Chip packaging box transportation box

Abstract

The embodiment of the utility model provides a chip packaging box transportation box which comprises an upper cover plate and a lower cover plate which are matched with each other, a cavity for containing a chip packaging box is formed between the upper cover plate and the lower cover plate, and the chip packaging box transportation box further comprises a plurality of upper elastic pieces installed on the side, close to the chip packaging box, of the upper cover plate and a plurality of lower elastic pieces installed on the side, close to the chip packaging box, of the lower cover plate. At least part of the upper elastic piece is in contact with the top of the chip packaging box; the lower elastic pieces are installed on the side, close to the chip packaging box, of the lower cover plate, and at least part of the lower elastic pieces make contact with the bottom of the chip packaging box; the side elastic pieces are installed on the inner side wall of the lower cover plate, and at least part of the side elastic pieces make contact with the outer side wall of the chip packaging box. Through the arrangement of the upper elastic piece, the lower elastic piece and the side elastic pieces, all-directional limiting and buffering of the chip packaging box are achieved, the situation that products are damaged and polluted in the transportation / vibration process is avoided, and the transportation box can be repeatedly used and is suitable for the chip packaging boxes of the same specification and size.

Description

Technical Field

[0001] This specification relates to the field of semiconductor packaging technology, specifically to a chip packaging box or transport box. Background Technology

[0002] Chip packaging and transportation is a crucial link in the semiconductor industry chain, involving the safe protection of chips throughout the processes from production, packaging, and testing to final delivery to customers. After the chips are packaged in boxes, they are typically placed inside transport containers during transportation. To prevent damage and contamination during transport / vibration, 360° foam wrapping is commonly used to eliminate blind spots for cushioning. However, this method is cumbersome, and the foam cannot be recycled, resulting in high costs. Summary of the Invention

[0003] In view of this, the embodiments of this specification provide a chip packaging box transport box, which achieves all-round limiting and buffering of the chip packaging box by setting upper elastic members, lower elastic members and side elastic members, so as to avoid product damage and contamination during transportation / vibration. The transport box is reusable and suitable for chip packaging boxes of the same specification and size.

[0004] This specification provides the following technical solution through its embodiments: a chip packaging box transport box, comprising an upper cover plate and a lower cover plate that cooperate with each other, wherein the upper cover plate and the lower cover plate form a cavity for accommodating the chip packaging box, and further comprising:

[0005] Multiple upper elastic members are installed on the side of the upper cover plate near the chip packaging box, and the upper elastic members are at least partially in contact with the top of the chip packaging box;

[0006] Multiple lower elastic members are installed on the side of the lower cover plate near the chip packaging box, and the lower elastic members are at least partially in contact with the bottom of the chip packaging box;

[0007] Multiple side elastic elements are installed on the inner sidewall of the lower cover plate, and the side elastic elements are at least partially in contact with the outer sidewall of the chip packaging box.

[0008] Preferably, the inner sidewall of the lower cover plate is formed with a plurality of mounting portions corresponding to the plurality of side elastic members, and the plurality of side elastic members are installed in a one-to-one correspondence with the plurality of mounting portions.

[0009] Preferably, the mounting portion includes a fixing plate and a positioning plate extending toward the upper cover plate, a positioning groove is formed between the positioning plate and the fixing plate, and the side elastic member is at least partially embedded in the positioning groove.

[0010] Preferably, the fixing plate is U-shaped, the fixing plate forms a receiving groove, and the side elastic member is at least partially located within the receiving groove.

[0011] Preferably, the side elastic member includes a main body portion, which is at least partially embedded in the positioning groove. Both sides of the main body portion extend outward to form expansion portions. Along the direction away from the main body portion, the distance between the two expansion portions gradually increases. The ends of the two expansion portions extend to form abutment portions, which abut against the outer wall of the chip packaging box.

[0012] Preferably, there are two positioning plates, each forming a positioning groove with the fixing plate. The width of the main body is greater than the distance between the two positioning grooves. A piece extends downward from the main body, and the width of the piece is less than the distance between the two positioning grooves. The piece is inserted into the space between the two positioning plates.

[0013] Preferably, the lower cover plate extends to form a lower mounting frame on the side near the upper cover plate, and the lower elastic member is at least partially engaged within the lower mounting frame.

[0014] Preferably, the lower cover plate extends to form a lower mounting frame on the side near the upper cover plate, and the lower elastic member is at least partially engaged within the lower mounting frame.

[0015] Preferably, at least three of the upper elastic elements are not on the same straight line, and at least three of the lower elastic elements are not on the same straight line.

