This is a schematic diagram of the assembly structure of the upper mold and the lower mold in an embodiment of this utility model.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. First component; 10. First potting cavity; 101. Fourth sub-cavity; 102. Fifth sub-cavity; 11. First fixing mechanism; 111. First base; 112. First sealing cover; 1121. First potting hole; 12. First molding mechanism; 121. First molding ring; 122. First positioning post; 2. Second component; 20. Second potting cavity; 201. First sub-cavity; 202. Second sub-cavity; 203. Third sub-cavity; 21. Second fixing mechanism; 211. Second base; 212. Second sealing cover; 2121. Second potting hole; 22. Second molding mechanism; 221. Second molding ring; 222. Second positioning post; 31. First fastener; 32. Second fastener; 33. Third fastener; 34. Fourth fastener; 4. Fixing plate; 5. Upper mold; 6. Lower mold; 61. Support cylinder; 62. Support plate; 63. Elastic seal; 7. Smart ring. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0038] The terms "first," "second," etc., used in the specification and claims of this utility model are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this utility model can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, the first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0039] The potting and molding device provided by the present invention will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0040] In the first embodiment, referring to Figure 1 , Figure 2 and Figure 3This utility model provides a glue-pouring and molding device, including a first component 1 and a second component 2; the first component 1 has a first glue-pouring cavity 10, and the second component 2 has a second glue-pouring cavity 20; the first glue-pouring cavity 10 has an annular cross-section, and the second glue-pouring cavity 20 includes a first sub-cavity 201 and a second sub-cavity 202, both with annular cross-sections and coaxially connected; the annular outer diameter of the first sub-cavity 201 is larger than the annular outer diameter of the second sub-cavity 202, and the annular inner diameter of the first glue-pouring cavity 10 is larger than the annular outer diameter of the second sub-cavity 202 and smaller than the annular outer diameter of the first sub-cavity 201.

[0041] Specifically, such as Figure 1 and Figure 2 As shown, the glue-pouring and molding device includes a first component 1 and a second component 2. The first component 1 and the second component 2 are each independently subjected to glue-pouring and molding. They can be fixed to the same fixing plate or fixed to different fixing plates. Figure 2 and Figure 3 As shown, the first component 1 has a first potting cavity 10, and the second component 2 has a second potting cavity 20. The first potting cavity 10 has an annular cross-section, and its annular inner diameter is D4 or D5. In this embodiment, the first potting cavity 10 is a variable cross-section cavity. The second potting cavity 20 includes a first sub-cavity 201 and a second sub-cavity 202, both with annular cross-sections. The first sub-cavity 201 and the second sub-cavity 202 are coaxial and distributed along the axial direction. The annular outer diameter of the first sub-cavity 201 is D1, and the annular outer diameter of the second sub-cavity 202 is D2, where D1 > D2, D2 < D4 < D1, and D2 < D5 < D1. The first potting cavity 10 is used for potting glue to form the upper mold 5 of the smart ring product, and the second potting cavity 20 is used for potting glue to form the lower mold 6 of the smart ring product. Therefore, the potting and molding device provided in this embodiment forms a potting mold including an upper mold 5 and a lower mold 6 after the molding operation. This potting mold is used for potting and molding wearable electronic devices such as smart rings, smartwatches, smart bracelets or smart rings.

[0042] During the glue-pouring process, after assembling the first component 1 and the second component 2, glue is poured into the first glue-pouring cavity 10 to form the upper mold 5, and simultaneously glue is poured into the second glue-pouring cavity 20 to form the lower mold 6. And as... Figure 4As shown, the lower mold 6 includes a support cylinder 61 and a support plate 62 that are coaxially connected and have the same inner diameter. The first sub-cavity 201 is used for filling glue to form the support plate 62, and the second sub-cavity 202 is used for filling glue to form the support cylinder 61. The annular inner diameters D4 and D5 of the first filling cavity 10 are larger than the annular outer diameter D2 of the second sub-cavity 202 and smaller than the annular outer diameter D1 of the first sub-cavity. This allows the upper mold 5 formed by casting to be installed above the support plate 62 of the lower mold 6 formed by casting and to be fitted around the outer periphery of the support cylinder 61. At the same time, the upper mold 5, the support cylinder 61, and the support plate 62 form a filling space for the smart ring 7.

