Chip capturing device and multi-section chip ejector
By designing a multi-segment chip pusher and utilizing negative pressure and a light source module, the problem of existing chip acquisition devices being unable to clearly present the outline of small-pitch chips is solved, achieving accurate chip positioning and reducing damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-03-10
AI Technical Summary
Existing chip acquisition devices cannot clearly capture the outline of small-pitch chips due to the combination of cameras and light sources, resulting in inaccurate chip acquisition.
The multi-segment chip pusher includes a housing, a negative pressure unit, an outer pusher, an inner pusher, a light source module, and a camera. Through the cooperation of negative pressure and the light source module, the chip outline is clearly presented and accurately positioned.
It achieves accurate positioning and acquisition of the target chip, reducing the risk of chip damage during the separation process.
Smart Images
Figure CN223987356U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a chip extractor, in particular to a chip extraction device and a multi-section chip ejector. BACKGROUND
[0002] The existing chip extraction device is configured with a camera and a light source above an adhesive film, and then the light source is used to irradiate multiple chips adhered to the adhesive film, so that the camera can obtain the positions of the multiple chips. However, with the development of semiconductor technology, the pitch of the multiple chips is getting smaller and smaller, which causes the camera and the light source used in the existing chip extraction device to fail to clearly present the outline of each chip.
[0003] Therefore, the applicant believes that the above defects can be improved, and after careful research and application of scientific principles, the present application is finally proposed to reasonably and effectively improve the above defects. CONTENT OF THE INVENTION
[0004] The technical problem to be solved by the present application is to provide a chip extraction device and a multi-section chip ejector, which can effectively improve the defects that may occur in the existing chip extraction device.
[0005] The chip extraction device disclosed in the embodiments of the present application comprises a multi-section chip ejector for pushing against an adhesive film of a target chip, and the adhesive film is adhered to multiple chips surrounding the target chip. A gap of less than 150 microns is formed between the target chip and the multiple chips surrounding the target chip, and the adhesive film has a light transmission area corresponding to the gap. The multi-section chip ejector comprises a housing, a negative pressure unit arranged in the housing and connected to a top surface of the housing, for adsorbing and fixing a peripheral area of the adhesive film to the top surface of the housing, an outer ejecting piece arranged in the housing in a ring shape, at least one inner ejecting piece located on the inner side of the outer ejecting piece, and the outer ejecting piece and the at least one inner ejecting piece can relatively move along a predetermined direction to push against the adhesive film of the target chip, so that the target chip is moved a predetermined distance along the predetermined direction, and a negative pressure space is generated between the top surface of the housing and the adhesive film by the negative pressure unit. A light source module is arranged around the housing and adjacent to the top surface of the housing. The light source module can be used to emit light towards the light transmission area to form a transmission light passing through the light transmission area and the gap. A camera is arranged above the multi-section chip ejector, and the camera can be used to receive the transmission light to obtain the position information of the target chip.
[0006] Optionally, when the multi-stage chip ejector passes through the negative pressure unit and the outer ejector and the at least one inner ejector jointly push against a first region of the adhesive film, the target chip is moved a predetermined distance, the outer ejector can leave the first region, so that the first region pushed by the outer ejector can be separated from the target chip through the negative pressure space, and the at least one inner ejector pushes against a second region of the adhesive film.
[0007] Optionally, when the multi-stage chip ejector passes through the negative pressure unit and the outer ejector and the at least one inner ejector jointly push against a first region of the adhesive film, the target chip is moved, the multi-stage chip ejector can only use the at least one inner ejector to continue to push against a second region of the adhesive film, so that the target chip is moved a predetermined distance, and the first region pushed by the outer ejector can be separated from the target chip through the negative pressure space.
[0008] Optionally, the multi-stage chip ejector comprises a heating element, the heating element is arranged on the housing and adjacent to the top surface of the housing.
[0009] Optionally, the outer ejector comprises an end surface in the form of a ring, and the end surface of the outer ejector is used to push against the adhesive film; wherein the end surface of the outer ejector is orthographically projected on a projection region of the surface of the target chip, which is located inside the contour of the surface.