[0016] Preferably, each of the four corners of the upper cover plate has an upper positioning post extending toward the lower cover plate, and the lower cover plate has a lower positioning post corresponding to the upper positioning post extending toward the upper cover plate. The upper positioning post and the lower positioning post are connected by bolts.

[0017] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0018] By setting an upper elastic element at the bottom of the upper cover plate, which abuts against the top of the chip packaging box, the upper elastic element can limit and buffer the top of the chip packaging box. A lower elastic element is set inside the lower cover plate, which abuts against the bottom of the chip packaging box, and can limit and buffer the bottom of the chip packaging box. At the same time, a side elastic element is set on the inner side wall of the lower cover plate, which abuts against the outer side wall of the chip packaging box, and can limit and buffer the sides of the chip packaging box. This achieves all-round limiting and buffering of the chip packaging box, avoiding product damage and contamination during transportation / vibration. The transport box is reusable and suitable for chip packaging boxes of the same size. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the assembled structure of the chip packaging box and transport box provided in this application;

[0021] Figure 2 This is a schematic diagram of the internal structure of the chip packaging box and shipping box provided in this application;

[0022] Figure 3 This is a schematic diagram of the structure of the top cover of the chip packaging box and shipping box provided in this application;

[0023] Figure 4 This is a schematic diagram of the structure of the lower cover plate of the chip packaging box and shipping box provided in this application;

[0024] Figure 5 This is a first-view structural diagram of the lower cover plate of the chip packaging box and transport box provided in this application after the elastic member on the mounting side is installed.

[0025] Figure 6 yes Figure 5 Enlarged structural diagram at point A in the middle;

[0026] Figure 7 This is a second-view structural diagram of the chip packaging box and transport box provided in this application after the elastic element on the lower cover plate is installed.

[0027] In the diagram, 1. Upper cover plate; 2. Lower cover plate; 3. Upper elastic element; 4. Lower elastic element; 5. Chip packaging box; 6. Upper mounting frame; 7. Lower mounting frame; 8. Mounting part; 81. Fixing plate; 82. Positioning plate; 83. Positioning groove; 9. Side elastic element; 91. Main body; 92. Expansion part; 93. Abutting part; 94. Insert; 10. Upper positioning post; 11. Lower positioning post. Detailed Implementation

[0028] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0029] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0031] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0032] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0033] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0034] like Figures 1-7 As shown, a chip packaging box transport box includes an upper cover plate 1 and a lower cover plate 2 that cooperate with each other, forming a chamber for accommodating the chip packaging box 5 between the upper cover plate 1 and the lower cover plate 2, and further includes:

[0035] Multiple upper elastic members 3 are installed on the side of the upper cover plate 1 near the chip packaging box 5, and the upper elastic members 3 are at least partially in contact with the top of the chip packaging box 5;

[0036] Multiple lower elastic members 4 are installed on the side of the lower cover plate 2 near the chip packaging box 5, and the lower elastic members 4 are at least partially in contact with the bottom of the chip packaging box 5;

[0037] Multiple side elastic elements 9 are installed on the inner side wall of the lower cover plate 2, and the side elastic elements 9 are at least partially in contact with the outer side wall of the chip packaging box 5.

[0038] The chip packaging box (transport box 5) uses a multi-directional elastic buffer structure to achieve all-round protection for the chip during transportation. The principle and effect are analyzed as follows:

[0039] Multiple upper elastic elements 3 are arranged on the inner side of the upper cover plate 1. When closed, they absorb vertical impact forces through elastic deformation. When external pressure is applied to the upper cover plate 1, the upper elastic elements 3 disperse the pressure through compression, avoiding rigid contact that could damage the chip surface. The lower elastic element 4 contacts the bottom of the chip packaging box 5 to form a support layer. The vertical vibration energy generated during transportation is absorbed by the elastic material. At the same time, the support structure can distribute the weight of the chip and prevent excessive local pressure. The side elastic elements 9 form a flexible constraint in the horizontal direction. When the transport box is subjected to lateral shaking, the rebound force of the side elastic elements 9 offsets the displacement inertia and keeps the chip packaging box 5 in a centered position, avoiding rigid collision with the box body. By setting up the upper elastic elements 3, lower elastic elements 4, and side elastic elements 9, the chip packaging box 5 is provided with all-round limiting and buffering, avoiding product damage and contamination during transportation / vibration.