[0043] The glue-pouring and molding device provided in this embodiment of the invention forms a glue-pouring mold, including an upper mold and a lower mold, through a molding operation. The upper and lower molds cooperate to mold wearable electronic devices, such as smart rings, using glue. Specifically, the upper mold is formed by pouring glue into a first glue-pouring cavity, and the lower mold is formed by pouring glue into a second glue-pouring cavity. This separate molding process allows the shape and structure of each component and glue-pouring cavity to be designed and processed according to the shape and structure of the molded product, resulting in a high degree of conformity with electronic devices such as smart rings. This improves the accuracy of mold size processing and avoids the need to cut the upper and lower molds from a single mold. Compared to conventional techniques that involve manually cutting the upper and lower molds, this method offers higher manufacturing efficiency and accuracy.

[0044] In the second embodiment, refer to Figure 2 and Figure 3 The first component 1 includes a first fixing mechanism 11 and a first molding mechanism 12, wherein the first molding mechanism 12 is disposed inside the first fixing mechanism 11 and between the first fixing mechanism 11 to form the first potting cavity 10; and / or, the second component 2 includes a second fixing mechanism 21 and a second molding mechanism 22, wherein the second molding mechanism 22 is disposed inside the second fixing mechanism 21 and between the second fixing mechanism 21 to form the second potting cavity 20.

[0045] Specifically, such as Figure 2 and Figure 3As shown, the first and second components consist of a fixing mechanism and a molding mechanism. The fixing mechanism provides rigid support, while the molding mechanism, located inside the fixing mechanism, controls the shape and dimensions of the cavity. In this embodiment, the first component 1 includes a first fixing mechanism 11 and a first molding mechanism 12, and the second component 2 includes a second fixing mechanism 21 and a second molding mechanism 22. The first molding mechanism 12 is disposed inside the first fixing mechanism 11, forming a first potting cavity 10 between the first molding mechanism 12 and the inner wall of the first fixing mechanism 11. The second molding mechanism 22 is disposed inside the second fixing mechanism 21, forming a second potting cavity 20 between the second molding mechanism 22 and the inner wall of the second fixing mechanism 21. The shape and dimensions of the first molding mechanism 12 and the second molding mechanism 22 are determined according to the shape and dimensions of the upper mold 5 and the lower mold 6.

[0046] Based on the second embodiment, and with reference to Figure 2 The first potting cavity 10 includes a fourth sub-cavity 101 and a fifth sub-cavity 102, both of which have annular cross-sections and are coaxially connected; the annular outer diameter of the fourth sub-cavity 101 is larger than the annular outer diameter of the fifth sub-cavity 102.

[0047] Specifically, such as Figure 2 As shown, the first potting cavity 10 includes a fourth sub-cavity 101 and a fifth sub-cavity 102, both with annular cross-sections. The fourth sub-cavity 101 and the fifth sub-cavity 102 are coaxial, have the same inner diameter, and are distributed axially. The annular inner diameter of the fourth sub-cavity 101 is D4, and the annular inner diameter of the fifth sub-cavity 102 is D5, where D4 > D5. The fourth sub-cavity 101 is used for potting to form the bottom of the upper mold 5, forming a potting space for the smart ring between itself and the lower mold 6. The fifth sub-cavity 102 is used for potting to form the upper part of the upper mold 5, contacting the lower mold 6. Since the inner diameter of the bottom of the upper mold 5 is larger than the inner diameter of the upper part, the annular inner diameter of the fourth sub-cavity 101 is larger than the annular inner diameter of the fifth sub-cavity 102.

[0048] Based on the second embodiment, referring to Figure 3 The second potting cavity 20 further includes a third sub-cavity 203 with an annular cross-section; the third sub-cavity 203 is connected to the outer periphery of the second sub-cavity 202, and the third sub-cavity 203 and the first sub-cavity 201 are spaced apart along the axial direction. The annular outer diameter of the third sub-cavity 203 is smaller than the annular outer diameter of the first sub-cavity 201, and the annular outer diameter of the third sub-cavity 203 is equal to the annular inner diameter of the fifth sub-cavity 102.

