Active cable
By introducing connection modules and chips into active cables, the problem of insufficient transmission distance of active cables is solved, and efficient, low-cost, long-distance signal transmission is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-03-10
AI Technical Summary
Existing active cables have limited transmission distance when transmitting high-speed signals, making it difficult to meet the needs of longer-distance connections.
A connection module is introduced into the active cable. The connection module contains a chip that can compensate for signal loss and obtain power and control signals through the power supply circuit of the first or second device to achieve continuous compensated signal transmission.
It extends the signal transmission distance, improves signal integrity and stability, and reduces operating costs.
Smart Images
Figure CN223986786U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of communication technology, and in particular to an active cable. Background Technology
[0002] High-speed copper connections, compared to fiber optic connections, are becoming the preferred solution for data interconnection in short-distance transmission scenarios for artificial intelligence (AI) clusters due to their advantages of high cost-effectiveness, good stability, and low power consumption.
[0003] In the early days, high-speed copper connections generally referred to passive direct attach cables (DACs). As the required transmission rates increased, the losses in copper cables became too high to meet interconnection length requirements. To address this, chips were added inside the electrical modules at the ends of the copper cables. These chips compensated for some of the losses caused by the copper cable transmission, thus increasing the transmission distance. Cables with chips within their electrical modules are called active cables. Active cables can be categorized into ACC (active copper cable) and AEC (active electrical cable) based on the type of chip used. ACC electrical modules include repeater chips, while AEC electrical modules include retimer chips. Because AEC can retime and redrive signals, it has a stronger ability to compensate for copper cable losses, thus achieving the longest transmission distance.
[0004] However, with the further improvement of transmission speed, even with the longest transmission distance, AEC, after the transmission speed on a single link reaches 224Gbps+, the transmission distance can only reach 3 to 5 meters, which is difficult to cope with connection scenarios with longer transmission distances. Utility Model Content
[0005] This disclosure provides an active cable that can extend the signal transmission distance.
[0006] In a first aspect, this disclosure provides an active cable, which includes m cable segments, a first electrical module, a second electrical module, and (m-1) connection modules, where m is an integer greater than or equal to 2;
[0007] The m segments of cable are connected through the (m-1) connection modules. The first electrical module is located at the first end of the connected m segments of cable and is used for electrical connection with the first device. The second electrical module is located at the second end of the connected m segments of cable and is used for electrical connection with the second device.
[0008] The first electrical module, the second electrical module, and the connection module all include chips for loss compensation of the transmitted service signals.
[0009] In the scheme disclosed herein, the active cable not only includes a first electrical module and a second electrical module for connecting the equipment, but also includes at least one connecting module on the cable between the first electrical module and the second electrical module. Moreover, the connecting module includes a chip and can also compensate for the loss of the received service signal. Therefore, compared with using the first electrical module and the second electrical module to compensate for the loss of the transmitted service signal, this disclosure uses the first electrical module, the second electrical module and at least one connecting module to compensate for the loss of the transmitted service signal, which can extend the signal transmission distance.
[0010] In one possible implementation, the chip of the connection module is electrically connected to the power supply circuit of the first device through the first electrical module and a cable connecting the first electrical module and the connection module. The power supply circuit of the first device is used to supply electrical energy to the first electrical module and the connection module.
[0011] or,
[0012] The chip of the connection module is electrically connected to the power supply circuit of the second device through the second electrical module and the cable connecting the second electrical module and the connection module. The power supply circuit of the second device is used to supply power to the second electrical module and the connection module.
[0013] In the scheme disclosed herein, the connection module includes a chip, which requires electrical energy to operate. The electrical energy input to the connection module can come from the first device plugged into the first electrical module. The first device supplies electrical energy to the first electrical module to power the chip within the first electrical module, and also supplies electrical energy to the connection module through the first electrical module and the cable connecting the first and second electrical modules to power the chip within the connection module.
[0014] In the scheme shown in this disclosure, the power supply to the input connection module can also come from the second device plugged into the second electrical module. In this case, the second device supplies power to the second electrical module to power the chip inside the second electrical module, and supplies power to the connection module through the second electrical module and the cable connected between the second electrical module and the connection module to power the chip inside the connection module.
[0015] In one possible implementation, the first electrical module includes a power pin for electrical connection with the power supply circuit of the first device. The power pin of the first electrical module is electrically connected to the chip of the first electrical module and is also electrically connected to the chip of the connection module through a cable between the first electrical module and the connection module.
[0016] or,
[0017] The second electrical module includes a power pin for electrical connection with the power supply circuit of the second device. The power pin of the second electrical module is electrically connected to the chip of the second electrical module and is also electrically connected to the chip of the connection module through a cable between the second electrical module and the connection module.
[0018] In the scheme shown in this disclosure, the cable connecting the first electrical module and the connecting module can be electrically connected to the power supply pin of the first electrical module. In this way, after the first electrical module is inserted into the electrical interface of the first device, the power supply circuit of the first device supplies electrical energy to the first electrical module and the connecting module through the power supply pin of the first electrical module.
[0019] In the scheme shown in this disclosure, the cable connecting the second electrical module and the connecting module can be electrically connected to the power supply pin of the second electrical module. In this way, after the second electrical module is inserted into the electrical interface of the second device, the power supply circuit of the second device supplies electrical energy to the second electrical module and the connecting module through the power supply pin of the second electrical module.
[0020] In one possible implementation, the power supply pin of the first electrical module is electrically connected to the chip of the connection module through the outermost metal layer of the cable between the first electrical module and the connection module.
[0021] or,
[0022] The power supply pin of the second electrical module is electrically connected to the chip of the connection module through the outermost metal layer of the cable between the second electrical module and the connection module.
[0023] In the scheme disclosed herein, where the connection module obtains electrical energy from the first device, the outermost metal layer of the cable connecting the first electrical module and the connection module can be used to transmit electrical energy. Thus, the cable between the first electrical module and the connection module does not require additional wire cores for transmitting electrical energy; therefore, the cable between the first electrical module and the connection module is the same as the cable between the second electrical module and the connection module (e.g., having the same number of wire cores).