[0010] Optionally, the outer ejector comprises a plurality of telescopic rods, and the end surfaces of the plurality of telescopic rods are distributed in a ring shape and used to push against the adhesive film.
[0011] Optionally, the number of the at least one inner ejector is a plurality, and the plurality of inner ejectors can be relatively moved in a predetermined direction; wherein an inner ejector adjacent to the outer ejector is arranged in a ring shape.
[0012] Optionally, the multi-stage chip ejector comprises a heating element, the heating element is located outside the outer ejector, and the heating element is adjacent to the end surface of the outer ejector used to push against the adhesive film.
[0013] Optionally, the chip extraction device further comprises an extractor, which is arranged corresponding to the multi-stage chip ejector, and the extractor is used to hold the top surface of the target chip.
[0014] This application also discloses a multi-segment chip pusher, which is used to push against an adhesive film for bonding a target chip. The adhesive film has multiple chips bonded to it, surrounding the target chip. A gap is formed between the target chip and the surrounding chips. The adhesive film has a light-transmitting area corresponding to the gap. The multi-segment chip pusher includes: a housing; a negative pressure unit disposed on the housing and connected to a top surface of the housing, used to adsorb and fix a peripheral area of the adhesive film to the top surface of the housing; and an external pushing member arranged in a ring. Inside the housing; at least one inner pusher located inside the outer pusher, and the outer pusher and at least one inner pusher are movable relative to each other in a predetermined direction to push against the adhesive film of the target chip, so that the target chip is moved a predetermined distance in the predetermined direction and a negative pressure space is generated between the top surface of the housing and the adhesive film through a negative pressure unit; a light source module is disposed around the housing and adjacent to the top surface of the housing; wherein the light source module is used to emit light toward the light-transmitting area to form a transmitted light that passes through the light-transmitting area and the gap.
[0015] In summary, the chip acquisition device and multi-segment chip pusher disclosed in this application can, by having a light source module positioned below the adhesive film corresponding to the light-transmitting area, clearly present the outline and position of the target chip by the transmitted light passing through the light-transmitting area, thereby facilitating the accurate acquisition of the target chip by the chip acquisition device.
[0016] The other effects and embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a functional block diagram of the chip separation device according to Embodiment 1 of this application;
[0019] Figure 2 This is a plan view of the chip pre-stripping device according to Embodiment 1 of this application;
[0020] Figure 3 for Figure 2 A schematic diagram of the chip pre-stripping device after operation;
[0021] Figure 4 This is a schematic diagram of the operation of the chip acquisition device according to Embodiment 1 of this application;
[0022] Figure 5 for Figure 4 A schematic diagram of the subsequent operation of the chip acquisition device;
[0023] Figure 6 for Figure 5 A schematic diagram of the subsequent operation of the chip acquisition device;
[0024] Figure 7 This is a schematic diagram of the extractor of Embodiment 1 of this application having a single internal pusher;
[0025] Figure 8 This is a schematic diagram showing that the push-out member of the extractor in Embodiment 1 of this application is a single-piece structure;
[0026] Figure 9 for Figure 8 A schematic diagram of the extractor after it has been run;
[0027] Figure 10 This is a schematic diagram showing that the push-out member of the extractor in Embodiment 1 of this application has a multi-piece structure;
[0028] Figure 11 for Figure 10 A schematic diagram of the extractor after it has been run;
[0029] Figure 12 This is a schematic diagram of the operation of the chip acquisition device according to Embodiment 2 of this application;
[0030] Figure 13 for Figure 12 A schematic diagram of the subsequent operation of the chip acquisition device;
[0031] Figure 14 for Figure 13 A schematic diagram of the subsequent operation of the chip acquisition device. Detailed Implementation
[0032] The following specific embodiments illustrate the implementation of the "chip acquisition device and multi-segment chip pusher" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.
[0033] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.
[0034] [Example 1]
[0035] Please see Figures 1 to 11 As shown, this is an embodiment of this application. Figure 1 and Figure 2 As shown, this embodiment discloses a chip separation device 100, which includes a chip pre-stripping device 1, a chip picking device 2 located downstream of the chip pre-stripping device 1, a transfer device 3 located between the chip pre-stripping device 1 and the chip picking device 2, and a supply device 4 provided corresponding to the transfer device 3.
