Chip transportation box

Abstract

The utility model discloses a chip transportation box which comprises a transportation box body and a chip bearing plate, a damping mechanism is arranged at the bottom in the transportation box body, the bottom of the chip bearing plate is connected with the damping mechanism, the chip bearing plate is provided with a chip containing groove and an air channel, the air channel is connected with an external air pump, and air bags are arranged on the side face and the bottom of the chip containing groove. By adjusting the inflation degree of the air bag, different chips are adapted, and stable and safe transportation is ensured. The transportation box body is provided with a limiting sliding groove and a buckle, additional buffering is provided, and the box cover is prevented from being opened. The chip bearing plate is provided with a limiting sliding block, and stability is ensured. The air bag and the damping mechanism are combined for use, and damage of vibration and impact to the chip is reduced to the maximum extent. The chip can be taken out by adjusting the air bag through the air pump.

Description

Technical Field

[0001] This utility model relates to the field of chip transportation technology, and in particular to a chip transportation box. Background Technology

[0002] In the semiconductor industry, chips are core components, and their safety and stability during transportation are paramount. Due to their high value and fragility, specialized shipping boxes are required to ensure their safe delivery. Traditional chip shipping boxes mostly use simple foam or sponge as cushioning materials, but this method often fails to provide sufficient protection in the face of complex and changing transportation environments. Especially when encountering bumps or impacts, chips are easily damaged.

[0003] To address this issue, various improved chip transport box designs have emerged on the market, some incorporating advanced cushioning elements such as shock absorption mechanisms and airbags. However, these designs often suffer from structural complexity, high cost, or limited applicability. Therefore, developing a chip transport box that can effectively reduce damage to chips from vibration and shock while also possessing a simple structure, low cost, and wide applicability is of paramount importance. Utility Model Content

[0004] The purpose of this invention is to provide a chip transport box that solves the above-mentioned problems.

[0005] This utility model is achieved through the following technical solution:

[0006] A chip transport box includes a transport box body and a chip carrier plate. A shock-absorbing mechanism is provided at the bottom of the transport box body. The bottom of the chip carrier plate is connected to the shock-absorbing mechanism. A chip placement slot is formed on the upper surface of the chip carrier plate, and there are two air channels inside the chip carrier plate. The two air channels are a first inflation / extraction channel and a second inflation / extraction channel. The air inlets of the two air channels are both located at the bottom of the chip carrier plate. Side airbags of the chip placement slot are provided on the left, right, front, and back opposite sides of the chip placement slot, and a bottom airbag of the chip placement slot is provided at the bottom of the chip placement slot. The side airbags of the chip placement slot are connected to a first inflation / extraction pump provided outside the transport box body through the first inflation / extraction channel and an air pipe. The bottom airbag of the chip placement slot is connected to a second inflation / extraction pump provided outside the transport box body through the second inflation / extraction channel and an air pipe.

[0007] The transport box consists of a main body and a chip carrier plate. The bottom of the main body is equipped with a shock-absorbing mechanism to effectively absorb and disperse external impact forces. The chip carrier plate is tightly connected to the shock-absorbing mechanism to ensure stable support. Its upper surface is carefully designed with chip placement slots for precise chip placement. Simultaneously, the chip carrier plate has a first and a second air-injection channel, both of which introduce gas from the bottom of the chip carrier plate. Side airbags are installed on the left, right, front, and back sides of the chip placement slot, and a bottom airbag is installed at the bottom. These airbags are connected to the first and second dual-purpose pumps for inflation and deflation located outside the main body of the transport box via their respective air channels. This allows operators to adjust the inflation or deflation of the airbags according to actual needs by controlling the pumps, thereby flexibly adjusting the stiffness and support of the airbags to provide customized cushioning protection for the chips and ensure that the chips are not damaged by vibration and impact during transportation.

[0008] Furthermore,

[0009] Limiting sliding grooves are provided on opposite sides of the main body of the transport box, and the bottom of the limiting sliding grooves is above the shock absorption mechanism. Buckles that connect to the box lid are provided around the outer perimeter of the main body of the transport box.

[0010] Furthermore,

[0011] The chip carrier board is also provided with limit sliders on both sides, which match the limit sliding grooves opened on the main body of the transport box.

