Liquid cooling device and electronic equipment

Abstract

The utility model discloses a liquid cooling device and electronic equipment, and relates to the technical field of servers, the liquid cooling device comprises a box shell and a box cover, the box shell is internally provided with a liquid cooling flow channel formed by at least two liquid cooling plates at intervals in sequence, the liquid cooling device further comprises an adjusting assembly comprising an adjusting part and a movable part, the adjusting piece is arranged on the box cover and located at the top of the liquid cooling flow channel, the adjusting piece comprises an adjusting part, and the movable piece is connected with the box cover and the adjusting part; the movable part has an extending state in which the movable part is unfolded and drives the adjusting part to move towards the bottom of the liquid cooling flow channel and a restoring state in which the movable part is contracted and restored and drives the adjusting part to return to the top of the liquid cooling flow channel; the cleaning assembly is arranged in the box shell, at least part of the cleaning assembly makes contact with the outer surface of the adjusting piece, and the cleaning assembly is movably arranged in the width direction of the adjusting piece so as to scrape impurities on the surface of the adjusting piece. The technical problem that the heat dissipation efficiency is low due to the fact that the micro-channel heat dissipation structure of the liquid cooling box of the server cannot be dynamically changed along with the working load in the prior art is solved.

Description

Technical Field

[0001] This application relates to the field of server technology, and more particularly to a liquid cooling device and electronic equipment. Background Technology

[0002] Currently, with the rapid development of information technology, server performance is constantly improving, and the power density of its internal chips is also increasing. Under high-power operation, chips generate a large amount of heat. If this heat cannot be dissipated effectively and in a timely manner, it will lead to excessively high chip temperatures, affecting the stability and reliability of the server, and may even cause chip damage. Microchannel liquid cooling technology, as a highly efficient heat dissipation method, has been widely used in the field of server heat dissipation.

[0003] However, while traditional microchannel heat dissipation structures in existing technologies can meet heat dissipation requirements to a certain extent, the cross-sectional area and channel layout of their microchannels are usually fixed. In actual server operation, however, the heat generated by the chip dynamically changes with the workload. When the chip is under high load, the heat generation increases dramatically, and the fixed microchannel cross-sectional area may not be able to provide sufficient coolant flow, resulting in low heat dissipation efficiency and excessively high chip temperature. Conversely, when the chip is under low load, the coolant flow is too large, not only wasting energy but also potentially increasing system operating costs. Utility Model Content

[0004] This application provides a liquid cooling device and electronic device to at least solve the technical problem in the related art that the microchannel heat dissipation structure of the server liquid cooling box cannot be dynamically changed with the workload, resulting in low heat dissipation efficiency.

[0005] This application provides a liquid cooling device, including a housing and a cover. The housing has a liquid cooling channel formed by at least two liquid cooling plates spaced apart in sequence. The liquid cooling device further includes: an adjustment assembly, including an adjustment member and a movable member. The adjustment member is disposed on the cover and located at the top of the liquid cooling channel. The adjustment member includes an adjustment portion. The movable member is located between the cover and the adjustment member and is connected to the cover and the adjustment portion respectively. The movable member has an extended state and a returned state. When the movable member is in the extended state, at least a portion of the movable member unfolds and drives the adjustment portion to move towards the bottom of the liquid cooling channel. When the movable member is in the returned state, at least a portion of the movable member retracts and returns to its original position, and the adjustment portion returns to the top of the liquid cooling channel. A cleaning assembly is disposed inside the housing. At least a portion of the cleaning assembly contacts the outer surface of the adjustment member and is movably disposed along the width direction of the adjustment member for scraping off impurities from the surface of the adjustment member.

[0006] Furthermore, the adjustment assembly also includes: a control element disposed on the inner wall of the cover and connected to the movable element for controlling the movable element to switch between an extended state and a restored state; and a first temperature sensor disposed on the inner wall of the housing or on the liquid cooling plate for detecting the real-time temperature within the liquid cooling channel.

[0007] Furthermore, the control element is a heating element for heating the moving part; and / or, the moving part is made of shape memory alloy; and / or, the moving part is in the form of a curved sheet.

[0008] Furthermore, the adjusting component also includes two connecting parts, which are U-shaped. The two connecting parts are respectively connected to the two ends of the adjusting part and are movably connected to the inner wall of the lid. The adjusting component is made of elastic material.

[0009] Furthermore, the adjustment assembly also includes: two limiting blocks, which are respectively connected to the two connecting parts; a limiting groove is provided on the inner wall of the cover; at least a portion of the two connecting parts are respectively embedded in the limiting groove and are movably arranged along the extending direction of the limiting groove.

[0010] Furthermore, the cleaning assembly includes: a scraping structure disposed within the housing, the scraping structure including a scraper movably disposed in a direction approaching or away from the adjusting member, the shape of the scraper being adapted to the shape of the adjusting member in its restored state; and a drive structure including a drive component and a transmission component, the drive component being disposed on the housing cover, the transmission component being disposed within the housing and connected to the drive component, and the transmission component being connected to the scraping structure so that the drive structure drives the scraper to move along the width direction of the adjusting member.

