Heat preservation device

Abstract

The utility model discloses a heat preservation device, and belongs to the technical field of heat preservation. The heat preservation device comprises a heat preservation structure, a heat storage layer and a photo-thermal layer. The heat preservation structure, the heat storage layer and the photo-thermal layer are sequentially stacked and attached, air gaps among the multi-layer structure can be reduced, the heat conduction and convection phenomena can be reduced, and therefore the heat preservation efficiency is improved, and heat loss is reduced. Moreover, the heat preservation structure further has the photo-thermal conversion capacity, solar energy can be converted into heat energy through the photo-thermal layer, heat is stored through the heat storage layer, in this way, the temperature difference in the heat preservation device can be reduced, the heat conduction speed is further reduced, and the heat preservation performance of the heat preservation device is improved.

Description

Technical Field

[0001] This utility model relates to the field of thermal insulation technology, and in particular to a thermal insulation device. Background Technology

[0002] With the development of technology, the application range of thermal insulation devices is becoming increasingly wide. Thermal insulation devices are equipment used to maintain or control the temperature of objects, and are widely used in industrial, household, medical, and scientific research fields. Their main function is to reduce heat loss or absorption to keep objects within the required temperature range.

[0003] Currently, for equipment and pipelines in industrial facilities, insulation devices typically include materials with low thermal conductivity (such as foam, fiberglass, vacuum layers, etc.) to reduce heat transfer. For example, for pipelines, insulation devices maintain a stable temperature of the medium inside the pipeline by reducing heat loss, thereby improving energy efficiency and reducing operating costs; for equipment such as reactors, they maintain a stable temperature inside the reactor to ensure reaction efficiency and quality.

[0004] However, in high-altitude and cold regions, the existing insulation devices have poor insulation performance. Utility Model Content

[0005] This utility model provides a heat preservation device. It can solve the problem of poor heat preservation effect in existing heat preservation devices. The technical solution is as follows:

[0006] The heat preservation device includes: a heat preservation structure, a heat storage layer, and a photothermal layer located on the outside of the target object;

[0007] The insulation structure includes at least one insulation layer, which is attached to the surface of the target object;

[0008] The heat storage layer is located on the side of the insulation structure away from the target object, the heat storage layer covers the insulation structure, and the side of the heat storage layer closest to the insulation structure is in contact with the insulation structure;

[0009] The photothermal layer is located on the side of the heat storage layer away from the insulation structure. The photothermal layer covers the heat storage layer, and the side of the photothermal layer closest to the heat storage layer is in contact with the heat storage layer. The photothermal layer is used to convert light energy into heat energy.

[0010] Optionally, the target object includes a pipe, and the at least one insulation layer includes an adhesive insulation layer that surrounds the pipe and is attached to the surface of the pipe;

[0011] The bonding insulation layer has a first end and a second end arranged circumferentially along the pipe, the second end overlapping the first end to form a first overlap seam;

[0012] There is a first gap between the first end and the second end, and the opening of the first gap faces the ground.

[0013] Optionally, the at least one insulation layer may include multiple insulation layers, wherein the multiple insulation layers include the bonding insulation layer and at least one covering insulation layer;

[0014] The at least one insulation layer covers the side of the adhesive insulation layer that faces away from the target object.

[0015] Optionally, the at least one layer of insulation covering may include multiple layers of insulation covering;

[0016] The multi-layer insulation layer is formed by stacking multiple insulation sheets radially away from the pipe;

[0017] Alternatively, the multi-layer insulation layer is formed by wrapping multiple layers of an insulation sheet around the circumference of the pipe.

[0018] Optionally, when the insulation structure includes one layer of the covering insulation layer, or when the insulation structure includes multiple layers of the covering insulation layer, and the multiple layers of the covering insulation layer are formed by stacking multiple insulation structures radially away from the pipe, any layer of the covering insulation layer has a third end and a fourth end arranged circumferentially along the pipe, and the third end overlaps the fourth end to form a second overlap joint.

