Punching device for micro holes
By designing a two-step punching and floating material ejection structure, the problem of easy chipping of punches in traditional micro-hole punching dies is solved, achieving efficient and reliable micro-hole punching and automatic material removal.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-14
- Publication Date
- 2026-03-13
AI Technical Summary
Traditional micro-hole punching dies have long punches, weak strength, and are prone to chipping, making it difficult to achieve efficient and reliable micro-hole punching.
A two-step punching process is adopted. In the first step, the punching bears most of the force to reduce the length of the punch. In the second step, the punching is completed by the scrap material ejecting the punch. Combined with the floating material ejection structure, automatic unloading and waste material discharge are achieved.
It improves punch strength and service life, enables complete punching of micro-holes and automated stripping, and reduces the risk of punch chipping.
Smart Images

Figure CN223988947U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of stamping technology, and in particular relates to a stamping device for micro-holes. Background Technology
[0002] Micro-hole is a relative concept, usually defined in manufacturing and processing technology based on the diameter of the hole. Generally speaking, holes with a diameter of 0.1 to 1.0 mm are called small holes, while holes with a diameter of less than 0.1 mm are called micro-holes. Micro-hole stamping is a precision metal processing technology, mainly used to manufacture holes of tiny size. Micro-hole stamping refers to the process of punching tiny holes into metal sheets using stamping dies. Micro-hole stamping is widely used in fields such as automobiles, electronics, fiber optic communications, and fluid control. For example, the fine structures of high-end products such as cooling holes for turbine blades in aero-engines, holes for jewel bearings, electron microscope gratings, and micro-perforated PCBs all require the use of micro-hole stamping technology.
[0003] Traditional mold structures allow for one-step punching of tiny holes, but the punches are long, weak, and prone to chipping. Therefore, a new type of equipment needs to be designed. Utility Model Content
[0004] The purpose of this invention is to provide a stamping device for micro-holes to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A stamping device for micro-holes includes an upper die assembly with a lower die assembly below it. The upper die assembly also includes a blanking punch within the upper die assembly. A scrap ejection punch is located on one side of the blanking punch. The blanking punch cuts A% of the material thickness, and the scrap ejection punch cuts the remaining material thickness. A discharge hole is located at the bottom of the scrap ejection punch within the lower die assembly, which includes a floating material ejection structure.
[0007] Furthermore: the upper module includes an upper mold base, a third pad is provided under the upper mold base, a fixing plate is installed under the third pad, a second pad is provided under the fixing plate, and a pressure plate is installed under the second pad.
[0008] Furthermore: the lower mold assembly includes a lower mold base, a first pad is disposed on the lower mold base, and a lower mold core plate is mounted on the first pad.
[0009] Furthermore: the floating material ejection structure includes a floating material ejection plate, six springs are evenly arranged below the floating material ejection plate, a support block is arranged at the bottom of the springs, a floating material ejection rod is arranged at the center of the floating material ejection plate, a floating material ejection pin is arranged on the floating material ejection rod, and four pressure rods are evenly arranged around the floating material ejection pin.
[0010] Furthermore, both the blanking punch and the scrap ejection punch are fixedly connected to the fixed plate.
[0011] Furthermore: the pressure rod is fixedly connected to the upper module, and the pressure rod is plugged into and plugged into the lower module.
[0012] Compared with existing technologies, the beneficial effects are:
[0013] 1. By setting up a two-step punching process, the punching is divided into two steps. The first step, which bears most of the punching force, reduces the punching depth, shortens the punch length, and increases the punch strength and service life. Then, the second step, which bears a small portion of the punching force, pushes out the scrap, thus achieving complete punching.
[0014] 2. Through the floating material ejection structure, the spring is compressed and stored when the mold is closed, and released when the mold is opened to eject the sunken part of the strip, thus achieving automatic material removal;
[0015] 3. The punching waste is automatically discharged through the material discharge hole. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of the micro-hole punching device described in this utility model;
[0017] Figure 2 This is a partial enlarged view of point A of the stamping device for micro-holes described in this utility model;
[0018] Figure 3 This is a partial enlarged view of section B of the punching device for micro-holes described in this utility model;
[0019] Figure 4 This is a schematic diagram of the mold opening of the stamping device for micro-holes described in this utility model;
[0020] Figure 5 This is a schematic diagram of the appearance of the stamping device for micro-holes described in this utility model.
[0021] In the attached diagram, the following are the reference numerals: 1. Lower die base; 2. First backing plate; 3. Lower die core plate; 4. Pressure plate; 5. Second backing plate; 6. Fixing plate; 7. Third backing plate; 8. Upper die base; 9. Material strip; 10. Punching punch; 11. Pressure rod; 12. Floating material ejection plate; 13. Spring; 14. Support block; 15. Floating material ejection rod; 16. Floating material ejector pin; 17. Scrap ejection punch; 18. Drop hole. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Please see Figures 1-5 A stamping device for micro-holes includes an upper die assembly and a lower die assembly below the upper die assembly. It also includes a punching punch 10 disposed within the upper die assembly. A scrap ejection punch 17 is disposed on one side of the punching punch 10. The punching punch 10 punches 60% of the material thickness, and the scrap ejection punch 17 punches the remaining 40% of the material thickness. A discharge hole 18 is disposed at the bottom of the scrap ejection punch 17 and is located within the lower die assembly. A floating material ejection structure is disposed within the lower die assembly.