[0024] In the scheme disclosed herein, where the connecting module obtains electrical energy from the second device, the outermost metal layer of the cable connecting the second electrical module and the connecting module can be used to transmit electrical energy. Thus, the cable between the second electrical module and the connecting module does not require additional wire cores for transmitting electrical energy; therefore, the cable between the first electrical module and the connecting module is the same as the cable between the second electrical module and the connecting module (e.g., the same number of wire cores).
[0025] In one possible implementation, the power supply pin of the first electrical module is electrically connected to the chip of the connection module through the wire core of the cable between the first electrical module and the connection module.
[0026] or,
[0027] The power pin of the second electrical module is electrically connected to the chip of the connection module through the wire core of the cable between the second electrical module and the connection module.
[0028] In the schemes disclosed herein, where the connection module obtains power from the first device, a conductor inside the cable connecting the first electrical module and the connection module is used to transmit power. Similarly, in the schemes where the connection module obtains power from the second device, a conductor inside the cable connecting the second electrical module and the connection module is used to transmit power.
[0029] In one possible implementation, the chip of the connection module is electrically connected to the controller of the first device via the first electrical module and a cable connecting the first electrical module and the connection module. The controller of the first device is used to send control signals to the connection module.
[0030] or,
[0031] The chip of the connection module is electrically connected to the controller of the second device through the second electrical module and the cable connecting the second electrical module and the connection module. The controller of the second device is used to send control signals to the connection module.
[0032] In the scheme shown in this disclosure, the control signal used to control the operation of the chip of the connection module can come from the first device. Then, the controller of the first device sends a control signal to the first electrical module on the one hand, and sends a control signal to the connection module through the first electrical module and the cable connected between the first electrical module and the connection module on the other hand.
[0033] The control signals used to control the operation of the chip in the connection module can also come from the second device. In this case, the controller of the second device sends control signals to the second electrical module on the one hand, and sends control signals to the connection module through the second electrical module and the cable connecting the second electrical module and the connection module on the other hand.
[0034] In one possible implementation, the first electrical module includes a control pin for electrical connection to the controller of the first device, the control pin of the first electrical module being electrically connected to the chip of the first electrical module, and also electrically connected to the chip of the connection module via a cable between the first electrical module and the connection module;
[0035] or,
[0036] The second electrical module includes control pins for electrical connection to the controller of the second device. The control pins of the second electrical module are electrically connected to the chip of the second electrical module and are also electrically connected to the chip of the connection module via a cable between the second electrical module and the connection module.
[0037] In the schemes disclosed herein, where the control signal to the connection module originates from the first device, the control pin of the first electrical module transmits control signals to both the chip of the first electrical module and the chip of the connection module. In the scheme where the control signal to the connection module originates from the second device, the control pin of the second electrical module transmits control signals to both the chip of the second electrical module and the chip of the connection module.
[0038] In one possible implementation, the first electrical module includes a first control pin and a second control pin for electrical connection to the controller of the first device; the first control pin of the first electrical module is electrically connected to the chip of the first electrical module; the second control pin of the first electrical module is electrically connected to the chip of the connection module through a cable between the first electrical module and the connection module.
[0039] or,
[0040] The second electrical module includes a first control pin and a second control pin for electrical connection with the controller of the second device; the first control pin of the second electrical module is electrically connected to the chip of the second electrical module; the second control pin of the second electrical module is electrically connected to the chip of the connection module through a cable between the second electrical module and the connection module.
[0041] In the scheme disclosed herein, where the control signal to the connection module originates from the first device, the first control pin of the first electrical module transmits the control signal to the chip of the first electrical module, and the second control pin of the first electrical module transmits the control signal to the chip of the connection module. In the scheme where the control signal to the connection module originates from the second device, the first control pin of the second electrical module transmits the control signal to the chip of the second electrical module, and the second control pin of the second electrical module transmits the control signal to the chip of the connection module.
[0042] In one possible implementation, the chip of the connection module is electrically connected to the controller of the first device via the power pin of the first electrical module and a cable connecting the first electrical module and the connection module.
[0043] or,
[0044] The chip of the connection module is electrically connected to the controller of the second device through the power pin of the second electrical module and the cable connecting the second electrical module and the connection module.
[0045] In the scheme disclosed herein, where the first device supplies power to the connection module, the control signal sent to the connection module can also originate from the first device. Therefore, the control signal can be generated by modulating the supply voltage. For example, in the case of the first device supplying power to the connection module, the first device inputs a DC voltage to both the first electrical module and the connection module. When the first device needs to send a control signal to the connection module, it can modulate the DC voltage input to the connection module into a control signal and transmit it to the connection module. This scheme eliminates the need for an additional link for transmitting control signals to the connection module.
[0046] In the scheme disclosed herein, where the second device supplies power to the connection module, the control signal sent to the connection module can also originate from the second device. Therefore, the control signal can be generated by modulating the supply voltage. For example, in the case of the second device supplying power to the connection module, the second device inputs a DC voltage to both the second electrical module and the connection module. When the second device needs to send a control signal to the connection module, it can modulate the DC voltage input to the connection module into a control signal and transmit it to the connection module. This scheme eliminates the need for an additional link for transmitting control signals to the connection module.
[0047] In one possible implementation, the connection module includes an electrical connector module and an electrical interface module, wherein the electrical connector module includes a chip for loss compensation of the transmitted service signal;
[0048] The electrical connector module is inserted into the electrical interface module, and the electrical connector module and the electrical interface module are electrically connected. A cable is electrically connected to the side of the electrical connector module that is opposite to the electrical interface module, and another cable is electrically connected to the side of the electrical interface module that is opposite to the electrical connector module.
