Auxiliary heat dissipation structure for computer
By designing a splicing frame and assembly mechanism, the heat dissipation equipment and chassis can be quickly adapted, solving the problem of limited applicability in existing technologies and improving versatility and heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-05
- Publication Date
- 2026-03-10
AI Technical Summary
Existing computer-aided cooling devices are limited to the installation of computer mainframes of a specific size, which restricts their applicability and reduces their versatility and popularity.
It adopts a splicing frame and combination mechanism, and drives the gear and rack to move relative to each other through the torsion spring rod, so that the clamping claws can engage with the chassis structure, realizing the rapid adaptation of heat dissipation equipment and chassis, and adapting to chassis of different specifications.
The applicability and versatility of the heat dissipation structure have been improved, enabling it to be adapted to different computer hosts and enhancing installation stability and heat dissipation effect.
Smart Images

Figure CN223986300U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer technology, specifically to an auxiliary heat dissipation structure for computers. Background Technology
[0002] A computer, commonly known as a PC, is a modern electronic computing machine used for high-speed calculations. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device capable of running programs and automatically and rapidly processing massive amounts of data. It consists of hardware and software systems. Currently, to improve the heat dissipation of computers, auxiliary cooling devices are usually installed externally to assist in cooling the computer case.
[0003] A search revealed that a computer-aided heat dissipation device with patent publication number CN222014704U states that "this utility model, by setting up components such as mounting base, slot, block, anti-collision frame, groove, protrusion and baffle, facilitates the covering and protection of the heat dissipation unit. Furthermore, the cooperation between the slot and the block allows the anti-collision frame to be easily disassembled and replaced; and by setting up the baffle, the front and back of the heat dissipation unit can be easily shielded and protected, thereby improving the protective effect of the heat dissipation unit."
[0004] However, the above solution still has some shortcomings in actual use. In this technical solution, two sets of cards are used to connect the heat sink to the computer host by a card-connection method, so as to realize the heat sink to heat the computer host.
[0005] However, this installation method is limited to computer hosts of a specific size, which means that the applicability of this auxiliary cooling device is greatly limited, thereby reducing its versatility and popularity in different computer hosts. Utility Model Content
[0006] This invention provides an auxiliary heat dissipation structure for computers to solve the problems in the background art.
[0007] To achieve the above objectives, this utility model provides the following technical solution: an auxiliary heat dissipation structure for a computer, including a chassis structure, a mounting structure at the top of the chassis structure, and a heat dissipation device on the inner side of the mounting structure;
[0008] The installation structure includes a splicing frame, with two assembly mechanisms fixedly installed at the bottom of the splicing frame. Each assembly mechanism includes a base box, with a connecting cover movably snapped onto the top of the base box. Inside the base box, a gear is rotatably connected via a torsion spring rod. A throttle is fixedly installed at the top of the gear, extending above the connecting cover. Two racks mesh with the outer side of the gear, and a clamping claw is fixedly installed at the bottom of the rack. The inner side of the clamping claw overlaps with the top of the chassis structure.
[0009] Furthermore, the chassis structure includes a chassis body, and the top of the chassis body has ventilation holes.
[0010] Furthermore, a placement slot is provided on the inner side of the splicing frame, and the heat dissipation device is located inside the placement slot.
[0011] Furthermore, a connecting rod is fixedly installed on the top of the connecting cover, and the connecting cover is fixedly connected to the bottom of the splicing frame through the connecting rod.
[0012] Furthermore, two crossbars are fixedly installed on the inner wall of the base box, and a sliding sleeve is fixedly connected to the outer side of the rack, with the sliding sleeve slidably connected to the surface of the crossbars.
[0013] Furthermore, a groove is provided at the bottom end of the base box, and the clamping claw passes through the groove and extends to the bottom of the base box.
[0014] Furthermore, the heat dissipation device includes a heat dissipation plate, a condenser tube is provided at the top of the heat dissipation plate, heat dissipation fins are provided on the outside of the condenser tube, and an exhaust fan is provided at the top of the heat dissipation fins.
[0015] Furthermore, the heat sink is an aluminum plate, and the condenser tube is filled with coolant.
[0016] Compared with the prior art, the present invention provides an auxiliary heat dissipation structure for computers, which has the following advantages:
[0017] This computer uses an auxiliary heat dissipation structure. Through the installation structure, a torsion spring rod drives two racks to move relative to each other via gears. This allows the racks to engage with the top of the chassis structure via clamping claws. This enables two assembly mechanisms at the bottom of the splicing frame to quickly and adaptably combine the heat dissipation device with the chassis structure. This allows the heat dissipation structure to be adapted to medium-sized chassis, thereby increasing its applicability and ensuring its versatility and widespread use in different computer hosts. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the chassis structure of this utility model;
[0020] Figure 3 This is a schematic diagram of the installation structure of this utility model;
[0021] Figure 4 This is a schematic diagram of the assembly mechanism of this utility model;
[0022] Figure 5 This is a schematic diagram of the heat dissipation device of this utility model.