[0011] Furthermore, the transmission component includes: two sliders, which are respectively connected to both ends of the scraping structure, and the sliders are provided with internal threaded holes; two lead screws, which are respectively inserted into the internal threaded holes of the two sliders, and the two ends of the lead screws are respectively rotatably connected to two opposite inner sidewalls of the housing; and a driving component is connected to the lead screws to drive the lead screws to rotate, so that the sliders drive the scraping structure to move.

[0012] Furthermore, the driving component includes: a first driving member, with a first mounting groove provided on the cover, the first driving member being disposed within the first mounting groove; a driving wheel, with a second mounting groove provided on the cover, the driving wheel being rotatably disposed within the second mounting groove and at least partially extending out of the second mounting groove; a rotating rod, with a third mounting groove provided on the cover, the rotating rod being disposed within the third mounting groove and at least a portion of the rotating rod passing through the driving wheel, one end of the rotating rod being connected to the output end of the first driving member; and a driven wheel provided on the lead screw, the driven wheel being connected to the driving wheel in a cooperative manner.

[0013] Furthermore, the scraping structure also includes: a mounting plate, the two ends of which are respectively connected to two sliders, and a fourth mounting groove is provided on the mounting plate; a second driving member, which is disposed in the fourth mounting groove, and the output end of the second driving member is connected to the scraper to drive the scraper to move in a direction closer to or away from the adjusting member.

[0014] Furthermore, the liquid cooling device also includes: a filter assembly, including a filter frame, mounting grooves respectively provided on the top surface of the housing and the liquid cooling plate, a positioning side protruding from its peripheral wall on the top of the filter frame, the positioning side being connected to the mounting groove in a cooperative manner, at least a portion of the filter frame being located within the liquid cooling channel, a cleaning component being located within the filter frame for receiving impurities falling from the adjusting component, and a plurality of filter holes being provided at intervals on the filter frame.

[0015] This application also provides an electronic device including the liquid cooling device mentioned above.

[0016] This application allows the movable parts in the adjustment component to extend and retract under different operating environments, dynamically adjusting the position of the adjustment section, i.e., adjusting the cross-sectional area of ​​the liquid cooling channel. This adjustment mechanism can optimize the flow rate of the coolant based on the real-time heat generation of the chip, thereby ensuring heat dissipation efficiency while avoiding resource waste caused by overcooling, improving energy utilization, and reducing server operating costs.

[0017] Furthermore, regularly cleaning the surface of the adjustment components by cleaning the components not only effectively prevents the decrease in thermal conductivity caused by impurity accumulation, but also avoids microchannel blockage, ensuring the smooth flow of liquid cooling channels. This is crucial for maintaining long-term, efficient heat dissipation and helps extend the lifespan of the server and its internal components. The ability to dynamically adjust the cross-sectional area of ​​the liquid cooling channels, combined with effective impurity removal methods, ensures the stability and reliability of the liquid cooling system. Even when the server is operating under high load, it maintains good heat dissipation performance, reducing the risk of system failures and downtime caused by insufficient heat dissipation. This also solves the technical problem in related technologies where the microchannel heat dissipation structure of server liquid cooling boxes cannot dynamically change with the workload, resulting in low heat dissipation efficiency. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 An exploded view of a liquid cooling device provided in an embodiment of this application;

[0020] Figure 2A cross-sectional view of a liquid cooling device provided in an embodiment of this application;

[0021] Figure 3 A cross-sectional view of the cover of a liquid cooling device provided in an embodiment of this application;

[0022] Figure 4 A partial enlarged view of a liquid cooling device provided in an embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the scraping structure of a liquid cooling device provided in an embodiment of this application;

[0024] Figure 6 This is a schematic diagram of the structure of the housing of a liquid cooling device provided in an embodiment of this application;

[0025] Figure 7 A partial cross-sectional view of the housing of a liquid cooling device provided in an embodiment of this application;

[0026] Figure 8 This is a schematic diagram of the structure of the cover of a liquid cooling device provided in an embodiment of this application.

[0027] The above figures include the following reference numerals:

[0028] 1. Housing shell; 2. Housing cover; 3. Liquid cooling plate; 4. Liquid cooling channel; 5. Limiting groove; 6. Mounting groove;

[0029] 10. Adjustment assembly; 11. Adjustment component; 110. Adjustment part; 111. Connecting part; 12. Moving part; 13. Control component; 14. Limit block;

[0030] 20. Cleaning components;

[0031] 21. Scraping structure; 210. Scraper; 211. Mounting plate; 212. Second drive component;

[0032] 22. Drive structure; 23. Drive component; 230. First drive element; 231. Drive wheel; 232. Rotating rod; 24. Transmission component; 240. Slider; 241. Lead screw; 242. Driven wheel;

[0033] 30. Filter assembly; 31. Filter frame; 32. Positioning side; 33. Filter hole;

[0034] 40. Inlet pipe; 41. First solenoid valve; 42. Second solenoid valve; 43. Third solenoid valve; 44. Drain pipe; 45. Liquid pump; 46. Heat exchanger; 47. Outlet pipe. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0036] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] To address the technical problem that the microchannel heat dissipation structure of server liquid cooling boxes cannot be dynamically changed according to the workload, resulting in low heat dissipation efficiency, this application provides a liquid cooling device and electronic equipment.

