Radio frequency board and radio frequency equipment
By setting inter-board capacitors on the RF board, electrostatic signals are isolated and high-frequency signals are coupled, solving the problem of RF equipment failure caused by electrostatic discharge, achieving equipment safety and signal integrity, and saving space.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2026-03-10
AI Technical Summary
Radio frequency (RF) signal interfaces in RF devices are susceptible to electrostatic discharge (ESD), which can lead to device malfunctions or damage, increase equipment maintenance costs, and negatively impact user experience.
A first reference layer and a second reference layer are set on the radio frequency board to form an inter-board capacitor. The capacitor is used to isolate low-frequency signals and couple high-frequency signals, thereby achieving electrostatic signal isolation and ensuring the integrity of radio frequency signal transmission.
It effectively protects against electrostatic signals, ensures the integrity of radio frequency signal transmission, saves RF board space, and improves equipment safety.
Smart Images
Figure CN223987321U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of radio frequency engineering technology, and in particular to a radio frequency board and radio frequency equipment. Background Technology
[0002] In today's electronic devices industry, which heavily relies on wireless communication, radio frequency (RF) devices are widely used, from smartphones and IoT devices to more complex radar systems and satellite communication devices, all demonstrating their importance.
[0003] However, the radio frequency signal interface in radio frequency equipment is susceptible to electrostatic discharge, which can lead to equipment failure or damage, increasing equipment maintenance costs and seriously affecting the user experience. Utility Model Content
[0004] In view of this, the present application provides an RF board and RF device, which can effectively solve the problems in the prior art where equipment failure or damage is caused by electrostatic discharge affecting the RF signal interface, which increases equipment maintenance costs and seriously affects the user experience.
[0005] In a first aspect, this application provides an RF board, comprising: a first reference layer and a second reference layer, wherein the first reference layer is electrically connected to the housing of the RF board, the second reference layer is electrically connected to the RF interface of the RF board, and the first reference layer and the second reference layer are overlapped to form an inter-board capacitor, the inter-board capacitor being used to isolate the housing from electrostatic signals.
[0006] In some embodiments, the first reference layer is a protective ground layer, and the second reference layer is a system ground layer.
[0007] In some embodiments, the radio frequency board further includes a radio frequency signal line, one end of which is electrically connected to the antenna interface of the radio frequency board, and the other end of which is electrically connected to the radio frequency interface.
[0008] In some embodiments, the inter-board capacitor is spaced at a preset distance from the radio frequency signal line.
[0009] In some embodiments, the ground terminal of the radio frequency signal line is electrically connected to the second reference layer.
[0010] In some embodiments, the target capacitance of the inter-plate capacitor is set to satisfy the following relationship with the area of the overlapping region between the first reference layer and the second reference layer:
[0011]
[0012] Wherein, C represents the target capacitance of the inter-board capacitor; A represents the area of the overlapping region between the first reference layer and the second reference layer; ε represents the total dielectric constant of the RF board; and d represents the spacing between the first reference layer and the second reference layer along the thickness direction of the RF board.
[0013] In some embodiments, the area of the overlapping region is related to the width and length of the overlapping region as follows:
[0014] A = WL
[0015] Where A represents the area of the overlapping region; W represents the width of the overlapping region; and L represents the length of the overlapping region.
[0016] In some embodiments, an insulating material is disposed between the first reference layer and the second reference layer, and the spacing is the thickness of the insulating material.
[0017] Secondly, this application provides a radio frequency device, the radio frequency device including the housing and at least one radio frequency board as described in the first aspect above.
[0018] In some embodiments, the radio frequency device is a router.