[0012] Furthermore,

[0013] The first inflation / deflation channel and the second inflation / deflation channel are respectively connected to the inside of the air bladder on the side of the chip placement slot and the inside of the air bladder at the bottom of the chip placement slot through the inflation hole on the side wall of the chip placement slot and the inflation hole at the bottom of the chip placement slot.

[0014] Furthermore,

[0015] The side airbags of the chip placement slot are arc-shaped airbags, while the bottom airbags of the chip placement slot are flat and horizontal airbags.

[0016] Furthermore,

[0017] The shock absorption mechanism includes a horizontal telescopic rod, a spring, a support rod, and a vertical telescopic rod. The horizontal telescopic rod is installed below the side of the transport box body and parallel to the bottom of the transport box body. One end of the support rod is hinged to the end of the horizontal telescopic rod, and the other end is hinged to the bottom of the chip carrier plate. The vertical telescopic rod is installed at the center of the bottom of the transport box body and is connected to the bottom of the chip carrier plate. The spring is respectively sleeved on the horizontal telescopic rod and the vertical telescopic rod.

[0018] Furthermore,

[0019] The air inlets are located on both sides of the vertical telescopic rod and are close to the vertical telescopic rod.

[0020] The beneficial effects of this utility model are:

[0021] 1. By combining shock absorption mechanisms, it can effectively absorb and disperse external impacts and vibrations during transportation, minimizing damage to the chip.

[0022] 2. The airbag is connected to an external dual-purpose pump (first for inflation, second for deflation) via a first inflation / deflation channel and a second inflation / deflation channel. This allows for flexible adjustment of the airbag's inflation level according to the size and weight of different chips. This design not only accommodates chips of various specifications but also provides optimal fixation and cushioning by adjusting the airbag's stiffness and support, ensuring chip stability during transportation. Attached Figure Description

[0023] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0024] Figure 1 This is a schematic diagram of the structure of this utility model;

[0025] Figure 2 This is an internal view of the main body of the transport box of this utility model;

[0026] Figure 3 This is a perspective view of the chip carrier board.

[0027] The attached diagram shows the markings and corresponding component names:

[0028] 1-Main body of transport box, 13-Limiting sliding groove, 2-Chip carrier plate, 20-Chip placement groove, 21-Side airbag of chip placement groove, 22-Bottom airbag of chip placement groove, 3-Shock absorption mechanism, 30-Horizontal telescopic rod, 31-Spring, 32-Support rod, 33-Vertical telescopic rod, 4-First vacuuming and inflation pump, 5-Second vacuuming and inflation pump, 6-First inflation and vacuuming channel, 7-Second inflation and vacuuming channel, 8-Chip, 9-Air inlet, 10-Air pipe, 11-Snap fastener, 12-Limiting slider. Detailed Implementation

[0029] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the implementation of the present invention is not limited thereto.

[0030] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner", "outer", "front", "rear", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "have," "install," "connect," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] Example

[0033] See Figures 1 to 3 :

[0034] A chip transport box includes a transport box body 1 and a chip carrier plate 2. A shock-absorbing mechanism 3 is provided at the bottom of the transport box body 1. The bottom of the chip carrier plate 2 is connected to the shock-absorbing mechanism 3. A chip placement slot 20 is formed on the upper surface of the chip carrier plate 2, and there are two air channels inside the chip carrier plate 2. The two air channels are a first inflation / extraction channel 6 and a second inflation / extraction channel 7. The air inlets 9 of the two air channels are both located at the bottom of the chip carrier plate 2. Side airbags 21 are provided on the left, right or front and back opposite sides of the chip placement slot 20. A bottom airbag 22 is provided at the bottom of the chip placement slot 20. The side airbags 21 are connected to a first inflation / extraction pump 4 provided outside the transport box body 1 through the first inflation / extraction channel 6 and an air pipe 10. The bottom airbag 22 is connected to a second inflation / extraction pump 5 provided outside the transport box body 1 through the second inflation / extraction channel 7 and an air pipe 10.

[0035] The combined use of the shock-absorbing mechanism 3 and the airbags is designed to minimize damage to the chip 8 from vibration and impact during transportation. The shock-absorbing mechanism 3, through a combination of horizontal telescopic rods 30, springs 31, support rods 32, and vertical telescopic rods 33, effectively absorbs and disperses external impact forces. The airbag design on the chip carrier plate 2, especially the side and bottom airbags, creates a soft buffer environment within the chip placement slot 20, further protecting the chip 8 from damage. The design of the first and second inflation / deflation channels 7 allows for adjustment of the airbag inflation level as needed to accommodate chips 8 of different sizes and weights, ensuring stability and safety during transportation.