[0049] In the scheme shown in this disclosure, the connection module includes an electrical connector module and an electrical interface module, wherein the electrical connector module is similar to a first electrical module or a second electrical module, and the electrical interface module is similar to an electrical interface of a first device for inserting the first electrical module, or an electrical interface of a second device for inserting the second electrical module.
[0050] In one possible implementation, a heat dissipation structure is arranged on the outer surface of the top wall and / or the outer surface of the bottom wall of the electrical interface module. The heat dissipation structure extends into the electrical interface module to dissipate heat for the chip in the electrical connector module.
[0051] In the scheme shown in this disclosure, the outer surface of the top wall and / or the outer surface of the bottom wall of the electrical interface module are arranged in the heat dissipation structure, and the bottom of the heat dissipation structure extends into the electrical interface module. In this way, after the electrical connector module is inserted into the electrical interface module, the bottom of the heat dissipation structure contacts the electrical connector module, thereby dissipating heat for the chip inside the electrical connector module.
[0052] In one possible implementation, the chip is a retiming chip.
[0053] In the scheme disclosed herein, the chips of the first electrical module, the second electrical module, and the connection module can all be retiming chips. The retiming chip can use continuous-time linear equalization or judgment feedback equalization at the receiving end, clock and data recovery at the receiving end, and an equalizer at the transmitting end to compensate for channel loss, eliminate signal jitter, improve signal integrity, and thereby increase transmission distance.
[0054] In a second aspect, a communication system is provided, comprising a first device, a second device, and an active cable as described in the first aspect or any of the first aspects, wherein a first electrical module of the active cable is plugged into an electrical interface of the first device, and a second electrical module of the active cable is plugged into an electrical interface of the second device. Attached Figure Description
[0055] Figure 1 This is a schematic diagram of an active cable for connecting a first device and a second device, provided in an exemplary embodiment of this disclosure;
[0056] Figure 2 This is a schematic diagram of an active cable for connecting a first device and a second device, provided in another exemplary embodiment of this disclosure;
[0057] Figure 3 This is a schematic diagram of an active cable for connecting a first device and a second device, provided in another exemplary embodiment of this disclosure;
[0058] Figure 4 This is a schematic diagram of the connection between the first electrical module and the connection module provided in an exemplary embodiment of this disclosure;
[0059] Figure 5 This is a schematic diagram of the connection between the second electrical module and the connection module provided in an exemplary embodiment of this disclosure;
[0060] Figure 6 This is a schematic diagram of the connection between the first electrical module and the connection module provided in another exemplary embodiment of this disclosure;
[0061] Figure 7 This is a schematic diagram of the connection between the second electrical module and the connection module provided in another exemplary embodiment of this disclosure;
[0062] Figure 8 This is a schematic diagram showing the connection of a first device, a first electrical module, and a connection module provided in an exemplary embodiment of this disclosure;
[0063] Figure 9 This is a schematic diagram illustrating the connection of the second device, the second electrical module, and the connection module provided in an exemplary embodiment of this disclosure;
[0064] Figure 10 This is a schematic diagram showing the connection of the first device, the first electrical module, and the connection module provided in another exemplary embodiment of this disclosure;
[0065] Figure 11 This is a schematic diagram showing the connection of the second device, the second electrical module, and the connection module provided in another exemplary embodiment of this disclosure;
[0066] Figure 12 This is a schematic diagram showing the connection of the first device, the first electrical module, and the connection module provided in another exemplary embodiment of this disclosure;
[0067] Figure 13 This is a schematic diagram showing the connection of a second device, a second electrical module, and a connection module provided in another exemplary embodiment of this disclosure.
[0068] Explanation of reference numerals in the attached figures
[0069] 100. First device; 101. Controller of the first device; 102. Control pin of the first device; 103. First control pin of the first device; 104. Second control pin of the first device; 105. Power supply pin of the first device.
[0070] 200. Second device; 201. Controller of the second device; 202. Control pin of the second device; 203. First control pin of the second device; 204. Second control pin of the second device; 205. Power supply pin of the second device.
[0071] 21. First electrical module; 211. Power supply pin of the first electrical module; 212. Control pin of the first electrical module; 213. First control pin of the first electrical module; 214. Second control pin of the first electrical module.
[0072] 22. Second electrical module; 221. Power supply pin of the second electrical module; 222. Control pin of the second electrical module; 223. First control pin of the second electrical module; 224. Second control pin of the second electrical module.
[0073] 3. Connection module; 31. Electrical connector module; 32. Electrical interface module.
[0074] 311. Power supply pins of the electrical connector module; 312. Control pins of the electrical connector module.
[0075] 321. Power supply pins of the electrical interface module; 322. Control pins of the electrical interface module. Detailed Implementation
[0076] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.
[0077] This embodiment relates to an active cable, which structurally includes a cable and electrical modules connected to both ends of the cable. Since the core of the cable is generally copper, the active cable is also called an active copper cable. Since the electrical module includes a chip that requires power to operate, it is called an active cable.
[0078] Compared to active optical fibers, active cables do not contain lasers within their electrical modules, and their internal chips do not require photoelectric or electro-optical conversion. Therefore, active cables are less expensive than active optical fibers. Consequently, in data centers, especially those with large-scale AI models, using active cable interconnects can reduce operating costs compared to using active optical fibers. Furthermore, active cables offer low power consumption and high stability during signal transmission.
[0079] However, because signal loss is relatively high in active cables, active cables are limited to short-distance interconnection scenarios. For example, in scenarios where low-speed signals are transmitted (such as single transmission links not exceeding 112Gbps), the longest transmission distance of AEC can reach seven meters. However, in scenarios where high-speed signals are transmitted (such as single transmission links reaching 224Gbps), the transmission distance of AEC is only about four meters.
[0080] Therefore, this embodiment provides an active cable, which includes not only a first electrical module and a second electrical module connected to both ends of the cable, but also a connecting module connected between the two ends of the cable. Each of these modules includes a chip. When a signal is transmitted to each module, the transmitted service signal can be processed for loss compensation before transmission, thus further extending the transmission distance of the active cable.