[0019] The embodiments of this application have the following beneficial effects:
[0020] The radio frequency (RF) board of this application includes a first reference layer and a second reference layer. The first reference layer is electrically connected to the housing of the RF board, and the second reference layer is electrically connected to the RF interface of the RF board. The first and second reference layers are overlapped to form an inter-board capacitor, which is used to isolate electrostatic signals from the housing. This application utilizes the characteristics of capacitors to isolate low-frequency signals and couple high-frequency signals to isolate electrostatic signals, achieving effective electrostatic protection while ensuring the integrity of RF signal transmission, greatly ensuring the safety of the device. Furthermore, this application utilizes inter-board capacitors directly integrated on the RF board, ensuring stable capacitance values and performance while significantly saving space on the RF board. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 A cross-sectional schematic diagram of the radio frequency board according to an embodiment of this application is shown;
[0023] Figure 2 A circuit diagram of the radio frequency board according to an embodiment of this application is shown;
[0024] Figure 3 A schematic diagram of the structure of the radio frequency board according to an embodiment of this application is shown.
[0025] Explanation of key component symbols:
[0026] 11: First reference layer; 12: Second reference layer; 13: Insulating material; 14: Housing; 15: RF interface; 16: Antenna interface; 17: RF signal line. Detailed Implementation
[0027] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0028] The components of the embodiments of this application described and illustrated in the accompanying drawings can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of this application provided in the drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0029] In the following text, the terms "comprising," "having," and their cognates, which may be used in various embodiments of this application, are intended only to indicate a particular feature, number, step, operation, element, component, or combination thereof, and should not be construed as primarily excluding the presence of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, or adding the possibility of one or more combinations thereof. Furthermore, the terms "first," "second," "third," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance.
[0030] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of this application pertain. Terms (such as those defined in commonly used dictionaries) shall be interpreted as having the same meaning as in their contextual meaning in the relevant technical field and shall not be construed as having an idealized or overly formal meaning, unless clearly defined in the various embodiments of this application.
[0031] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0032] Considering that in the prior art, equipment failure or damage caused by electrostatic discharge to the radio frequency signal interface increases equipment maintenance costs and seriously affects the user experience, this application provides a radio frequency board and radio frequency device. This application utilizes the characteristics of capacitors to isolate low-frequency signals and couple high-frequency signals to isolate electrostatic signals, achieving effective electrostatic protection while ensuring the integrity of radio frequency signal transmission, greatly ensuring the safety of the equipment. Furthermore, this application utilizes inter-board capacitors directly integrated on the radio frequency board, ensuring stable capacitance values and performance while greatly saving space on the radio frequency board.
[0033] The radio frequency board will be described below with reference to some specific embodiments.
[0034] Radio frequency (RF) equipment is a device capable of transmitting and receiving radio frequency signals, widely used in various scenarios such as mobile phones, routers, satellite communication systems, and radar systems. RF equipment includes a housing 14 and an RF board integrating various components and interfaces. Antenna interfaces 16, power input terminals, etc., can be installed at appropriate locations on the housing 14 according to the actual application.
[0035] Figure 1 A cross-sectional schematic diagram of an RF board according to an embodiment of this application is shown. Figure 2 The diagram illustrates a circuit diagram of an embodiment of this application. In a demonstrative manner, the radio frequency board includes a first reference layer 11 and a second reference layer 12. The first reference layer 11 is electrically connected to the housing 14 of the radio frequency board and serves as a protective grounding layer. The protective grounding layer is used for electrical safety protection, connecting metal components that may generate dangerous voltages to the ground, providing a safe discharge path in the event of leakage or short circuit, and preventing damage caused by the energized housing of the device.
[0036] The second reference layer 12 is electrically connected to the RF interface 15 of the RF board. It is understood that the RF board also includes an RF signal line 17. The RF interface 15 is electrically connected to the second reference layer 12 via the RF signal line 17. Specifically, one end of the RF signal line 17 is electrically connected to the antenna interface 16 of the RF board, and the other end of the RF signal line 17 is electrically connected to the RF interface 15. The ground terminal of the RF signal line 17 is electrically connected to the second reference layer 12. The antenna interface 16 of the RF board is electrically connected to the first reference layer 11. The second reference layer 12 is the system ground layer, which provides a stable reference potential for the entire system, eliminates potential differences between different signals, provides a stable power supply loop, improves electromagnetic compatibility performance, and reduces noise interference.