[0036] The supply device 4 is used to convey an adhesive film 200 and a plurality of chips 300 adhered thereto to the transfer device 3. The transfer device 3 can be used to convey the adhesive film 200 and the plurality of chips 300 thereon to the chip pre-peeling device 1, and the transfer device 3 can also be used to convey the adhesive film 200 and the plurality of chips 300 thereon after being processed by the chip pre-peeling device 1 to the chip picking device 2. Furthermore, the chip picking device 2 can be used to pick up any one of the chips 300 (conveyed from the transfer device 3 and processed by the chip pre-peeling device 1) so as to separate it from the adhesive film 200.
[0037] It should be noted that although the chip separation device 100 is described as including multiple devices that are used in combination as described above, this application is not limited thereto. For example, in other embodiments not shown in this application, the chip picking device 2 can be used alone (e.g., for sale) or in combination with other devices, depending on actual needs.
[0038] Furthermore, given the numerous possible configurations of the transfer device 3 and the supply device 4, their specific implementations will not be elaborated upon here. Therefore, this embodiment primarily describes one feasible configuration of the chip pre-peeling device 1 and the chip picking device 2, but this application is not limited thereto. That is, the chip pre-peeling device 1 and / or the chip picking device 2 can be adjusted and varied according to requirements.
[0039] like Figure 2 and Figure 3As shown, the chip pre-peeling device 1 in this embodiment includes a platform 11, a cavity 12 disposed on the platform 11, a plurality of abutment posts 13 disposed corresponding to the platform 11, and a pneumatic unit 14 (e.g., a pneumatic pump), but this application is not limited thereto. For example, in other embodiments not shown in this application, the plurality of abutment posts 13 of the chip pre-peeling device 1 may be omitted as needed.
[0040] The stage 11 is used to fix the adhesive film 200 (peripheral portion), and multiple chips 300 are adhered to the inner side of the peripheral portion of the adhesive film 200. Further, in this embodiment, the stage 11 includes a fixing frame 111 and a plate 112 located inside the fixing frame 111, and multiple abutment posts 13 are spaced apart from each other and mounted on the plate 112 facing the cavity 12.
[0041] Furthermore, the cavity 12 and the stage 11 together form a pre-peeling chamber C for housing the adhesive film 200 and the plurality of chips 300. It should be noted that the pre-peeling chamber C is closed in this embodiment, and the cavity 12 and the adhesive film 200 may together form a closed space within the pre-peeling chamber C, but this application is not limited to this. For example, in other embodiments not shown in this application, the pre-peeling chamber C may be open, but the cavity 12 and the adhesive film 200 together form a closed space within the pre-peeling chamber C.
[0042] A plurality of abutment posts 13 are located within the pre-peeling chamber C, and the plurality of abutment posts 13 are used to apply force to the plurality of chips 300 by abutting against the adhesive film 200. That is, the bottom surface of each chip 300 is adhered to the adhesive film 200, and a portion of the bottom surface of each chip 300 is abutted by at least one abutment post 13 through the adhesive film 200.
[0043] The pneumatic unit 14 is configured corresponding to the pre-stripping chamber C; in this embodiment, the pneumatic unit 14 may be installed in the cavity 12 or the stage 11, and the pneumatic unit 14 is connected to the pre-stripping chamber C. Furthermore, the air pressure in the pre-stripping chamber C can be adjusted to a default air pressure as needed, through the pneumatic unit 14.
[0044] Therefore, the pneumatic unit 14 can be used to create a positive pressure environment in the pre-peeling chamber C, so that any part of the chip 300 can be separated from the adhesive film 200 (e.g., the portion of the adhesive film 200 not abutting the plurality of abutment posts 13 can be separated from any chip 300 by the positive pressure environment). In other words, when the pneumatic unit 14 is used to create the positive pressure environment in the pre-peeling chamber C, the various portions of the adhesive film 200 abutting the plurality of abutment posts 13 remain adhered to the plurality of chips 300.
