Novel plate heat exchange heat dissipation system of chip burning test cabinet

Abstract

The utility model relates to a novel plate heat exchange heat dissipation system of a chip burning test cabinet, and aims to solve the problems that the conventional similar chip burning test equipment directly enters a water drainage heat exchanger through a factory service water cooling source, so that aluminum water corrosion and water drainage leakage are easily caused, the normal use of the chip burning test equipment is influenced, and the environmental protection effect is poor. The key points are that a plate heat exchanger primary side liquid outlet valve and a plate heat exchanger primary side liquid inlet valve at a primary side circulation system of the novel plate heat exchanger heat dissipation system are in heat exchange connection with one side of the plate heat exchanger, and a plate heat exchanger secondary side liquid outlet valve and a plate heat exchanger secondary side liquid inlet valve at a secondary side circulation system of the novel plate heat exchanger heat dissipation system are in heat exchange connection with the other side of the plate heat exchanger; the primary side circulation system and the secondary side circulation system are two independent circulation systems, the primary side circulation system is provided with factory water, and the secondary side circulation system is provided with a test cabinet; circulation of the secondary side circulation system is completed through power provided by a pump, and a plate heat exchanger is a brazed plate heat exchanger or a copper coil pipe heat exchanger.

Description

Technical Field

[0001] This utility model relates to a heat dissipation device for a chip programming and testing cabinet, which is a novel board heat exchange system for a chip programming and testing cabinet. Background Technology

[0002] Heat dissipation devices refer to devices used in mechanical equipment, metal cabinets, circuit boards, and other equipment components to quickly dissipate heat, thereby ensuring the normal operation of the equipment components. These include components such as cooling fans, heat sinks, cooling towers, condensate pipes, and heat spreaders. Nowadays, chips are closely related to people's lives and hold an important position. With the continuous development of integrated circuit technology, electronic products are becoming increasingly smaller; however, in order to have powerful computing capabilities, chips are experiencing increasingly higher power densities and generating more heat. Chip programming equipment is a device specifically used to write program code or data into integrated circuits (ICs). It uses programming algorithms to write binary data into the internal memory of the target device, realizing the programming operation of the IC's internal memory. One example of such chip programming equipment is the chip programming test cabinet disclosed in Chinese patent literature, application number 202410365748.5, publication date 2024.07.05, invention title "A Chip Programming Test Equipment Air-Liquid Hybrid Heat Dissipation Rack".

[0003] Furthermore, to improve the efficiency of chip programming and testing, existing technologies employ simultaneous programming and testing of multiple chip groups. This results in the entire chip programming and testing equipment generating tens or even hundreds of thousands of watts of heat. Current technologies utilize traditional air-cooling systems for heat dissipation, which are not only excessively noisy but also, especially in summer when room temperature rises, increase the intake air temperature, failing to meet the overall cooling requirements of the equipment. This leads to overheating of the chips, affecting the programming and testing process. Additionally, because traditional air-cooling systems are open-loop external circulation systems, heat is directly exhausted from the equipment to the outside, necessitating the addition of an exhaust system to prevent the exhausted heat from directly causing overheating.

[0004] Meanwhile, most sites can only provide industrial wastewater as their cooling source. This wastewater, due to the combined effects of dissolved oxygen, chloride ions, pH changes, bicarbonate ions, microorganisms, and sulfate ions, can corrode aluminum. If this wastewater is used directly as a cooling source into the aluminum water heater of the chip programming and testing equipment, the aluminum water heater will corrode over time, causing leaks and affecting the normal operation of the equipment. Replacing the aluminum water heater with a copper one would be too heavy and too expensive, making it unsuitable for large-scale deployment. Summary of the Invention

[0005] To overcome the above-mentioned shortcomings, the purpose of this utility model is to provide a novel board heat exchanger system for chip programming and testing cabinets, thereby solving the technical problems of existing similar chip programming and testing equipment products that easily cause aluminum corrosion and water leakage when the factory water cooling source directly enters its water drain heat exchanger, affecting the normal use of the chip programming and testing equipment and resulting in poor environmental performance. This objective is achieved through the following technical solution.