[0039] Please refer to Figures 1 to 8As shown, this application provides a liquid cooling device, including a housing 1 and a cover 2. The housing 1 has a liquid cooling channel 4 formed by at least two liquid cooling plates 3 spaced apart in sequence. The liquid cooling device further includes an adjustment assembly 10, including an adjustment member 11 and a movable member 12. The adjustment member 11 is disposed on the cover 2 and located at the top of the liquid cooling channel 4. The adjustment member 11 includes an adjustment part 110. The movable member 12 is located between the cover 2 and the adjustment member 11 and is connected to the cover 2 and the adjustment part 110 respectively. The movable member 12 has an extended state and a restored state. In the extended state, at least a portion of the movable member 12 unfolds and drives the adjustment part 110 to move towards the bottom of the liquid cooling channel 4; when the movable member 12 is in the restored state, at least a portion of the movable member 12 retracts and restores, and the adjustment part 110 returns to the top of the liquid cooling channel 4; the cleaning component 20 is disposed inside the housing 1, at least a portion of the cleaning component 20 contacts the outer surface of the adjustment member 11 and is movably disposed along the width direction of the adjustment member 11 to scrape off impurities from the surface of the adjustment member 11.

[0040] Through this application, the movable part 12 in the adjustment component 10 can extend and retract under different working environments, dynamically adjusting the position of the adjustment part 110, that is, adjusting the cross-sectional area of ​​the liquid cooling channel 4. This adjustment mechanism can optimize the flow rate of the coolant according to the real-time heat generation of the chip, thereby ensuring heat dissipation efficiency while avoiding resource waste caused by over-cooling, improving energy utilization, and reducing server operating costs.

[0041] Furthermore, by periodically removing impurities from the surface of the regulating component 11 through the cleaning component 20, not only is the decrease in thermal conductivity due to impurity accumulation effectively prevented, but microchannel blockage is also avoided, ensuring the unobstructed flow of the liquid cooling channel 4. This is crucial for maintaining long-term, efficient heat dissipation and helps extend the lifespan of the server and its internal components. The ability to dynamically adjust the cross-sectional area of ​​the liquid cooling channel 4, combined with effective impurity removal methods, ensures the stability and reliability of the liquid cooling system. Even under high server load, it maintains good heat dissipation, reducing the risk of system failures and downtime caused by insufficient heat dissipation. This solves the technical problem in related technologies where the microchannel heat dissipation structure of the server liquid cooling box cannot dynamically change with the workload, resulting in low heat dissipation efficiency.

[0042] In this embodiment, the adjustment component 10 further includes a control element 13 and a first temperature sensor. The control element 13 is disposed on the inner wall of the cover 2 and connected to the movable element 12 to control the movable element 12 to switch between an extended state and a restored state. The first temperature sensor is disposed on the inner wall of the housing 1 or on the liquid cooling plate 3 to detect the real-time temperature in the liquid cooling channel 4.

[0043] By using the first temperature sensor, the liquid cooling system can monitor temperature changes within the liquid cooling channel 4 in real time, providing immediate data support for dynamic adjustment. This real-time monitoring capability ensures that the system can react quickly according to actual needs, avoiding problems such as low heat dissipation efficiency or overcooling caused by temperature monitoring delays.

[0044] Furthermore, the combined use of the control unit 13 and the first temperature sensor enables automated thermal management. Based on feedback information from the first temperature sensor, the control unit 13 automatically controls the extension and retraction of the movable part 12 without manual intervention, greatly improving the intelligence level and management efficiency of server operation.

[0045] It is evident that the adjustment component 10 integrating the control unit 13 and the first temperature sensor not only improves the intelligent control and automation level of the liquid cooling device, but also effectively enhances the heat dissipation efficiency, stability and reliability of the system. At the same time, it has a significant positive effect on energy saving, emission reduction and extending the service life of the device, making it an ideal intelligent control solution for server liquid cooling.

[0046] In this embodiment, the control element 13 is a heating element used to heat the movable element 12; the movable element 12 is made of shape memory alloy.

[0047] Shape memory alloys can undergo reversible shape changes at specific temperatures. By precisely heating the moving part 12 with a heating element, the moving part 12 can be quickly switched between an extended state and a restored state. This characteristic enables the liquid cooling system to intelligently adjust the cross-sectional area of ​​the liquid cooling channel 4 based on the real-time temperature feedback from the first temperature sensor, thereby achieving efficient management of the coolant flow rate.

[0048] Compared to traditional mechanical or hydraulic adjustment methods, the shape memory alloy-based adjustment component 10 has a simpler structure, a more direct control process, and reduces complex transmission mechanisms, thereby lowering the system's size, weight, and energy consumption. The use of a heating element also eliminates the need for an additional drive unit, further simplifying the control system and reducing maintenance costs.

[0049] In this embodiment, the movable component 12 is in the shape of a curved sheet.

[0050] The curved, sheet-like design of the moving part 12, combined with the characteristics of shape memory alloy, ensures that the moving part 12 maintains good deformation capacity and recovery performance during long-term thermal cycling, avoiding the problems of frequent maintenance and shortened equipment life caused by metal fatigue or deformation failure.