[0045] As described above, in this embodiment, the chip pre-peeling device 1 provides the adhesive film 200 and a plurality of chips 300 adhered thereto by forming the pre-peeling chamber C with the positive pressure environment, so that a portion of any chip 300 is separated from the adhesive film 200, thereby achieving the pre-peeling effect of any chip 300, which facilitates the separation of the chip 300 from the adhesive film 200 and reduces the possibility of damage to the chip 300 when separating from the adhesive film 200.
[0046] like Figure 1 and Figures 4 to 6 As shown, the chip acquisition device 2 includes at least one acquisition unit 21, at least one multi-segment chip pusher 22 coupled to the at least one acquisition unit 21, and at least one camera 23 coupled to the at least one multi-segment chip pusher 22. In this embodiment, the chip acquisition device 2 is described as a set of acquisition units 21, multi-segment chip pushers 22, and camera 23 coupled together, but this application is not limited thereto. For example, in other embodiments not shown in this application, the chip acquisition device 2 may include multiple sets of acquisition units 21, multi-segment chip pushers 22, and camera 23 coupled together; or, the multi-segment chip pusher 22 may be used alone (e.g., for sale) or in combination with other components, depending on actual needs.
[0047] The picker 21 is used to hold one of the chips 300 partially adhered to the adhesive film 200, defined as a target chip 300a; and the multi-segment chip pusher 22 is used to push against the adhesive film 200 that adheres to the target chip 300a. A (annular) gap G is formed between the target chip 300a and a plurality of chips 300 surrounding it, and the adhesive film 200 has a light-transmitting area 201 along the predetermined direction P corresponding to the gap G.
[0048] In this embodiment, the target chip 300a is generally located within the light-transmitting area 201, and the gap G (or the distance between the target chip 300a and any adjacent chip 300) is, for example, less than 150 micrometers (μm), but is not limited thereto. Furthermore, the imager 21 is fixed to the top surface of one of the chips 300 (e.g., the target chip 300a), and the imager 21 is described as a vacuum nozzle, but this application is not limited thereto.
[0049] Furthermore, one of the ejector surfaces S of the multi-segment chip pusher 22 is used to push against a first region of the adhesive film 200 bonded to the target chip 300a along a predetermined direction P, so that the target chip 300a is moved a predetermined distance D along the predetermined direction P. That is, in this embodiment, the first region is equivalent to the portion of the adhesive film 200 that is contacted by the ejector surface S.
[0050] Furthermore, the projection area formed by the ejector surface S of the multi-segment chip pusher 22 projecting onto the surface 301 (e.g., the bottom surface of the target chip 300a) of the target chip 300a is located inside the contour of the surface 301; that is, after the target chip 300a moves the predetermined distance D, the adhesive film 200 portion that does not touch the ejector surface S will separate from the target chip 300a.
[0051] The type of the multi-segment chip pusher 22 can be adjusted and varied according to requirements. In this embodiment, the multi-segment chip pusher 22 is described as operating in a reverse push-out mode, but this application is not limited thereto. Further, the multi-segment chip pusher 22 includes a housing 221, an outer pusher 222 arranged in a ring within the housing 221, at least one inner pusher 223 located inside the outer pusher 222, a negative pressure unit 224 disposed in the housing 221, a heating element 225 located outside the outer pusher 222, and a light source module 226 disposed around the housing 221.
[0052] It should be noted that, in other embodiments not shown in this application, at least one of the housing 221, the negative pressure unit 224, and the heating element 225 may be omitted as needed. Furthermore, the number of at least one of the inner push-up members 223 is less than in this embodiment. Figures 4 to 6The text describes multiple inner pushers 223, which are capable of relative movement along the predetermined direction P. One inner pusher 223 adjacent to the outer pusher 222 is arranged in a ring (e.g., a single ring structure or multiple components arranged in a ring), but this application is not limited to this; that is, the number of inner pushers 223 can also be as follows. Figure 7 One shown.