[0019] There is a second gap between the third end and the fourth end, and the opening of the second gap faces the ground;

[0020] The second overlap seam on the covering insulation layer adjacent to the bonding insulation layer is offset from the first overlap seam in the radial direction of the pipe, and the second overlap seams of any two adjacent covering insulation layers are offset in the radial direction of the pipe.

[0021] Optionally, the angle between the shortest line connecting the first lap joint and the second lap joint to the axis of the pipe and the vertical direction is greater than or equal to 45°, where the vertical direction is perpendicular to the ground.

[0022] Optionally, the target object includes a pipe, and any one of the at least one insulation layer includes multiple insulation sections, which are arranged along the axial direction of the pipe, and any two adjacent insulation sections have a first adjacent joint.

[0023] The insulation structure also includes a fireproof and heat-insulating coating, which is filled in the first adjacent joint.

[0024] Optionally, the heat insulation device further includes a first fixing layer and a second fixing layer;

[0025] The first fixing layer includes a plurality of first fixing rings, which surround the side of the insulation structure away from the target object and are used to fasten the insulation structure.

[0026] The second fixing layer includes a plurality of second fixing rings, which surround the photothermal layer on the side opposite to the heat storage layer and are used to fasten the photothermal layer.

[0027] Optionally, both the first fixing ring and the second fixing ring include at least one of aluminum foil tape, fiberglass tape, and galvanized iron wire.

[0028] Optionally, the target object includes a device, and any one of the at least one insulation layer includes a plurality of insulation sheets, the plurality of insulation sheets being arranged along the extension direction of the surface of the device, and any two adjacent insulation sheets having a second adjacent seam.

[0029] The insulation structure also includes a fireproof and heat-insulating coating, which is filled in the second adjacent joint.

[0030] The beneficial effects of the technical solution provided by this utility model embodiment include at least the following:

[0031] A thermal insulation device is provided, comprising a thermal insulation structure, a heat storage layer, and a photothermal layer. The thermal insulation structure, heat storage layer, and photothermal layer are stacked and bonded together sequentially, reducing air gaps between the multiple layers. This reduces heat conduction and convection, thereby improving insulation efficiency and reducing heat loss. Furthermore, the thermal insulation structure also possesses photothermal conversion capabilities, converting solar energy into heat energy through the photothermal layer and storing heat through the heat storage layer. This reduces the internal temperature difference of the thermal insulation device, further slowing down heat conduction and improving its insulation performance. This addresses the problem of poor insulation performance in related technologies. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of a heat preservation device provided in an embodiment of this utility model;

[0034] Figure 2This is a schematic diagram of another heat preservation device provided in this embodiment of the utility model;

[0035] Figure 3 This is a schematic diagram of heat exchange in a heat preservation device provided in an embodiment of this utility model;

[0036] Figure 4 This is a schematic diagram of another heat preservation device provided in this embodiment of the utility model;

[0037] Figure 5 This is a schematic diagram of a thermal insulation structure provided in an embodiment of the present invention;

[0038] Figure 6 This is a schematic diagram of another heat insulation structure provided in this embodiment of the utility model;

[0039] Figure 7 This is a schematic diagram of another heat insulation structure provided in this embodiment of the utility model;

[0040] Figure 8 This is a schematic diagram of another heat insulation structure provided in this embodiment of the utility model;

[0041] Figure 9 This is a schematic diagram of another heat insulation structure provided in this embodiment of the utility model;

[0042] Figure 10 This is a schematic diagram of another heat insulation structure provided in this embodiment of the utility model. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0044] Although the present invention can be readily embodied in various forms, only some specific embodiments are shown in the accompanying drawings and will be described in detail in this specification. It is understood that this specification should be regarded as an exemplary illustration of the principles of the present invention and is not intended to limit the present invention to what is described herein.