[0051] Specifically, the adjusting member 11 also includes two connecting parts 111. The adjusting part 110 is U-shaped, and the two connecting parts 111 are respectively connected to the two ends of the adjusting part 110. The two connecting parts 111 are respectively movably connected to the inner wall of the box cover 2. The adjusting member 11 is made of elastic material.

[0052] In this embodiment, the adjusting element 11 is made of nickel-titanium alloy.

[0053] The U-shaped adjusting part 110, combined with the movable connecting part 111, allows the adjusting part 11 to extend and retract freely in the vertical direction. Based on the deformation of the movable part 12, the adjusting part 110 can move precisely up and down, changing the cross-sectional area of ​​the liquid cooling channel 4 and achieving dynamic control of the coolant flow rate. This structural design ensures the flexibility and accuracy of the adjusting action.

[0054] Furthermore, the adjusting member 11, made of nickel-titanium alloy, can absorb and disperse stress during the expansion and contraction adjustment process, avoiding the structural fatigue and fracture risk that may occur in the rigid adjusting member 11 during frequent expansion and contraction, thereby enhancing the structural stability and durability of the adjusting assembly 10.

[0055] In this embodiment, the adjustment component 10 further includes two limiting blocks 14, which are respectively connected to two connecting parts 111. A limiting groove 5 is provided on the inner wall of the cover 2. At least a portion of the two connecting parts 111 is respectively embedded in the limiting groove 5 and is movably arranged along the extending direction of the limiting groove 5. The limiting blocks 14 are dovetail-shaped.

[0056] By using the limiting block 14 in conjunction with the limiting groove 5, the movement range of the adjusting component 11 can be precisely limited, preventing excessive offset of the adjusting part 110 during extension and retraction, ensuring the accuracy of the adjustment action and the controllability of the liquid cooling channel 4 cross-sectional area adjustment. Furthermore, the limiting groove 5 provides guidance and constraint for the movement of the adjusting component 11, reducing swaying and offset during movement, enhancing the overall structural stability of the adjusting assembly 10, and preventing adjustment failure or system malfunction due to unstable movement. This not only achieves precise control of the movement of the adjusting component 11 and enhances the stability of the assembly, but also simplifies the installation and maintenance process and improves the safety and operating efficiency of the liquid cooling system.

[0057] In this application, the temperature at various points in the liquid cooling channel 4 is detected by a first temperature sensor. When the liquid cooling channel 4 needs to be narrowed, the heating element heats the shape memory alloy and causes it to elongate, causing the adjusting part 110 of the adjusting element 11 to extend downwards, thus narrowing the liquid cooling channel 4. When the adjusting part 110 of the adjusting element 11 is at its highest position, both ends of the adjusting element 11 are abutted by the inner wall of the limiting groove 5, achieving positioning and limiting. When installing the adjusting element 11, the limiting block 14 is forcefully inserted into the limiting groove 5 for assembly. When the liquid cooling channel 4 needs to be restored, the heating element is turned off, the shape memory alloy cools and recovers, the shape memory alloy shortens, and the adjusting part 110 of the elastic adjusting element 11 also returns to its original highest height.

[0058] The narrowness of the liquid cooling channel 4 can be controlled according to the heating temperature, and the specific heating temperature can be set according to the actual situation.

[0059] In this embodiment, two adjusting components 11 are provided in one liquid cooling channel 4. The adjusting components 11 of two adjacent liquid cooling channels 4 are staggered to avoid aggregation and ensure the uniformity of liquid cooling effect. Each adjusting component 11 corresponds to a filter frame 31 below it.

[0060] In this application, the liquid cooling device is mounted above the server electronic components via mounting lugs, support plates, or other auxiliary tools, with the bottom surface of the liquid cooling device contacting the top surface of the electronic components. The housing 1 and the cover 2 of the liquid cooling device are locked together by a fixing assembly. The fixing assembly includes a fixing screw and a fixing nut. The fixing screw is fixed to the side wall of the housing 1, and the cover 2 has a clearance hole for the fixing screw to pass through. The fixing nut is screwed onto the fixing screw and tightened, pressing against the outer wall of the cover 2 to lock the housing 1 and the cover 2.

[0061] In this embodiment, one side of the housing 1 is provided with an inlet and an outlet that are connected to both ends of the liquid cooling channel 4. The inlet is connected to the inlet pipe 40, and the outlet is connected to the outlet pipe 47. A circulation pipe is provided between the inlet pipe 40 and the outlet pipe 47. A liquid pump 45 and a small heat exchanger 46 are provided on the circulation pipe. A drain pipe 44 is provided between the heat exchanger 46 and the inlet pipe 40. A first solenoid valve 41 is provided on the inlet pipe 40, a second solenoid valve 42 is provided on the circulation pipe, and a third solenoid valve 43 is provided on the drain pipe 44. When the coolant is first introduced, the first solenoid valve 41 is open and the second solenoid valve 42 and the third solenoid valve 43 are closed. When the liquid pump 45 draws the coolant from the inlet pipe 40 to the circulation pipe, the first solenoid valve 41 is closed, the second solenoid valve 42 is open, and the third solenoid valve 43 is closed, keeping the circulating coolant circulating in the liquid cooling channel 4. When the coolant needs to be discharged, the first solenoid valve 41 and the second solenoid valve 42 are open, the third solenoid valve 43 is closed, and the coolant is discharged from the drain pipe 44.