[0053] like Figures 4 to 6 As shown, the negative pressure unit 224 is connected to a top surface 2211 of the housing 221, used to adsorb and fix a peripheral region of the adhesive film 200 (located outside the first region) to the top surface 2211 of the housing 221. The outward pusher 222 and at least one inward pusher 223 are movable relative to each other along the predetermined direction P to push against the adhesive film 200 of the target chip 300a, so that the target chip 300a is moved a predetermined distance D along the predetermined direction P and a negative pressure space N (e.g., a generally vacuum-like space) is generated between the top surface 2211 of the housing 221 and the adhesive film 200 through the negative pressure unit 224. In this embodiment, the end face 2221 of the outward pusher 222 and the end face 2231 of at least one inward pusher 223 are collectively referred to as the ejection surface S of the multi-segment chip pusher 22.
[0054] Furthermore, when the multi-segment chip pusher 22 pushes the first region of the adhesive film 200 through the negative pressure unit 224 and together with the outer pusher 222 and at least one inner pusher 223, causing the target chip 300a to be moved by the predetermined distance D, the outer pusher 222 can (moving relative to at least one inner pusher 223) leave the first region, so that the portion of the first region pushed by the outer pusher 222 can be separated from the target chip 300a through the negative pressure space N, while at least one inner pusher 223 pushes against a second region of the adhesive film 200. That is, in this embodiment, the second region is equivalent to the portion of the adhesive film 200 contacted by the end face 2231 of at least one inner pusher 223.
[0055] In other words, the multi-segment chip pusher 22 uses the negative pressure unit 224 and the external pusher 222 and at least one internal pusher 223 to first move the target chip 300a to the predetermined distance D. Then, the external pusher 222 and at least one internal pusher 223 move from the outside to the inside in a direction away from the target chip 300a, so that the adhesive film 200 and the target chip 300a gradually separate through the negative pressure space N.
[0056] It should be noted that the push-out member 222 can be as follows: Figure 8 and Figure 9 The single-piece structure shown has an annular end face 2221, and the end face 2221 of the outward pusher 222 is used to push against the adhesive film 200 (e.g.: Figure 4 Alternatively, the push-out member 222 can also be as follows: Figure 10 and Figure 11 The multi-piece structure shown includes multiple telescopic rods 222a, and the end faces 2221 of the multiple telescopic rods 222a are arranged in a ring and used to push against the adhesive film 200 (e.g.: Figure 4 ).
[0057] Furthermore, such as Figures 4 to 6 As shown, the outward pushing member 222 and at least one inward pushing member 223 are preferably used by the negative pressure unit 224 to generate suction on the adhesive film 200. Thus, when the outward pushing member 222 or at least one inward pushing member 223 separates from the adhesive film 200, the suction generated by the negative pressure unit 224 facilitates the separation of the corresponding portion of the adhesive film 200 from the target chip 300a.
[0058] Furthermore, in this embodiment, the heating element 225 is adjacent to the end face 2221 of the outward pusher 222 used to push the adhesive film 200 (e.g., the heating element 225 is disposed on the housing 221 and adjacent to the top surface 2211 of the housing 221). The heating element 225 can increase the temperature of the multi-segment chip pusher 22 to heat the portion of the adhesive film 200 pushed by the multi-segment chip pusher 22. In other words, the multi-segment chip pusher 22 can increase its temperature through the heating element 225 to heat the first area of the adhesive film 200 it pushes.
[0059] Therefore, in this embodiment, the multi-segment chip pusher 22 can be equipped with the heating element 225 so that the adhesive film 200 can be heated to reduce its adhesion to the corresponding chip 300, thereby facilitating the separation of the corresponding chip 300 from the adhesive film 200 and effectively reducing the possibility of damage to the chip 300 when separating from the adhesive film 200.
[0060] Furthermore, the light source module 226 is adjacent to the top surface 2211 of the housing 221, and in this embodiment, the light source module 226 includes a plurality of light-emitting chips 2261 arranged in a ring along the housing 221. While the plurality of light-emitting chips 2261 may be arranged in a circular ring in this embodiment, it is not limited thereto. For example, in other embodiments not shown in this application, the plurality of light-emitting chips 2261 may also be arranged in a square ring according to actual needs, preferably with their position corresponding to the light-transmitting area 201 of the adhesive film 200 along the predetermined direction P.