[0023] In the diagram: 1. Chassis structure; 101. Chassis body; 102. Ventilation holes; 2. Mounting structure; 201. Splicing frame; 202. Assembly mechanism; 203. Base box; 204. Connecting cover; 205. Torsion spring rod; 206. Gear; 207. Rack; 208. Crossbar; 209. Clamping claw; 210. Slide; 211. Connecting rod; 212. Thruster; 3. Cooling equipment; 301. Heat sink; 302. Condenser pipe; 303. Heat sink fins; 304. Exhaust fan. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] Please see Figure 1-5 This utility model discloses an auxiliary heat dissipation structure for a computer, including a chassis structure 1, a mounting structure 2 at the top of the chassis structure 1, and a heat dissipation device 3 on the inner side of the mounting structure 2.
[0026] The chassis structure 1 includes a chassis body 101, and a heat dissipation hole 102 is provided at the top of the chassis body 101.
[0027] The installation structure 2 includes a splicing frame 201. Two combination mechanisms 202 are fixedly installed at the bottom of the splicing frame 201. Each combination mechanism 202 includes a base box 203. A connecting cover 204 is movably engaged at the top of the base box 203. A gear 206 is rotatably connected inside the base box 203 via a torsion spring rod 205. A throttle 212 is fixedly installed at the top of the gear 206. The throttle 212 extends above the connecting cover 204. Two racks 207 mesh with the outer side of the gear 206. A clamping claw 209 is fixedly installed at the bottom of the rack 207. The inner side of the clamping claw 209 overlaps with the top of the chassis structure 1.
[0028] By setting up the installation structure 2, the torsion spring rod 205 can drive the two racks 207 to move relative to each other through the gear 206, so that the racks 207 can be engaged with the top of the chassis structure 1 through the clamping claw 209. This enables the two combination mechanisms 202 at the bottom of the splicing frame 201 to quickly and adaptably combine the heat dissipation device 3 with the chassis structure 1, so that the heat dissipation structure can be adapted to medium-sized chassis, thereby improving the applicability of the heat dissipation structure and ensuring its universality and popularity in different computer hosts.
[0029] Specifically, the splicing frame 201 has a placement slot on its inner side, and the heat dissipation device 3 is located inside the placement slot.
[0030] In this embodiment, the heat dissipation device 3 is placed in the placement slot inside the splicing frame 201 and can be stably supported by the mounting structure 2.
[0031] Specifically, a connecting rod 211 is fixedly installed on the top of the connecting cover 204, and the connecting cover 204 is fixedly connected to the bottom of the splicing frame 201 through the connecting rod 211.
[0032] In this embodiment, the connecting cover 204 is fixedly connected to the bottom end of the splicing frame 201 via the connecting rod 211. This design enhances the overall stability of the installation structure 2, making the heat dissipation device 3 less prone to shaking or falling off during installation, thus further ensuring the heat dissipation effect. At the same time, the connecting rod 211 also makes it easier for users to turn the handle 212, improving the convenience of use.
[0033] Specifically, two crossbars 208 are fixedly installed on the inner wall of the bottom box 203, and a sliding sleeve is fixedly connected to the outer side of the rack 207, with the sliding sleeve slidably connected to the surface of the crossbars 208.
[0034] In this embodiment, the rack 207, driven by the gear 206, can move in a stable straight line along the crossbar 208, avoiding the rack 207 from deviating or jamming during the movement, thereby ensuring that the clamping claw 209 can accurately engage with the top of the chassis structure 1.
[0035] Specifically, the bottom end of the base box 203 is provided with a sliding groove 210, and the clamping claw 209 passes through the sliding groove 210 and extends to the bottom of the base box 203.
[0036] In this embodiment, the design of the slide groove 210 also ensures the stability of the clamping claw 209 during movement, avoiding the situation where the clamping effect is affected by the shaking of the clamping claw 209.
[0037] Specifically, the heat dissipation device 3 includes a heat dissipation plate 301, which is an aluminum plate. A condenser pipe 302 is provided at the top of the heat dissipation plate 301. Coolant is injected into the interior of the condenser pipe 302. Heat dissipation fins 303 are provided on the outside of the condenser pipe 302. An exhaust fan 304 is provided at the top of the heat dissipation fins 303.
[0038] In this embodiment, the heat sink 301 of the heat dissipation device 3 is made of aluminum plate, which has good thermal conductivity and can quickly conduct the heat generated inside the chassis structure 1 to the condenser pipe 302. The coolant injected inside the condenser pipe 302 circulates during the heat dissipation process, effectively absorbing and carrying away heat. At the same time, the arrangement of the heat dissipation fins 303 increases the heat dissipation area and improves the heat dissipation efficiency. The exhaust fan 304 generates airflow to accelerate the airflow around the heat dissipation fins 303, further enhancing the heat dissipation effect.