[0081] The following section introduces solutions for active cables.
[0082] like Figure 1 The diagram shown is a structural schematic of an active cable. (Refer to...) Figure 1 As shown, the active cable includes m cable segments, a first electrical module 1, a second electrical module 2, and m-1 connecting modules 3, where m is an integer greater than or equal to 2. For example, Figure 1 In this case, m = 2. Of course, m can also be 3 or 4, etc. The attached diagram uses m = 2 as an example.
[0083] m segments of cable are connected by m-1 connecting modules 3 to form a single cable. One end of this cable is connected to the first electrical module 1, and the other end is connected to the second electrical module 2. Alternatively, the first segment, the second segment, ..., the m-th segment of cable are sequentially connected by connecting modules 3. For example, the first segment and the second segment are connected by one connecting module 3, the second segment and the third segment are connected by another connecting module 3, and the (m-1)-th segment is connected to the m-th segment by one connecting module 3. The end of the first segment is connected to the first electrical module 1, and the end of the m-th segment is connected to the second electrical module 2.
[0084] The first electrical module 1 is used for electrical connection with a device (denoted as first device 100), for example, the first electrical module 1 is plugged into the electrical interface of the first device 100. The second electrical module 2 is used for electrical connection with another device (denoted as second device 200), for example, the second electrical module 2 is plugged into the electrical interface of the second device 200. Thus, the first device 100 and the second device 200 are electrically connected via an active cable to transmit data.
[0085] The first electrical module 1, the second electrical module 2, and the connection module 3 all include chips, which can be either retimer chips or relay chips.
[0086] For example, if the chips in the first electrical module 1, the second electrical module 2, and the connection module 3 are all retimer chips, then the active cable is specifically an AEC. As another example, if some of the chips in the first electrical module 1, the second electrical module 2, and the connection module 3 are retimer chips, and others are redriver chips. Again, if all the chips in the first electrical module 1, the second electrical module 2, and the connection module 3 are redriver chips, then the active cable is specifically an ACC.
[0087] The Redriver chip compensates for losses and reduces the attenuation of service signals by using the CTLE at the receiver and the driver at the transmitter, thereby extending the transmission distance of service signals.
[0088] The Retimer chip can use continuous time linear equalizer (CTLE) or decision feedback equalizer (DFE) at the receiver, clock and data recovery (CDR) at the receiver, and equalizer (EQ) at the transmitter to compensate for channel loss, eliminate signal jitter, improve the integrity of service signals, and thus increase the transmission distance of service signals.
[0089] refer to Figure 1 As shown, taking the example of the first device 100 transmitting service signals to the second device 200, the chip of the first electrical module 21 compensates for the loss generated on the transmission link before the receiving end of the first electrical module 21, the chip of the connection module 3 compensates for the loss generated on the transmission link before the receiving end of the connection module 3, such as compensating for the loss generated on the first cable 41, and the chip of the second electrical module 22 compensates for the loss generated on the transmission link between the receiving ends of the second electrical module 22.
[0090] As can be seen, during signal transmission between the first device 100 and the second device 200, loss compensation is continuously performed by the chip within the module, thereby extending the transmission distance.
[0091] Features of the first electrical module 21 and the second electrical module 22. (See reference...) Figure 1 As shown, both the first electrical module 21 and the second electrical module 22 include electrical connectors. The panels of the first device 100 and the second device 200 have electrical interfaces. The electrical connector of the first electrical module 21 is inserted into the electrical interface of the first device 100 to realize the electrical connection between the first electrical module 21 and the first device 100. The electrical connector of the second electrical module 22 is inserted into the electrical interface of the second device 200 to realize the electrical connection between the second electrical module 22 and the second device 200.
[0092] refer to Figure 1 As shown, both the first electrical module 21 and the second electrical module 22 structurally include a circuit board, a chip located on the circuit board, and a package shell. The chip is located on the circuit board, which has a circuit pattern. One end of the circuit board has a row of gold fingers, forming an electrical connector that extends out of the package shell. The electrical connector is internally connected to the chip on the circuit board through the circuit pattern on the circuit board, and is externally used to connect to the electrical interface on the device.
[0093] Continue to refer to Figure 1As shown, the end of the first cable 41 is soldered to the surface of the circuit board of the first electrical module 21, and the first cable 41 is electrically connected to the chip on the circuit board through the circuit pattern on the circuit board. The end of the second cable 42 is soldered to the surface of the circuit board of the second electrical module 22, and the second cable 42 is electrically connected to the chip on the circuit board through the circuit pattern on the circuit board.
[0094] The chips in the first electrical module 21 and the second electrical module 22 require power and control signals during operation. Therefore, the chip in the first electrical module 21 obtains power and control signals from the plugged-in first device 100, and performs signal loss compensation processing based on the control signals sent by the first device 100. Similarly, the chip in the second electrical module 22 obtains power and control signals from the plugged-in second device 200, and performs signal loss compensation processing based on the control signals sent by the second device 200.
[0095] For example, refer to Figure 1 As shown, the first electrical module 21 includes power pins among its row of gold fingers. These power pins are electrically connected to the chip on the circuit board via traces. The electrical interface of the first device 100 also includes power pins, which are electrically connected to the power supply circuit of the first device 100. Thus, after the first electrical module 21 is inserted into the electrical interface of the first device 100, the power pins of the first electrical module 21 are electrically connected to the power pins within the electrical interface of the first device 100, thereby allowing the chip of the first electrical module 21 to obtain power from the power supply circuit of the first device 100.
[0096] Continue to refer to Figure 1 As shown, the first electrical module 21 also includes control pins in a row of gold fingers. These control pins are electrically connected to the chip on the circuit board via traces. The electrical interface of the first device 100 includes control pins. After the first electrical module 21 is inserted into the electrical interface of the first device 100, the control pins of the first electrical module 21 are electrically connected to the control pins of the first device 100. The control pins of the first device 100 are electrically connected to the controller of the first device 100. Thus, the controller of the first device 100 can send control signals to the chip of the first electrical module 21.