[0036] Furthermore,

[0037] Each of the opposite sides of the transport box body 1 is provided with a limiting sliding groove 13, and the bottom of the limiting sliding groove 13 is above the shock absorption mechanism 3. All four sides of the outer side of the transport box body 1 are provided with buckles 11 that connect to the box lid.

[0038] The limiting sliding groove 13 allows the chip carrier board 2 to slide within the transport box, providing additional cushioning space during transportation and reducing direct impact. The design of the latch 11 ensures a tight connection between the box lid and the transport box body 1, preventing the box lid from accidentally opening during transportation and thus protecting the internal chip 8.

[0039] Furthermore,

[0040] The chip carrier plate 2 is also provided with limit sliders 12 on both sides, and the limit sliders 12 match the limit sliding grooves 13 opened on the main body of the transport box 1.

[0041] The limiting sliders 12 on both sides of the chip carrier plate 2 match the limiting sliding grooves 13 on the main body of the transport box 1, ensuring the stability and precise positioning of the carrier plate in the transport box. This prevents the carrier plate from moving or tilting unnecessarily during transportation, thus ensuring the safety and stability of the chip 8 during transportation.

[0042] Furthermore,

[0043] The first inflation / deflation channel 6 and the second inflation / deflation channel 7 are connected to the inside of the side airbag 21 of the chip placement slot and the inside of the bottom airbag 22 of the chip placement slot through the inflation holes on the side wall and the bottom of the chip placement slot, respectively.

[0044] The first and second inflation / deflation channels 7 are connected to the inside of the airbag through the inflation holes on the side wall and bottom of the chip placement slot 20. The airbag is inflated and deflated by an external air pump. This flexible air pressure adjustment mechanism can adjust the stiffness and support of the airbag according to different chips 8 to provide the best protection effect.

[0045] Furthermore,

[0046] The side airbag 21 of the chip placement slot is an arc-shaped airbag, and the bottom airbag 22 of the chip placement slot is a flat and horizontal airbag.

[0047] The side airbags 21 of the chip placement slot are designed in an arc shape, while the bottom airbag is designed to be flat and horizontal. This shape design helps to better adapt to the shape and size of the chip 8, providing uniform support and cushioning. The arc-shaped side airbags can better wrap and fix the chip 8, reducing the impact of side impacts, while the flat bottom airbag ensures the stability of the chip 8 in the vertical direction.

[0048] Furthermore,

[0049] The shock absorption mechanism 3 includes a horizontal telescopic rod 30, a spring 31, a support rod 32, and a vertical telescopic rod 33. The horizontal telescopic rod 30 is installed on the lower side of the transport box body 1 and parallel to the bottom of the transport box body 1. One end of the support rod 32 is hinged to the end of the horizontal telescopic rod 30 and the other end is hinged to the bottom of the chip carrier plate 2. The vertical telescopic rod 33 is installed at the center of the bottom of the transport box body 1 and connected to the bottom of the chip carrier plate 2. The spring 31 is respectively sleeved on the horizontal telescopic rod 30 and the vertical telescopic rod 33.

[0050] The combination of the horizontal telescopic rod 30, the spring 31, and the support rod 32, and the combination of the vertical telescopic rod 33 and the spring 31, can absorb impacts, and the combination of the vertical telescopic rod 33 and the spring 31 also provides support for the chip carrier plate 2.

[0051] Furthermore,

[0052] The air inlet 9 is located on both sides of the vertical telescopic rod 33 and is close to the vertical telescopic rod 33.

[0053] The air inlets 9 are located on both sides of the vertical telescopic rod 33 and close to the vertical telescopic rod 33 to ensure that the airflow can enter the airbag evenly and avoid uneven air pressure inside the airbag.