[0037] The first reference layer 11 and the second reference layer 12 are overlapped to form an inter-plate capacitor. Figure 2 In the figure, capacitor C1 represents the inter-board capacitance. It is understood that signal traces should be avoided in the overlapping area. The position and size of the first reference layer 11 and the second reference layer 12 can be set according to the actual application. The first reference layer 11 can be set on the upper layer of the second reference layer 12 or on the lower layer of the second reference layer 12. As an example, the first reference layer 11 is set on the upper layer of the second reference layer 12.
[0038] Inter-board capacitors are used to isolate electrostatic signals from the housing 14. The target capacitance of the inter-board capacitors can be set according to the actual application. As an example, the target capacitance of the inter-board capacitors is set to satisfy the following relationship with the area of the overlap region between the first reference layer and the second reference layer:
[0039]
[0040] Where C represents the target capacitance of the inter-board capacitor; A represents the area of the overlapping region of the first reference layer 11 and the second reference layer 12; ε represents the total dielectric constant of the RF board; and d represents the spacing between the first reference layer 11 and the second reference layer 12 along the thickness direction of the RF board.
[0041] Understandably, to ensure signal quality, the area of the overlapping region and the capacitance of the inter-board capacitors can be limited. The area of the overlapping region cannot be too large, and the setting of the area of the overlapping region should satisfy the following relationship with the setting of the width and length of the overlapping region:
[0042] A = WL
[0043] Where A represents the area of the overlapping region; W represents the width of the overlapping region; and L represents the length of the overlapping region. By limiting the area of the overlapping region, the quality of the inter-board capacitance is limited, thereby ensuring the transmission of high-frequency signals.
[0044] The total dielectric constant is related to the material between the first reference layer 11 and the second reference layer 12 in the overlapping region. An insulating material 13 is disposed between the first reference layer 11 and the second reference layer 12. The thickness of the insulating material 13 should be uniform, and the spacing between the first reference layer 11 and the second reference layer 12 along the thickness direction of the RF board is the thickness of the insulating material 13. It is understood that the insulating material 13 can be epoxy resin; the insulating material 13 can also be polyimide; the insulating material 13 can also be a glass fiber reinforced epoxy resin composite material; the insulating material 13 can also be phenolic resin. Exemplarily, the insulating material 13 is epoxy resin.
[0045] As another implementation, another reference layer can be provided between the first reference layer 11 and the second reference layer 12, and the capacitance of the inter-board capacitor can be obtained by the thickness and dielectric constant of the other reference layer; alternatively, a hollow structure can be provided between the first reference layer 11 and the second reference layer 12 in the overlapping area, and the capacitance of the inter-board capacitor can be obtained by the height of the hollow structure and the dielectric constant.
[0046] The total dielectric constant of the RF board can be obtained using the following formula:
[0047] ε=ε0*ε r
[0048] Where ε0 represents the vacuum permittivity; ε r This indicates the relative permittivity of insulating material 13. Exemplarily, insulating material 13 is epoxy resin.
[0049] The process of transmitting radio frequency (RF) signals is as follows: RF signals are generated and transmitted to RF interface 15, then enter RF signal line 17 through RF interface 15, and RF signal line 17 transmits the signal to antenna interface 16. Antenna interface 16 transmits the signal to antenna through a connector. The antenna is responsible for converting the electrical signal into electromagnetic waves and propagating them into space. The process of receiving RF signals is as follows: The antenna captures electromagnetic waves and converts them into electrical signals. The electrical signals are transmitted through antenna interface 16 to RF signal line 17, and then through RF signal line 17 to RF interface 15, so that subsequent circuits can process the RF signals.
[0050] The RF interface 15 may include components such as amplifiers and filters to enhance signal strength and remove unwanted noise or frequency components, thereby ensuring signal quality and stability. Adapters or converters may be connected to both ends of the RF signal line 17 to ensure compatibility with both the antenna interface 16 and the RF interface 15.
[0051] In this configuration, the grounding terminal of the RF signal line 17 is connected to the system ground plane. The inter-plate capacitance formed by the system ground plane and the protective ground plane isolates low-frequency signals from coupling with high-frequency signals. Since the RF signal is a high-frequency signal, and electrostatic discharge occurs in the housing 14, the electrostatic discharge signal can be considered a low-frequency signal due to its low trigger frequency. The inter-plate capacitance within the housing 14 acts as a barrier, effectively blocking the transmission of low-frequency electrostatic discharge signals to the system ground plane of the RF signal. The return path of the high-frequency signal can still couple back to the system ground, without affecting the normal transmission of the high-frequency signal.
