Water surrounding assembly

Abstract

The utility model relates to the technical field of wafer detection, in particular to a water surrounding assembly. Comprising a lifting mechanism and a water surrounding mechanism, and the water surrounding mechanism is divided into a water injection module, a water surrounding module and a water absorption module. The water injection module uniformly injects water to the wafer back film through a plurality of water injection ports, so that the imaging quality is improved; the water surrounding module forms a sealed water surrounding area by using a silica gel waterproof strip to prevent liquid from flowing out; and the water absorption module absorbs the water flowing out through the water absorption holes in the water absorption cover plate, so that other areas on the surface of the wafer are prevented from being infiltrated. The height of the lifting mechanism can be adjusted according to needs to adapt to wafers or detection equipment of different sizes. The water injection port and the water suction port are separately arranged, water injection and water suction are achieved at the same time, even if the water surrounding module loses efficacy, other areas can be prevented from being wetted, water flow is kept gentle, and the imaging effect is stable.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, and more specifically, to a water containment component. Background Technology

[0002] Wafers are typically made of single-crystal silicon and are used in the manufacture of microelectronic devices such as integrated circuits, chips, and sensors. During wafer thinning, dicing, dicing, and testing, imaging and inspection of the wafer's backsheet are necessary to promptly detect defects and contamination on the backsheet, allowing for appropriate improvements to ensure wafer quality and performance.

[0003] During wafer backsheet inspection, an appropriate amount of water needs to be injected into the inspection area to reduce scattering noise and improve imaging quality. Existing water-enclosing modules have the water inlet and outlet located in the same position. If the water intake is too fast, the water layer on the wafer backsheet surface may be quickly absorbed, failing to adequately wet the backsheet and thus failing to effectively reduce scattering noise, affecting image quality. Conversely, if the water intake is too slow, excessive water may flow in, wetting other areas of the wafer surface and contaminating them. Utility Model Content

[0004] This invention provides a water containment component that solves the problems of existing water containment modules where the water inlet and outlet are located in the same position, making it difficult to control the water intake speed, causing unstable imaging, and making it easy for liquid to flow out and wet other areas of the wafer surface.

[0005] According to the present invention, a water containment component includes: a lifting mechanism fixed on one side of the outer wall of a wafer inspection device, and a water containment mechanism fixedly connected to the lifting mechanism; the water containment mechanism includes a water injection module for injecting water into the wafer back film, and a water containment module for sealing the water injection area of ​​the wafer back film is provided on the outer wall of the water injection module; a water absorption module for absorbing water is fixedly connected to the outside of the water containment module.

[0006] The water-enclosing mechanism in this invention, consisting of a water injection module, a water enclosure module, and a water absorption module, allows water to continuously permeate the field of view, improving imaging quality. The water enclosure module seals the water within the field of view, while the water absorption module absorbs the water flowing out of the field of view, thus preventing water from permeating other areas of the wafer surface.

[0007] In this invention, the lifting mechanism is fixed to the outer wall of one side of the wafer inspection equipment. The height of the lifting mechanism can be adjusted as needed to accommodate wafers or wafer inspection equipment of different sizes.

[0008] In this utility model, the water injection module includes a rectangular support plate. The support plate has an observation hole for inspecting the wafer back film in the middle. The observation hole penetrates the support plate. A glass cover is provided at the end of the observation hole near the wafer back film. A pressure ring for limiting the glass cover is provided on the upper part of the side of the glass cover away from the wafer back film.

[0009] The support plate in this invention provides a stable support platform, and the observation hole through the support plate facilitates the inspection and observation of the wafer back film. The glass cover plate is set at the end of the observation hole close to the wafer back film, which effectively prevents the injected water from entering the observation hole and ensures clear imaging. The pressure ring at the top limits the glass cover plate and ensures that the glass cover plate will not be squeezed up by water in the sealed area.

[0010] In this utility model, the water injection module also includes multiple water injection ports arranged circumferentially along the outer side of the observation hole, and the water injection ports penetrate the support plate.