[0049] Specifically, such as Figure 3As shown, the second potting cavity 20 includes a first sub-cavity 201, a second sub-cavity 202, and a third sub-cavity 203, with the third sub-cavity 203 having an annular cross-section. The third sub-cavity 203 is connected to the outer periphery of the second sub-cavity 202, and is axially spaced from the first sub-cavity 201. The annular outer diameter of the third sub-cavity 203 is D3, where D3 < D1, and the annular outer diameter D3 of the third sub-cavity 203 is equal to the annular inner diameter D5 of the fifth sub-cavity 102. The third sub-cavity 203 is used to form an elastic seal 63 in the lower mold 6 during potting. The elastic seal 63 is connected to the outer periphery of the support cylinder 61 and is axially spaced from the support plate 62. During the assembly of the lower mold 6 and the upper mold 5, the upper part of the upper mold 5 comes into contact with the elastic seal 63. It is necessary to design the outer diameter of the elastic seal 63 to be equal to the inner diameter of the upper structure of the upper mold 5. Therefore, the outer diameter of the third sub-cavity 203 is equal to the inner diameter of the fifth sub-cavity 102.

[0050] Based on the second embodiment, referring to Figure 2 The first forming mechanism 12 includes a first forming ring 121 and a first positioning post 122; the first positioning post 122 presses against the first forming ring 121, the fifth sub-cavity 102 is located on the outer periphery of the first forming ring 121, and the fourth sub-cavity 101 is located on the outer periphery of the first positioning post 122.

[0051] Specifically, such as Figure 2 As shown, the first molding mechanism 12 includes a first molding ring 121 and a first positioning post 122. The first molding ring 121 is the mold, and its shape and size are determined according to the shape and size of the smart ring 7 to improve the accuracy of the upper mold 5 size design. The first positioning post 122 is pressed onto the first molding ring 121 to fix the first positioning post 122 and is detachably connected to the first base 111. A fifth sub-cavity 102 is formed between the outer periphery of the first positioning post 122 and the inner wall of the first base 111. The fifth sub-cavity 102 is used for potting glue to form the upper structure of the upper mold 5. A fourth sub-cavity 101 is formed between the outer periphery of the first molding ring 121 and the inner wall of the first base 111. The fourth sub-cavity 101 is used for potting glue to form the bottom structure of the upper mold 5.

[0052] Based on the second embodiment, referring to Figure 3 The second forming mechanism 22 includes a second forming ring 221 and a second positioning post 222; the second forming ring 221 is spaced around the outer periphery of the second positioning post 222, the second sub-cavity 202 is located between the second forming ring 221 and the second positioning post 222, the first sub-cavity 201 is located around the outer periphery of the second forming ring 221, and the second forming ring 221 has the same size as the first forming ring 121.

[0053] Specifically, such as Figure 3 As shown, the second molding mechanism 22 includes a second molding ring 221 and a second positioning post 222. The shape and size of the second molding ring 221 are consistent with those of the first molding ring 121, that is, the inner diameter, outer diameter, and radial thickness of the second molding ring 221 and the first molding ring 121 are the same, and the shape and size are consistent with those of the smart ring 7, so that the dimensions between the upper mold 5 and the lower mold 6 after molding are mutually matched, ensuring that the dimensional error of the smart ring 7 after potting is small. After the second positioning post 222 is installed in the second base 211, the second molding ring 221 is installed in the second base 211, and the second molding ring 221 is spaced around the outer periphery of the second positioning post 222, so that the space between the second molding ring 221 and the second positioning post 222 forms a second sub-cavity 202, and a first sub-cavity 201 is formed between the outer periphery of the second molding ring 221 and the second positioning post 222 and the inner wall of the second base 211. In addition, the second base 211 is also provided with a groove, and a third sub-cavity 203 is formed between the groove and the second positioning post 222. Therefore, this embodiment designs the positional structure of the second molding ring 221 and the second positioning post 222 to match the structure of the lower mold 6 for glue pouring to form the lower mold 6.

[0054] Based on the second embodiment, referring to Figures 2 to 3 The first fixing mechanism 11 includes a first base 111 and a first sealing cover 112, and the second fixing mechanism 21 includes a second base 211 and a second sealing cover 212. The first base 111 and the first sealing cover 112 are fastened together to form a first receiving cavity, and the first molding mechanism 12 is disposed in the first receiving cavity. The second base 211 and the second sealing cover 212 are fastened together to form a second receiving cavity, and the second molding mechanism 22 is disposed in the second receiving cavity.

[0055] Specifically, such as Figures 2 to 3 As shown, the first fixing mechanism 11 includes a first base 111 and a first sealing cover 112, which are detachably connected by a snap fastener or threaded fastener. A first receiving cavity is formed between the first base 111 and the first sealing cover 112, and a first molding ring 121 and a first positioning post 122 are disposed within the first receiving cavity. The second base 211 and the second sealing cover 212 are detachably connected by a snap fastener or threaded fastener. The second molding ring 221 and the second positioning post 222 are disposed within the second receiving cavity.