[0052] In this embodiment, the RF board ensures that the inter-board capacitors isolate electrostatic signals while coupling high-frequency signals, forming a loop between the high-frequency signals and the system ground plane, thus ensuring the integrity of RF signal transmission. Furthermore, the integrated inter-board capacitors on the RF board optimize the return path of high-frequency signals, achieving better high-frequency performance. While ensuring stable capacitance values and performance, it significantly saves space on the RF board.
[0053] In one embodiment, based on the above embodiments, Figure 3 A schematic diagram of a radio frequency board according to an embodiment of this application is shown.
[0054] The inter-board capacitors and the RF signal line 17 are spaced at a preset distance. This distance can be set according to the actual application. Understandably, the physical distance between the inter-board capacitors and the RF signal line 17 should be as small as possible to reduce parasitic capacitance effects and ensure signal integrity.
[0055] This application also provides a radio frequency (RF) device, exemplary of which includes the aforementioned RF board and housing 14. An antenna interface 16, power input terminals, etc., can be disposed at appropriate locations on the housing 14 according to actual application requirements. Specifically, the RF device can be a wireless communication device, such as a mobile phone, router, or Bluetooth device; it can also be a broadcasting device, such as a radio or satellite broadcasting device; it can be a radar device, such as a weather radar; or it can be a medical device, such as a magnetic resonance imaging (MRI) instrument. Through the inter-board capacitance of the RF board, electrostatic signals from the housing 14 are isolated, ensuring the integrity of the high-frequency signal return path while achieving effective electrostatic protection, greatly ensuring the safety of the device.
[0056] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that, in alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and combinations of blocks in the block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.
[0057] In addition, the functional modules or units in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.
[0058] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a smartphone, personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application.
[0059] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.
Claims
1. A radio frequency board, characterized by, The application relates to a radio frequency device. The radio frequency device comprises a first reference layer and a second reference layer, the first reference layer is electrically connected with a shell of the radio frequency board, the second reference layer is electrically connected with a radio frequency interface of the radio frequency board, the first reference layer and the second reference layer are arranged in an overlapping mode to form an inter-board capacitor, and the inter-board capacitor is used for electrostatic signal isolation of the shell.
2. The radio frequency board of claim 1, wherein, The first reference layer is a protection ground layer, and the second reference layer is a system ground layer.
3. The radio frequency board of claim 1, wherein, The radio frequency board further comprises a radio frequency signal line, one end of the radio frequency signal line is electrically connected with an antenna interface of the radio frequency board, and the other end of the radio frequency signal line is electrically connected with the radio frequency interface.
4. The radio frequency board of claim 3, wherein, The inter-board capacitor is spaced apart from the radio frequency signal line by a preset distance.
5. The radio frequency board of claim 4, wherein, A ground end of the radio frequency signal line is electrically connected with the second reference layer.
6. The radio frequency board of claim 1, wherein, A target capacity of the inter-board capacitor and an overlapping area of the first reference layer and the second reference layer satisfy the following relationship: Wherein, C represents the target capacity of the inter-board capacitor, A represents the overlapping area of the first reference layer and the second reference layer, epsilon represents a total dielectric constant of the radio frequency board, and d represents a distance between the first reference layer and the second reference layer along a thickness direction of the radio frequency board.
7. The radio frequency board of claim 6, wherein, The overlapping area and the width and length of the overlapping area satisfy the following relationship: A=W*L Wherein, A represents the overlapping area, W represents the width of the overlapping area, and L represents the length of the overlapping area.
8. The radio frequency board of claim 6, wherein, Insulating material is arranged between the first reference layer and the second reference layer, and the distance is the thickness of the insulating material.
9. A radio frequency device, characterized by The radio frequency device comprises the shell and the radio frequency board in any one of claims 1-8.
10. The radio-frequency device according to claim 9, characterized in that, The radio frequency device is a router.