[0097] Similarly, the second electrical module 22 also includes power pins and control pins in its row of gold fingers. The power pins in the electrical interface of the second electrical module 22 are electrically connected to the power supply circuit of the second device 200, and the control pins in the electrical interface of the second electrical module 22 are electrically connected to the controller 201 of the second device 200. Thus, after the second electrical module 22 is inserted into the electrical interface of the second device 200, the power pins of the second electrical module 22 are electrically connected to the power pins in the electrical interface of the second device 200, and the control pins of the second electrical module 22 are electrically connected to the control pins in the electrical interface of the second device 200. Therefore, the second electrical module 22 obtains power and control signals from the inserted second device 200.
[0098] Regarding the features of connection module 3, such as... Figure 2 The diagram shown is a structural schematic of an active cable. (Refer to...) Figure 2 As shown, the connection module 3 may include a circuit board and a chip, as well as a package housing (…). Figure 2 (Not shown, only the circuit board and chip are shown). The chip is located on the circuit board, which has a printed circuit pattern. (Refer to...) Figure 2 As shown, the end of the first cable 41 furthest from the first electrical module 21 is soldered to the circuit board of the connecting module 3, and is electrically connected to the chip on the circuit board through the circuit pattern on the circuit board. Similarly, the end of the second cable 42 furthest from the second electrical module 22 is soldered to the circuit board of the connecting module 3, and is electrically connected to the chip on the circuit board through the circuit pattern on the circuit board.
[0099] In another example, such as Figure 3 The diagram shown is another structural schematic of an active cable. (Refer to...) Figure 3 As shown, the connection module 3 includes an electrical connector module 31 and an electrical interface module 32. The electrical connector module 31 includes a circuit board and a chip. The chip is located on the circuit board, which has circuit patterns. The ends of the circuit board have gold fingers. The electrical interface module 32 has gold fingers. The electrical connector module 31 is inserted into the electrical interface module 32, enabling the gold fingers of the electrical connector module 31 to connect with the gold fingers of the electrical interface module 32.
[0100] Continue to refer to Figure 3 As shown, a cable is electrically connected to the side of the electrical connector module 31 that is opposite to the electrical interface module 32, and a cable is also electrically connected to the side of the electrical interface module 32 that is opposite to the electrical connector module 31. After the electrical connector module 31 and the electrical interface module 32 are plugged in, the cable connected to the electrical connector module 31 is electrically connected to the cable connected to the electrical interface module 32.
[0101] For example, refer to Figure 3As shown, one end of the first cable 41 is connected to the first electrical module 21, and the other end is connected to the electrical connector module 31 of the connection module 3. One end of the second cable 42 is connected to the second electrical module 22, and the other end is connected to the electrical interface module 32 of the connection module 3.
[0102] In this circuit, the cable connected to the electrical connector module 31 and the chip of the electrical connector module 31 are electrically connected through circuit patterns on the circuit board of the electrical connector module 31. Similarly, the gold fingers of the electrical connector module 31 and the chip of the electrical connector module 31 are also electrically connected through circuit patterns on the circuit board of the electrical connector module 31. Likewise, the gold fingers of the electrical interface module 32 and the cable connected to the electrical interface module 32 are electrically connected through circuit patterns on the circuit board of the electrical interface module 32.
[0103] Connection module 3 is as follows Figure 2 The diagram shows a cable with electrical connections at both ends, containing a chip internally. It is still as shown. Figure 3 The diagram shows an electrical connector module 31 and an electrical interface module 32, which are pluggable and detachable. This embodiment does not limit this configuration. Figure 3 The example of connection module 3 is shown below.
[0104] The chip in connection module 3 also requires power and input control signals. The power can come from the first device 100 or the second device 200. Similarly, the control signals can come from the controller of the first device 100 or the controller of the second device 200.
[0105] like Figure 4 and Figure 6 The diagram shows how the chip in connection module 3 obtains power from the first device 100 plugged into the first electrical module 21 through the first electrical module 21. Figure 5 and Figure 7 The diagram shows the chip of the connection module 3 obtaining power from the second device 200 plugged into the second electrical module 22 through the second electrical module 22.
[0106] In one example, the power supply to the connection module 3 comes from the first device 100. A chip on the circuit board of the electrical connector module 31 is electrically connected to the power pin of the first electrical module 21 via a cable connected to the electrical connector module 31. (Reference) Figure 4As shown, the power supply pin 211 of the first electrical module 21 is not only electrically connected to the chip on the circuit board through the circuit pattern on the circuit board, but also electrically connected to the chip of the electrical connector module 31 of the connecting module 3 through the first cable 41. In this way, the power supply circuit in the first device 100 inputs electrical energy to the first electrical module 21 on the one hand, and also inputs electrical energy to the electrical connector module 31 of the connecting module 3 on the other hand, so as to enable the chip of the first electrical module 21 and the chip of the electrical connector module 31 to work.
[0107] Electrical energy can be transmitted through the grounding layer of the cable or through the core of the cable.
[0108] In one example, a cable typically includes wire cores, metal layers, and insulation layers in its structure. For instance, a cable may include multiple wire cores, each wire core is wrapped with a metal layer as a grounding layer, and all wire cores are also wrapped with another metal layer, which is also grounded and used to shield external signals; this is also called a shielding layer.
[0109] refer to Figure 4 As shown, if the cable is a differential cable, one wire core consists of two wires. One wire receives a positive voltage, and the other receives a negative voltage. The positive and negative voltages transmit one signal, also known as a differential signal. If the cable is a single-ended cable, one wire core consists of only one wire, and this single wire transmits one signal; this signal is also called a single-ended signal. (Reference) Figure 4 As shown, the cable is a differential cable. Each line core includes two wires. Each line core is wrapped with a metal layer (called the outermost metal layer) for grounding, also known as the grounding layer. All line cores are also surrounded by another metal layer, which is also grounded.
