Flexible pressure demolding auxiliary device

Abstract

The utility model relates to a flexible pressure demoulding auxiliary device, comprising a vacuum adsorption platform which is arranged on one side of a packaging casing, is used for fixing and bearing a slide glass platform and adsorbs the slide glass platform through a vacuum pump, and the packaging casing coincides with the slide glass platform on an overlook angle projection; the lifting platform is arranged at one end of the packaging machine shell and driven by a lifting air cylinder, meanwhile, a connecting rod and a rod sleeve are arranged at the center point of the lifting platform, the connecting rod penetrates through the rod sleeve arranged on the packaging machine shell, the rear end of the connecting rod is connected with the contact platform, and pressure is evenly applied to the surface of the wafer. According to the auxiliary device, through the synergistic effect of the heating module, the contact platform and the temperature control system, the problem that the resin wafer warps in the separation process is successfully solved, the product quality and the production efficiency are effectively improved, and the auxiliary device has wide application prospects.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging production technology, and in particular to a flexible pressure demolding auxiliary device. Background Technology

[0002] Currently, in fan-out wafer-level chip packaging, the resin wafer (usually an encapsulating resin layer) needs to be separated from the carrier substrate after the molding process. However, during separation, the wafer edges are subjected to significant stress, which may cause wafer warping. Warping not only affects the accuracy of subsequent processes but may also compromise the overall package quality. Therefore, designing an efficient contact device to avoid wafer warping caused by stress concentration is crucial for improving production efficiency and product quality. Summary of the Invention

[0003] To solve the above-mentioned technical problems, this utility model provides a flexible pressure demolding auxiliary device, comprising:

[0004] A vacuum adsorption platform is located on one side of the packaging housing. It is used to fix and support the wafer platform and adsorbs the wafer platform by a vacuum pump. The packaging housing coincides with the wafer platform in a top-view projection.

[0005] A heating module is disposed in the hole in the surface of the carrier plate platform and is used to heat the contact area between the carrier plate and the disc.

[0006] The lifting platform is located at one end of the packaging machine housing. The lifting platform is driven by a lifting cylinder. At the same time, a connecting rod and a sleeve are provided at the center point of the lifting platform. The connecting rod passes through the sleeve located in the packaging machine housing, and the other end is connected to the contact platform to apply pressure evenly to the surface of the wafer.

[0007] The temperature regulation mechanism, including a temperature-conducting pipe, a cooling element, and a fan, is used to control the temperature changes of the internal environment of the device. It is connected to the side of the encapsulation housing through the temperature-conducting pipe, and the temperature-conducting pipe is located on one side of the fan.

[0008] In one embodiment of this utility model, the demolding auxiliary device further includes: a packaging housing for providing a vacuum operating environment; and a power interface located in a fixing hole at one end of the carrier plate platform for supplying power to the heating module.

[0009] In one embodiment of this utility model, the vacuum pump is connected to the vacuum adsorption platform through an extraction pipe to maintain the adsorption force, and an exhaust pipe is provided at the other end of the vacuum pump.

[0010] In one embodiment of this utility model, the heating module is connected to a temperature control system, wherein a temperature sensor is provided inside the packaging housing to monitor the temperature in real time in a non-contact manner.

[0011] In one embodiment of this utility model, a silicone pad is provided on one side of the contact platform, and one end of the power source is linked to the lifting platform through a connecting rod and a sleeve. The silicone pad is used to flexibly support the circular plate.

[0012] In one embodiment of this utility model, multiple cooling plates are evenly distributed on the surface of the temperature-conducting pipe to achieve local rapid cooling; in addition, the temperature regulation mechanism is also provided with: an adjustment platform and an air inlet pipe located on the side of the fan, for realizing the regulation and circulation cooling of airflow.

[0013] Compared with the prior art, the above-mentioned technical solution of this utility model has the following advantages: the demolding auxiliary device of this utility model has a temperature control system that controls the uniform change of the internal ambient temperature of the disc during the cooling stage, so that the thermal stress of the disc can be released slowly.

[0014] It controls the deformation that occurs when the membrane foam detaches from the carrier plate and has a rebound effect, effectively reducing the deformation of the disc.

[0015] The equipment achieves demolding while also reducing warping, which facilitates cost control. Attached Figure Description

[0016] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0017] Figure 1 This is a three-dimensional structural diagram of the flexible pressure demolding auxiliary device of this utility model;

[0018] Figure 2 This is a cross-sectional schematic diagram of the membrane removal auxiliary device described in this utility model;

[0019] Figure 3 This is a side view of the vacuum pump described in this utility model;

[0020] Figure 4 This is a side view of the temperature regulating mechanism described in this utility model.

[0021] As shown in the figure: 1. Packaging housing; 2. Carrier platform; 3. Heating module; 4. Power interface; 5. Connecting rod; 6. Temperature sensor; 7. Lifting cylinder; 8. Lifting platform; 9. Rod sleeve; 10. Temperature adjustment mechanism; 101. Adjustment table; 102. Fan; 103. Inlet pipe; 104. Cooling chip; 105. Temperature conduction pipe; 11. Contact platform; 12. Silicone gasket; 13. Vacuum pump; 14. Vacuum adsorption platform; 15. Exhaust pipe; 16. Extraction pipe. Detailed Implementation

[0022] In current production processes, the adhesive layer of the wafer foams and detaches from the carrier plate after heating, without any other protective measures. This leaves the wafer edges susceptible to significant stress, potentially leading to warping. While some warping reduction devices exist on the market, these are complex, costly, and cannot completely eliminate warping, resulting in unsatisfactory warping reduction effects. Example 1

[0023] Therefore, as Figure 1 and Figure 2 As shown, this embodiment provides a flexible pressure demolding auxiliary device, including:

[0024] A vacuum adsorption platform 14 is located on one side of the packaging housing 1. It is used to fix and support the wafer carrier platform 2, and the wafer carrier platform 2 is adsorbed by a vacuum pump 13. The packaging housing 1 coincides with the wafer carrier platform 2 in the top view projection.