[0011] The multiple water injection ports arranged circumferentially in this invention can uniformly inject water into the wafer back film, achieving full coverage of the water layer in the wafer back film detection area, stabilizing imaging, and facilitating detection.

[0012] In this utility model, the water-sealing module includes four silicone water-sealing strips disposed on the outer wall of the support plate. The four silicone water-sealing strips extend out of the support plate near the end of the wafer back film and together form a water-sealing area to seal the water after water injection.

[0013] By setting up the water-enclosed area formed by the silicone water-blocking strip in this utility model, during the test, the entire mechanism moves down, and the silicone water-enclosed strip is pressed against the wafer surface. Water is injected from the water inlet, and the silicone achieves a seal, preventing water leakage. The water flow becomes smooth, achieving clear imaging and completing the test. Furthermore, due to the good elasticity of the silicone, it will not damage the wafer when in contact with the wafer back film.

[0014] In this utility model, the water absorption module includes four water absorption covers disposed on the side of the silicone water-proof strip away from the support plate, and the end of the water absorption cover near the wafer back film is provided with water absorption holes spaced apart along the length of the water absorption cover.

[0015] With the water-absorbing holes evenly distributed on the water-absorbing cover plate in this utility model, after the test is completed, the entire mechanism is lifted and the water layer flows out. Due to the high density of the holes, the water flowing out is directly absorbed into the water-absorbing holes, preventing other areas on the wafer surface from being wetted.

[0016] In this invention, the end face of the absorbent cover away from the wafer back film and the end face of the support plate away from the wafer back film are on the same horizontal plane. The upper part of the end of the absorbent cover away from the wafer back film is provided with fixing blocks spaced apart along the length of the absorbent cover. The fixing blocks extend to the support plate and abut against the support plate. The side of the absorbent cover away from the support plate is provided with countersunk screw holes. The absorbent cover, the silicone water-blocking strip and the support plate are connected by bolts through the countersunk screw holes.

[0017] The water-absorbing cover, silicone water-blocking strip, and support plate are bolted together using countersunk screw holes in this invention, achieving a tight connection of the water-enclosing mechanism. Furthermore, the abutting arrangement between the fixing block and the support plate makes the connection between the water-absorbing cover, silicone water-blocking strip, and support plate more secure, and facilitates the disassembly and replacement of the water-absorbing cover and silicone water-blocking strip, reducing the maintenance cost of the water-enclosing mechanism.

[0018] In this utility model, the lifting mechanism includes a buffer slide rail disposed on the outer wall of one side of the wafer inspection equipment, an L-shaped connecting buffer plate slidably connected on the buffer slide rail, and one end of the connecting buffer plate near the support plate being bolted to the support plate.

[0019] The buffer slide rail in this invention provides a stable sliding track for the L-shaped connecting buffer plate, ensuring a smooth lifting process. The L-shaped connecting buffer plate is bolted to the support plate, and the lifting of the water-enclosing mechanism is achieved through a sliding connection on the buffer slide rail.

[0020] In this invention, the lifting mechanism also includes a photoelectric sensor disposed on the outer wall of one side of the wafer testing equipment.

[0021] By using a photoelectric sensor in this invention to control the height of the lifting mechanism, when the lifting mechanism fails and presses down, the water-enclosing mechanism can rebound and trigger an alarm via the buffer slide rail and connecting buffer plate.

[0022] This invention uses a water inlet within a support plate to maintain liquid circulation and fill the surrounding water area during scanning. After detection, the liquid flowing out is absorbed through the suction holes on the suction cover. This invention separates the water inlet and suction outlet, allowing for simultaneous water injection and absorption. Even if the silicone water barrier fails, liquid will flow out from the surrounding water area, but water injection and absorption can continue. Water injection improves imaging results. Due to the higher density of the suction outlet, the efficiency of liquid absorption and recovery is greater than the injection speed, preventing other areas from getting wet and maintaining a smooth water flow within the surrounding water area, thus ensuring consistent imaging results. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the water containment components.