[0006] A novel heat exchanger system for a chip programming test cabinet includes a primary circulation system and a secondary circulation system, which exchange heat through the heat exchanger. The key structural design feature is that the primary side outlet valve and primary side inlet valve of the primary circulation system are connected to one side of the heat exchanger for heat exchange, while the secondary side outlet valve and secondary side inlet valve of the secondary circulation system are connected to the other side of the heat exchanger for heat exchange. The primary and secondary circulation systems are two independent circulation systems, each connected to a heat exchanger on a different side. In the secondary circulation system between the heat exchanger and the test cabinet, a low-temperature working fluid A enters the test cabinet and exits as a high-temperature working fluid A after heat exchange with the water outlet of the test cabinet. In the secondary circulation system between the heat exchanger and the plant water, low-temperature plant water enters the heat exchanger and exchanges heat with the high-temperature working fluid A, becoming high-temperature plant water. That is, the low-temperature working fluid A from the heat exchanger enters the test cabinet to provide a cold source for the test cabinet. After heat exchange with the water drain in the test cabinet, the low-temperature working fluid A becomes high-temperature working fluid A, which is the secondary side circulation system. The circulation of the secondary side circulation system is completed by the power provided by the pump. The low-temperature plant water enters the heat exchanger and becomes high-temperature plant water after heat exchange with the high-temperature working fluid A in the heat exchanger. This is the primary side circulation system.

[0007] The primary circulation system includes a plate heat exchanger, plant water, a primary inlet valve for the plate heat exchanger, a primary outlet valve for the plate heat exchanger, a flow rate, pressure, and temperature monitoring meter for the plant water outlet, and a flow rate, pressure, and temperature monitoring meter for the plant water return. The flow rate, temperature, and temperature monitoring meter for the plant water outlet and return are used to monitor the flow rate, inlet and outlet temperatures, and inlet and outlet pressures of the plant water. The primary inlet valve and primary outlet valve for the plate heat exchanger are used to control the required flow rate of plant water for the heat exchange required on the primary side.

[0008] The secondary-side circulation system includes a test cabinet, a pump, a plate heat exchanger, a first inlet valve, a second inlet valve, a first outlet valve, a second outlet valve, a secondary-side inlet valve, a secondary-side outlet valve, an inlet flow rate, pressure, and temperature monitoring meter, and an outlet flow rate, pressure, and temperature monitoring meter. The inlet flow rate, pressure, and temperature monitoring meter and the outlet flow rate, pressure, and temperature monitoring meter are used to monitor the flow rate of working fluid A, the temperature of working fluid A entering and exiting the system, and the pressure of working fluid A entering and exiting the system. The first inlet valve, the second inlet valve, the first outlet valve, the second outlet valve, the secondary-side inlet valve, and the secondary-side outlet valve are used to control the flow rate of working fluid A required for heat exchange on the secondary side.

[0009] The working fluid of the primary circulation system is plant water, and the working fluid of the secondary circulation system is working fluid A, which does not corrode aluminum.

[0010] The plate heat exchanger is a brazed plate heat exchanger. The plate heat exchanger is provided with alternating superimposed and sealed base plates and cover plates. The inlet and outlet channels arranged symmetrically on both sides of the base plates and cover plates are connected in sequence. The working fluid tank in the base plate is provided with capillary channels that are evenly distributed.

[0011] The plate heat exchanger is a copper coil heat exchanger. The plate heat exchanger has an alternatingly stacked and sealed base plate and a cover plate. The inlet and outlet channels on both sides of the base plate and the cover plate are symmetrically arranged and connected in sequence. The tube grooves in the base plate are respectively provided with copper coils that are integrally formed and filled with working fluid; or the cavity of the base plate is respectively provided with fin modules and the cavity of the base plate is filled with working fluid.

[0012] This utility model has a reasonable structural design, which facilitates the programming and testing of standardized multi-combination chips, avoids the risk of aluminum corrosion caused by factory water, reduces costs and improves efficiency, is flexible and convenient, and is suitable for mass promotion; it is suitable as a new type of board heat exchanger cooling system for chip programming and testing cabinets, and for further improvement of similar products. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the working principle of this utility model.

[0014] Figure 2 This is a schematic diagram of the structure of the first embodiment of the plate heat exchanger of this utility model.

[0015] Figure 3 This is a schematic diagram of the second embodiment of the plate heat exchanger of this utility model.