[0039] In use, the user only needs to align the mounting structure 2 with the top of the chassis structure 1, and rotate the handle 212 to drive the gear 206 to rotate, so that the handle 212 drives the torsion spring rod 205 to be gradually compressed. The rotation of the gear 206 will drive the two racks 207 to move relative to each other, so that the two clamping claws 209 gradually separate. Then, release the handle 212, and use the automatic elasticity of the torsion spring rod 205 to make the two clamping claws 209 gradually approach each other, so that the two clamping claws 209 make contact with the top of the chassis structure 1.
[0040] Since the inner side of the clamping claw 209 overlaps with the top of the chassis structure 1, a stable connection between the mounting structure 2 and the chassis structure 1 can be ensured.
[0041] When the computer is working, the heat from the main body 101 of the chassis is conducted to the heat sink 301 through the heat dissipation holes 102, so that the heat sink 301 transfers the heat to the condenser pipe 302. The heat heats the coolant in the condenser pipe 302, and then the heat of the coolant is transferred to the heat dissipation fins 303. Then, the exhaust fan 304 removes the heat from the heat dissipation fins 303, thus completing the heat dissipation of the computer.
[0042] In summary, this auxiliary heat dissipation structure for computers, through the installation structure 2, utilizes a torsion spring rod 205 to drive two racks 207 to move relative to each other via a gear 206. This allows the racks 207 to engage with the top of the chassis structure 1 via clamping claws 209, enabling the two combination mechanisms 202 at the bottom of the splicing frame 201 to quickly and adaptably combine the heat dissipation device 3 with the chassis structure 1. This allows the heat dissipation structure to be adapted to medium-sized chassis, thereby improving its applicability and ensuring its versatility and widespread use in different computer hosts.
[0043] It should be noted that the specific model and specifications of the heat dissipation device 3 in the computer auxiliary heat dissipation structure have been proposed in a computer auxiliary heat dissipation device with patent publication number CN221125203U. The specific selection and calculation method adopts the existing technology in this field, so it will not be described in detail here.
[0044] Furthermore, the power supply and principle of the heat dissipation device 3 in the auxiliary heat dissipation structure for computers are clear to those skilled in the art, and will not be described in detail here.
[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An auxiliary heat dissipation structure for computer, comprising a case structure (1), characterized in that: The top end of the case structure (1) is provided with a mounting structure (2), and the inner side of the mounting structure (2) is provided with a heat dissipation device (3); The mounting structure (2) comprises a splicing frame (201), the bottom end of the splicing frame (201) is fixedly provided with two combination mechanisms (202), the combination mechanism (202) comprises a bottom box (203), the top end of the bottom box (203) is movably clamped with a connecting cover (204), the inside of the bottom box (203) is rotatably connected with a gear (206) through a torsion spring rod (205), the top end of the gear (206) is fixedly provided with a handle (212), the handle (212) extends above the connecting cover (204), the outer side of the gear (206) is engaged with two racks (207), the bottom end of the rack (207) is fixedly provided with a clamping claw (209), and the inner side of the clamping claw (209) is overlapped with the top end of the case structure (1).
2. The computer heat dissipation auxiliary structure according to claim 1, wherein: The case structure (1) comprises a case main body (101), and the top end of the case main body (101) is provided with a heat dissipation hole (102).
3. The computer heat dissipation auxiliary structure of claim 1, wherein: The inner side of the splicing frame (201) is provided with a placing groove, and the heat dissipation device (3) is located in the placing groove.
4. The computer heat dissipation auxiliary structure of claim 1, wherein: The top end of the connecting cover (204) is fixedly provided with a connecting rod (211), and the connecting cover (204) is fixedly connected with the bottom end of the splicing frame (201) through the connecting rod (211).
5. The computer heat dissipation auxiliary structure of claim 1, wherein: The inner wall of the bottom box (203) is fixedly provided with two cross rods (208), and the outer side of the rack (207) is fixedly connected with a sliding sleeve, and the sliding sleeve is slidingly connected with the surface of the cross rod (208).
6. The computer heat dissipation auxiliary structure of claim 1, wherein: The bottom end of the bottom box (203) is provided with a sliding groove (210), and the clamping claw (209) extends below the bottom box (203) through the sliding groove (210).
7. The computer heat dissipation auxiliary structure of claim 1, wherein: The heat dissipation device (3) comprises a heat dissipation plate (301), the top end of the heat dissipation plate (301) is provided with a condenser pipe (302), the outer side of the condenser pipe (302) is provided with a heat dissipation fin (303), and the top end of the heat dissipation fin (303) is provided with an exhaust fan (304).
8. The computer heat dissipation auxiliary structure according to claim 7, wherein: The heat dissipation plate (301) is an aluminum plate, and the inside of the condenser pipe (302) is injected with cooling liquid.
Citation Information
Patent Citations
Computer auxiliary heat dissipation device
CN221125203U
Computer auxiliary heat dissipation device
CN222014704U