[0110] So, reference Figure 4 As shown, the power supply pin 211 of the first electrical module 21 is electrically connected to the chip of the first electrical module 21 and the outermost metal layer of the first cable 41 through the traces on the circuit board of the first electrical module 21. The outermost metal layer of the first cable 41 is also electrically connected to the chip on the electrical connector module 31 of the connection module 3. For example, the outermost metal layer of the first cable 41 is soldered to the circuit board of the electrical connector module 31 and is electrically connected to the chip on the circuit board through the traces on the circuit board.
[0111] refer to Figure 6 As shown, a new cable is added to the first cable segment 41. This cable core is used to transmit electrical energy. Then, the power pin 211 of the first electrical module 21 is electrically connected to the chip of the first electrical module 21 and the cable core of the first cable segment 41, respectively. This cable core of the first cable segment 41 is also electrically connected to the chip on the electrical connector module 31.
[0112] Specifically, the first cable 41 is a differential cable. The electrical energy transmitted between the power pin 211 of the first electrical module 21 and the chip of the electrical connector module 31 can be transmitted through one of the wires in the cable or through two wires in the cable.
[0113] In another example, the power supply for connection module 3 comes from the second device 200. Therefore, the power pin of electrical interface module 32 is electrically connected to the power pin of the second electrical module 22 via a cable connected to electrical interface module 32 (denoted as the second cable 42). (See reference) Figure 5 As shown, the power pin 221 of the second electrical module 22 is electrically connected to the chip on the circuit board through the traces on the circuit board, and is also electrically connected to the power pin 321 of the electrical interface module 32 through the outermost metal layer of the second cable 42. The power pin 311 of the electrical connector module 31 is electrically connected to the chip of the electrical connector module 31. Thus, after the electrical connector module 31 is plugged into the electrical interface module 32, the electrical energy output by the power supply circuit of the second device 200 is transmitted to the chip of the second electrical module 22 on the one hand, and to the chip of the electrical connector module 31 on the other hand through the outermost metal layer of the second cable 42 and the electrical interface module 32.
[0114] refer to Figure 7 As shown, the power pin 221 of the second electrical module 22 is electrically connected to the chip on the circuit board through a trace on the circuit board, and is also electrically connected to the power pin 321 of the electrical interface module 32 through a new trace on the second cable 42. The power pin 311 of the electrical connector module 31 is electrically connected to the chip of the electrical connector module 31. Thus, after the electrical connector module 31 is plugged into the electrical interface module 32, the electrical energy input by the second device 200 is transmitted to the chip of the second electrical module 22, and is also transmitted to the chip of the electrical connector module 31 through a trace on the second cable 42 and the electrical interface module 32.
[0115] The above describes the scheme for the chip of connection module 3 to obtain power from the first device and the second device respectively. The following describes the scheme for the chip of connection module 3 to obtain control signals from the first device and the second device respectively.
[0116] like Figure 8 and Figure 10 The diagram shown illustrates how the chip in connection module 3 obtains control signals from the first device 100. Figure 9 and Figure 11 The diagram shows the chip of connection module 3 obtaining control signals from the second device 200.
[0117] In one example, connection module 3 receives control signals from first device 100. Then, refer to... Figure 8As shown, the controller 101 of the first device 100 is electrically connected to the control pin 102 in the electrical interface of the first device 100, and the control pin 212 of the first electrical module 21 is electrically connected to the chip on the electrical connector module 31 of the connection module 3 through the first cable 41.
[0118] The control signal transmitted to the connection module 3 can be transmitted through the outermost metal layer of the first cable 41 or through one core of the first cable 41. The attached figure shows an example of transmission through the outermost metal layer of the first cable 41.
[0119] In one example, the chip of connection module 3 and the chip of the first electrical module 21 can obtain control signals from the same control pin of the first device 100. Therefore, referring to... Figure 8 As shown, the control pin 212 of the first electrical module 21 is connected to the chip of the first electrical module 21 on one hand, and to the chip of the connection module 3 through the first cable 41 on the other hand.
[0120] Figure 8 In the illustrated scheme, the control information corresponding to the chip of the first electrical module 21 or the control information corresponding to the chip of the connection module 3 can be distinguished by the different number of bits in the control signal. For example, the control pin 102 of the first device 100 sends an 8-bit control signal to the control pin 212 of the first electrical module 21. After receiving the control signal, the chip of the first electrical module 21 reads the first 4 bits of the control signal, and after receiving the control signal, the chip of the connection module 3 reads the last 4 bits of the control signal.
[0121] In another example, the chip of connection module 3 and the chip of the first electrical module 21 can obtain control signals from different control pins of the first device 100. Then, referring to... Figure 10 As shown, the electrical interface of the first device 100 includes a first control pin 103 and a second control pin 104, both of which are electrically connected to the controller 101 of the first device 100. The first electrical module 21 includes a first control pin 213 and a second control pin 214. The first control pin 213 of the first electrical module 21 is electrically connected to the chip of the first electrical module 21, and the second control pin 214 of the first electrical module 21 is electrically connected to the chip of the connecting module through a first cable 41.
[0122] Therefore, after the first electrical module 21 is plugged into the electrical interface of the first device 100, the controller 101 of the first device 100 can send control signals to the chip of the first electrical module 21, and can also send control signals to the chip of the connection module 3.
[0123] In another example, connection module 3 receives control signals from second device 200. Then, refer to... Figure 9 As shown, the controller 201 of the second device 200 is electrically connected to the control pin 202 in the electrical interface of the second device 200. The control pin 222 of the second electrical module 22 is electrically connected to the control pin 322 of the electrical interface module 32 through the second cable 42. The control pin 312 of the electrical connector module 31 is electrically connected to the chip on the electrical connector module 31.
[0124] The control signal transmitted to the connection module 3 can be transmitted through the outermost metal layer of the second cable 42 or through one core of the second cable 42. The attached figure shows an example of transmission through the outermost metal layer of the second cable 42.