[0062] In this embodiment, the liquid cooling plate 3 is detachably connected to the housing 1. Mounting grooves are provided on the top surfaces of both ends of the housing 1 along its length. Positioning blocks are provided at both ends of the liquid cooling plate 3. The mounting grooves allow the liquid cooling plate 3 and the positioning blocks to be inserted. The top surface of the liquid cooling plate 3 is tightly fitted against the inner top wall of the housing cover 2. When the housing cover 2 is placed on the housing 1, the housing cover 2 presses against the liquid cooling plate 3, thus fixing the liquid cooling plate 3 in place.

[0063] Since server coolants are mostly water-based or oil-based, when they come into contact with metal, scale (calcium carbonate, calcium sulfate, etc.), corrosion products (iron oxide, copper oxide), oil stains (from coolant decomposition or external introduction) and other impurities easily adhere to the metal surface. In order to avoid scale buildup affecting the deformation ability of the elastic adjustment component 11, it is necessary to clean the impurities on the surface of the elastic adjustment component 11 regularly. However, it is not convenient to always remove the elastic adjustment component 11 from the liquid cooling unit during normal server operation. Therefore, the elastic adjustment component 11 is first physically cleaned inside the liquid cooling unit by scraping off the impurities on the surface of the elastic adjustment component 11 and collecting the scraped impurities through the filter component 30 to prevent the scraped impurities from flowing with the coolant. Then, when the server unit is disassembled later, the elastic adjustment component 11 is deeply cleaned with a chemical cleaning agent.

[0064] In this embodiment, the cleaning component 20 includes a scraping structure 21 and a driving structure 22. The scraping structure 21 is disposed inside the housing 1 and includes a scraper 210 movably disposed in a direction close to or away from the adjusting member 11. The shape of the scraper 210 is adapted to the shape of the adjusting member 11 when it is in the restored state. The driving structure 22 includes a driving component 23 and a transmission component 24. The driving component 23 is disposed on the housing cover 2, and the transmission component 24 is disposed inside the housing 1 and connected to the driving component 23. The transmission component 24 is connected to the scraping structure 21 so that the driving structure 22 drives the scraper 210 to move along the width direction of the adjusting member 11.

[0065] The shape of the scraper 210 matches the shape of the adjusting member 11 in its restored state, ensuring that during the cleaning process, the scraper 210 can closely conform to the surface of the adjusting member 11, effectively scraping away impurities and dirt attached to it, thus improving cleaning efficiency and quality. This precise shape matching is the key to ensuring cleaning results.

[0066] The drive component 23 in the drive structure 22 is mounted on the cover 2, while the transmission component 24 is connected to the drive component 23 inside the housing 1 and ultimately connects to the scraping structure 21. This structural design enables the cleaning process to be automated without manual intervention, reducing maintenance costs and labor requirements, while also minimizing server downtime caused by cleaning operations. Furthermore, the connection between the transmission component 24 and the drive component 23 ensures that the movement of the drive component 23 is precisely transmitted to the scraper 210, driving the scraper 210 to move along the width direction of the adjusting member 11. This effectively avoids deviations in the position of the scraper 210 during the cleaning process, ensuring the uniformity and integrity of the cleaning coverage area.

[0067] By combining the deformation of the moving part 12 controlled by the heating element and the feedback from the first temperature sensor, the start-up and operation of the cleaning component 20 can be controlled by the intelligent management system. For example, the cleaning program can be started at a specific temperature threshold, ensuring the effective integration of cleaning and maintenance with temperature management of the liquid cooling system, and improving the overall operating efficiency and intelligence level.

[0068] In this embodiment, the transmission component 24 includes two sliders 240 and two lead screws 241. The two sliders 240 are respectively connected to both ends of the scraping structure 21, and the sliders 240 are provided with internal threaded holes. The two lead screws 241 are respectively inserted into the internal threaded holes of the two sliders 240. The two ends of the lead screws 241 are respectively rotatably connected to two opposite inner sidewalls of the housing 1. The driving component 23 is connected to the lead screws 241 to drive the lead screws 241 to rotate, so that the sliders 240 drive the scraping structure 21 to move.

[0069] The threaded connection mechanism between the lead screw 241 and the slider 240 converts rotational motion into linear motion, enabling the scraper 210 to perform precise linear reciprocating motion along the width direction of the adjusting member 11. This precise control is crucial for scraping away dirt and impurities from the surface of the adjusting member 11, ensuring uniformity and thoroughness of the cleaning coverage area.

[0070] The lead screw 241 is rotatably connected to the inner wall of the housing 1 at both ends. This not only provides a stable support point for the lead screw 241, but also ensures that it will not bend or wobble when bearing the torque generated by the drive component 23. The stable sliding of the slider 240 on the lead screw 241 further ensures the smoothness of the scraping structure 21 during movement and reduces the decrease in cleaning effect caused by vibration. This not only achieves precise control of the scraper 210's movement and high-efficiency energy conversion, but also simplifies the mechanical structure and reduces maintenance costs.