[0056] Based on the second embodiment, referring to Figure 2 and Figure 3The first fixing mechanism 11 includes a first base 111 and a first sealing cover 112. The second fixing mechanism 21 includes a second base 211 and a second sealing cover 212. The first sealing cover 112 has a first glue-filling hole 1121 and the second sealing cover 212 has a second glue-filling hole 2121. The first glue-filling hole 1121 communicates with the first glue-filling cavity 10 and the second glue-filling hole 2121 communicates with the second glue-filling cavity 20.

[0057] Specifically, such as Figure 2 and Figure 3 As shown, the first sealing cap 112 has a first glue-filling hole 1121, which communicates with the first glue-filling cavity 10, and is used to fill glue into the first glue-filling cavity 10 after the first sealing cap 112 is installed. The second sealing cap 212 has a second glue-filling hole 2121, which communicates with the second glue-filling cavity 20, and is used to fill glue into the second glue-filling cavity 20 after the second sealing cap 212 is installed.

[0058] Based on the second embodiment, referring to Figures 2 to 3 The first fixing mechanism 11 includes a first base 111 and a first sealing cover 112, and the second fixing mechanism 21 includes a second base 211 and a second sealing cover 212. The glue-pouring and molding device further includes a first fastener 31 and / or a second fastener 32. The first fastener 31 is inserted and fixed inside the first sealing cover 112 and the first base 111, and the second fastener 32 is inserted and fixed inside the second sealing cover 212 and the second base 211.

[0059] Specifically, such as Figures 2 to 3 As shown, the first fastener 31 is inserted and fixed inside the first sealing cover 112 and the first base 111, detachably connecting the first sealing cover 112 and the first base 111. The second fastener 32 is inserted and fixed inside the second sealing cover 212 and the second base 211, detachably connecting the second sealing cover 212 and the second base 211. The first fastener 31 and the second fastener 32 are bolts, screws, or pins.

[0060] In addition, refer to Figure 2 and Figure 3 The third fastener 33 is inserted and fixed between the first positioning post 122 and the first base 111, and the fourth fastener 34 is inserted and fixed between the second positioning post 222 and the second base 211.

[0061] Based on the second embodiment, referring to Figure 1The first fixing mechanism 11 includes a first base 111 and a first sealing cover 112, and the second fixing mechanism 21 includes a second base 211 and a second sealing cover 212. The glue-pouring and molding device also includes a fixing plate 4. The first base 111 and the second base 211 are both fixedly connected to the fixing plate 4.

[0062] Specifically, such as Figure 1 As shown, the first base 111 and the second base 211 are both fixed on the fixing plate 4, integrating the first component 1 and the second component 2 together, thus improving the overall integrity of the device.

[0063] In the third embodiment, such as Figure 2 As shown, the first component 1 in this embodiment is assembled using the following steps:

[0064] S11. Install the first base 111 onto the fixing plate 4.

[0065] S12. Insert the first forming ring 121 into the first base 111.

[0066] S13. Install the first positioning post 122 in the first base 111 to press the first forming ring 121.

[0067] S14. The first sealing cover 112 and the first base 111 are locked in place by the first fastener 31.

[0068] like Figure 2 As shown, the second component 2 in this embodiment is assembled using the following steps:

[0069] S21. Install the second base 211 onto the fixing plate 4.

[0070] S22. Fix the second positioning post 222 inside the second base 211.

[0071] S23. Insert the second forming ring 221 into the second base 211.

[0072] S24. The second sealing cover 212 and the second base 211 are locked together by the second fastener 32.

[0073] Using the glue-pouring and molding device provided in this embodiment, the upper mold and the lower mold are formed by glue pouring through the following steps:

[0074] S31 and AB glue are weighed and mixed evenly. The glue is degassed for 3-5 minutes, and the cleanliness of the glue pouring and molding device is checked.

[0075] S32. Glue is poured into the first glue filling chamber 10 from the first glue filling hole 1121, and glue is poured into the second glue filling hole 2121 from the second glue filling hole 2121.

[0076] S33, vacuum degassing 3-5 times, each time lasting 60-70 seconds.

[0077] S34. Let stand for 10-15 minutes under standard atmospheric pressure.

[0078] S35. Bake and cure at a temperature of 50℃-70℃ for 2-2.5 hours.

[0079] S36. Cool and let stand until room temperature.

[0080] S37. Open the glue-pouring and molding device, and take out the upper mold 5 and lower mold 6 that have been molded.