[0045] Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present invention, and does not imply that every embodiment of the present invention must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0046] In the embodiments shown in the accompanying drawings, the directional indications (such as up, down, left, right, front, and back) used to explain the structure and movement of the various elements of this invention are relative rather than absolute. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, these directional indications also change accordingly.

[0047] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of a heat preservation device provided in an embodiment of this utility model. Figure 2 This is a schematic diagram of another heat preservation device provided in this embodiment of the present invention. The heat preservation device may include: a heat preservation structure 11, a heat storage layer 12, and a photothermal layer 13 located outside the target object 20. The target object 20 can be used to contain a medium, the temperature of which may be higher than the ambient temperature. The heat preservation device can be used to reduce the heat loss of the medium in the target object 20. For example, the target object 20 may include equipment and pipelines, and the pipelines may include pipelines for transporting high-temperature liquids, such as reaction vessels, oil pipelines, etc.

[0048] The thermal insulation structure 11 may include at least one thermal insulation layer 111, which is attached to the surface of the target object 20. The thermal insulation structure 11 may include one or more thermal insulation layers 111. For example, the thermal insulation structure 11 may include N thermal insulation layers 111, where N can be a positive integer less than or equal to 3.

[0049] The heat storage layer 12 is located on the side of the insulation structure 11 away from the target object 20. The heat storage layer 12 covers the insulation structure 11, and the side of the heat storage layer 12 closest to the insulation structure 11 is in contact with the insulation structure 11. The photothermal layer 13 is located on the side of the heat storage layer 12 away from the insulation structure 11. The photothermal layer 13 covers the heat storage layer 12, and the side of the photothermal layer 13 closest to the heat storage layer 12 is in contact with the heat storage layer 12. The photothermal layer 13 is used to convert light energy into heat energy. That is, the heat storage layer 12 and the photothermal layer 13 can be stacked on the insulation structure 11 in a direction away from the target object 20, and the two sides of the heat storage layer 12 can be in contact with the insulation structure 11 and the photothermal layer 13, respectively.

[0050] The sequential stacking and bonding of the insulation structure 11, the heat storage layer 12, and the photothermal layer 13 reduces air gaps between the multiple layers, thereby reducing heat conduction and convection, improving insulation efficiency, and reducing heat loss. It also reduces stress on the target object 20 caused by temperature fluctuations, resulting in better overall integrity between the insulation device and the target object 20, improving the stability and mechanical strength of the overall structure, and thus extending the service life of both the target object 20 and the insulation device. It is understood that the bonding in this embodiment can refer to the complete bonding of two adjacent structures or the partial bonding of two adjacent structures.

[0051] Please refer to Figure 3 , Figure 3 This is a schematic diagram of heat exchange in a heat preservation device provided in this embodiment of the present invention. The heat preservation device in this embodiment of the present invention has dual functions of heat preservation and heat insulation and solar thermal conversion. Under the irradiation of sunlight, the solar thermal layer 13 can convert solar energy into heat energy, realizing solar thermal conversion. In this way, solar energy is stored in the form of heat energy in the solar thermal layer 13 and the heat storage layer 12. On the one hand, it can provide the heat required for heat exchange between the heat preservation device and the outside air (T2 and T3, where T2 represents the temperature of the heat storage layer 12 and T3 represents the temperature in the solar thermal layer 13). On the other hand, it can ensure a stable temperature environment internally. The change of T2 is small and can remain basically unchanged, which can effectively reduce the temperature gradient between the heat storage layer 12 and the heat preservation structure 11 (T1 represents the temperature of the heat preservation structure 11), reduce the heat exchange between the target object 20 (e.g., high-temperature pipes and high-temperature equipment) and the heat preservation structure 11, thereby improving the heat preservation effect of the heat preservation device, reducing energy loss, reducing heating energy consumption, and saving operating costs.