[0071] Compared to complex gear or chain drives, the transmission structure of the lead screw 241 and slider 240 is simpler, reducing the number of parts and potential failure points, thereby lowering the system's maintenance frequency and cost. Furthermore, this mechanism requires no lubrication, reducing maintenance workload.

[0072] In this embodiment, the driving component 23 includes a first driving member 230, a drive wheel 231, and a rotating rod 232. The first driving member 230 is disposed within a first mounting groove on the cover 2. The cover 2 also has a second mounting groove, within which the drive wheel 231 is rotatably disposed and at least partially extends. A third mounting groove is also provided on the cover 2, within which the rotating rod 232 is disposed, with at least a portion of the rotating rod 232 passing through the drive wheel 231. One end of the rotating rod 232 is connected to the output end of the first driving member 230. A driven wheel 242 is disposed on the lead screw 241, and the driven wheel 242 is connected to the drive wheel 231 in a cooperative manner. The first driving member 230 is a drive motor.

[0073] The first driving component 230 is disposed in the first mounting groove inside the cover 2, and is connected to the driving wheel 231 via the rotating rod 232, thereby driving the lead screw 241, which cooperates with the driven wheel 242, to rotate. This design simplifies the driving path, reduces intermediate transmission links, improves energy transmission efficiency, and makes the cleaning process more efficient.

[0074] The coordinated use of the drive wheel 231 and the driven wheel 242 ensures stable and precise torque transmission from the first drive component 230 to the lead screw 241. The interference fit mechanism between the driven wheel 242 and the drive wheel 231 effectively avoids torque loss, ensuring stable operation of the scraper 210 and sufficient cleaning force during the cleaning process.

[0075] It can be seen that by adopting the transmission mechanism of the first driving component 230, the driving wheel 231, the rotating rod 232 and the driven wheel 242, not only is precise driving control of the cleaning component 20 achieved and cleaning efficiency is improved, but also the spatial layout is optimized.

[0076] In this embodiment, the scraping structure 21 further includes a mounting plate 211 and a second driving member 212. Both ends of the mounting plate 211 are connected to two sliders 240, and a fourth mounting groove is provided on the mounting plate 211. The second driving member 212 is disposed within the fourth mounting groove, and its output end is connected to the scraper 210 to drive the scraper 210 to move in a direction closer to or further away from the adjusting member 11. The second driving member 212 is a miniature electric actuator.

[0077] Mounting plate 211 connects the two sliders 240 together to form a rigid frame, providing a stable support base for scraper 210. Even when moving at high speed or encountering uneven surfaces, scraper 210 can remain smooth, reducing vibration and thus improving the efficiency and quality of dirt removal.

[0078] The second drive component 212 is disposed in the fourth mounting slot on the mounting plate 211 and is directly connected to the scraper 210. It can precisely control the vertical movement of the scraper 210, that is, the direction of moving closer to or away from the adjusting component 11. This independent vertical control can better conform to the surface of the adjusting component 11 during the cleaning process, ensuring that there are no dead corners in the cleaning.

[0079] In this embodiment, a second temperature sensor is installed on the upper surface of the adjusting member 11 to detect the real-time temperature of the adjusting member 11. When the second temperature sensor detects that the adjusting part 110 of the adjusting member 11 has reached the recovery temperature (recovery temperature 37°, which can be set to 39° here), the scraper 210 rises under the drive of the micro electric push rod and abuts against the bottom surface of the elastic adjusting member 11, helping the adjusting member 11 to completely return to its original state.

[0080] It can be seen that by introducing the mounting plate 211 and the second drive component 212 into the scraping structure 21, not only is the stability and control accuracy of the scraper 210 movement improved, but energy consumption during the cleaning process is also optimized, and the versatility and adaptability of the cleaning component 20 are increased.

[0081] In this embodiment, the liquid cooling device further includes a filter assembly 30, which includes a filter frame 31. The top surfaces of the housing 1 and the liquid cooling plate 3 are respectively provided with mounting grooves 6. The top of the filter frame 31 is provided with a positioning side 32 protruding from its peripheral wall. The positioning side 32 is connected to the mounting groove 6 in a cooperative manner. At least a portion of the filter frame 31 is located in the liquid cooling channel 4. The cleaning component 20 is located in the filter frame 31 to receive impurities falling from the adjusting member 11. The filter frame 31 is provided with a plurality of filter holes 33 at intervals.

[0082] The filter frame 31 is designed to be located directly inside the liquid cooling channel 4. Through the multiple filter holes 33 provided on it, it can effectively intercept impurities and dirt scraped off from the regulating component 11, preventing these particles from re-entering the circulation system and causing blockages or damage to other components.

[0083] By placing the cleaning component 20 within the filter frame 31, the two functions of cleaning and filtration are tightly integrated. This integrated design makes the cleaning process more efficient while reducing the additional space requirements and structural complexity that might result from setting up a separate cleaning mechanism.

[0084] The positioning side 32 of the filter frame 31 connects with the mounting groove 6 on the housing 1 and the liquid cooling plate 3, making the installation and removal of the filter frame 31 very convenient. Maintenance personnel can easily remove the filter frame 31 for cleaning or replacement without disassembling the entire liquid cooling system, greatly reducing the difficulty and time cost of maintenance.