[0016] Attached Figures and Their Names: 1-1 Test Cabinet, 1-2 Pump, 1-3 Plate Heater, 1-4 Plant Water, 1-5 Test Cabinet First Inlet Valve, 1-6 Test Cabinet Second Inlet Valve, 1-7 Test Cabinet First Outlet Valve, 1-8 Test Cabinet Second Outlet Valve, 1-9 Plate Heater Secondary Side Outlet Valve, 1-10 Plate Heater Primary Side Outlet Valve, 1-11 Plate Heater Secondary Side Inlet Valve, 1-12 Plate Heater Primary Side Inlet Valve, 1-13 Test Cabinet Inlet Flow, Pressure and Temperature Monitor, 1-14 Test Cabinet Outlet Flow, Pressure and Temperature Monitor, 1-15 Plant Water Return Flow, Pressure and Temperature Monitor, 1-16 Outlet Flow, Pressure and Temperature Monitor. Implementation

[0017] The structure and use of this utility model will now be further described with reference to the accompanying drawings. Figure 1 As shown, this novel plate heat exchanger system includes a primary circulation system and a secondary circulation system, which exchange heat through plate heat exchanger 1-3. The primary and secondary circulation systems are two independent systems, connected to plate heat exchanger 1-3 on opposite sides. In the secondary circulation system between plate heat exchanger 1-3 and test cabinet 1-1, the low-temperature working fluid A enters test cabinet 1-1 and becomes high-temperature working fluid A after heat exchange through the water drain in test cabinet 1-1. In the secondary circulation system between plate heat exchanger 1-3 and plant water 1-4, low-temperature plant water enters plate heat exchanger 1-3 and becomes high-temperature plant water after heat exchange with high-temperature working fluid A. The working fluid in the primary circulation system is plant water 1-4, and the working fluid in the secondary circulation system is working fluid A, which does not corrode aluminum.

[0018] Furthermore, the aforementioned primary-side circulation system includes plate heat exchanger 1-3, plant water 1-4, plate heat exchanger primary-side inlet valve 1-12, plate heat exchanger primary-side outlet valve 1-10, plant water outlet flow rate, pressure, and temperature monitoring meter 1-16, and plant water return flow rate, pressure, and temperature monitoring meter 1-15. The plant water outlet flow rate, pressure, and temperature monitoring meter 1-16 and the plant water return flow rate, pressure, and temperature monitoring meter 1-15 are used to monitor the flow rate of the plant water, the inlet and outlet temperatures of the plant water, and the inlet and outlet pressures of the plant water. The plate heat exchanger primary-side inlet valve 1-12 and the plate heat exchanger primary-side outlet valve 1-10 are used to control the required flow rate of plant water for the heat exchange required on the primary side.

[0019] Furthermore, the aforementioned secondary-side circulation system includes a test cabinet 1-1, a pump 1-2, a plate heat exchanger 1-3, a first inlet valve 1-5 for the test cabinet, a second inlet valve 1-6 for the test cabinet, a first outlet valve 1-7 for the test cabinet, a second outlet valve 1-8 for the test cabinet, a secondary-side inlet valve for the plate heat exchanger, a secondary-side outlet valve 1-9 for the plate heat exchanger, an inlet flow rate, pressure, and temperature monitoring meter 1-13 for the test cabinet, and an outlet flow rate, pressure, and temperature monitoring meter 1-14 for the test cabinet. The inlet flow rate, pressure, and temperature monitoring meter 1-13 and the outlet flow rate, pressure, and temperature monitoring meter 1-14 are used to monitor the flow rate of working fluid A, the temperature of working fluid A entering and exiting the system, and the pressure of working fluid A entering and exiting the system. The first inlet valve 1-5, the second inlet valve 1-6, the first outlet valve 1-7, the second outlet valve 1-8, the secondary-side inlet valve 1-11, and the secondary-side outlet valve 1-9 for the test cabinet are used to control the flow rate of the working fluid A required for heat exchange on the secondary side.

[0020] like Figure 2 As shown, the above-mentioned plate heat exchangers 1-3 are brazed plate heat exchangers. The plate heat exchangers are provided with alternatingly stacked and sealed base plates and cover plates. The inlet and outlet channels arranged symmetrically on both sides of the base plates and cover plates are connected in sequence. The working fluid tanks in the base plates are provided with capillary channels that are evenly distributed.