[0052] In summary, this utility model embodiment provides a heat preservation device comprising a heat preservation structure 11, a heat storage layer 12, and a photothermal layer 13. The heat preservation structure 11, the heat storage layer 12, and the photothermal layer 13 are stacked and bonded together sequentially, reducing air gaps between the multiple layers and minimizing heat conduction and convection, thereby improving heat preservation efficiency and reducing heat loss. Furthermore, the heat preservation structure 11 also possesses photothermal conversion capabilities, converting solar energy into heat energy through the photothermal layer 13 and storing heat through the heat storage layer 12. This reduces the temperature difference within the heat preservation device, further slowing down heat conduction and improving the heat preservation performance of the device, thus solving the problem of poor heat preservation effect in related technologies.

[0053] In one exemplary embodiment, the material of at least one insulation layer 111 in the insulation structure 11 may include a composite material of graphene-silica aerogel and glass fiber felt (also known as a composite material of graphene-doped modified silica aerogel and glass fiber felt). Materials for insulation devices in related technologies typically include polyurethane, rock wool, and glass wool. Compared to the insulation structure 11 in related technologies, the insulation layer 111 in this embodiment of the present invention has a lower thermal conductivity, provides good insulation, does not shed dust, is thinner, is more conducive to construction operations under various working conditions, and is lighter in weight, making the insulation structure 11 less prone to deformation and longer in service life. In other words, the insulation layer 111 in this embodiment of the present invention has characteristics such as low density, low thermal conductivity, and high temperature resistance, which can reduce the overall weight and thickness of the insulation structure 11.

[0054] Furthermore, the material of the heat storage layer 12 may include graphene and phase change materials; the material of the photothermal layer 13 may include graphene-doped modified silicon dioxide and adsorbed organic phase change materials, possessing both heat insulation and photothermal conversion characteristics. Thus, the heat preservation device in this embodiment of the invention also has high photothermal conversion performance, enabling it to utilize solar energy to acquire and store heat. The stored heat can reduce the temperature difference inside the heat preservation structure 11, lower heat conduction efficiency, improve the heat preservation performance of the heat preservation device, and achieve energy saving and consumption reduction effects.

[0055] The insulation device in this embodiment can be applied to various fields such as petrochemicals, municipal heating, chemical industrial parks, new energy vehicles, and energy-saving buildings. For example, when the insulation device is located in high-altitude, cold regions such as Qinghai and Tibet, where the temperature is low and the air is thin, solar radiation is strong while the atmospheric insulation effect is weak. The insulation device in this embodiment can have both photothermal conversion efficiency and thermal insulation effects. Solar energy is converted into heat energy through the photothermal layer 13, and the heat is stored through the heat storage layer 12. This stored heat reduces the temperature difference inside the insulation device, lowers the heat transfer efficiency, improves the insulation performance of the device, and achieves energy saving and consumption reduction.

[0056] In one exemplary embodiment, the phase change material in the heat storage layer 12 may include inorganic phase change materials and organic phase change materials. For example, inorganic phase change materials may include sodium sulfate decahydrate modified with borax and carboxymethyl cellulose, disodium hydrogen phosphate dodecahydrate coated with polyurethane, etc.; organic phase change materials may include graphene-modified n-eicosane, lauric acid blended with stearic acid, etc.

[0057] The organic phase change material in the photothermal layer 13 may include solid-solid phase change energy storage polyols and fatty alcohols. For example, the organic phase change material may include polyols such as pentaerythritol, neopentyl glycol, trimethylolethane, and trimethylolaminomethane, as well as fatty alcohols with more than 12 carbon atoms, such as octadecyl alcohol.

[0058] Please refer to Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of another heat preservation device provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of a thermal insulation structure 11 provided in an embodiment of the present invention. In an optional embodiment, the target object 20 may include a pipe 21, and at least one thermal insulation layer may include an adhesive thermal insulation layer 11a, which surrounds the pipe 21 and is attached to the surface of the pipe 21. By tightly attaching the adhesive thermal insulation layer 11a to the surface of the pipe 21, energy loss can be reduced, the thermal insulation effect can be improved, structural stability can be enhanced, maintenance can be simplified, and the service life can be extended.