[0085] By regularly removing impurities from the surface of the regulating component 11, good deformation performance of the regulating component 11 and effective flow of the liquid cooling channel 4 are ensured, avoiding a reduction in coolant flow due to impurity accumulation, thereby reducing unnecessary energy waste. In addition, the presence of the filter assembly 30 also improves the safety of the system and prevents equipment failure caused by impurities.

[0086] In this embodiment, a flow sensor is provided on the side wall of the liquid cooling channel 4 at each regulating component 11. When the flow sensor detects that the flow rate at the regulating component 11 drops below the set value, the filter frame 31 needs to be removed to clean the impurities.

[0087] In this application, the working process of the liquid cooling device is as follows:

[0088] When liquid cooling is performed, at the beginning of liquid inlet, the first solenoid valve 41 is open and the second solenoid valve 42 and the third solenoid valve 43 are closed. When the liquid pump 45 draws the coolant from the inlet pipe 40 to the circulation pipe, the first solenoid valve 41 is closed, the second solenoid valve 42 is open, and the third solenoid valve 43 is closed, so that the circulating coolant is kept circulating in the liquid cooling channel 4.

[0089] According to the temperature of the liquid cooling channel 4 detected by the first temperature sensor, if it is too cold, the liquid cooling channel 4 is narrowed to reduce the coolant flow. When the liquid cooling channel 4 needs to be narrowed, the heating element heats the shape memory alloy and causes the shape memory alloy to elongate, causing the adjustment part 110 of the elastic adjustment element 11 to extend downward, thus narrowing the liquid cooling channel 4. If it is too hot, the liquid cooling channel 4 needs to recover. When the liquid cooling channel 4 needs to recover, the heating element is turned off, the shape memory alloy recovers upon cooling, the shape memory alloy shortens, and the adjustment part 110 of the elastic adjustment element 11 also returns to its original maximum height.

[0090] When the second temperature sensor detects that the regulating part 110 has reached the recovery temperature (recovery temperature 37°C, which can be set to 39°C here), the scraper 210 rises under the drive of the micro electric push rod and abuts against the bottom surface of the regulating part 11, helping the regulating part 11 to fully return to its original state. When the second temperature sensor detects that the regulating part 110 has reached the recovery temperature for 5 seconds, the drive motor starts, the mounting plate 211 begins to slide back and forth, and the scraper 210 scrapes off impurities by sticking close to the bottom surface of the regulating part 11. When the flow sensor detects that the flow rate at the regulating part 11 drops below the set value, the filter frame 31 needs to be removed to clean the impurities.

[0091] When removing the filter frame 31, all the coolant can be drained or some can be drained while retaining some. Then, open the cover 2. The adjusting component 11 and the shape memory alloy are both located on the cover 2 and can be removed. Then, lift the filter frame 31 upwards. When disassembling the adjusting component 11, pull the adjusting component 11 out forcefully to disengage the limiting block 14 from the limiting groove 5, and then remove the adjusting component 11.

[0092] First install the filter frame 31, then install the cover 2. When installing the cover 2, insert the adjusting piece 11 into the liquid cooling channel 4 and position it above the filter frame 31.

[0093] This application also provides an electronic device including the liquid cooling device mentioned above.

[0094] Integrated liquid cooling systems can dynamically adjust the cross-sectional area of ​​microchannels based on the real-time temperature and load of the chips inside electronic devices, effectively improving heat dissipation efficiency. Under high loads, the liquid cooling system can increase the coolant flow rate to quickly remove heat; under low loads, it can reduce the coolant flow rate to avoid energy waste.

[0095] By precisely regulating the coolant flow rate, a stable internal temperature is maintained for the electronic device, preventing performance degradation or damage that could be caused by chip overheating, thereby extending the overall lifespan of the electronic device. Furthermore, stable temperature control ensures that the electronic device maintains optimal operating conditions under various load conditions, improving its performance and stability, which is particularly important for scenarios requiring high computing power and continuous operation. The liquid cooling device of this application not only significantly improves heat dissipation efficiency, ensures stable chip operation, and extends the lifespan of the electronic device, but also optimizes energy management and reduces operating costs.

[0096] In this application, electronic devices are not limited to servers, but also include high-performance computers, graphics processing units (GPUs), data center modules, network devices, etc., which generate a large amount of heat during operation due to high-speed data processing and intensive computing. With technological advancements, the performance and power consumption of electronic devices are constantly increasing; therefore, efficient and intelligent heat dissipation solutions have become essential for ensuring stable operation. The liquid cooling device proposed in this application, with its innovative features and functions, makes it suitable not only for servers but also for a wide range of electronic devices.