[0025] Heating module 3 is disposed in the hole in the surface of the carrier plate 2 and is used to heat the contact area between the carrier plate and the disc.

[0026] The lifting platform 8 is located at one end of the packaging machine housing 1. The lifting platform 8 is driven by the lifting cylinder 7. At the same time, the center point of the lifting platform 8 is provided with a connecting rod 5 and a rod sleeve 9. The connecting rod 5 passes through the rod sleeve 9 located in the packaging machine housing 1, and the other end is connected to the contact platform 11 to apply pressure evenly to the surface of the wafer.

[0027] The temperature regulation mechanism 10 includes a temperature-conducting pipe 105, a cooling chip 104, and a fan 102. It is used to control the temperature change of the internal environment of the device. It is connected to the side of the packaging shell 1 through the temperature-conducting pipe 105, and the temperature-conducting pipe 105 is located on one side of the fan 102.

[0028] like Figure 3 As shown, the vacuum pump 13 is connected to the vacuum adsorption platform 14 through the extraction pipe 16 to maintain the adsorption force, and the other end of the vacuum pump 13 is provided with an exhaust pipe 15.

[0029] like Figure 4 As shown, multiple cooling plates 104 are evenly distributed on the surface of the temperature-conducting pipe 105 to achieve local rapid cooling; in addition, the temperature regulation mechanism 10 is also provided with: an adjustment platform 101 and an air inlet pipe 103 located on the side of the fan 102, for realizing the regulation and circulation cooling of airflow.

[0030] The demolding auxiliary device described in this embodiment effectively solves the warping problem during the demolding process of discs by synergistically controlling temperature, pressure and vacuum environment, while the overall cost of the device is reduced by 30% compared with existing equipment. Example 2

[0031] Simultaneously, in conjunction with a demolding auxiliary device, a flexible pressure demolding assisted operation method was designed, including the following steps:

[0032] Step S1: Place the carrier plate on the substrate platform 2, start the vacuum pump 13 to adsorb and fix it, and align the encapsulation housing 1 with the substrate.

[0033] Step S2: The lifting cylinder 7 pushes the lifting platform 8 to contact the circular piece, and the silicone pad 12 provides flexible support;

[0034] Step S3: The heating module 3 is heated to 180°C to make the adhesive layer foam. After the temperature rises to 210°C, the disc initially separates from the carrier plate, and the carrier platform 2 in contact provides support for the deformation generated at the moment of demolding.

[0035] Step S4: Turn off heating module 3, start fan 102 and cooling chip 104 to cool down at a rate of 2℃ / min, and cool down at a uniform speed to slowly release the thermal stress inside the disc.

[0036] Step S5: After the temperature drops to room temperature, the lifting platform 8 is reset, completing the strip removal and achieving the strip removal and warp reduction effects.

[0037] The auxiliary operation method of this embodiment reduces wafer warpage to below 0.1mm through silicone pad 12 and uniform cooling; the vacuum environment avoids external interference, and the demolding success rate reaches 100%; after solving the problem, it also has high efficiency and economy, and is suitable for large-scale wafer-level packaging production.

[0038] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A flexible pressure membrane stripping assist device, characterized by, The utility model relates to a kind of encapsulation machine, including: Vacuum suction platform (14) is arranged in the side of encapsulation machine shell (1), for fixed and carrying slide platform (2), and slide platform (2) is adsorbed by vacuum pump (13), and the encapsulation machine shell (1) is coincident with slide platform (2) in the projection on the overhead angle; Heating module (3) is arranged in the edition face hole of the carrying slide platform (2); Lifting platform (8) is arranged in one end of encapsulation machine shell (1), lifting platform (8) is driven by lifting cylinder (7), and the center point of lifting platform (8) is equipped with connecting rod (5) and rod sleeve (9), the connecting rod (5) in which passes through rod sleeve (9) arranged in encapsulation machine shell (1), and the latter end is connected with contact platform (11); Temperature adjusting mechanism (10) includes temperature guide pipe (105), refrigerating sheet (104) and fan (102), for controlling the temperature change of inside environment of device, temperature guide pipe (105) is connected with the side of encapsulation machine shell (1), and temperature guide pipe (105) is arranged in one side of fan (102).

2. The stripping aid of claim 1, wherein: The desorption auxiliary device further includes encapsulation machine shell (1) and power interface (4), wherein the power interface (4) is arranged in one end fixed hole of carrying slide platform (2).

3. The stripping aid of claim 1, wherein: The vacuum pump (13) is connected with vacuum suction platform (14) by extraction pipeline (16), and the other end of vacuum pump (13) is equipped with exhaust pipeline (15).

4. The stripping aid of claim 1, wherein: The heating module (3) is connected with temperature control system, and temperature sensor (6) is arranged in the inner side of encapsulation machine shell (1).

5. The stripping aid of claim 1, wherein: The side of contact platform (11) is equipped with silica gel gasket (12), and the power source end is linked with lifting platform (8) through connecting rod (5) and rod sleeve (9), wherein silica gel gasket (12).

6. The stripping aid of claim 1, wherein: Multiple refrigerating sheets (104) are uniformly distributed on the surface of temperature guide pipe (105);In addition, the temperature adjusting mechanism (10) further includes adjusting table (101) arranged on the side of fan (102) and air inlet pipeline (103).

Images