[0061] In this embodiment, the light source module 226 can emit light toward the light-transmitting area 201 of the adhesive film 200 to form a transmitted light ray L passing through the light-transmitting area 201 and the gap G. That is, the adhesive film 200 (or the light-transmitting area 201) is capable of allowing the light emitted by the light source module 226 to pass through, and the light emitted by the light source module 226 can be adjusted and changed according to actual needs (e.g., visible light or infrared light).
[0062] Furthermore, the camera 23 is positioned above the multi-segment chip pusher 22 (along the predetermined direction P), and the camera 23 is used to receive the transmitted light L to obtain the position information of the target chip 300a. That is to say, in this embodiment, the chip acquisition device 2 may not have a light source positioned above the multi-segment chip pusher 22 (or not near the camera 23).
[0063] Therefore, the multi-segment chip pusher 22 of the chip acquisition device 2 can make the outline and position of the target chip 300a clearly visible by the transmitted light L passing through the light-transmitting area 201 by the light source module 226 positioned below the adhesive film 200 and corresponding to the light-transmitting area 201, thereby facilitating the accurate acquisition of the target chip 300a by the chip acquisition device 2.
[0064] [Example 2]
[0065] Please see Figures 12 to 14 As shown, this is Embodiment Two of this application. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The main differences between this embodiment and Embodiment One described above are explained as follows:
[0066] In this embodiment, the structure of the multi-segment chip pusher 22 is largely the same as in Embodiment 1, but the multi-segment chip pusher 22 operates in a forward pushing manner. Specifically, when the multi-segment chip pusher 22 moves the target chip 300a by pushing against the first region of the adhesive film 200 with the external pusher 222 and at least one internal pusher 223 through the negative pressure unit 224, the multi-segment chip pusher 22 can continue to push against the second region of the adhesive film 200 using only at least one internal pusher 223, so that the target chip 300a is moved by the predetermined distance D. The first region pushed by the external pusher 222 can then separate from the target chip 300a through the negative pressure space N.
[0067] In other words, the multi-segment chip pusher 22 uses the negative pressure unit 224 to push the target chip 300a one by one from the outside to the inside with the outer pusher 222 and at least one inner pusher 223, so that the target chip 300a is gradually moved by the predetermined distance D, thereby causing the adhesive film 200 and the target chip 300a to gradually separate through the negative pressure space N.
[0068] [Technical Effects of the Embodiments in this Application]
[0069] In summary, the chip acquisition device and multi-segment chip pusher disclosed in this application can, by having a light source module positioned below the adhesive film corresponding to the light-transmitting area, clearly present the outline and position of the target chip by the transmitted light passing through the light-transmitting area, thereby facilitating the accurate acquisition of the target chip by the chip acquisition device.
[0070] Furthermore, the chip separation equipment and chip pre-peeling device disclosed in the embodiments of this application provide the adhesive film and a plurality of chips attached thereto by forming the pre-peeling chamber with the positive pressure environment, so that a portion of any chip is separated from the adhesive film, thereby achieving the pre-peeling effect of any chip, thereby facilitating the separation of the chip from the adhesive film and reducing the possibility of damage to the chip during separation from the adhesive film.
[0071] Furthermore, the multi-segment chip pusher disclosed in this application embodiment, by providing the heating element, allows the adhesive film to be heated to reduce its adhesion to the corresponding chip, thereby facilitating the separation of the corresponding chip from the adhesive film and effectively reducing the possibility of damage to the chip during separation from the adhesive film.
[0072] The embodiments and / or implementation methods described above are merely preferred embodiments and / or implementation methods for implementing the technology of this application, and are not intended to limit the implementation methods of the technology of this application in any way. Any person skilled in the art may make some modifications or alterations to other equivalent embodiments without departing from the scope of the technical means disclosed in this application, but these should still be regarded as the technology or embodiments that are substantially the same as those of this application.