[0059] The bonding insulation layer 11a may have a first end and a second end arranged circumferentially along the pipe 21, with the second end overlapping the first end to form a first overlap joint x1; wherein, a first gap x11 is formed between the first end and the second end, and the opening of the first gap x11 faces the ground. Before being installed on the pipe 21, the bonding insulation layer 11a may be a sheet-like insulation layer 111. After wrapping the sheet-like insulation layer 111 around the pipe 21 and bonding it to the surface of the pipe 21, the bonding insulation layer 11a is formed. The bonding insulation layer 11a has the first overlap joint x1, and the opening at the joint between the first end and the second end of the bonding insulation layer 11a faces the ground. In this way, rainwater, dust, etc. can be reduced from entering the first overlap joint x1, achieving waterproof and dustproof functions and reducing the risk of damage to the pipe 21 located inside the bonding insulation layer 11a.

[0060] It is understandable that the above Figure 5 The opening of the first gap x11 in the diagram is a schematic structure. In the actual insulation structure 11, under the force of the outer layer structure, the opening of the first gap x11 is smaller, close to 0°.

[0061] Please refer to Figure 6 , Figure 6This is a schematic diagram of another thermal insulation structure 11 provided in an embodiment of the present invention. In an optional embodiment, at least one thermal insulation layer includes multiple thermal insulation layers, including an adhesive thermal insulation layer 11a and at least one covering thermal insulation layer 11b; at least one thermal insulation layer covers the side of the adhesive thermal insulation layer 11a facing away from the target object 20. The thermal insulation structure 11 is a multi-layer structure, which can reduce heat conduction, enhance the overall thermal insulation effect of the thermal insulation structure 11, better block heat flow, and improve thermal insulation performance; it can also reduce the thermal bridging effect, as the multi-layer thermal insulation layer can break thermal bridges, reduce heat loss through the multi-layer thermal insulation layer, and further improve the thermal insulation effect; and the multi-layer thermal insulation layer can disperse stress, reduce the load on the single-layer structure, and extend the service life of the thermal insulation structure 11. This improves the service life of the thermal insulation structure 11.

[0062] It is understandable that the above Figure 5 and Figure 6 The patterns of the bonding insulation layer 11a and the covering insulation layer 11b are not filled in so that the structure of the first lap joint x1 and the second lap joint x2 is clearer.

[0063] In one optional embodiment, at least one layer of covering insulation 11b may include multiple layers of covering insulation 11b. The multiple layers of covering insulation 11b can be formed in two ways: the multiple layers of covering insulation 11b are formed by stacking multiple insulation sheets radially away from the pipe 21; or, the multiple layers of covering insulation 11b are formed by winding a single insulation sheet multiple times circumferentially around the pipe 21. Construction personnel can select a suitable method for forming the multiple layers of covering insulation 11b according to the size of the pipe 21. For example, if the diameter of the pipe 21 is large, each independent layer of covering insulation 11b can be formed separately; if the diameter of the pipe 21 is small, a single insulation sheet can be wound multiple times to form multiple layers of covering insulation 11b.

[0064] Please refer to Figure 5 and Figure 6 In an optional embodiment, when the insulation structure 11 includes a single covering insulation layer 11b, or when the insulation structure 11 includes multiple covering insulation layers 11b, and the multiple covering insulation layers 11b are formed by stacking multiple insulation structures 11 in a radial direction away from the pipe 21, any single covering insulation layer 11b has a third end and a fourth end arranged circumferentially along the pipe 21, the third end overlapping the fourth end to form a second overlap joint x2; wherein, a second gap x12 is provided between the third end and the fourth end, the opening of the second gap x12 facing the ground; the second overlap joint x2 on the covering insulation layer 11b adjacent to the bonding insulation layer 11a is offset from the first overlap joint x1 in the radial direction of the pipe 21, and when the insulation structure 11 includes multiple covering insulation layers 11b, the second overlap joint x2 of any two adjacent covering insulation layers 11b is offset in the radial direction of the pipe 21.