[0024] Figure 2This is the first schematic diagram of the water containment mechanism.

[0025] Figure 3 This is a second schematic diagram of the water containment mechanism.

[0026] Figure 4 This is a top view of the water containment mechanism.

[0027] Figure 5 This is a front view of the water containment mechanism.

[0028] Figure 6 This is a schematic diagram of the lifting mechanism.

[0029] Figure 7 This is a schematic diagram of the water injection module. Detailed Implementation

[0030] To further understand the content of this utility model, a detailed description of the utility model is provided in conjunction with the embodiments. It should be understood that the embodiments are merely illustrative and not limiting of the utility model.

[0031] Example 1

[0032] like Figure 1-7 As shown, this embodiment provides a water containment assembly, which includes: a lifting mechanism 200 fixed on the outer wall of one side of a wafer inspection device, and a water containment mechanism 100 fixedly connected to the lifting mechanism 200; the water containment mechanism 100 includes a water injection module 110 for injecting water into the wafer back film, and a water containment module 120 for sealing the water injection area of ​​the wafer back film is provided on the outer wall of the water injection module 110; a water absorption module 130 for absorbing water is fixedly connected to the outside of the water containment module 120.

[0033] With the water containment mechanism 100 in this embodiment, the water injection module 110 injects water through the water injection module 110, the water containment module 120, and the water absorption module 130, so that water continuously wets the field of view area, improving the imaging quality. The water containment module 120 seals the water within the field of view area, and the water absorption module 130 absorbs the water flowing out of the field of view area, thereby preventing water from wetting other areas of the wafer surface.

[0034] In this embodiment, the lifting mechanism 200 is fixed on the outer wall of one side of the wafer inspection equipment. The height of the lifting mechanism 200 can be adjusted as needed to accommodate wafers or wafer inspection equipment of different sizes.

[0035] In this embodiment, the water injection module 110 includes a rectangular support plate 111. The support plate 111 has an observation hole 1111 for inspecting the back film of the wafer in the middle. The observation hole 1111 passes through the support plate 111. A glass cover plate 1112 is provided at the end of the observation hole 1111 near the back film of the wafer. A pressure ring 1113 for limiting the glass cover plate 1112 is provided on the upper part of the side of the glass cover plate 1112 away from the back film of the wafer.

[0036] In this embodiment, the support plate 111 provides a stable support platform. The observation hole 1111 through the support plate 111 facilitates the inspection and observation of the wafer back film. The glass cover plate 1112 is set at the end of the observation hole 1111 near the wafer back film, which effectively prevents injected water from entering the observation hole 1111 and ensures clear detection imaging. The upper pressure ring 1113 limits the glass cover plate 1112 to ensure that the glass cover plate 1112 will not be squeezed up by water in the sealed area.

[0037] In this embodiment, the water injection module 110 also includes a plurality of water injection ports 1114 arranged circumferentially along the outer side of the observation hole 1111, and the water injection ports 1114 penetrate the support plate 111.

[0038] In this embodiment, multiple water injection ports 1114 arranged circumferentially can uniformly inject water into the wafer back film, achieving full coverage of the water layer in the wafer back film detection area, stabilizing imaging, and facilitating detection.

[0039] In this embodiment, the water-sealing module 120 includes four silicone water-sealing strips 121 disposed on the outer wall of the support plate 111. The four silicone water-sealing strips 121 extend out of the support plate 111 near the end of the wafer back film and together form a water-sealing area 122 that seals against water after water injection.

[0040] With the water-enclosed area 122 formed by the silicone water-separating strip 121 in this embodiment, since the bottom of the silicone water-separating strip 121 is lower than the bottom of the support plate 111, during the test, the entire mechanism moves down, and the mechanism is 0.5mm away from the wafer surface. At this time, the silicone water-separating strip 121 is pressed against the wafer surface and water is injected from the water injection port 1114. At this time, the silicone achieves a seal, preventing water leakage. The water flow becomes smooth, achieving clear imaging and completing the test. Moreover, due to the good elasticity of the silicone, it will not damage the wafer when in contact with the wafer back film.