[0040] like Figures 4-7 As shown, in some embodiments, the inner sidewall of the lower cover plate 2 has multiple mounting portions 8 corresponding to the multiple side elastic elements 9, and the multiple side elastic elements 9 are installed one-to-one with the multiple mounting portions 8. The mounting portions 8 on the inner sidewall of the lower cover plate 2 are formed into grooves or snap-fit ​​structures by a mold forming process, which complement and match the shape of the side elastic elements 9. Each mounting portion 8 corresponds to a single side elastic element 9, and is fixed by snap-fit ​​or bolts, which facilitates the individual replacement of damaged elastic elements and improves maintenance efficiency.

[0041] like Figures 4-7 As shown, in some embodiments, the mounting portion 8 includes a fixing plate 81 and a positioning plate 82 extending toward the upper cover plate 1. A positioning groove 83 is formed between the positioning plate 82 and the fixing plate 81, and the side elastic member 9 is at least partially embedded in the positioning groove 83. The fixing plate 81 and the positioning plate 82 form a rigid clamping surface, and the distance between them (i.e., the width of the positioning groove 83) matches the thickness of the side elastic member 9. Lateral impact force is transmitted to the inner wall of the positioning groove 83 through the side elastic member 9. The fixing plate 81, as the main load-bearing structure, disperses the force to the entire lower cover plate 2, which significantly improves production efficiency and maintenance convenience while ensuring the safety of chip transportation.

[0042] like Figures 4-7 As shown, in some embodiments, the fixing plate 81 is U-shaped, forming a receiving groove, and the side elastic member 9 is at least partially located within the receiving groove. The U-shaped fixing plate 81 facilitates the installation of the side elastic member 9. Through the synergistic effect of the rigid structure of the fixing plate 81 and the elastic material of the side elastic member 9, efficient dissipation and precise positioning of lateral impact forces during chip transportation are achieved.

[0043] like Figures 5-7 As shown, in some embodiments, the side elastic member 9 includes a main body 91, which is at least partially embedded in the positioning groove 83. Both sides of the main body 91 extend outwards to form expansion portions 92. Along a direction away from the main body 91, the distance between the two expansion portions 92 gradually increases. The ends of both expansion portions 92 extend to form abutment portions 93, which abut against the outer wall of the chip packaging box 5. When the main body 91 is embedded in the positioning groove 83, initial positioning is achieved through rigid contact with the groove wall, ensuring installation accuracy. The expansion portions 92 are gradually expanding; under lateral impact, the expansion portions 92 on both sides are squeezed outwards, generating a wedge-shaped self-locking effect. The abutment portions 93 abut against the outer wall of the chip packaging box 5, limiting and fixing the chip packaging box 5. This simultaneously achieves precise positioning, impact attenuation, and adaptive compensation during chip transportation.

[0044] like Figures 5-7As shown, in some embodiments, two positioning plates 82 are provided, and two positioning grooves 83 are formed between the two positioning plates 82 and the fixing plate 81, respectively. The width of the main body 91 is greater than the distance between the two positioning grooves 83. A piece 94 extends downward from the main body 91, and the width of the piece 94 is less than the distance between the two positioning grooves 83. The piece 94 is inserted into the space between the two positioning plates 82. The two positioning plates 82 form two positioning grooves 83 between the fixing plate 81. The bottom wall of the positioning groove 83 supports the main body 91 to ensure the stability of the side elastic member 9 after installation. The piece 94 is formed at the bottom of the main body 91 and is inserted into the space between the positioning plates 82. It can play a positioning role when the side elastic member 9 is installed, ensuring that the side elastic member 9 is installed in the designated position.

[0045] like Figures 2-3 As shown, in some embodiments, an upper mounting frame 6 extends from the side of the upper cover plate 1 near the lower cover plate 2, and the upper elastic member 3 is at least partially engaged within the upper mounting frame 6. By providing multiple upper mounting frames 6 at the bottom of the upper cover plate 1, with each upper mounting frame 6 corresponding to an upper elastic member 3, and the upper part of the upper elastic member 3 engaged within the upper mounting frame 6, separation between the upper elastic member 3 and the upper cover plate 1 can be prevented. The bottom of the upper elastic member 3 abuts against the top of the chip packaging box 5, providing a buffering and limiting effect on the top of the chip packaging box 5.

[0046] like Figure 2 and Figures 4-5 As shown, in some embodiments, a lower mounting frame 7 extends from the side of the lower cover plate 2 near the upper cover plate 1, and the lower elastic member 4 is at least partially engaged within the lower mounting frame 7. By providing multiple lower mounting frames 7 at the bottom of the lower cover plate 2, with each lower mounting frame 7 corresponding to a lower elastic member 4, and the lower part of the lower elastic member 4 engaged within the lower mounting frame 7, separation between the lower elastic member 4 and the lower cover plate 2 can be prevented. The top of the lower elastic member 4 abuts against the bottom of the chip packaging box 5, providing support and buffering for the bottom of the chip packaging box 5.