[0081] S38. Product appearance inspection.

[0082] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0083] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A glue-filling and mold-reversing device, characterized in that, The first assembly (1) and the second assembly (2) are provided; The first assembly (1) has a first glue filling cavity (10), and the second assembly (2) has a second glue filling cavity (20); The first glue filling cavity (10) has a ring-shaped cross section, and the second glue filling cavity (20) includes a first sub-cavity (201) and a second sub-cavity (202) which have ring-shaped cross sections and are coaxially connected, the ring-shaped outer diameter of the first sub-cavity (201) is greater than the ring-shaped outer diameter of the second sub-cavity (202), and the ring-shaped inner diameter of the first glue filling cavity (10) is greater than the ring-shaped outer diameter of the second sub-cavity (202) and less than the ring-shaped outer diameter of the first sub-cavity (201).

2. The device according to claim 1, wherein The first assembly (1) includes a first fixing mechanism (11) and a first forming mechanism (12), and the first forming mechanism (12) is arranged inside the first fixing mechanism (11) to form the first glue filling cavity (10) between the first fixing mechanism (11) and the first forming mechanism (12); And / or, the second assembly (2) includes a second fixing mechanism (21) and a second forming mechanism (22), and the second forming mechanism (22) is arranged inside the second fixing mechanism (21) to form the second glue filling cavity (20) between the second fixing mechanism (21) and the second forming mechanism (22).

3. The device according to claim 2, wherein The first glue filling cavity (10) includes a fourth sub-cavity (101) and a fifth sub-cavity (102) which have ring-shaped cross sections and are coaxially connected; The ring-shaped inner diameter of the fourth sub-cavity (101) is greater than the ring-shaped inner diameter of the fifth sub-cavity (102).

4. The device according to claim 3, wherein The second glue filling cavity (20) further includes a third sub-cavity (203) which has a ring-shaped cross section; The third sub-cavity (203) is connected to the outer periphery of the second sub-cavity (202), the third sub-cavity (203) and the first sub-cavity (201) are arranged in an axial direction, the ring-shaped outer diameter of the third sub-cavity (203) is less than the ring-shaped outer diameter of the first sub-cavity (201), and the ring-shaped outer diameter of the third sub-cavity (203) is equal to the ring-shaped inner diameter of the fifth sub-cavity (102).

5. The device according to claim 4, wherein The first forming mechanism (12) includes a first forming ring (121) and a first positioning column (122); The first positioning column (122) is crimped to the first forming ring (121), the fifth sub-cavity (102) is located at the outer periphery of the first forming ring (121), and the fourth sub-cavity (101) is located at the outer periphery of the first positioning column (122).

6. The device according to claim 5, wherein The second forming mechanism (22) includes a second forming ring (221) and a second positioning column (222); The second forming ring (221) is arranged in a spaced manner on the outer periphery of the second positioning column (222), the second sub-cavity (202) is located between the second forming ring (221) and the second positioning column (222), the first sub-cavity (201) is located at the outer periphery of the second forming ring (221), and the second forming ring (221) has the same size as the first forming ring (121).

7. The device of claim 2, wherein, The first fixing mechanism (11) comprises a first base (111) and a first sealing cover (112), and the second fixing mechanism (21) comprises a second base (211) and a second sealing cover (212); The first base (111) and the first sealing cover (112) are connected in a buckling mode to form a first accommodating cavity, the first forming mechanism (12) is arranged in the first accommodating cavity, the second base (211) and the second sealing cover (212) are connected in a buckling mode to form a second accommodating cavity, and the second forming mechanism (22) is arranged in the second accommodating cavity.

8. The device according to claim 7, wherein A first glue pouring hole (1121) is arranged on the first sealing cover (112), and a second glue pouring hole (2121) is arranged on the second sealing cover (212). The first glue pouring hole (1121) is in communication with the first glue pouring cavity (10), and the second glue pouring hole (2121) is in communication with the second glue pouring cavity (20).

9. The device of claim 7, wherein, The glue pouring and reverse molding device further comprises a first fastener (31) and / or a second fastener (32); The first fastener (31) is fixedly arranged in the first sealing cover (112) and the first base (111), and the second fastener (32) is fixedly arranged in the second sealing cover (212) and the second base (211).

10. The device of claim 7, wherein, The glue pouring and reverse molding device further comprises a fixing plate (4); The first base (111) and the second base (211) are fixedly connected with the fixing plate (4).

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