[0041] In this embodiment, the water absorption module 130 includes four water absorption cover plates 131 disposed on the side of the silicone water-proof strip 121 away from the support plate 111. The end of the water absorption cover plate 131 near the wafer back film is provided with water absorption holes 132 spaced apart along the length of the water absorption cover plate 131.

[0042] With the uniformly distributed water absorption holes 132 on the water absorption cover plate 131 in this embodiment, after the test is completed, the entire mechanism is lifted and the water layer flows out. Due to the high density of the holes, the water absorption holes 132 directly absorb the flowing water into the water absorption holes 132, preventing other areas on the wafer surface from being wetted.

[0043] In this embodiment, the end face of the water-absorbing cover plate 131 away from the wafer back film and the end face of the support plate 111 away from the wafer back film are on the same horizontal plane. The upper part of the end of the water-absorbing cover plate 131 away from the wafer back film is provided with fixing blocks 133 spaced along the length direction of the water-absorbing cover plate 131. The fixing blocks 133 extend to the support plate 111 and abut against the support plate 111. The side of the water-absorbing cover plate 131 away from the support plate 111 is provided with countersunk screw holes 134. The water-absorbing cover plate 131, the silicone water-blocking strip 121 and the support plate 111 are bolted together through the countersunk screw holes 134.

[0044] In this embodiment, the water-absorbing cover plate 131, the silicone water-blocking strip 121, and the support plate 111 are bolted together through the countersunk screw holes 134, thus achieving a tight connection of the water-enclosing mechanism 100. Furthermore, the abutting arrangement between the fixing block 133 and the support plate 111 makes the connection between the water-absorbing cover plate 131, the silicone water-blocking strip 121, and the support plate 111 more secure, and facilitates the disassembly and replacement of the water-absorbing cover plate 131 and the silicone water-blocking strip 121, thereby reducing the maintenance cost of the water-enclosing mechanism 100.

[0045] In this embodiment, the lifting mechanism 200 includes a buffer slide rail 210 disposed on the outer wall of one side of the wafer inspection equipment. An L-shaped connecting buffer plate 220 is slidably connected to the buffer slide rail 210. One end of the connecting buffer plate 220 near the support plate 111 is bolted to the support plate 111.

[0046] In this embodiment, the buffer slide rail 210 provides a smooth sliding track for the L-shaped connecting buffer plate 220, ensuring the smoothness of the lifting process. The L-shaped connecting buffer plate 220 is bolted to the support plate 111 and the water containment mechanism 100 is lifted and lowered by sliding on the buffer slide rail 210. The buffer slide rail 210 has a guide rail buffer stroke, and the product limit height is adjusted to 0.2mm away from the product to prevent the water containment mechanism 100 from damaging the wafer when the lifting mechanism 200 fails.

[0047] In this embodiment, the lifting mechanism 200 also includes a photoelectric sensor 230 disposed on the outer wall of one side of the wafer testing equipment.

[0048] By setting the photoelectric sensor 230 in this embodiment, the height of the lifting mechanism 200 is controlled. When the lifting mechanism 200 fails and presses down, the water containment mechanism 100 can rebound and trigger an alarm through the buffer slide rail 210 and the connecting buffer plate 220.

[0049] In this embodiment, the water inlet 1114 in the support plate 111 maintains the liquid circulation to fill the water-enclosed area 122 during the scanning process. After the detection is completed, the outflowing liquid is absorbed through the water absorption hole 132 on the water absorption cover plate 131. In this embodiment, the water inlet 1114 and the water absorption port are set separately, so water can be injected and absorbed at the same time. In the event that the silicone water-blocking strip 121 fails, the liquid flows out from the water-enclosed area 122. At this time, water can still be injected and absorbed continuously. Water injection improves the imaging effect. Since the density of the water absorption port is large, the efficiency of liquid absorption and recovery is greater than the water injection speed of the water inlet 1114, preventing other areas from getting wet and keeping the water flow in the water-enclosed area 122 smooth, so that the imaging effect can be maintained.