[0065] In this case, the installation method of covering the insulation layer 11b can be the same as the installation method of attaching the insulation layer 11a. The shape of the second gap x21 can be the same as the shape of the first gap x11. Thus, each insulation layer 111 has an overlap joint, and the overlap joints of any two adjacent insulation layers 111 are staggered in the radial direction of the pipe 21. In this way, staggering the overlap joints can block the direct heat transfer path, reduce the heat loss through the overlap joints, thereby reducing the thermal bridge effect and improving the insulation performance of the insulation structure 11. Furthermore, staggering the overlap joints can reduce the risk of water or moisture seeping through the overlap joints, thereby improving the seepage prevention and waterproof performance of the insulation structure 11.

[0066] In addition, staggered lap joints can improve the flatness of the surface of the insulation structure 11, reduce the seam marks on the insulation layer 111, and thus improve the fit between the insulation structure 11 and the heat storage layer.

[0067] In one alternative embodiment, the angle between the shortest line connecting the first lap joint x1 and the second lap joint x2 to the axis of the pipe 21 and the vertical direction is greater than or equal to 45°, where the vertical direction is perpendicular to the ground. In other words, as... Figure 5 and Figure 6 As shown, the areas where the first lap joint x1 and the second lap joint x2 are set are within an angle range of 45° to 135° on both sides of the vertical center line of the cross-section of the pipe 21.

[0068] Please refer to Figure 7 , Figure 7 This is a schematic diagram of another thermal insulation structure 11 provided in this embodiment of the present invention. In an optional embodiment, the target object 20 may include a pipe 21, and any one of the at least one thermal insulation layer 111 may include multiple thermal insulation sections b1, which are arranged along the axial direction of the pipe 21. Any two adjacent thermal insulation sections b1 have a first adjacent joint x3. The thermal insulation structure 11 also includes a fireproof and heat-insulating coating, which fills the first adjacent joint x3. For example, the fireproof and heat-insulating coating may include an aerogel fireproof and heat-insulating coating, which may include a silica-based aerogel fireproof coating or a composite substrate-reinforced aerogel coating. When the thermal insulation structure 11 includes multiple thermal insulation layers 111, the first adjacent joints x3 on adjacent thermal insulation layers 111 are staggered, and the overlapping joints (e.g., on the multiple thermal insulation sections in the same layer) are also staggered. Figure 6 The first lap joint x1 or the second lap joint x2 in the pipe are set in the same position, that is, the lap joints on the multiple insulation sections in the same layer can be arranged along the axial direction of the pipe 21.

[0069] Please refer to Figure 8 and Figure 9, Figure 8 This is a schematic diagram of another heat insulation structure 11 provided in this embodiment of the present invention. Figure 9 This is a schematic diagram of another thermal insulation structure 11 provided in an embodiment of the present invention. In an optional embodiment, the thermal insulation device may further include a first fixing layer 14 and a second fixing layer 15. The first fixing layer 14 includes a plurality of first fixing rings, which surround the side of the thermal insulation structure 11 away from the target object 20 and are used to fasten the thermal insulation structure 11. The second fixing layer 15 includes a plurality of second fixing rings, which surround the side of the photothermal layer 13 away from the heat storage layer 12 and are used to fasten the photothermal layer 13. Both the first fixing rings and the second fixing rings may include at least one of aluminum foil tape, fiberglass tape, and galvanized iron wire.

[0070] The first fixing layer 14 can fasten the insulation structure 11, and the second fixing layer 15 can fasten the photothermal layer 13. The width of both the first and second fixing rings can be 50mm to 100mm. The extension directions of the multiple first fixing rings and the multiple second fixing rings can be parallel. The distance between two adjacent first fixing rings and the distance between two adjacent second fixing rings can both be 200mm to 500mm. For example, the width of both the first and second fixing rings can be 50mm, 60mm, 70mm, 80mm, 90mm, or 100mm; the distance between two adjacent first fixing rings can be 200mm, 300mm, 350mm, 400mm, or 500mm; and the distance between two adjacent second fixing rings can be 200mm, 300mm, 350mm, 400mm, or 500mm.