[0024] In this embodiment: the upper die assembly includes an upper die base 8, a third pad 7 is provided under the upper die base 8, a fixing plate 6 is installed under the third pad 7, a second pad 5 is provided under the fixing plate 6, and a pressure plate 4 is installed under the second pad 5. The punching punch 10 and the scrap ejection punch 17 are both fixedly connected to the fixing plate 6. The upper die base 8 is used to connect to the punching end of the stamping equipment. The fixing plate 6 is fixed to the upper die base 8 through the third pad 7. The third pad 7 is used to reduce the wear between the upper die base 8 and the fixing plate 6. The pressure plate 4 is fixed to the fixing plate 6 through the second pad 5. The second pad 5 is used to reduce the wear between the pressure plate 4 and the fixing plate 6.
[0025] In this embodiment: the lower die assembly includes a lower die base 1, a first pad 2 is provided on the lower die base 1, and a lower die core plate 3 is installed on the first pad 2. The lower die base 1 is used to fix on the stamping table, thereby providing support for the lower die core plate 3 through the first pad 2. The first pad 2 is used to reduce wear between the lower die core plate 3 and the lower die base 1.
[0026] In this embodiment: the floating material ejection structure includes a floating material ejection plate 12, six springs 13 are evenly arranged below the floating material ejection plate 12, a support block 14 is arranged at the bottom of the springs 13, a floating material ejection rod 15 is arranged at the center of the floating material ejection plate 12, a floating material ejector pin 16 is arranged on the floating material ejector pin 15, four pressure rods 11 are evenly arranged around the floating material ejector pin 16, the pressure rods 11 are fixedly connected to the pressure plate 4, the pressure rods 11 are plugged and pulled connected to the lower mold core plate 3, and the pressure rods 11 are plugged and pulled connected to the first pad plate 2. When the mold is closed, the upper mold base 8 is open. The fixed plate 6 drives the pressure rod 11 downward through the lower mold core plate 3 and the first pad plate 2, thereby causing the floating material ejector plate 12 to compress the spring 13 downward. The floating material ejector rod 15 drives the floating material ejector pin 16 to move downward and retract into the lower mold core plate 3, ensuring that the punching punch 10 is not subjected to the force of the lower mold spring 13 when punching downward. When the mold is opened, the support block 14 supports the spring 13 to push the floating material ejector plate 12 upward. The floating material ejector plate 12 then drives the floating material ejector pin 16 to move upward through the floating material ejector rod 15, pushing out the sunken part of the strip 9 and realizing the strip removal.
[0027] Working principle: This device divides the punching of micro-holes into two steps. In the first step, when the mold is closed, the upper mold base 8 drives the pressure rod 11 downward through the lower mold core plate 3 and the first pad plate 2 via the fixed plate 6. This causes the floating material ejector plate 12 to compress the spring 13 downward, and the floating material ejector rod 15 drives the floating material ejector pin 16 to move downward and retract into the lower mold core plate 3. This ensures that the punching punch 10 is not subjected to the force of the lower mold core spring 13 when punching downward. During this process, the punching punch 10 punches down 60% of the thickness of the strip 9, so that the waste and the strip 9 are basically separated. The material strip 9 remains stuck in the strip. When the mold opens, the support block 14 supports the spring 13 to push the floating material ejector plate 12 upward. The floating material ejector plate 12 then drives the floating material ejector pin 16 upward through the floating material ejector rod 15, ejecting the sunken part of the strip 9 to achieve material removal. Then the strip 9 is sent to the next step, so that the punching position is aligned with the scrap ejector punch 17. At this time, the mold is closed again, so that the scrap ejector punch 17 punches the remaining 40% of the thickness of the strip 9 and punches the scrap into the blanking hole 18 to achieve the complete punching of the micro hole.
[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A micro-hole punching device comprising an upper die set, below which is arranged a lower die set, characterized in that: The upper die set is provided with a blanking punch (10) on one side of which a waste material ejection punch (17) is arranged, the blanking punch (10) punches A% of the material thickness, the waste material ejection punch (17) punches the remaining material thickness, the waste material ejection punch (17) is provided at the bottom with a blanking hole (18), the blanking hole (18) is located in the lower die set, and the lower die set is provided with a floating material ejection structure.
2. The micro-hole punching device according to claim 1, wherein: The upper die set comprises an upper die seat (8), the lower surface of the upper die seat (8) is provided with a third backing plate (7), the lower surface of the third backing plate (7) is mounted with a fixed plate (6), the lower surface of the fixed plate (6) is provided with a second backing plate (5), and the lower surface of the second backing plate (5) is mounted with a material pressing plate (4).
3. The micro-hole punching device according to claim 1, wherein: The lower die set comprises a lower die seat (1), the upper surface of the lower die seat (1) is provided with a first backing plate (2), and the upper surface of the first backing plate (2) is mounted with a lower die core plate (3).
4. The micro-hole punching device according to claim 1, wherein: The floating material ejection structure comprises a floating material ejection plate (12), the lower surface of the floating material ejection plate (12) is uniformly provided with six springs (13), the bottom of the spring (13) is provided with a supporting block (14), the upper surface of the floating material ejection plate (12) is provided at the center position with a floating material ejection rod (15), the upper surface of the floating material ejection rod (15) is provided with a floating material ejector pin (16), and the periphery of the floating material ejector pin (16) is uniformly provided with four pressing rods (11).
5. The micro-hole punching device according to claim 2, wherein: The blanking punch (10) and the waste material ejection punch (17) are fixedly connected with the fixed plate (6).
6. The micro-hole punching device according to claim 4, wherein: The pressing rod (11) is fixedly connected with the upper die set, and the pressing rod (11) is plug-in connected with the lower die set.