[0050] It is readily understood that those skilled in the art can combine, split, or reorganize the embodiments provided in this application to obtain other embodiments, all of which do not exceed the protection scope of this application.

[0051] In summary, the above description is only a preferred embodiment of the present utility model. All equivalent changes and modifications made within the scope of the patent application of the present utility model shall fall within the scope of the patent of the present utility model.

Claims

1. A water containment assembly, characterized by: The lifting mechanism (200) is fixed on the outer wall of one side of the wafer detection device, and the water surrounding mechanism (100) is fixedly connected with the lifting mechanism (200); the water surrounding mechanism (100) comprises a water injection module (110) for injecting water to the wafer back film, and a water surrounding module (120) is arranged on the outer wall of the water injection module (110) and used for sealing the wafer back film detection area; the outer side of the water surrounding module (120) is fixedly connected with a water absorbing module (130) used for absorbing water.

2. A water containment assembly according to claim 1, wherein: The water injection module (110) comprises a support plate (111) in the shape of a rectangle, and an observation hole (1111) for detecting the wafer back film is arranged in the middle of the support plate (111); the observation hole (1111) penetrates through the support plate (111), and a glass cover plate (1112) is arranged at one end of the observation hole (1111) close to the wafer back film; and a pressing ring (1113) for limiting the glass cover plate (1112) is arranged on the upper portion of the side of the glass cover plate (1112) away from the wafer back film.

3. A water containment assembly according to claim 2, wherein: The water injection module (110) further comprises a plurality of water injection ports (1114) arranged in the circumferential direction of the outer side of the observation hole (1111), and the water injection ports (1114) penetrate through the support plate (111).

4. A water containment assembly according to claim 2, wherein: The water surrounding module (120) comprises four silica gel water isolation strips (121) arranged on the outer wall of the support plate (111), and the portions of the four silica gel water isolation strips (121) extending out of the end of the support plate (111) close to the wafer back film jointly form a water sealing surrounding area (122) for sealing the water after injection.

5. A water containment assembly according to claim 1, wherein: The water absorbing module (130) comprises four water absorbing cover plates (131) arranged on the side of the silica gel water isolation strips (121) away from the support plate (111), and the water absorbing cover plates (131) are provided with water absorbing holes (132) arranged at intervals along the length direction of the water absorbing cover plates (131) at one end close to the wafer back film.

6. A water containment assembly according to claim 5, wherein: The end face of the water absorbing cover plate (131) away from the wafer back film is in the same horizontal plane as the end face of the support plate (111) away from the wafer back film, the upper portion of the end of the water absorbing cover plate (131) away from the wafer back film is provided with fixing blocks (133) arranged at intervals along the length direction of the water absorbing cover plate (131), the fixing blocks (133) extend to the support plate (111) and abut against the support plate (111), and the side of the water absorbing cover plate (131) away from the support plate (111) is provided with a countersunk screw hole (134), and the water absorbing cover plate (131), the silica gel water isolation strips (121) and the support plate (111) are connected through the countersunk screw hole (134).

7. A water containment assembly according to claim 2, wherein: The lifting mechanism (200) comprises a buffer sliding rail (210) arranged on the outer wall of one side of the wafer detection device, and an L-shaped connecting buffer plate (220) is slidingly connected on the buffer sliding rail (210); and one end of the connecting buffer plate (220) close to the support plate (111) is bolted with the support plate (111).

8. A water containment assembly according to claim 7, wherein: The lifting mechanism (200) further comprises a photoelectric sensor (230) arranged on the outer wall of one side of the wafer detection device.

Images