[0071] Please refer to Figure 10 , Figure 10 This is a schematic diagram of another thermal insulation structure 11 provided in this embodiment of the present invention. In an optional embodiment, the target object 20 may include a device 22. For example, the device 22 may include a high-temperature reactor, crucible, and storage tank, etc. Any one of the at least one thermal insulation layer 111 includes multiple thermal insulation sheets, which are arranged along the extension direction of the surface of the device 22. Any two adjacent thermal insulation sheets have a second adjacent joint x4. The thermal insulation structure 11 may also include a fireproof and heat-insulating coating, which fills the second adjacent joint x4. The fireproof and heat-insulating coating may include an aerogel fireproof and heat-insulating coating. When the thermal insulation layer 111 on the device 22 is multi-layered, the second adjacent joint x4 on any two adjacent thermal insulation layers 111 are staggered in a direction perpendicular to the surface of the device 22.

[0072] In one exemplary embodiment, when the insulation layer 111 on the device 22 is multi-layered, an adhesive layer may be provided between any two adjacent insulation layers 111 so that the multiple insulation layers 111 can be stably connected, and an adhesive layer may also be provided between any two layers in the insulation structure, the heat storage layer and the photothermal layer.

[0073] In one exemplary embodiment, when the target object 20 may include the device 22, the insulation structure may further include a third fixing layer, which may include multiple third fixing rings. The insulation structure may wrap around the outside of the device 22, and the multiple third fixing rings may be sleeved on the outside of the insulation structure to fasten the insulation mechanism to the device 22, thereby improving the connection stability between the insulation structure and the device 22.

[0074] In one exemplary embodiment, the thermal conductivity of any insulation layer 111 is less than or equal to 0.021 W / m·K. The thickness of any insulation layer 111 ranges from 3 mm to 15 mm. For example, the thickness of the insulation layer 111 is 3 mm, 5 mm, 7 mm, 8 mm, 10 mm, 12 mm, or 15 mm.

[0075] The thickness of the thermal storage layer 12 ranges from 2mm to 5mm. For example, the thickness of the thermal storage layer 12 is 2mm, 2.5mm, 3mm, 4mm, 4.6mm, or 5mm. The thermal storage density of the thermal storage layer 12 is greater than 650KJ / L, the static heat loss over 24 hours is less than 5%, and the number of phase change cycles is greater than 6000.

[0076] The photothermal layer 13 is a single-layer structure, and the thickness of the photothermal layer 13 ranges from 5 mm to 10 mm. For example, the thickness of the photothermal layer 13 is 5 mm, 6.5 mm, 7 mm, 8 mm, 9 mm or 10 mm. The thermal conductivity of the material of the photothermal layer 13 is less than 0.090 W / m·K. The maximum latent heat of phase change of the material of the photothermal layer 13 is greater than or equal to 150 J / g.

[0077] In summary, this utility model embodiment provides a heat preservation device comprising a heat preservation structure 11, a heat storage layer 12, and a photothermal layer 13. The heat preservation structure 11, the heat storage layer 12, and the photothermal layer 13 are stacked and bonded together, reducing air gaps between the multiple layers and minimizing heat conduction and convection, thereby improving heat preservation efficiency and reducing heat loss. Furthermore, the heat preservation structure 11 also possesses photothermal conversion capabilities, converting solar energy into heat energy through the photothermal layer 13 and storing heat through the heat storage layer 12. This reduces the temperature difference within the heat preservation device, further slowing heat conduction and improving its heat preservation performance, thus solving the problem of poor heat preservation in related technologies. The heat preservation device in this utility model embodiment can be applied in industrial, household, medical, scientific research, agricultural, transportation, and urban community fields.

