Detachable assembled Kovar enclosure frame structure

Abstract

The utility model relates to the technical field of microelectronic packaging tube shell application, in particular to a split type assembled kovar enclosure frame structure which comprises a body, the body comprises a kovar ring, a first groove, a second groove, a first kovar supporting column and a second kovar supporting column, the first groove and the second groove are both formed in the kovar ring, and the first kovar supporting column and the second kovar supporting column are arranged on the body. The detachable assembled kovar enclosure frame structure comprises two first grooves, two second grooves, two first kovar supporting columns and two second kovar supporting columns, the first kovar supporting columns are arranged on the first grooves, the second kovar supporting columns are arranged on the second grooves, the number of the first grooves and the number of the second grooves are both two, and the number of the first kovar supporting columns and the number of the second kovar supporting columns are both two. Compared with the original kovar enclosure frame, the problem of production cost caused by high production difficulty can be reduced, and the verification process of the subsequent process is accelerated.

Description

Technical Field

[0001] This utility model relates to the field of microelectronic packaging shell application technology, specifically a Kovar frame structure that can be disassembled and assembled. Background Technology

[0002] As is well known, the frame in a chip package usually refers to the structure used to fix and protect the chip during the semiconductor packaging process, especially in packaged semiconductor packaging. The main functions of the frame include ensuring good electrical connection between the chip and external circuits, protecting the chip surface from physical damage or environmental influences, reducing the damage of electrostatic discharge (ESD) to the chip, fixing the chip in a designated position, and preventing movement during soldering or use.

[0003] As society develops, electronic devices are becoming increasingly complex. This requires them to be reliable, fast, low-power, lightweight, and miniaturized. The size and shape of Kovar frames need to be controlled, which makes the production of Kovar frames more difficult and costly. Using a one-piece manufactured Kovar frame requires significant investment in subsequent research and development. Therefore, there is a need to provide a Kovar frame structure that reduces production difficulty and cost. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a Kovar frame structure that can be disassembled and assembled.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a disassembled and assembled Kovar frame structure, comprising a body, the body comprising a Kovar ring, a first groove, a second groove, a first Kovar support column, and a second Kovar support column, the first groove and the second groove being formed on the Kovar ring, the first Kovar support column being disposed on the first groove, the second Kovar support column being disposed on the second groove, and two of each of the first groove and the second groove, and two of each of the first Kovar support column and the second Kovar support column.

[0006] To improve the performance, the present invention is improved in that the first Kovar support is matched with the first groove, and the second Kovar support is matched with the second groove.

[0007] To improve the performance, this utility model is improved by symmetrically arranging two first grooves and two second grooves.

[0008] To improve the performance, this utility model is improved by symmetrically arranging two first collapsible supports and two second collapsible supports.

[0009] Compared with the prior art, this utility model provides a Kovar frame structure that can be disassembled and assembled, which has the following advantages:

[0010] This modular Kovar frame structure breaks down the complex Kovar frame into multiple parts for processing, reducing processing difficulty and production costs. For applications requiring high precision, etching is employed to improve the accuracy of the Kovar frame, lowering usage standards and reducing defect rates. Silver-copper solder is used for brazing to ensure the strength of the assembled modular product, further reducing subsequent defect rates. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model;

[0012] Figure 2 This is a schematic diagram of the structure of this utility model;

[0013] Figure 3 This utility model Figure 1 Schematic diagram of the structure of the first Kovar support;

[0014] Figure 4 This utility model Figure 1 Schematic diagram of the structure of the second Kovar support;

[0015] In the diagram: 1. Body; 2. Kovar ring; 3. First groove; 4. Second groove; 5. First Kovar support; 6. Second Kovar support. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-4 A disassembled and assembled Kovar frame structure includes a body 1. The body 1 includes a Kovar ring 2, a first groove 3, a second groove 4, a first Kovar support 5, and a second Kovar support 6. The first groove 3 and the second groove 4 are both formed on the Kovar ring 2. The first Kovar support 5 is disposed on the first groove 3, and the second Kovar support 6 is disposed on the second groove 4. There are two of each of the first groove 3 and the second groove 4, and two of each of the first Kovar support 5 and the second Kovar support 6.

[0018] To improve the performance, in this embodiment, the first Kovar support 5 is matched with the first groove 3, and the second Kovar support 6 is matched with the second groove 4.

[0019] To improve the performance, in this embodiment, the two first grooves 3 are symmetrically arranged, and the two second grooves 4 are symmetrically arranged.

[0020] To improve the effectiveness of use, in this embodiment, two first collapsible support pillars 5 are symmetrically arranged, and two second collapsible support pillars 6 are symmetrically arranged.

[0021] In summary, the main body 1 consists of a Kovar ring 2, a first Kovar support 5, a second Kovar support 6, a first groove 3, and a second groove 4. Both the first Kovar support 5 and the second Kovar support 6 are etched. After assembly with the first groove 3 and the second groove 4, a silver-copper brazing process is used. The silver-copper ring is placed at the bottom of the product, and high-temperature brazing allows the silver-copper solder to naturally adhere to the joint, completing the welding. The Kovar ring 2 is a regular rectangular ring. The first groove 3 and the second groove 4 are rectangular, with a depth one-third of the total thickness and a width consistent with the wall thickness of the Kovar ring 2. The first groove 3 and the second groove 4 have rounded corners to reduce the difficulty of etching and facilitate subsequent assembly. The four corners of the inner wall of the Kovar ring 2 are also rounded to reduce the difficulty of etching. The first Kovar support 5 and the second Kovar support 6 are both irregular rectangular bodies. Figure 3 , Figure 4 The edges of the mating surfaces of the Kovar ring 2 are rounded to match the rectangular grooves of the Kovar ring 2, which facilitates subsequent assembly and brazing. After the Kovar ring 2 is assembled with the first Kovar support 5 and the second Kovar support 6, it is brazed with silver-copper solder to form a complete Kovar frame.

[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A split assembled van frame structure comprising a body (1), characterized in that: The body (1) comprises a Kovar ring (2), a first groove (3), a second groove (4), a first Kovar support (5) and a second Kovar support (6), the first groove (3) and the second groove (4) are both arranged on the Kovar ring (2), the first Kovar support (5) is arranged on the first groove (3), the second Kovar support (6) is arranged on the second groove (4), the first groove (3) and the second groove (4) are both provided with two, the first Kovar support (5) and the second Kovar support (6) are both provided with two.

2. The split assembled van structure of claim 1, wherein: The first Kovar support (5) is matched with the first groove (3), and the second Kovar support (6) is matched with the second groove (4).

3. The split assembled van structure of claim 2, wherein: The two first grooves (3) are symmetrically arranged, and the two second grooves (4) are symmetrically arranged.

4. The split assembled van structure of claim 3, wherein: The two first Kovar supports (5) are symmetrically arranged, and the two second Kovar supports (6) are symmetrically arranged.

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