[0054] The principle of this utility model is as follows:

[0055] In use, the chip 8 is first placed in the chip placement slot 20 on the chip carrier plate 2. The chip placement slot 20 has arc-shaped side airbags and a flat bottom airbag on its sides and bottom, respectively. These airbags are connected to the external first and second dual-purpose pumps 5 for air intake and exhaust through the first inflation / exhaust channel 6 and the second inflation / exhaust channel 7. By adjusting the air pumps, the airbags can be inflated or deflated, thereby adjusting the hardness and support force of the airbags to accommodate chips 8 of different sizes and weights and to fix the chips 8 in place, ensuring that the chips 8 are firmly fixed and uniformly cushioned during transportation. The shock absorption mechanism 3 at the bottom of the transport box body 1 consists of a horizontal telescopic rod 30, a spring 31, a support rod 32, and a vertical telescopic rod 33, which can effectively absorb and disperse the impact force from the outside and reduce the impact of vibration on the chips 8. The limiting sliders 12 on both sides of the chip carrier plate 2 match the limiting sliding grooves 13 on the transport box body 1 to ensure that the carrier plate does not move or tilt unnecessarily during transportation. The buckle 11 on the outside of the main body 1 of the transport box ensures that the lid is tightly closed, preventing accidental opening during transportation. Through the combination of the flexible cushioning of the airbag and the rigid support of the shock absorption mechanism 3, the transport box can minimize the damage to the chip 8 caused by vibration and impact during transportation, ensuring the safety and stability of the chip 8.

[0056] When it is necessary to remove chip 8 from chip placement slot 20, the airbag 21 on the side of chip placement slot can be vented through the first pump 4 and the first pump 6. Then, the second pump 5 can be started to inflate the airbag 22 at the bottom of chip placement slot through the second pump 7, thereby raising chip 8 until it is easy to remove. Then, the inflation of the airbag 22 at the bottom of chip placement slot is stopped.

[0057] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A chip transport box comprising a transport box body (1), characterized in that, Also include chip carrier board (2), the inner bottom of the transport box body (1) is provided with damping mechanism (3), the bottom of the chip carrier board (2) is connected with damping mechanism (3), the upper surface of chip carrier board (2) is provided with chip placing groove (20) and has two air passages in chip carrier board (2), two air passages are first air filling and exhausting passage (6) and second air filling and exhausting passage (7) respectively, the air inlet (9) of two air passages is in the bottom of chip carrier board (2), the left and right or front and back opposite sides of the chip placing groove (20) are provided with chip placing groove side air bag (21), the bottom of chip placing groove (20) is provided with chip placing groove bottom air bag (22), the chip placing groove side air bag (21) is connected with the first air filling and exhausting dual-purpose pump (4) arranged outside the transport box body (1) through first air filling and exhausting passage (6) and air pipe (10), the chip placing groove bottom air bag (22) is connected with the second air filling and exhausting dual-purpose pump (5) arranged outside the transport box body (1) through second air filling and exhausting passage (7) and air pipe (10).

2. The chip transport box according to claim 1, wherein The opposite side of the transport box body (1) is provided with limiting sliding groove (13), and the bottom of limiting sliding groove (13) is above damping mechanism (3), and the periphery of the outer side of transport box body (1) is provided with buckle (11) connected with box cover.

3. The chip transport box according to claim 2, wherein The two sides of the chip carrier board (2) are also provided with limiting sliding block (12), and limiting sliding block (12) is matched with limiting sliding groove (13) opened on the transport box body (1).

4. The chip transport box according to claim 1, wherein The first air filling and exhausting passage (6) and second air filling and exhausting passage (7) are respectively communicated with the inside of chip placing groove side air bag (21) and chip placing groove bottom air bag (22) through the air filling hole of the side wall of chip placing groove (20) and the air filling hole of the bottom.

5. The chip transport box according to claim 1, wherein The chip placing groove side air bag (21) is arc air bag, and the chip placing groove bottom air bag (22) is flat and horizontal air bag.

6. The chip transport box according to claim 1, wherein The damping mechanism (3) includes horizontal telescopic rod (30), spring (31), support rod (32) and vertical telescopic rod (33), the horizontal telescopic rod (30) is arranged below the side of transport box body (1) and parallel to the bottom of transport box body (1), one end of support rod (32) is hinged with the end of horizontal telescopic rod (30) and the other end is hinged with the bottom of chip carrier board (2), the vertical telescopic rod (33) is installed at the center position of the bottom of transport box body (1) and connected with the bottom of chip carrier board (2), and the spring (31) is respectively sleeved on the horizontal telescopic rod (30) and the vertical telescopic rod (33).

7. The chip transport box according to claim 6, wherein The air inlet (9) is on both sides of vertical telescopic rod (33) and close to vertical telescopic rod (33).

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