[0125] In one example, the chip of connection module 3 and the chip of the second electrical module 22 can obtain control signals from the same control pin of the second device 200. Therefore, referring to... Figure 9 As shown, the control pin 222 of the second electrical module 22 is connected to the chip of the second electrical module 22 on one hand, and to the chip of the connection module 3 through the second cable 42 on the other hand.
[0126] Figure 9 In the illustrated scheme, the control information corresponding to the chip of the second electrical module 22 and the control information corresponding to the chip of the connection module 3 can be distinguished by the different number of bits in the control signal. For example, the control pin 202 of the second device 200 sends an 8-bit control signal to the control pin 222 of the second electrical module 22. After receiving the control signal, the chip of the second electrical module 22 reads the first 4 bits of the control signal, and after receiving the control signal, the chip of the connection module 3 reads the last 4 bits of the control signal.
[0127] In another example, the chip of connection module 3 and the chip of the second electrical module 22 can obtain control signals from different control pins of the second device 200. Therefore, referring to... Figure 11 As shown, the electrical interface of the second device 200 includes a first control pin 203 and a second control pin 204, both of which are electrically connected to the controller 201 of the second device 200. The second electrical module 22 includes a first control pin 223 and a second control pin 224. The first control pin 223 of the second electrical module 22 is electrically connected to the chip of the second electrical module 22, and the second control pin 224 of the second electrical module 22 is electrically connected to the control pin 322 of the electrical interface module 32 via the second cable 42. The control pin 312 of the electrical connector module 31 is electrically connected to the chip on the electrical connector module 31.
[0128] Therefore, after the second electrical module 2 is plugged into the second device 200 and the electrical connector module 31 is plugged into the electrical interface module 32, the controller 201 of the second device 200 can send control signals to the chip of the second electrical module 22 and also send control signals to the chip of the connection module 3.
[0129] It should be pointed out that, Figures 4 to 11 In the diagrams, the cables are shown as cross-sectional views, which are used to distinguish whether the outermost metal layer of the cable transmits electrical energy or control signals, or whether one of the cable's cores transmits electrical energy or control signals.
[0130] It should be noted that the control signal used to control the connection module 3 is not continuously sent. Instead, the device sends an updated control signal to the connection module 3 when the control signal changes. Therefore, the control signal sent to the connection module 3 can be modulated onto the power transmitted to the connection module 3. For example, when it is necessary to send a control signal to the connection module 3, it is only necessary to modulate the amplitude of the transmitted power supply voltage.
[0131] For example, in a scheme where the power for connection module 3 comes from the first device 100, you can refer to... Figure 12 As shown, the controller 101 of the first device 100 is electrically connected to the power pin 105 in the electrical interface of the first device 100. After the first electrical module 21 is plugged into the electrical interface of the first device 100, the power pin 105 in the electrical interface of the first device 100 is electrically connected to the power pin 211 of the first electrical module 21. In this way, on the one hand, the first device 100 supplies power to the first electrical module 21 and the connection module 3 so that the chip of the first electrical module 21 and the chip of the connection module 3 can work. On the other hand, when it is necessary to send a control signal to the connection module 3, the controller 101 of the first device 100 modulates the DC power supply voltage into a pulse signal carrying control information. This pulse signal is transmitted to the chip of the connection module 3 via the first electrical module 21 and the first cable 41.
[0132] For example, in a solution where the power for connection module 3 comes from the second device 200, you can refer to... Figure 13As shown, the controller 201 of the second device 200 is electrically connected to the power pin 205 in the electrical interface of the second device 200. After the second electrical module 22 is plugged into the electrical interface of the second device 200, the power pin 205 in the electrical interface of the second device 200 is electrically connected to the power pin 221 of the second electrical module 22. In this way, on the one hand, the second device 200 supplies power to the second electrical module 22 and the connection module 3 to enable the chips of the second electrical module 22 and the connection module 3 to work. On the other hand, when it is necessary to send a control signal to the connection module 3, the controller 201 of the second device 200 modulates the DC power supply voltage into a pulse signal carrying control information. This pulse signal is transmitted to the chip of the connection module 3 via the second electrical module 22 and the second cable 42.
[0133] In one example, the chip of the connection module 3 generates heat during operation. A heat dissipation structure can be used to dissipate heat from the chip of the connection module 3. Accordingly, a heat dissipation structure can be arranged on the outer surface of the top wall and / or the outer surface of the bottom wall of the electrical interface module 32 of the connection module 3. The heat dissipation structure can also extend into the electrical interface module 32. After the electrical connector module 31 is inserted into the electrical interface module 32, the electrical connector module 31 can contact the heat dissipation structure extending into the electrical interface module 32, thereby the heat dissipation structure absorbs the heat of the electrical connector module 31.
[0134] In one example, the package of connection module 3 can be a Small Form-factor Pluggable (SFP) for transmission rates of 10G and below, or it can be an upgraded version of SFP, SFP+, with transmission rates of 6G to 16G, a more compact size, and lower cost. Alternatively, the package of connection module 3 can be a Quad Small Form-factor Pluggable (QSFP) for transmission rates of 40G or 50G. Alternatively, the package can be an upgraded version of QSFP, QSFP+. Alternatively, the package can be a Double Density Quad Small Form-factor Pluggable (QSFP-DD). Alternatively, the package of connection module 3 can be an Octal Small Form-factor Pluggable (OSFP). This embodiment does not limit the package type of connection module 3.
[0135] In this embodiment of the disclosure, at least one additional connection module is added between the two ends of the active cable. The connection module includes a chip that can compensate for signal loss when received. Therefore, compared with an active cable that only includes a first electrical module and a second electrical module, the active cable of this embodiment can extend the signal transmission distance.
[0136] This embodiment also provides a communication system, see reference. Figure 1 As shown, the communication system includes a first device 100, a second device 200, and the active cable described above. The first electrical module 21 of the active cable is plugged into the electrical interface of the first device 100, and the second electrical module 22 of the active cable is plugged into the electrical interface of the second device 200.