[0097] The liquid cooling device and electronic device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A liquid cooling device comprising a tank shell (1) and a tank cover (2), the tank shell (1) having a liquid cooling flow channel (4) formed by at least two liquid cooling plates (3) sequentially and spaced, characterized in that, The liquid cooling device further comprises: An adjusting assembly (10) comprising an adjusting piece (11) and a movable piece (12), the adjusting piece (11) is arranged on the box cover (2) and located at the top of the liquid cooling flow channel (4), the adjusting piece (11) comprises an adjusting part (110), the movable piece (12) is located between the box cover (2) and the adjusting piece (11) and connected with the box cover (2) and the adjusting part (110) respectively; the movable piece (12) has an extended state and a restored state, when the movable piece (12) is in the extended state, at least part of the movable piece (12) is unfolded and drives the adjusting part (110) to move towards the bottom of the liquid cooling flow channel (4); when the movable piece (12) is in the restored state, at least part of the movable piece (12) is retracted and restored, and the adjusting part (110) is reset to the top of the liquid cooling flow channel (4); A cleaning assembly (20) arranged in the box shell (1), at least part of the cleaning assembly (20) is in contact with the outer surface of the adjusting piece (11) and movably arranged along the width direction of the adjusting piece (11) to scrape off impurities on the surface of the adjusting piece (11).

2. The liquid cooling device of claim 1, wherein, The adjusting assembly (10) further comprises: A control piece (13) arranged on the inner wall of the box cover (2) and connected with the movable piece (12) to control the movable piece (12) to switch between the extended state and the restored state; A first temperature sensor arranged on the inner wall of the box shell (1) or the liquid cooling plate (3) to detect the real-time temperature in the liquid cooling flow channel (4).

3. The liquid cooling device of claim 2, wherein, The control piece (13) is a heating piece to heat the movable piece (12); and / or, The movable piece (12) is made of shape memory alloy; and / or, The movable piece (12) is in the shape of a curved sheet.

4. The liquid cooling device of claim 1, wherein, The adjusting piece (11) further comprises two connecting parts (111), the adjusting part (110) is in the shape of U, the two connecting parts (111) are respectively connected with the two ends of the adjusting part (110), and the two connecting parts (111) are respectively movably connected with the inner wall of the box cover (2); The adjusting piece (11) is made of elastic material.

5. The liquid cooling device of claim 4, wherein, The adjusting assembly (10) further comprises: Two limiting blocks (14) respectively connected with the two connecting parts (111), a limiting groove (5) is arranged on the inner wall of the box cover (2), and at least part of the two connecting parts (111) is respectively embedded in the limiting groove (5) and movably arranged along the extension direction of the limiting groove (5).

6. The liquid cooling device of claim 1, wherein, The cleaning assembly (20) comprises: A scraping structure (21) arranged in the box shell (1), the scraping structure (21) comprises a scraper (210) movably arranged in the direction of approaching or moving away from the adjusting piece (11), and the shape of the scraper (210) is adaptively arranged to the shape of the adjusting piece (11) in the restored state; A driving structure (22) comprises a driving component (23) arranged on the box cover (2) and a transmission component (24) arranged in the box shell (1) and connected with the driving component (23), the transmission component (24) is connected with the scraping structure (21), so that the driving structure (22) drives the scraper (210) to move along the width direction of the adjusting piece (11).

7. The liquid cooling device of claim 6, wherein, The transmission component (24) comprises: Two sliding blocks (240) are respectively connected with two ends of the scraping structure (21), and an internally threaded hole is arranged on the sliding block (240); Two lead screws (241) are respectively correspondingly arranged in the internally threaded holes of the two sliding blocks (240), two ends of the lead screw (241) are respectively rotatably connected with two opposite inner side walls of the box shell (1), the driving component (23) is connected with the lead screw (241), so as to drive the lead screw (241) to rotate, so that the sliding block (240) drives the scraping structure (21) to move.

8. The liquid cooling device of claim 7, wherein, The driving component (23) comprises: A first driving piece (230) is arranged in the first mounting groove arranged on the box cover (2); A driving wheel (231) is rotatably arranged in the second mounting groove arranged on the box cover (2) and at least partially protrudes from the second mounting groove; A rotating rod (232) is arranged in the third mounting groove arranged on the box cover (2) and at least partially penetrates the driving wheel (231), one end of the rotating rod (232) is connected with the output end of the first driving piece (230); a driven wheel (242) is arranged on the lead screw (241), and the driven wheel (242) is connected with the driving wheel (231) in a mutually matched manner.

9. The liquid cooling device of claim 7, wherein, The scraping structure (21) further comprises: An installation plate (211) is connected with the two sliding blocks (240) at two ends respectively, and a fourth mounting groove is arranged on the installation plate (211); A second driving piece (212) is arranged in the fourth mounting groove, and the output end of the second driving piece (212) is connected with the scraper (210), so as to drive the scraper (210) to move in the direction of approaching or moving away from the adjusting piece (11).

10. The liquid cooling device of claim 1, wherein, The liquid cooling device further comprises: The filter assembly (30) comprises a filter frame (31), the cabinet (1) and the top surface of the liquid cooling plate (3) are respectively provided with mounting grooves (6), the top of the filter frame (31) is provided with positioning side edges (32) protruding from the peripheral wall thereof, the positioning side edges (32) are connected to the mounting grooves (6) in a matched manner, at least part of the filter frame (31) is located in the liquid cooling flow channel (4), the cleaning assembly (20) is located in the filter frame (31) and is used for receiving impurities falling from the adjusting piece (11), and a plurality of filter holes (33) are arranged at intervals on the filter frame (31).

11. An electronic device, comprising: The liquid cooling device comprises the liquid cooling device according to any one of claims 1 to 10.

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