[0078] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0079] In this invention, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0080] The above description is only an optional embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat retaining device, characterized by, The application relates to a heat preservation device for a target object, and belongs to the technical field of heat preservation. The heat preservation device comprises a heat preservation structure, a heat storage layer and a photothermal layer. The heat preservation structure comprises at least one heat preservation layer, and the at least one heat preservation layer is attached to the surface of the target object. The heat storage layer is located on the side of the heat preservation structure away from the target object, the heat storage layer covers the heat preservation structure, and the side of the heat storage layer close to the heat preservation structure is attached to the heat preservation structure. The photothermal layer is located on the side of the heat storage layer away from the heat preservation structure, the photothermal layer covers the heat storage layer, and the side of the photothermal layer close to the heat storage layer is attached to the heat storage layer. The photothermal layer is used for converting light energy into heat energy. The target object comprises a pipeline, and the at least one heat preservation layer comprises an attached heat preservation layer which surrounds the pipeline and is attached to the surface of the pipeline. The attached heat preservation layer has a first end portion and a second end portion arranged along the circumferential direction of the pipeline, and the second end portion is overlapped on the first end portion to form a first overlap joint. The first end portion and the second end portion have a first gap therebetween, and the opening of the first gap is directed towards the ground. The heat preservation device further comprises a first fixing layer and a second fixing layer. The first fixing layer comprises a plurality of first fixing rings which surround the side of the heat preservation structure away from the target object and are used for fastening the heat preservation structure.

2. The heat retaining device according to claim 1, characterized by The second fixing layer comprises a plurality of second fixing rings which surround the side of the photothermal layer away from the heat storage layer and are used for fastening the photothermal layer. The at least one heat preservation layer comprises a plurality of heat preservation layers, and the plurality of heat preservation layers comprise the attached heat preservation layer and at least one covering heat preservation layer.

3. The heat retaining device according to claim 2, characterized in that The at least one heat preservation layer covers the side of the attached heat preservation layer away from the target object. The at least one covering heat preservation layer comprises a plurality of covering heat preservation layers. The plurality of covering heat preservation layers are formed by a plurality of heat preservation sheets which are stacked along the radial direction away from the pipeline.

4. The heat retaining device according to claim 2, wherein Alternatively, the plurality of covering heat preservation layers are formed by winding one heat preservation sheet along the circumferential direction of the pipeline. In the case that the heat preservation structure comprises one covering heat preservation layer or the heat preservation structure comprises a plurality of covering heat preservation layers which are formed by a plurality of heat preservation structures stacked along the radial direction away from the pipeline, any one of the covering heat preservation layers has a third end portion and a fourth end portion arranged along the circumferential direction of the pipeline, and the third end portion is overlapped on the fourth end portion to form a second overlap joint. The third end portion and the fourth end portion have a second gap therebetween, and the opening of the second gap is directed towards the ground.

5. The heat retaining device according to claim 4, wherein The second overlap joint of the covering heat preservation layer adjacent to the attached heat preservation layer is staggered with the first overlap joint in the radial direction of the pipeline, and the second overlap joints of any two adjacent covering heat preservation layers are staggered in the radial direction of the pipeline. The included angle between the shortest line connecting the first overlap joint and the second overlap joint and the vertical direction is greater than or equal to 45 degrees, and the vertical direction is the direction perpendicular to the ground.

6. The thermal device of claim 1, wherein, The target object comprises a pipeline, and any one of the at least one thermal insulation layer comprises a plurality of thermal insulation sections arranged along an axial direction of the pipeline, and any two adjacent thermal insulation sections have a first adjacent joint therebetween. The thermal insulation structure further comprises fireproof and heat-insulating paint filled in the first adjacent joint.

7. The thermal device of claim 1, wherein, The first fixing ring and the second fixing ring each comprise at least one of an aluminum foil tape, a glass fiber tape and a galvanized iron wire.

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