[0047] like Figures 2-4 As shown, in some embodiments, at least three of the upper elastic members 3 are not on the same straight line, and at least three of the lower elastic members 4 are not on the same straight line. The multiple upper elastic members 3 are evenly distributed in a ring to ensure uniform cushioning of the top of the chip packaging box 5, and the multiple lower elastic members 4 are evenly distributed in a ring to ensure uniform cushioning of the bottom of the chip packaging box 5.

[0048] like Figures 3-4As shown, in some embodiments, upper positioning posts 10 extend from each of the four corners of the upper cover plate 1 toward the lower cover plate 2, and lower positioning posts 11 extend from each of the four corners of the lower cover plate 2 toward the upper cover plate 1, corresponding to the upper positioning posts 10. The upper positioning posts 10 and the lower positioning posts 11 are connected by bolts. By setting upper positioning posts 10 at the four bottom corners of the upper cover plate 1 and lower positioning posts 11 at the four top corners of the lower cover plate 2, the installation positioning between the upper cover plate 1 and the lower cover plate 2 can be achieved through the cooperation of the upper positioning posts 10 and the lower positioning posts 11. The connection between the upper positioning posts 10 and the lower positioning posts 11 is achieved by connecting the upper positioning posts 10 and the lower positioning posts 11 with bolts.

[0049] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.

[0050] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip package shipping box comprising a mating upper cover plate and lower cover plate, a cavity formed between the upper cover plate and the lower cover plate to accommodate a chip package, characterized in that, Also comprising: a plurality of upper elastic members installed on the upper cover plate near the chip packaging box, the upper elastic members at least partially contacting the top of the chip packaging box; a plurality of lower elastic members installed on the lower cover plate near the chip packaging box, the lower elastic members at least partially contacting the bottom of the chip packaging box; a plurality of side elastic members installed on the inner side wall of the lower cover plate, the side elastic members at least partially contacting the outer side wall of the chip packaging box.

2. The chip package shipping box of claim 1, wherein, The inner side wall of the lower cover plate is formed with a plurality of mounting portions corresponding to the plurality of side elastic members, and the plurality of side elastic members are installed one-to-one with the plurality of mounting portions.

3. The chip package shipping box of claim 2, wherein, The mounting portion includes a fixing plate and a positioning plate extending in the direction of the upper cover plate, and a positioning groove is formed between the positioning plate and the fixing plate, and the side elastic member is at least partially embedded in the positioning groove.

4. The chip package shipping box of claim 3, wherein, The fixing plate is in the shape of a V, and the fixing plate forms a containing groove, and the side elastic member is at least partially in the containing groove.

5. The chip package pod transport box of claim 4, wherein, The side elastic member includes a main body portion, the main body portion is at least partially embedded in the positioning groove, and the main body portion extends outward on both sides to form an expansion portion, the distance between the two expansion portions gradually increases along the direction away from the main body portion, and the end of the two expansion portions extends to form an abutting portion, and the abutting portion abuts against the outer wall of the chip packaging box.

6. The chip package shipping box of claim 5, wherein, The positioning plate is provided with two, two positioning grooves are formed between the positioning plate and the fixing plate, the width of the main body portion is greater than the distance between the two positioning grooves, the main body portion extends downward with an insertion sheet, the width of the insertion sheet is less than the distance between the two positioning grooves, and the insertion sheet is inserted into the space between the two positioning plates.

7. The chip package carrier transport box according to any one of claims 1 to 6, characterized in that, The upper cover plate extends on the side near the lower cover plate to form an upper mounting frame, and the upper elastic member is at least partially engaged in the upper mounting frame.

8. The chip package shipping box according to any one of claims 1-6, wherein, The lower cover plate extends on the side near the upper cover plate to form a lower mounting frame, and the lower elastic member is at least partially engaged in the lower mounting frame.

9. The chip package carrier transport box according to any one of claims 1 to 6, characterized in that, The upper elastic member has at least three not on the same straight line, and the lower elastic member has at least three not on the same straight line.

10. The chip package shipping box according to any one of claims 1-6, wherein, The upper cover plate extends in the direction of the lower cover plate at the corners to form an upper positioning column, the lower cover plate extends in the direction of the upper cover plate to form a lower positioning column corresponding to the upper positioning column, and the upper positioning column and the lower positioning column are connected by bolts.

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