[0137] The terminology used in the embodiments of this disclosure is for illustrative purposes only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar words used in this disclosure and the claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "an" or "a" and similar words do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including" and similar words mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. "A plurality" means two or more, unless otherwise expressly defined.
[0138] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this disclosure should be included within the protection scope of this disclosure.
Claims
1. An active cable, characterized by The active cable comprises m cable segments, a first electrical module (21), a second electrical module (22), and (m-1) connecting modules (3), m being an integer greater than or equal to 2; The m cable segments are connected through the (m-1) connecting modules (3), the first electrical module (21) is located at a first end of the connected m cable segments and is used for electrical connection with a first device (100), and the second electrical module (22) is located at a second end of the connected m cable segments and is used for electrical connection with a second device (200); The first electrical module (21), the second electrical module (22), and the connecting module (3) each comprise a chip used for loss compensation of a service signal transmitted.
2. The active cable of claim 1, wherein, The chip of the connecting module (3) is electrically connected with a power supply circuit of the first device (100) through the first electrical module (21) and a cable connected between the first electrical module (21) and the connecting module (3), and the power supply circuit of the first device (100) is used for delivering electric energy to the first electrical module (21) and the connecting module (3). Alternatively, The chip of the connecting module (3) is electrically connected with a power supply circuit of the second device (200) through the second electrical module (22) and a cable connected between the second electrical module (22) and the connecting module (3), and the power supply circuit of the second device (200) is used for delivering electric energy to the second electrical module (22) and the connecting module (3).
3. The active cable of claim 2, wherein, The first electrical module (21) comprises a power supply pin used for electrical connection with the power supply circuit of the first device (100), the power supply pin (211) of the first electrical module (21) is electrically connected with the chip of the first electrical module (21) and is further electrically connected with the chip of the connecting module (3) through the cable between the first electrical module (21) and the connecting module (3). Alternatively, The second electrical module (22) comprises a power supply pin (221) used for electrical connection with the power supply circuit of the second device (200), the power supply pin of the second electrical module (22) is electrically connected with the chip of the second electrical module (22) and is further electrically connected with the chip of the connecting module (3) through the cable between the second electrical module (22) and the connecting module (3).
4. The active cable of claim 3, wherein, The power supply pin of the first electrical module (21) is electrically connected with the chip of the connecting module (3) through a metal layer of an outermost layer of the cable between the first electrical module (21) and the connecting module (3). Alternatively, The power supply pin of the second electrical module (22) is electrically connected with the chip of the connecting module (3) through a metal layer of an outermost layer of the cable between the second electrical module (22) and the connecting module (3).
5. The active cable of claim 3, wherein, The power supply pin of the first electrical module (21) is electrically connected with the chip of the connecting module (3) through a core of the cable between the first electrical module (21) and the connecting module (3). Alternatively, The power supply pin of the second electric module (22) is electrically connected with the chip of the connection module (3) through the core of the cable between the second electric module (22) and the connection module (3).
6. The active cable of claim 1, wherein, The chip of the connection module (3) is electrically connected with the controller of the first device (100) through the first electric module (21) and the cable connected between the first electric module (21) and the connection module (3), and the controller of the first device (100) is used for sending a control signal to the connection module (3); Or, The chip of the connection module (3) is electrically connected with the controller of the second device (200) through the second electric module (22) and the cable connected between the second electric module (22) and the connection module (3), and the controller of the second device (200) is used for sending a control signal to the connection module (3).
7. The active cable of claim 6, wherein, The first electric module (21) comprises a control pin (212) for being electrically connected with the controller of the first device (100), the control pin (212) of the first electric module (21) is electrically connected with the chip of the first electric module (21), and is also electrically connected with the chip of the connection module (3) through the cable between the first electric module (21) and the connection module (3); Or, The second electric module (22) comprises a control pin for being electrically connected with the controller of the second device (200), the control pin of the second electric module (22) is electrically connected with the chip of the second electric module (22), and is also electrically connected with the chip of the connection module (3) through the cable between the second electric module (22) and the connection module (3).
8. The active cable of claim 6, wherein, The first electric module (21) comprises a first control pin and a second control pin for being electrically connected with the controller of the first device (100); the first control pin of the first electric module (21) is electrically connected with the chip of the first electric module (21); and the second control pin of the first electric module (21) is electrically connected with the chip of the connection module (3) through the cable between the first electric module (21) and the connection module (3); Or, The second electric module (22) comprises a first control pin and a second control pin for being electrically connected with the controller of the second device (200); the first control pin of the second electric module (22) is electrically connected with the chip of the second electric module (22); and the second control pin of the second electric module (22) is electrically connected with the chip of the connection module (3) through the cable between the second electric module (22) and the connection module (3).
9. The active cable of claim 6, wherein, The chip of the connection module (3) is electrically connected with the controller of the first device (100) through the power supply pin of the first electric module (21) and the cable connected between the first electric module (21) and the connection module (3); Or, The chip of the connection module (3) is electrically connected with the controller of the second device (200) through the power supply pin of the second electric module (22) and the cable connected between the second electric module (22) and the connection module (3).
10. The active cable of claim 1, wherein, The connection module (3) comprises an electric connector module (31) and an electric interface module (32), the electric connector module (31) comprises a chip for loss compensation of the transmitted service signal; The electric connector module (31) is inserted into the electric interface module (32), and the electric connector module (31) and the electric interface module (32) are electrically connected, one side of the electric connector module (31) opposite to the electric interface module (32) is electrically connected with a cable, and the other side of the electric interface module (32) opposite to the electric connector module (31) is electrically connected with another cable.
11. The active cable of claim 10, wherein, A heat dissipation structure is arranged on the top wall outer surface and / or the bottom wall outer surface of the electric interface module (32), the heat dissipation structure extends into the electric interface module (32) and is used for heat dissipation of the chip in the electric connector module (31).
12. Active cable according to any of claims 1 to 11, characterized in that The chip is a re-timing chip.