Claims
1. A chip capture device, comprising: The chip capturing device comprises: A multi-stage chip ejector is used to push against an adhesive film of a target chip, and the adhesive film is adhered with a plurality of chips surrounding the target chip, a gap of less than 150 microns is formed between the target chip and the plurality of chips surrounding the target chip, and the adhesive film has a light transmission area corresponding to the gap; wherein the multi-stage chip ejector comprises: A housing; A negative pressure unit is arranged in the housing and is communicated to a top surface of the housing, so that an outer peripheral region of the adhesive film is adsorbed and fixed to the top surface of the housing; An outer ejecting member is annularly arranged in the housing; At least one inner ejecting member is located inside the outer ejecting member, and the outer ejecting member and at least one inner ejecting member can relatively move in a predetermined direction to push against the adhesive film of the target chip, so that the target chip is moved a predetermined distance in the predetermined direction, and a negative pressure space is generated between the top surface of the housing and the adhesive film by the negative pressure unit; and A light source module is annularly arranged in the housing and adjacent to the top surface of the housing; wherein the light source module can be used to emit light towards the light transmission area to form a transmission light passing through the light transmission area and the gap; and A camera is arranged above the multi-stage chip ejector, and the camera can be used to receive the transmission light to obtain position information of the target chip.
2. The chip card according to claim 1, characterized in that When the multi-stage chip ejector moves the target chip by a predetermined distance through the negative pressure unit and the outer ejecting member and at least one inner ejecting member jointly push against a first region of the adhesive film, the outer ejecting member can move away from the first region, so that the first region pushed by the outer ejecting member can be separated from the target chip through the negative pressure space, and at least one inner ejecting member pushes against a second region of the adhesive film.
3. The chip card according to claim 1, characterized in that When the multi-stage chip ejector moves the target chip through the negative pressure unit and the outer ejecting member and at least one inner ejecting member jointly push against a first region of the adhesive film, the multi-stage chip ejector can continue to push against a second region of the adhesive film only by at least one inner ejecting member to move the target chip by a predetermined distance, and the first region pushed by the outer ejecting member can be separated from the target chip through the negative pressure space.
4. The chip card according to claim 1, characterized in that The multi-stage chip ejector comprises a heating member arranged in the housing and adjacent to the top surface of the housing.
5. The chip card according to claim 1, characterized in that The outer ejecting member comprises an annular end surface, and the end surface of the outer ejecting member is used to push against the adhesive film; wherein a projection area formed by the normal projection of the end surface of the outer ejecting member on the surface of the target chip is located inside the contour of the surface.
6. The chip card according to claim 1, characterized in that The outer ejecting member comprises a plurality of telescopic rods, and the end surfaces of the plurality of telescopic rods are annularly distributed and used to push against the adhesive film.
7. The chip card according to claim 1, characterized in that The number of the at least one inner pushing element is plural, and the plural inner pushing elements are relatively movable along the predetermined direction; wherein one of the inner pushing elements adjacent to the outer pushing element is annularly arranged.
8. The chip card according to claim 1, characterized in that The multi-stage chip pushing device further comprises a heating element, which is located outside the outer pushing element and adjacent to the end surface of the outer pushing element used for pushing the adhesive film.
9. The chip card according to claim 1, characterized in that The chip capturing device further comprises a capturing device corresponding to the multi-stage chip pushing device, and the capturing device is used for holding the top surface of the target chip.
10. A multi-stage chip ejector, comprising: The multi-stage chip pushing device is used for pushing an adhesive film of a target chip, and the adhesive film is adhered with a plurality of chips surrounding the target chip, and a gap is formed between the target chip and the plurality of chips surrounding the target chip, and the adhesive film has a light transmission area corresponding to the gap; wherein the multi-stage chip pushing device comprises: a housing; a negative pressure unit arranged in the housing and communicated to a top surface of the housing, so as to adsorb and fix a peripheral area of the adhesive film to the top surface of the housing; an outer pushing element annularly arranged in the housing; at least one inner pushing element located inside the outer pushing element, and the outer pushing element and the at least one inner pushing element are relatively movable along a predetermined direction, so as to push the adhesive film adhered to the target chip, so that the target chip is moved a predetermined distance along the predetermined direction, and a negative pressure space is generated between the top surface of the housing and the adhesive film through the negative pressure unit; and a light source module annularly arranged in the housing and adjacent to the top surface of the housing; wherein the light source module is used for emitting light towards the light transmission area, so as to form a transmission light passing through the light transmission area and the gap.