[0021] like Figure 3 As shown, the plate heat exchangers 1-3 are copper coil heat exchangers. The plate heat exchangers are provided with alternatingly stacked and sealed base plates and cover plates. The inlet and outlet channels arranged symmetrically on both sides of the base plates and cover plates are connected in sequence. The tube grooves in the base plates are provided with integrally formed copper coils filled with working fluid; or the cavity of the base plates is provided with fin modules and the cavity of the base plates is filled with working fluid.

[0022] This novel plate heat exchanger system features two independent circulation systems (a primary circulation system and a secondary circulation system) that exchange heat through the plate heat exchanger to cool the test cabinet. The low-temperature working fluid A from the plate heat exchanger enters the test cabinet to provide a cooling source. After heat exchange with the water outlet of the test cabinet, the low-temperature working fluid A becomes high-temperature working fluid A, forming the secondary circulation system. The circulation of the secondary circulation system is powered by a pump. Low-temperature plant water enters the plate heat exchanger, where it exchanges heat with the high-temperature working fluid A to become high-temperature plant water, forming the primary circulation system.

[0023] In summary, this novel heat exchanger system effectively combines a primary circulation system and a secondary circulation system to exchange heat within the heat exchanger, thereby cooling the test cabinet. It not only meets the demand for greater heat dissipation but also allows for automated and precise control of chip programming and testing temperatures. Furthermore, it standardizes the programming and testing of multiple chip combinations. The effective combination of the primary and secondary circulation systems also avoids the risk of aluminum corrosion caused by molten aluminum discharge from the plant, resulting in cost reduction, efficiency improvement, flexibility, and convenience, making it suitable for large-scale deployment.

Claims

1. A novel plate heat exchanger cooling system of a chip burning test cabinet, the novel plate heat exchanger cooling system comprising a primary side circulation system and a secondary side circulation system, the primary side circulation system and the secondary side circulation system exchanging heat through a plate heat exchanger (1-3); characterized in that The plate exchanger primary side outflow valve (1-10) and the plate exchanger primary side inflow valve (1-12) of the primary side circulation system are connected with the plate exchanger (1-3) for heat exchange, and the plate exchanger secondary side outflow valve (1-9) and the plate exchanger secondary side inflow valve (1-11) of the secondary side circulation system are connected with the plate exchanger (1-3) for heat exchange.

2. The new board exchange heat dissipation system of the chip burning test cabinet according to claim 1, characterized in that The primary side circulation system comprises the plate exchanger (1-3), the plant water (1-4), the plate exchanger primary side inflow valve (1-12), the plate exchanger primary side outflow valve (1-10), the plant water outflow flow rate pressure temperature monitoring meter (1-16) and the plant water inflow flow rate pressure temperature monitoring meter (1-15).

3. The new board exchange heat dissipation system of the chip burning test cabinet according to claim 1, characterized in that The secondary side circulation system comprises the test cabinet (1-1), the pump (1-2), the plate exchanger (1-3), the test cabinet first inflow valve (1-5), the test cabinet second inflow valve (1-6), the test cabinet first outflow valve (1-7), the test cabinet second outflow valve (1-8), the plate exchanger secondary side inflow valve (1-11), the plate exchanger secondary side outflow valve (1-9), the test cabinet inflow flow rate pressure temperature monitoring meter (1-13) and the test cabinet outflow flow rate pressure temperature monitoring meter (1-14).

4. The new board exchange heat dissipation system of the chip burning test cabinet according to claim 1, characterized in that The working medium of the primary side circulation system is the plant water (1-4), and the working medium of the secondary side circulation system is the working medium A which does not have a corrosion effect on aluminum.

5. The new board exchange heat dissipation system of the chip burning test cabinet according to claim 1, characterized in that The plate exchanger (1-3) is a brazed plate heat exchanger, and the plate exchanger is internally provided with alternately and sealingly arranged base plates and cover plates.

6. The new board exchange heat dissipation system of the chip burning test cabinet according to claim 1, characterized in that The plate exchanger (1-3) is a copper disc tube heat exchanger, and the plate exchanger is internally provided with alternately and sealingly arranged base plates and cover plates. The plate exchanger (1-3) is a copper disc tube heat exchanger, and the plate exchanger is internally provided with alternately and sealingly arranged base plates and cover plates.

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